CN221178069U - Waterproof and high-heat-dissipation liquid-cooled vehicle-mounted domain controller - Google Patents

Abstract

The utility model belongs to the technical field of domain controllers, and particularly relates to a waterproof and high-heat-dissipation liquid-cooled vehicle-mounted domain controller which comprises a liquid cooling cover plate component and a waterproof and air-permeable bottom cover component which are mutually assembled into a whole; the control PCBA is arranged between the liquid cooling cover plate assembly and the waterproof and breathable bottom cover assembly and is used for controlling the whole operation of the domain controller; and the multi-medium combined heat conduction assembly is correspondingly arranged between the heating chip of the control PCBA and the liquid cooling cover plate assembly and is used for rapidly transmitting heat of the heating chip to the liquid cooling cover plate assembly, and meanwhile, the heat dissipation area of the heating chip is increased and the overall heat dissipation efficiency of the domain controller is improved. The utility model provides a waterproof and high-heat-dissipation liquid-cooled vehicle-mounted domain controller, which not only can effectively improve the overall heat dissipation efficiency and heat dissipation performance of the domain controller, but also can play a waterproof role on the controller and eliminate the risk of short circuit of electronic components caused by water vapor condensation in the controller.

Description

Waterproof and high-heat-dissipation liquid-cooled vehicle-mounted domain controller

Technical Field

The utility model belongs to the technical field of domain controllers, and particularly relates to a waterproof high-heat-dissipation liquid-cooled vehicle-mounted domain controller.

Background

At present, heat transfer is carried out between a liquid cooling plate and a chip by using heat conduction grease, and along with the development of the intelligent driving industry, the vehicle-mounted intelligent degree is improved, and meanwhile, higher requirements are also provided for the domain controller: in the aspect of heat dissipation, when the power consumption of a chip is overlarge, the heat dissipation requirement of the chip with large power consumption in the future cannot be met due to smaller heat transfer surface connection in the way that the traditional liquid cooling plate is contacted with the top surface of the chip to be matched for heat dissipation; in the aspect of environmental protection, the mode of traditional controller can't satisfy waterproof dustproof requirement such as IP6K8, if carry out the sealed of sealant to the controller, the inside phenomenon that often leads to the inside emergence condensation of controller because of unable smooth discharge of moisture of controller, serious person can lead to the inside components and parts of controller to take place the phenomenon of short circuit.

As shown in fig. 7, the conventional vehicle-mounted domain controller mainly comprises a liquid cooling upper cover plate (1), a liquid cooling plate (2), heat dissipation grease (3), a chip (4), a PCBA (5) and a lower cover (6). When the chip works, the heat of the chip is transferred to the liquid cooling plate (2) through the heat dissipation grease (3), and then the heat is dissipated by the liquid cooling plate. By adopting the heat conduction mode, the area of the chip in direct contact with the liquid cooling plate is limited, and the heat conductivity of the aluminum series material used by the current liquid cooling plate is limited due to the consideration of cost, so that heat accumulation is easily caused in a liquid cooling area corresponding to the upper part of the chip, the use efficiency of the liquid cooling plate is low, and the whole heat dissipation capacity is insufficient; meanwhile, the sealing structure can not discharge moisture in the controller, so that when the temperature of the cooling liquid of the controller is low, condensation can be generated in the controller, and water accumulation is caused.

Therefore, the control equipment capable of effectively improving heat conduction and heat dissipation efficiency, preventing water accumulation and improving waterproof effect due to condensation is designed, and has important significance for the development of the intelligent driving field.

Disclosure of utility model

In order to solve the defects in the prior art, the utility model provides the waterproof and high-heat-dissipation liquid-cooled vehicle-mounted domain controller, which adopts the multi-medium combined heat conduction assembly to diffuse heat generated by a heating chip to the liquid cooling cover plate assembly, and then takes away the heat by cooling liquid in the liquid cooling cover plate assembly, so that the heat conduction and heat dissipation of the heating chip are realized, and compared with a heat dissipation grease heat conduction mode in the prior art, the multi-medium combined heat conduction assembly can effectively enlarge the heat conduction area of the liquid cooling cover plate assembly and improve the heat dissipation efficiency of the liquid cooling cover plate assembly, thereby effectively improving the whole heat dissipation efficiency and heat dissipation performance of the domain controller; meanwhile, the waterproof breathable bottom cover component can enable moisture in the controller to be exchanged with the outside, moisture accumulated in the controller is guaranteed to volatilize into the outside environment, so that a waterproof effect is achieved on the controller, and the risk of short circuit of electronic components, which is caused by condensation of the moisture, in the controller is eliminated.

The technical effects to be achieved by the utility model are realized by the following technical scheme:

The utility model relates to a waterproof and high-heat-dissipation liquid-cooled vehicle-mounted domain controller, which comprises a liquid-cooled cover plate component and a waterproof and air-permeable bottom cover component which are mutually assembled into a whole; the control PCBA is arranged between the liquid cooling cover plate assembly and the waterproof and breathable bottom cover assembly and is used for controlling the whole operation of the domain controller; and the multi-medium combined heat conduction assembly is correspondingly arranged between the heating chip of the control PCBA and the liquid cooling cover plate assembly and is used for rapidly transmitting heat of the heating chip to the liquid cooling cover plate assembly, and meanwhile, the heat dissipation area of the heating chip is increased and the overall heat dissipation efficiency of the domain controller is improved.

As one preferable scheme, the multi-medium combined heat conduction assembly comprises a first ceramic heat conduction sheet corresponding to the heating chip of the control PCBA, a second ceramic heat conduction sheet corresponding to the first ceramic heat conduction sheet and propped against the liquid cooling cover plate assembly, and a graphene heat conduction piece corresponding to and arranged between the first ceramic heat conduction sheet and the second ceramic heat conduction sheet.

As one preferable scheme, the sectional area of the first ceramic heat conducting sheet is 1-1.5 times of the sectional area of the control PCBA heating chip; the cross section area of the second ceramic heat conducting fin is 0.8-1.5 times of the cross section area of the PCBA heating chip.

As one preferable scheme, the first ceramic heat conducting fin and the second ceramic heat conducting fin are rectangular heat conducting fin structures which are matched with the control PCBA heating chip.

As one preferable scheme, the graphene heat conducting piece is a stepped graphene heat conducting piece and comprises a first heat conducting part, a second heat conducting part and a heat conducting connecting part, wherein the first heat conducting part is correspondingly arranged between the first ceramic heat conducting piece and the second ceramic heat conducting piece, the second heat conducting part is propped against the liquid cooling cover plate assembly and is arranged adjacent to one side edge of the second ceramic heat conducting piece, and the heat conducting connecting part is connected between the first heat conducting part and the second heat conducting part.

As one preferable scheme, the cross section area of the first heat conduction part is 0.8-1.5 times of the cross section area of the first ceramic heat conduction sheet, and the cross section area of the second heat conduction part is more than or equal to the cross section area of the first heat conduction part.

As one preferable scheme, the first heat conduction part is of a rectangular heat conduction block structure which is matched with the control PCBA heating chip.

As one preferable scheme, the multi-medium combined heat conduction assembly further comprises a first heat conduction glue arranged between the first ceramic heat conduction piece and the graphene heat conduction piece, and a second heat conduction glue arranged between the graphene heat conduction piece and the second ceramic heat conduction piece.

As one preferable scheme, the liquid cooling cover plate assembly comprises a liquid cooling runner cavity and a liquid cooling cover plate arranged at the top of the liquid cooling runner cavity; the liquid cooling runner cavity comprises a hollow runner cavity body, a plurality of liquid cooling heat dissipation columns uniformly protruding in the runner cavity body, and a liquid inlet pipeline and a liquid outlet pipeline connected to two opposite side edges of the runner cavity body.

As one preferable scheme, the waterproof and breathable bottom cover assembly comprises a controller bottom cover matched with the liquid cooling cover plate assembly and a waterproof and breathable valve which is arranged on the controller bottom cover and used for discharging condensation in the controller.

In summary, the present utility model has at least the following advantages:

1. According to the waterproof and high-heat-dissipation liquid-cooled vehicle-mounted domain controller, the multi-medium combined heat conduction assembly is used for diffusing heat generated by the heating chip to the liquid cooling cover plate assembly, and then the cooling liquid in the liquid cooling cover plate assembly takes away the heat, so that heat conduction and heat dissipation of the heating chip are realized.

2. According to the waterproof and high-heat-dissipation liquid-cooled vehicle-mounted domain controller, the waterproof and air-permeable bottom cover assembly can enable moisture in the controller to be exchanged with the outside, so that the moisture accumulated in the controller can be volatilized into the outside environment, a waterproof effect is achieved on the controller, and the risk of short circuit of electronic components caused by condensation of the moisture in the controller is eliminated.

Drawings

FIG. 1 is an exploded view of the overall structure of a waterproof, high heat dissipating liquid-cooled vehicle-mounted domain controller according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of a liquid-cooled cover plate assembly according to an embodiment of the utility model;

FIG. 3 is a schematic diagram of a liquid cooling flow channel cavity in an embodiment of the utility model;

FIG. 4 is a schematic view of a waterproof and breathable bottom cover assembly in accordance with an embodiment of the present utility model;

FIG. 5 is a schematic structural view of a multi-medium combined heat conducting component according to an embodiment of the present utility model;

Fig. 6 is a schematic structural diagram of a graphene heat conducting member according to an embodiment of the present utility model;

fig. 7 is an exploded view of the overall structure of the vehicle-mounted domain controller in the background art.

Reference numerals:

100. The liquid cooling cover plate assembly 110, the liquid cooling runner cavity 111, the runner cavity body 112, the liquid cooling heat dissipation column 113, the liquid inlet pipeline 114, the liquid outlet pipeline 120 and the liquid cooling cover plate;

200. a waterproof and breathable bottom cover assembly 210, a controller bottom cover, 220, and a waterproof and breathable valve;

300. Controlling the PCBA;

400. The multi-medium combined type heat conduction component comprises a multi-medium combined type heat conduction component body 410, a first ceramic heat conduction sheet 420, a second ceramic heat conduction sheet 430, a graphene heat conduction piece 431, a first heat conduction part 432, a second heat conduction part 433, a heat conduction joint part 440, a first heat conduction glue 450 and a second heat conduction glue 450.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. The described embodiments are some, but not all, embodiments of the utility model.

Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, based on the embodiments of the utility model, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present utility model and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal," "vertical," "overhang," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

Example 1:

Referring to fig. 1, the waterproof and high heat dissipation liquid-cooled vehicle-mounted domain controller in this embodiment includes a liquid-cooled cover plate assembly 100 and a waterproof and air-permeable bottom cover assembly 200 assembled together, a control PCBA300 disposed between the liquid-cooled cover plate assembly 100 and the waterproof and air-permeable bottom cover assembly 200, and a multi-medium combined heat-conducting assembly 400 correspondingly disposed between a heat-generating chip of the control PCBA300 and the liquid-cooled cover plate assembly 100. Wherein, the liquid cooling cover plate assembly 100 and the waterproof and breathable bottom cover assembly 200 are combined for the installation and protection of the whole controller; and the liquid cooling cover plate assembly 100 can also be used for exchanging heat between the inside heat and the outside heat of the controller, so that the integral heat dissipation of the controller is realized, the waterproof and breathable bottom cover assembly 200 can also be used for exchanging moisture inside the controller with the outside, the moisture accumulated inside the controller is ensured to volatilize into the outside environment, the waterproof effect is achieved, and the risk of short circuit of electronic components caused by condensation of water vapor inside the controller is eliminated. The control PCBA300 is used for controlling the whole operation of the domain controller, and the multi-medium combined heat conduction assembly 400 is used for rapidly transmitting the heat of the heating chip to the liquid cooling cover plate assembly 100, and meanwhile, the heat dissipation area of the heating chip is increased, and the whole heat dissipation efficiency of the domain controller is improved.

Referring further to fig. 2, the liquid cooling cover plate assembly 100 includes a liquid cooling channel cavity 110, and a liquid cooling cover plate 120 disposed on top of the liquid cooling channel cavity 110; referring to fig. 3, the liquid cooling channel cavity 110 includes a hollow channel cavity body 111, a plurality of liquid cooling heat dissipation columns 112 uniformly protruding into the channel cavity body 111, and a liquid inlet pipe 113 and a liquid outlet pipe 114 connected to two opposite sides of the channel cavity body 111; preferably, the liquid cooling heat dissipation column 112 is a cylindrical heat dissipation column, a square column heat dissipation column, or a prismatic heat dissipation column structure, and the top end of the liquid cooling heat dissipation column 112 is abutted against the liquid cooling cover plate 120. When the heat of the heating chip is transferred to the liquid cooling heat dissipation column 112 through the runner cavity body 111, the cooling liquid flowing in the runner cavity body 111 can absorb the heat and take the heat out of the runner cavity body 111 through flowing; meanwhile, the top end of the liquid cooling heat dissipation column 112 is propped against the liquid cooling cover plate 120, heat can be transferred to the liquid cooling cover plate 120 through the liquid cooling heat dissipation column 112, and is dissipated to the outside of the controller through the liquid cooling cover plate 120, so that the overall heat dissipation efficiency of the vehicle-mounted domain controller is effectively improved.

Referring further to fig. 4, the waterproof and breathable bottom cover assembly 200 includes a controller bottom cover 210 adapted to the flow channel cavity body 111 of the liquid cooling cover assembly 100, and a waterproof and breathable valve 220 mounted on the controller bottom cover 210 for draining condensation inside the controller; preferably, the waterproof and breathable valve 220 is a check valve as in the prior art. When the humidity inside the controller is higher and has humidity difference with the outside, the waterproof ventilation valve 220 allows water molecules with higher concentration inside the controller to be discharged into the outside air through the waterproof ventilation valve 220 until the inside and the outside of the controller reach humidity balance, and the outside water molecules cannot enter the inside of the controller due to the fact that the volume of the outside water molecules exceeds the gaps among the film fibers in the waterproof ventilation valve 220, so that the controller assembled by the waterproof ventilation bottom cover assembly 200 can meet the waterproof and dustproof requirements of IP6K8, meanwhile, the condensation risk caused by moisture accumulation inside the controller is eliminated, and the reliability and the safety of the whole controller are improved.

Example 2:

Referring to fig. 1-4, the waterproof and high heat dissipation liquid-cooled vehicle-mounted domain controller in this embodiment is the same as that in embodiment 1, and includes a liquid-cooled cover plate assembly 100 and a waterproof and air-permeable bottom cover assembly 200 assembled together, a control PCBA300 disposed between the liquid-cooled cover plate assembly 100 and the waterproof and air-permeable bottom cover assembly 200, and a multi-medium combined heat-conducting assembly 400 correspondingly disposed between a heat-generating chip of the control PCBA300 and the liquid-cooled cover plate assembly 100. The main difference is that, in this embodiment, based on embodiment 1, the multi-medium combined heat conduction assembly 400 is further designed, and the specific design is as follows:

Referring to fig. 5, the multi-medium combined heat conducting assembly 400 includes a first ceramic heat conducting sheet 410 corresponding to a heat generating chip of the PCBA300, a second ceramic heat conducting sheet 420 corresponding to the first ceramic heat conducting sheet 410 and abutting against the flow channel cavity body 111 in the liquid cooling cover plate assembly 100, a graphene heat conducting member 430 corresponding to the first ceramic heat conducting sheet 410 and the second ceramic heat conducting sheet 420, a first heat conducting glue 440 disposed between the first ceramic heat conducting sheet 410 and the graphene heat conducting member 430, and a second heat conducting glue 450 disposed between the graphene heat conducting member 430 and the second ceramic heat conducting sheet 420. Preferably, the first heat-conducting glue 440 and the second heat-conducting glue 450 are coated heat-conducting glue layers or directly attached heat-conducting glue block structures.

Further, the cross-sectional area of the first ceramic heat conducting fin 410 is 1-1.5 times of the cross-sectional area of the heating chip of the PCBA300, and the cross-sectional area of the second ceramic heat conducting fin 420 is 0.8-1.5 times of the cross-sectional area of the heating chip of the PCBA 300; that is, the cross-sectional area of the first ceramic heat conducting fin 410 corresponding to the heat generating chip is at least the cross-sectional area of the heat generating chip, so that the heat conducting area of the assembly can be effectively increased, and the overall heat dissipation efficiency of the controller is improved; the sectional area of the second ceramic heat conducting fin 420 can be adaptively designed according to actual production requirements, and when the internal layout of the controller needs to be optimized, the sectional area of the second ceramic heat conducting fin 420 can be adaptively reduced; and when the overall heat dissipation efficiency of the controller needs to be improved, the sectional area can be properly increased. Further preferably, the first ceramic heat conducting fin 410 and the second ceramic heat conducting fin 420 are rectangular heat conducting fin structures adapted to the control PCBA300 heating chip, so that the contact area between each component can be effectively increased, and the overall heat dissipation efficiency of the controller is ensured.

Example 3:

Referring to fig. 1-5, the waterproof and high heat dissipation liquid-cooled vehicle-mounted domain controller in this embodiment is the same as that in embodiment 2, and includes a liquid-cooled cover plate assembly 100 and a waterproof and air-permeable bottom cover assembly 200 assembled together, a control PCBA300 disposed between the liquid-cooled cover plate assembly 100 and the waterproof and air-permeable bottom cover assembly 200, and a multi-medium combined heat-conducting assembly 400 correspondingly disposed between a heat-generating chip of the control PCBA300 and the liquid-cooled cover plate assembly 100. The main difference is that, in this embodiment, based on embodiment 2, the graphene heat conducting member 430 in the multi-medium combined heat conducting component 400 is further designed, and the specific design is as follows:

Referring to fig. 6, the graphene heat conducting member 430 is a stepped graphene heat conducting member, and the specific structure thereof includes a first heat conducting portion 431 disposed between the first ceramic heat conducting fin 410 and the second ceramic heat conducting fin 420, a second heat conducting portion 432 disposed adjacent to one side edge of the second ceramic heat conducting fin 420 and abutting against the flow channel cavity body 111 in the liquid cooling cover plate assembly 100, and a heat conducting joint portion 433 connected between the first heat conducting portion 431 and the second heat conducting portion 432. Further, the cross-sectional area of the first heat conducting part 431 is 0.8-1.5 times that of the first ceramic heat conducting fin 410, and the cross-sectional area of the second heat conducting part 432 is larger than or equal to that of the first heat conducting part 431; that is, the contact area between the multi-medium combined heat conduction assembly 400 and the liquid cooling cover plate assembly 100 is at least 2 times of that of the heating chip, so that the overall heat conduction and heat dissipation efficiency of the multi-medium combined heat conduction assembly 400 and the controller is effectively increased. Further preferably, the first heat conducting portion 431 is a rectangular heat conducting block structure adapted to the PCBA heating chip, and the second heat conducting portion 432 may be designed into a circular heat conducting block, an elliptical heat conducting block, a rectangular heat conducting block or a polygonal heat conducting block structure according to practical needs, and the specific structure is not limited as long as the contact area between the multi-medium combined heat conducting assembly 400 and the liquid cooling cover plate assembly 100 can be effectively enlarged.

Compared with the design of conducting heat by only adopting heat dissipation grease in the prior art, in embodiments 2 and 3, the ceramic heat conduction sheet is adopted to conduct heat, and meanwhile, the graphene heat conduction member 430 is adopted as a soaking layer heat conduction structure, so that the heat of the heating chip can be rapidly and uniformly transferred to the liquid cooling cover plate assembly 100, the contact area of the multi-medium combined heat conduction assembly 400 and the liquid cooling cover plate assembly 100 can be effectively increased by the graphene heat conduction member 430, the heat conduction area of the multi-medium combined heat conduction assembly 400 is enlarged, and the overall heat dissipation efficiency of the domain controller is improved.

According to the technical scheme of the embodiment, the waterproof high-heat-dissipation liquid-cooled vehicle-mounted domain controller is provided, so that the heat conduction area of the liquid-cooled cover plate assembly can be effectively enlarged, the heat dissipation efficiency of the liquid-cooled cover plate assembly is improved, and the overall heat dissipation efficiency and heat dissipation performance of the domain controller are effectively improved; and the waterproof breathable bottom cover component can enable moisture in the controller to exchange with the outside, so that the moisture accumulated in the controller can volatilize into the outside environment, a waterproof effect is achieved on the controller, and the risk of short circuit of electronic components caused by condensation of water vapor in the controller is eliminated.

In the description of the present utility model, it should be understood that the terms "orientation" or "positional relationship" are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and to simplify the description, rather than to indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the utility model.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature may include first and second features directly contacting each other, either above or below a second feature, or through additional features contacting each other, rather than directly contacting each other. Moreover, the first feature being above, over, and on the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being below, beneath, and beneath the second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is less level than the second feature.

While the utility model has been described in conjunction with the specific embodiments above, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, all such alternatives, modifications, and variations are included within the spirit and scope of the following claims.

Claims (10)

1. A waterproof, high heat dissipation liquid cooled vehicle domain controller comprising:

The liquid cooling cover plate component and the waterproof and breathable bottom cover component are mutually assembled into a whole;

the control PCBA is arranged between the liquid cooling cover plate assembly and the waterproof and breathable bottom cover assembly and is used for controlling the whole operation of the domain controller;

And the multi-medium combined heat conduction assembly is correspondingly arranged between the heating chip of the control PCBA and the liquid cooling cover plate assembly and is used for rapidly transmitting heat of the heating chip to the liquid cooling cover plate assembly, and meanwhile, the heat dissipation area of the heating chip is increased and the overall heat dissipation efficiency of the domain controller is improved.

2. The waterproof, high heat dissipation, liquid-cooled, vehicle-mounted domain controller of claim 1, wherein the multi-media combined heat conducting assembly comprises a first ceramic heat conducting strip disposed in correspondence with a heat generating chip of the control PCBA, a second ceramic heat conducting strip disposed in correspondence with the first ceramic heat conducting strip and in abutment with the liquid-cooled cover plate assembly, and a graphene heat conducting member disposed in correspondence between the first ceramic heat conducting strip and the second ceramic heat conducting strip.

3. The waterproof, high heat dissipation liquid-cooled vehicle-mounted domain controller of claim 2, wherein the cross-sectional area of the first ceramic thermally conductive sheet is 1-1.5 times the cross-sectional area of the control PCBA heat-generating chip; the cross section area of the second ceramic heat conducting fin is 0.8-1.5 times of the cross section area of the PCBA heating chip.

4. The waterproof, high heat dissipation liquid-cooled vehicle-mounted domain controller of claim 2, wherein the first ceramic heat conducting strip and the second ceramic heat conducting strip are rectangular heat conducting strip structures adapted to control PCBA heat generating chips.

5. The waterproof and high-heat-dissipation liquid-cooled vehicle-mounted domain controller according to claim 2, wherein the graphene heat-conducting member is a stepped graphene heat-conducting member, and comprises a first heat-conducting portion corresponding to and arranged between the first ceramic heat-conducting sheet and the second ceramic heat-conducting sheet, a second heat-conducting portion offset from the liquid-cooled cover plate assembly and arranged adjacent to one side edge of the second ceramic heat-conducting sheet, and a heat-conducting connection portion connected between the first heat-conducting portion and the second heat-conducting portion.

6. The waterproof, high heat dissipation liquid-cooled vehicle-mounted domain controller of claim 5, wherein the cross-sectional area of the first heat conducting portion is 0.8-1.5 times the cross-sectional area of the first ceramic heat conducting sheet, and the cross-sectional area of the second heat conducting portion is greater than or equal to the cross-sectional area of the first heat conducting portion.

7. The waterproof, high heat dissipation liquid-cooled vehicle-mounted domain controller of claim 5, wherein the first thermally conductive portion is a rectangular thermally conductive block structure adapted to control a PCBA heat-generating chip.

8. The waterproof, high heat dissipation, liquid-cooled, vehicle-mounted domain controller of claim 2, wherein the multi-media combined heat conducting assembly further comprises a first heat conducting glue disposed between the first ceramic heat conducting sheet and the graphene heat conducting piece, and a second heat conducting glue disposed between the graphene heat conducting piece and the second ceramic heat conducting sheet.

9. The waterproof, high heat dissipation, liquid-cooled, vehicle-mounted domain controller of claim 1, wherein the liquid-cooled cover plate assembly comprises a liquid-cooled runner cavity and a liquid-cooled cover plate disposed on top of the liquid-cooled runner cavity;

The liquid cooling runner cavity comprises a hollow runner cavity body, a plurality of liquid cooling heat dissipation columns uniformly protruding in the runner cavity body, and a liquid inlet pipeline and a liquid outlet pipeline connected to two opposite side edges of the runner cavity body.

10. The waterproof, high heat dissipation, liquid-cooled, vehicle-mounted domain controller of claim 1, wherein the waterproof, breathable bottom cover assembly comprises a controller bottom cover adapted to the liquid-cooled cover assembly, and a waterproof, breathable valve mounted to the controller bottom cover for draining condensation from the controller interior.