CN221102046U - Semiconductor wafer taking device - Google Patents

Abstract

The utility model discloses a semiconductor wafer taking device, which comprises a base, a suction assembly and a rotating assembly, wherein the suction assembly comprises a suction piece and a deformation structure, the deformation structure is arranged on the base, the suction piece is arranged on the deformation structure and is provided with a suction surface, the deformation structure is provided with an air inflation cavity, the deformation structure is elastic, and the air inflation cavity is connected with an external air source; one end of the rotating component is rotationally connected with the base, and the other end of the rotating component is connected with the deformation structure; when the suction surface is abutted with the wafer and the gas is filled in the gas filling cavity, the deformation structure is suitable for bearing the wafer, and when the suction surface is abutted with the wafer which is warped, the deformation structure elastically deforms and extrudes the gas in the gas filling cavity so as to enable the suction surface to incline and enable the suction surface to be abutted with a warping area on the wafer so as to suck the wafer which is warped. The semiconductor wafer taking device with the structure can hold wafers with warp deformation, avoids breaking, and is beneficial to improving the production efficiency of the wafers.

Description

Semiconductor wafer taking device

Technical Field

The utility model relates to the technical field of semiconductor wafer holding and conveying, in particular to a semiconductor wafer holding device.

Background

With the rapid development of electronic products, the semiconductor industry has put higher demands on the research and production of chips, and in order to improve the production efficiency, not only the manufacturing of chips, but also advanced packaging production gradually uses automation operation.

In the prior art, wafers used in processes such as chip manufacturing and wafer level packaging are placed in a wafer transfer box (FOUP) during the process of transferring between machines, and each process is taken out from a wafer on a clamping groove of the wafer transfer box by a manipulator and transferred to semiconductor manufacturing or packaging equipment to be operated. There are two general ways of holding a manipulator: one is to adopt a tray type, and limit grooves are arranged at two finger ends of a manipulator to ensure that a wafer is taken by the manipulator; another type of suction cup is typically three suction cups mounted on the end piece of the manipulator, each at the junction of two fingers and a finger. The working process is as follows: the manipulator takes each wafer from the wafer transfer box, then places the wafer on a wafer chuck (Pedestal) of a wafer bearing cavity of the semiconductor device, and after the wafer is processed, the manipulator takes the processed wafer out and places the wafer back on a wafer clamping groove in the wafer transfer box, and in the process of taking the wafer by the manipulator, the manipulator takes the wafer through a finger or a sucker on the finger arranged on the manipulator.

However, when the wafer level fan-out package is operated, due to the large difference of thermal expansion coefficients between the plastic package material and the chips, the plastic package wafer generates large buckling deformation, so that the wafer with buckling cannot be held by a mechanical finger alone, but the wafer cannot be smoothly sucked at the buckling deformation position due to insufficient adsorption force on the back of the wafer by adopting a conventional sucking disc, and sometimes the buckling wafer is easy to slide off from a mechanical arm in the conveying process even if being picked, so that the wafer cannot be conveyed into process equipment or cannot be taken out from the equipment to be conveyed back into a conveying box, and the wafer in the conveying process often breaks to cause loss.

Disclosure of utility model

Therefore, the technical problem to be solved by the utility model is to overcome the defect that when the wafer is sucked by the sucker on the manipulator, the sucker cannot suck the position of the wafer with buckling deformation, so that the wafer cannot be conveyed or the wafer smoothly falls down to break the wafer in the conveying process.

To this end, the present utility model provides a semiconductor wafer picking apparatus comprising:

A base;

The suction assembly comprises a suction member and a deformation structure, the deformation structure is arranged on the base, the suction member is arranged on the deformation structure, the suction member is provided with a suction surface, the suction surface is suitable for being abutted with the wafer under the action of external force so as to suck the wafer, the deformation structure is provided with an air inflation cavity, the deformation structure is elastic, and the air inflation cavity is suitable for being connected with an external air source;

One end of the rotating component is rotationally connected with the base, and the other end of the rotating component is connected with the deformation structure so as to drive the deformation structure and the suction piece to rotate under the action of external force;

When the suction surface is abutted with the wafer and the gas is filled in the gas filling cavity, the deformation structure is elastically deformed under the action of gravity of the wafer so as to bear the wafer, and when the suction surface is abutted with the wafer which is warped, the deformation structure is elastically deformed and extrudes the gas in the gas filling cavity so as to enable the suction surface to incline and enable the suction surface to be abutted with a warping area on the wafer so as to suck the wafer which is warped.

Optionally, in the semiconductor wafer taking device, the deformation structure includes:

The elastic piece is connected with one end of the rotating assembly and is provided with a limiting cavity;

The deformation piece is arranged in the limiting cavity, the inflation cavity is formed in the deformation piece, the deformation piece is in an inflation state of inflating gas in the inflation cavity and a deflation state of lacking gas in the inflation cavity, and the deformation piece is placed in the limiting cavity in the deflation state.

Optionally, the elastic piece includes a mounting portion, a supporting portion and a plurality of limiting portions, the mounting portion and the supporting portion are oppositely disposed, the mounting portion is adapted to be connected with the rotating assembly, the sucking piece is disposed on the supporting portion, any one of the limiting portions is disposed between the mounting portion and the supporting portion, and all of the limiting portions jointly form the limiting cavity.

Optionally, in the above semiconductor wafer taking device, the deforming member is provided with a communicating portion, and the communicating portion is adapted to communicate the inflating chamber with an external air source, so that the deforming member is switched between the deflated state and the inflated state.

Optionally, in the semiconductor wafer taking device, the rotating assembly includes a first rotating member, one end of the first rotating member is rotationally connected with the base, and the other end of the first rotating member is connected with the deformation structure, so as to drive the deformation structure to rotate relative to the base under the action of external force.

Optionally, in the above semiconductor wafer taking device, the rotating assembly further includes a second rotating member, one end of the second rotating member is rotationally connected with the first rotating member, and the other end of the second rotating member is connected with the deformation structure, so as to drive the deformation structure to rotate relative to the first rotating member under the action of external force.

Optionally, in the above semiconductor wafer taking device, the rotating assembly further includes a third rotating member, one end of the third rotating member is rotationally connected with the second rotating member, and the other end of the third rotating member is connected with the deformation structure, so as to drive the deformation structure to rotate relative to the second rotating member under the action of external force.

Optionally, the semiconductor wafer taking device further includes a driving assembly, the driving assembly includes a first driving member, the first driving member is disposed on the base, and a driving end of the first driving member is connected with the first rotating member, so as to drive the first rotating member to rotate relative to the base.

Optionally, in the semiconductor wafer taking device, the driving assembly further includes a second driving member, the second driving member is disposed on the first rotating member, and a driving end of the second driving member is connected to the second rotating member, so as to drive the second rotating member to rotate relative to the first rotating member.

Optionally, in the semiconductor wafer taking device, the driving assembly further includes a third driving member, the third driving member is disposed on the second rotating member, and a driving end of the third driving member is connected to the third rotating member, so as to drive the third rotating member to rotate relative to the second rotating member.

The technical scheme provided by the utility model has the following advantages:

1. The utility model provides a semiconductor wafer taking device, which comprises a base, a suction assembly and a rotating assembly, wherein the suction assembly comprises a suction piece and a deformation structure, the deformation structure is arranged on the base, the suction piece is arranged on the deformation structure, the suction piece is provided with a suction surface, the suction surface is suitable for being abutted with a wafer under the action of external force so as to suck the wafer, the deformation structure is provided with an air inflation cavity, the deformation structure is elastic, and the air inflation cavity is suitable for being connected with an external air source; one end of the rotating component is rotationally connected with the base, and the other end of the rotating component is connected with the deforming structure so as to drive the deforming structure and the absorbing piece to rotate under the action of external force; when the suction surface is abutted with the wafer and the gas is filled in the gas filling cavity, the deformation structure elastically deforms under the action of gravity of the wafer to bear the wafer, and when the suction surface is abutted with the wafer which is warped, the deformation structure elastically deforms and extrudes the gas in the gas filling cavity to enable the suction surface to incline and enable the suction surface to be abutted with a warping area on the wafer so as to suck the wafer which is warped.

The semiconductor wafer taking device with the structure comprises a rotating component and a sucking component, wherein the rotating component is arranged between the base and the sucking component, namely one end of the rotating component is connected with the base, the other end of the rotating component is connected with the sucking component, so that the sucking component is driven to rotate on the base under the action of external force, the sucking component comprises a sucking component and a deformation structure, the deformation structure is arranged on the rotating component, the sucking component is arranged on the deformation structure and is provided with a sucking surface, the sucking surface on the sucking component can be abutted with a wafer when the rotating component drives the sucking component to rotate on the base, the sucking component can suck the wafer through the sucking surface, and the holding of the wafer is completed, wherein the sucking surface is generally abutted with the back surface of the wafer, and the sucking component sends the wafer into a wafer conveying box under the driving of the rotating component, so that the movement of the wafer is completed. The deformation structure is provided with an air inflation cavity which is connected with an external air source, and has elasticity, so that when the air inflation cavity is inflated into the air inflation cavity and is filled with air, the air inflation cavity can press the deformation structure to elastically deform, and when the suction surface on the suction piece is abutted against the perfect wafer, the deformation structure can deform under the action of self gravity of the wafer, and the deformation structure and the suction piece support the wafer. When the suction surface on the suction member is abutted with the wafer with warp deformation, the deformation structure is correspondingly deformed under the action of self gravity of the wafer, and the suction surface is abutted with the warp area of the wafer, so that the suction member extrudes the deformation structure and enables gas to move in the inflation cavity, the shape of the inflation cavity is changed, the suction surface of the suction member is inclined, the suction surface on the suction member is abutted with the warp area on the wafer, the wafer is sucked, the suction member sends the wafer into the wafer conveying box under the drive of the rotating assembly, the movement of the wafer with warp deformation is completed, the smooth holding and conveying of the warp wafer are ensured, the production efficiency of the wafer is improved, and the situation that the wafer is broken due to unstable holding is avoided.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic view of a semiconductor wafer picking apparatus according to an embodiment of the present utility model;

Fig. 2 is a schematic structural diagram of a semiconductor wafer picking apparatus according to an embodiment of the present utility model;

FIG. 3 is a schematic view of a collapsed state structure of a suction assembly provided in an embodiment of the present utility model;

FIG. 4 is a schematic structural view of an elastic structure provided in an embodiment of the present utility model;

FIG. 5 is a schematic view of an inflated state structure of a suction assembly provided in an embodiment of the present utility model;

FIG. 6 is a schematic view showing the inclination of a suction member in the suction assembly provided in the embodiment of the present utility model;

Reference numerals illustrate:

1-a base;

2-a suction assembly; 21-a suction piece; 22-deformed structure; 221-an elastic member; 2211—an installation part; 2212-a support; 2213—a limit part; 222-deformation;

3-a rotating assembly; 31-a first rotating member; 32-a second rotating member; 33-a third rotating member;

4-wafer.

Detailed Description

The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In addition, the technical features of the different embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.

Example 1

The embodiment provides a semiconductor wafer taking device, as shown in fig. 1 to 6, comprising a base 1, a suction component 2 and a rotating component 3, wherein the suction component 2 comprises a suction piece 21 and a deformation structure 22, the deformation structure 22 is arranged on the base 1, the suction piece 21 is arranged on the deformation structure 22, the suction piece 21 is provided with a suction surface, the suction surface is suitable for being abutted with a wafer 4 under the action of external force so as to suck the wafer 4, the deformation structure 22 is provided with an air filling cavity, the deformation structure 22 is elastic, and the air filling cavity is suitable for being connected with an external air source; one end of the rotating component 3 is rotationally connected with the base 1, and the other end is connected with the deforming structure 22 so as to drive the deforming structure 22 and the absorbing piece 21 to rotate under the action of external force; when the suction surface is abutted against the wafer 4 and the gas is filled into the gas filling cavity, the deformation structure 22 elastically deforms under the action of gravity of the wafer 4 to bear the wafer 4, and when the suction surface is abutted against the wafer 4 with warpage, the deformation structure 22 elastically deforms and extrudes the gas in the gas filling cavity to enable the suction surface to incline and enable the suction surface to be abutted against the warpage area on the wafer 4 so as to suck the wafer 4 with warpage.

The semiconductor wafer taking device with the structure is characterized in that the rotating component 3 and the absorbing component 2 are arranged on the base 1, wherein the rotating component 3 is arranged between the base 1 and the absorbing component 2, namely one end of the rotating component 3 is connected with the base 1, the other end of the rotating component 3 is connected with the absorbing component 2, so that the absorbing component 2 is driven to rotate on the base 1 under the action of external force, the absorbing component 2 comprises an absorbing component 21 and a deformation structure 22, the absorbing component 21 is a sucking disc in the embodiment, the deformation structure 22 is arranged on the rotating component 3, the absorbing component 21 is arranged on the deformation structure 22, and the absorbing component 21 is provided with an absorbing surface, so that when the rotating component 3 drives the absorbing component 21 to rotate on the base 1, the absorbing surface on the absorbing component 21 is enabled to be abutted with the wafer 4, and then the absorbing component 21 absorbs the wafer 4 through the absorbing surface so as to finish the taking of the wafer 4, wherein the absorbing surface is generally abutted with the back surface of the wafer 4, and the absorbing component 2 is driven by the rotating component 3 to send the wafer 4 into the wafer 4 to the conveying box so as to finish the movement of the wafer 4.

Specifically, the deformation structure 22 has an inflation cavity, and the inflation cavity is connected with an external air source, and the deformation structure 22 has elasticity, so that when the inflation cavity is inflated and filled with air, the inflation cavity can press the deformation structure 22 to elastically deform, and when the suction surface on the suction piece 21 is abutted against the perfect wafer 4, the deformation structure 22 deforms under the action of self gravity of the wafer 4, and the deformation structure 22 and the suction piece 21 support the wafer 4.

In addition, when the suction surface on the suction piece 21 is abutted against the wafer 4 with warp deformation, the deformation structure 22 will also generate corresponding deformation under the action of the self gravity of the wafer 4, and as the suction surface is abutted against the warp area of the wafer 4, the suction piece 21 extrudes the deformation structure 22 and makes the gas move in the inflation cavity, so that the shape of the inflation cavity is changed, and the suction surface of the suction piece 21 is inclined, and finally the suction surface on the suction piece 21 is abutted against the warp area on the wafer 4 and sucks the wafer 4, so that the suction piece 21 sends the wafer 4 into the wafer 4 conveying box under the drive of the rotating assembly 3, thereby completing the movement of the wafer 4 with warp deformation, avoiding the suction piece 21 from being incapable of sucking the wafer 4 with warp deformation, avoiding human intervention, reducing the slipping and breaking of the wafer 4 in the conveying process, thereby being beneficial to improving the production efficiency of the wafer 4 and advanced packaging, and ensuring the smooth holding and conveying of the wafer 4.

As shown in fig. 3 to 6, the deformation structure 22 includes an elastic member 221 and a deformation member 222, the elastic member 221 is connected with one end of the rotating assembly 3, and the elastic member 221 has a limiting cavity; the deformation piece 222 is arranged in the limiting cavity, the inflation cavity is formed in the deformation piece 222, the deformation piece 222 has an inflation state that the inflation cavity is filled with gas and a deflation state that the inflation cavity is lack of gas, and the deformation piece 222 is placed in the limiting cavity in the deflation state.

The semiconductor wafer taking device with the above structure comprises the elastic member 221 and the deformation member 222 by arranging the deformation member 22, wherein the deformation member 222 is an air bag in the embodiment, the elastic member 221 is connected with one end of the rotating assembly 3 far away from the base 1, the elastic member 221 is provided with a limiting cavity, the deformation member 222 is arranged in the limiting cavity, meanwhile, the inflating cavity is formed in the deformation member 222, the inflating cavity is provided with an inflating state in which the inflating cavity is inflated and a deflating state in which the inflating cavity lacks gas, when the deformation member 222 is in the deflating state, the deformation member 222 can be placed in the limiting cavity, and when the deformation member 222 is in the inflating state, the deformation member 222 can squeeze the elastic member 221 and enable the elastic member 221 to elastically deform, so that when an absorbing surface on the absorbing member 21 is abutted against the wafer 4, the elastic member 221 and the deformation member 222 can support the wafer 4.

As shown in fig. 4, the elastic member 221 includes an installation portion 2211, a supporting portion 2212 and a plurality of limiting portions 2213, the installation portion 2211 and the supporting portion 2212 are oppositely disposed, the installation portion 2211 is adapted to be connected with the rotating assembly 3, the suction member 21 is disposed on the supporting portion 2212, any one of the limiting portions 2213 is disposed between the installation portion 2211 and the supporting portion 2212, and all of the limiting portions 2213 jointly form a limiting cavity.

In the semiconductor wafer taking device with the above structure, the elastic member 221 includes the mounting portion 2211, the supporting portion 2212 and the limiting portion 2213, where the mounting portion 2211 is a mounting portion in this embodiment, the supporting portion 2212 is a supporting plate in this embodiment, the limiting portion 2213 is a limiting post in this embodiment, the mounting portion 2211 and the supporting portion 2212 are oppositely disposed, the limiting portion 2213 is disposed between the mounting portion 2211 and the supporting portion 2212, the mounting portion 2211 can be connected with the rotating group, the supporting portion 2212 can be connected with the suction member 21, the limiting portion 2213 is specifically provided with three limiting portions, and the three limiting portions 2213 together form a limiting cavity, so that when the deforming member 222 is in a deflated state, the deforming member 222 can be placed in the limiting cavity, and when the deforming member 222 is in an inflated state, the deforming member 222 is respectively abutted against the mounting portion 2211, the supporting portion 2212 and the limiting portion 2213, so that the deforming member 222 can squeeze the elastic member 221 and elastically deform the elastic member 221.

As shown in fig. 3 to 4, the deforming member 222 is provided with a communicating portion, and the communicating portion is adapted to communicate the inflating chamber with an external air source, so that the deforming member 222 is switched between a deflated state and an inflated state.

The semiconductor wafer taking device with the structure can enable the external gas to flow into the inflating cavity through the communicating part and enable the deforming part 222 to be in an inflating state, so that the deforming part 222 extrudes the elastic part 221, or enable the gas in the inflating cavity to flow out to the outside through the communicating part and enable the deforming part 222 to be in a shrunken state, so that the deforming part 222 can be placed in the limiting cavity.

As shown in fig. 1 and 2, the rotating assembly 3 includes a first rotating member 31, one end of the first rotating member 31 is rotatably connected with the base 1, and the other end of the first rotating member is connected with the deformation structure 22, so as to drive the deformation structure 22 to rotate relative to the base 1 under the action of an external force.

The semiconductor wafer taking device with the structure comprises the rotating component 3, wherein the rotating component 3 comprises the first rotating component 31, the first rotating component 31 is a first rotating rod in the embodiment, one end of the first rotating component 31 is rotationally connected with the base 1, and the other end of the first rotating component is connected with the deformation structure 22, so that the deformation structure 22 can be driven to rotate back and forth relative to the base 1 under the action of external force, further the absorbing component 21 arranged on the deformation structure 22 is abutted with the wafer 4, and after the wafer 4 is absorbed by the absorbing component 21, the absorbing component 21 is driven to place the wafer 4 into the wafer 4 conveying box.

As shown in fig. 1 and 2, the rotating assembly 3 further includes a second rotating member 32, one end of the second rotating member 32 is rotatably connected to the first rotating member 31, and the other end of the second rotating member 32 is connected to the deforming structure 22, so as to drive the deforming structure 22 to rotate relative to the first rotating member 31 under the action of an external force.

The semiconductor wafer taking device with the structure further comprises the second rotating member 32 through the arrangement of the rotating assembly 3, the second rotating member 32 is a second rotating rod in the embodiment, one end of the second rotating member 32 is rotationally connected with the first rotating member 31, and the other end of the second rotating member 32 is connected with the deforming structure 22, so that the deforming structure 22 can be driven to rotate back and forth relative to the first rotating member 31 under the action of external force, further the absorbing member 21 arranged on the deforming structure 22 is abutted to the wafer 4, after the absorbing member 21 absorbs the wafer 4, the absorbing member 21 is driven to place the wafer 4 into the wafer 4 conveying box, and the moving distance of the absorbing member 21 is prolonged through the arrangement of the second rotating member 32 between the deforming structure 22 and the first rotating member 31, so that the flexibility of the absorbing member 21 for absorbing the wafer 4 is improved.

As shown in fig. 1 and 2, the rotating assembly 3 further includes a third rotating member 33, one end of the third rotating member 33 is rotatably connected to the second rotating member 32, and the other end of the third rotating member 33 is connected to the deforming structure 22, so as to drive the deforming structure 22 to rotate relative to the second rotating member 32 under the action of an external force.

The semiconductor wafer taking device with the structure further comprises a third rotating member 33 through the arrangement of the rotating assembly 3, the third rotating member 33 is a third rotating rod in the embodiment, one end of the third rotating member 33 is rotationally connected with the second rotating member 32, and the other end of the third rotating member 33 is connected with the deforming structure 22, so that the deforming structure 22 can be driven to rotate back and forth relative to the second rotating member 32 under the action of external force, further the absorbing member 21 arranged on the deforming structure 22 is abutted to the wafer 4, after the absorbing member 21 absorbs the wafer 4, the absorbing member 21 is driven to place the wafer 4 into the wafer 4 conveying box, and the moving distance of the absorbing member 21 is further prolonged through the arrangement of the third rotating member 33 between the deforming structure 22 and the second rotating member 32, so that the flexibility of the absorbing member 21 for absorbing the wafer 4 is further improved.

The semiconductor wafer taking device provided in this embodiment, as shown in fig. 1 and 2, further includes a driving assembly, where the driving assembly includes a first driving member, the first driving member is disposed on the base 1, and a driving end of the first driving member is connected to the first rotating member 31 to drive the first rotating member 31 to rotate relative to the base 1.

The semiconductor wafer taking device with the structure comprises a driving assembly arranged on the base 1, wherein the driving assembly specifically comprises a first driving piece, the first driving piece is a first servo motor in the embodiment, the first driving piece is arranged on the base 1, and the driving end of the first driving piece is connected with the first rotating piece 31, so that the first rotating piece 31 is driven to rotate back and forth relative to the base 1, and the deformation structure 22 and the sucking piece 21 are driven to suck the wafer 4 or place the wafer 4 in a wafer 4 conveying box.

In the semiconductor wafer picking device provided in this embodiment, as shown in fig. 1 and fig. 2, the driving assembly further includes a second driving member disposed on the first rotating member 31, and the driving ends of the second driving member are connected to the second rotating member 32 to drive the second rotating member 32 to rotate relative to the first rotating member 31.

The semiconductor wafer taking device with the structure further comprises a second driving piece through the driving assembly, the second driving piece is a second servo motor in the embodiment, the second driving piece is arranged on the first rotating piece 31, and the driving end of the second driving piece is connected with the second rotating piece 32, so that the second rotating piece 32 is driven to rotate back and forth relative to the first rotating piece 31, and the deformation structure 22 and the suction piece 21 are driven to suck the wafer 4 or place the wafer 4 in the wafer 4 conveying box.

As shown in fig. 1 and 2, the driving assembly further includes a third driving member disposed on the second rotating member 32, and the driving end of the third driving member is connected to the third rotating member 33 to drive the third rotating member 33 to rotate relative to the second rotating member 32.

The semiconductor wafer taking device with the above structure further comprises a third driving piece, the third driving piece is a third servo motor in the embodiment, the third driving piece is arranged on the second rotating piece 32, and the driving end of the third driving piece is connected with the third rotating piece 33, so that the third rotating piece 33 is driven to rotate back and forth relative to the second rotating piece 32, and the deformation structure 22 and the suction piece 21 are driven to suck the wafer 4 or place the wafer 4 in the wafer 4 conveying box.

The utility model provides a semiconductor wafer taking device, which comprises the following steps:

First, the first driving member drives the first rotating member 31 to rotate, and the first rotating member 31 drives the second rotating member 32, the third rotating member 33 and the suction assembly 2 to synchronously rotate; then, the second driving member drives the second rotating member 32 to rotate, and the second rotating member 32 drives the third rotating member 33 and the suction assembly 2 to synchronously rotate; then, the third driving piece drives the third rotating piece 33 to rotate, and the third rotating piece 33 drives the suction assembly 2 to synchronously rotate; then, the suction member 21 on the suction member 21 abuts against the wafer 4, and sucks the wafer 4; finally, the suction piece 21 is driven by the rotating component 3 to place the wafer 4 in the wafer 4 conveying box. Thus, the picking process of the semiconductor wafer picking device is completed.

The utility model provides a semiconductor wafer taking device, which is provided by a rotating component 3 and a sucking component 2 arranged on a base 1, wherein the rotating component 3 is arranged between the base 1 and the sucking component 2, namely one end of the rotating component 3 is connected with the base 1, the other end is connected with the sucking component 2, so that the sucking component 2 is driven to rotate on the base 1 under the action of external force, the sucking component 2 comprises a sucking component 21 and a deforming structure 22, wherein the deforming structure 22 is arranged on the rotating component 3, the sucking component 21 is arranged on the deforming structure 22, and the sucking component 21 is provided with a sucking surface, so that when the rotating component 3 drives the sucking component 21 to rotate on the base 1, the sucking surface on the sucking component 21 can be abutted with a wafer 4, and then the sucking component 21 sucks the wafer 4 through the sucking surface to finish the holding of the wafer 4, wherein the sucking surface is generally abutted with the back surface of the wafer 4, and under the drive of the rotating component 3, the sucking component 2 sends the wafer 4 into the wafer 4 conveying box to finish the movement of the wafer 4, the deforming structure 22 is provided with an inflating cavity, the inflating cavity is connected with an external air source, the deforming structure 22 is elastic, so that when the inflating cavity is inflated and filled with the inflating cavity, the inflating cavity presses the deforming structure 22 to elastically deform, when the sucking surface on the sucking component 21 is abutted with the perfect wafer 4, the deforming structure 22 deforms under the action of self gravity of the wafer 4, the deforming structure 22 and the sucking component 21 support the wafer 4, and when the sucking surface on the sucking component 21 is abutted with the wafer 4 with warp deformation, the deforming structure 22 correspondingly deforms under the action of self gravity of the wafer 4, and because the sucking surface is abutted with the warp area of the wafer 4, the suction piece 21 is made to squeeze the deformation structure 22, and the gas is made to move in the inflation cavity, so that the shape of the inflation cavity is changed, the suction surface of the suction piece 21 is inclined, the suction surface of the suction piece 21 is finally made to abut against the area of the wafer 4, which is warped, and the wafer 4 is sucked, so that the suction piece 21 sends the wafer 4 into the wafer 4 conveying box under the driving of the rotating assembly 3, the movement of the wafer 4, which is warped, is completed, the phenomenon that the suction piece 21 cannot suck the wafer 4, which is warped, is avoided, the manual intervention is avoided, the sliding breakage of the warped wafer 4 in the conveying process is reduced, the production efficiency of manufacturing and advanced packaging of the wafer 4 is improved, and the smooth holding and conveying of the warped wafer 4 are ensured.

It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the utility model.

Claims (10)

1. A semiconductor wafer handling device adapted to handle a wafer (4), comprising:

A base (1);

The suction assembly (2) comprises a suction piece (21) and a deformation structure (22), wherein the deformation structure (22) is arranged on the base (1), the suction piece (21) is arranged on the deformation structure (22), the suction piece (21) is provided with a suction surface, the suction surface is suitable for being abutted with the wafer (4) under the action of external force so as to suck the wafer (4), the deformation structure (22) is provided with an air charging cavity, the deformation structure (22) is elastic, and the air charging cavity is suitable for being connected with an external air source;

The rotating assembly (3), one end of the rotating assembly (3) is rotationally connected with the base (1), and the other end of the rotating assembly is connected with the deformation structure (22) so as to drive the deformation structure (22) and the suction piece (21) to rotate under the action of external force;

When the suction surface is abutted with the wafer (4) and the gas is filled into the gas filling cavity, the deformation structure (22) elastically deforms under the action of gravity of the wafer (4) so as to bear the wafer (4), and when the suction surface is abutted with the wafer (4) which is warped, the deformation structure (22) elastically deforms and extrudes the gas in the gas filling cavity so as to enable the suction surface to incline, and enable the suction surface to be abutted with a warping area on the wafer (4) so as to suck the warped wafer (4).

2. The semiconductor wafer handling device according to claim 1, wherein the deformation structure (22) comprises:

An elastic piece (221) connected with one end of the rotating assembly (3), wherein the elastic piece (221) is provided with a limiting cavity;

The deformation piece (222) is arranged in the limiting cavity, the inflation cavity is formed in the deformation piece (222), the deformation piece (222) is in an inflation state that gas is inflated in the inflation cavity and in a deflation state that gas is absent in the inflation cavity, and the deformation piece (222) is placed in the limiting cavity in the deflation state.

3. The semiconductor wafer taking device according to claim 2, wherein the elastic member (221) comprises a mounting portion (2211), a supporting portion (2212) and a plurality of limiting portions (2213), the mounting portion (2211) and the supporting portion (2212) are oppositely arranged, the mounting portion (2211) is suitable for being connected with the rotating assembly (3), the suction member (21) is arranged on the supporting portion (2212), any one of the limiting portions (2213) is arranged between the mounting portion (2211) and the supporting portion (2212), and all of the limiting portions (2213) jointly form the limiting cavity.

4. A semiconductor wafer handling device according to claim 2 or 3, wherein the deforming member (222) is provided with a communication portion adapted to communicate the inflating chamber with an external air source to switch the deforming member (222) between the deflated state and the inflated state.

5. The semiconductor wafer taking apparatus according to claim 4, wherein the rotating assembly (3) comprises a first rotating member (31), one end of the first rotating member (31) is rotatably connected to the base (1), and the other end of the first rotating member is connected to the deformation structure (22), so as to drive the deformation structure (22) to rotate relative to the base (1) under the action of an external force.

6. The semiconductor wafer handling device according to claim 5, wherein the rotating assembly (3) further comprises a second rotating member (32), one end of the second rotating member (32) is rotatably connected to the first rotating member (31), and the other end of the second rotating member is connected to the deformation structure (22), so as to drive the deformation structure (22) to rotate relative to the first rotating member (31) under the action of an external force.

7. The semiconductor wafer handling device according to claim 6, wherein the rotating assembly (3) further comprises a third rotating member (33), one end of the third rotating member (33) is rotatably connected to the second rotating member (32), and the other end of the third rotating member is connected to the deformation structure (22), so as to drive the deformation structure (22) to rotate relative to the second rotating member (32) under the action of an external force.

8. The semiconductor wafer pickup device according to claim 7, further comprising a driving assembly including a first driving member disposed on the base (1), the driving end of the first driving member being connected to the first rotating member (31) to drive the first rotating member (31) to rotate relative to the base (1).

9. The semiconductor wafer handling device according to claim 8, wherein the driving assembly further comprises a second driving member disposed on the first rotating member (31), and the driving ends of the second driving member are connected to the second rotating member (32) to drive the second rotating member (32) to rotate relative to the first rotating member (31).

10. The semiconductor wafer handling device according to claim 9, wherein the driving assembly further comprises a third driving member disposed on the second rotating member (32), and the driving end of the third driving member is connected to the third rotating member (33) to drive the third rotating member (33) to rotate relative to the second rotating member (32).