CN220753424U - Novel solder resist structure of ceramic substrate - Google Patents
Novel solder resist structure of ceramic substrate Download PDFInfo
- Publication number
- CN220753424U CN220753424U CN202322344475.XU CN202322344475U CN220753424U CN 220753424 U CN220753424 U CN 220753424U CN 202322344475 U CN202322344475 U CN 202322344475U CN 220753424 U CN220753424 U CN 220753424U
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- layer
- solder resist
- plating
- plated
- resist structure
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 42
- 239000000919 ceramic Substances 0.000 title claims abstract description 29
- 239000000758 substrate Substances 0.000 title claims abstract description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 50
- 238000007747 plating Methods 0.000 claims abstract description 47
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 25
- 238000007789 sealing Methods 0.000 claims abstract description 23
- 238000001704 evaporation Methods 0.000 claims abstract description 12
- 239000003292 glue Substances 0.000 claims abstract description 11
- 230000008020 evaporation Effects 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 80
- 239000012790 adhesive layer Substances 0.000 claims description 19
- 229920002120 photoresistant polymer Polymers 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000001259 photo etching Methods 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to the technical field of solder resist structures, and discloses a novel solder resist structure of a ceramic substrate, wherein the ceramic substrate comprises a ceramic sheet and a gold-plated pattern plated on the ceramic sheet, the solder resist structure is arranged on the gold-plated pattern, and the solder resist structure comprises a glue layer, a sealing edge layer, a nickel layer and a pre-plating layer; the edge sealing layer is arranged at the edge of the gold-plated pattern. The ceramic solder resist design is made by adopting the evaporation nickel plating, so that the problems of poor precision of solder resist position, small solder resist thickness and shape selectivity and the like in the conventional ceramic solder resist design which mostly adopts green oil and PI are solved; the uniform film can be formed on the substrate through evaporating nickel plating, so that the consistency of the coating is improved, and the problem of poor precision of the solder resist position is solved; meanwhile, the pre-plating layer can adapt to base materials with different shapes in an evaporation plating mode, comprises complex concave-convex surfaces, expands the shape selectivity of the solder resist, and meanwhile, the nickel layer is arranged on the surface to cover the pre-plating layer, so that the adhesion of the nickel layer is improved.
Description
Technical Field
The utility model relates to the technical field of solder resist structures, in particular to a novel solder resist structure of a ceramic substrate.
Background
Ceramic substrates are a common base material for the fabrication of various micro-nano devices and elements such as electronic, optical, sensor, etc. The impedance structure of the ceramic substrate generally refers to a specific pattern or structure of electrical properties fabricated on the surface of the ceramic substrate to meet specific circuit requirements; in the prior art, when ceramic solder resist is designed and manufactured, the problems of poor precision of the position of the solder resist, uneven solder resist thickness, limited shape selectivity and the like can be possibly met, and in order to improve the problems in the aspect, the application provides a novel solder resist structure of a ceramic substrate.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides a novel solder resist structure of a ceramic substrate, and solves the problems in the background art.
In order to achieve the above purpose, the utility model is realized by the following technical scheme:
the novel solder resist structure of the ceramic substrate comprises a ceramic sheet and a gold-plated pattern plated on the ceramic sheet, wherein the solder resist structure is arranged on the gold-plated pattern and comprises a glue layer, a sealing edge layer, a nickel layer and a pre-plating layer;
the edge sealing layer is arranged at the edge of the gold-plated pattern;
the adhesive layer is arranged on the gold-plated pattern through a photoetching technology;
the pre-plating layer is evaporated and plated on the adhesive layer and the edge sealing layer;
the nickel layer is evaporated and plated on the pre-plating layer.
Through the technical scheme, the problems of improved welding position precision, small welding thickness, small shape selectivity and the like are formed by adopting edge sealing design and different connection modes.
Optionally, the glue layer adopts AZ4620 photoresist, the banding layer wraps the glue layer, the banding layer is consistent with the glue layer in thickness.
Through the technical scheme, the adhesive layer made of the material is arranged in the edge sealing layer and is formed in parallel in a consistent manner.
Optionally, a plurality of caulking grooves are formed in the surface of the adhesive layer.
Through the technical scheme, a plurality of caulking grooves are formed, so that the connection strength is high in the process of plating.
Optionally, the pre-plating layer is adhered to the inner surface of the caulking groove in a smooth shape.
According to the technical scheme, the pre-plating layer is connected with the nickel layer under the condition that the surface of the pre-plating layer is in smooth arrangement, so that the adhesive force of the nickel layer is improved.
Optionally, the pre-plating layer is one of metal coatings.
According to the technical scheme, the first layer of anti-corrosion effect can be achieved on the adhesive layer by selecting one of the metal coatings, and the nickel layer is connected more conveniently based on the fact that the thin pre-plating layer is plated.
The utility model provides a novel solder resist structure of a ceramic substrate, which has the following beneficial effects:
1. the ceramic solder resist design is made by adopting the evaporation nickel plating, so that the problems of poor precision of solder resist position, small solder resist thickness and shape selectivity and the like in the conventional ceramic solder resist design which mostly adopts green oil and PI are solved; the uniform film can be formed on the substrate through evaporating nickel plating, so that the consistency of the coating is improved, and the problem of poor precision of the solder resist position is solved; meanwhile, the pre-plating layer can adapt to base materials with different shapes in an evaporation plating mode, and comprises complex concave-convex surfaces, so that the shape selectivity of the solder resist is expanded; meanwhile, the nickel layer is arranged on the surface of the pre-plating layer to cover, so that the adhesion of the plating layer is improved by the nickel layer.
2. This application sets up the banding layer in the edge of gilding figure to when connecting the glue film on the potsherd, the banding layer can provide the reference sign at edge, helps more accurately counterpoint the exposure of photoresist, simultaneously, the banding layer can reduce the side scatter when the photoresist exposes, helps keeping the definition and the size of pattern.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model.
In the figure: 1. a ceramic sheet; 2. gold plating patterns; 3. a caulking groove; 4. a glue layer; 5. edge sealing layer; 6. pre-plating; 7. and a nickel layer.
Detailed Description
The utility model will be further described with reference to the following embodiments in order to make the technical means, the creation features, the achievement of the objects and the effects of the utility model easy to understand.
In the description of the present utility model, it should be understood that the terms "transverse", "longitudinal", "end", "edge", "side wall", "upper", "lower", "directly above", "surface", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", "end", "head", "tail", etc. refer to the orientation or positional relationship based on the drawings, are merely for convenience of describing the technical solution of the present utility model and for simplifying the description, and do not indicate or imply that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
The application provides a novel solder resist structure of ceramic substrate, specifically does:
referring to fig. 1, a gold-plated pattern 2 is plated on a ceramic sheet 1; the solder resist structure is arranged on the gold-plated pattern 2, an edge sealing layer 5 is arranged at the edge of the gold-plated pattern 2, the edge sealing layer 5 is arranged along the shape edge of the gold-plated pattern 2, and the edge sealing layer 5 can be finished by glue, sealant and silica gel, so that a layer of surrounding ring is formed effectively.
The bead layer 5 may provide a reference mark for the edges, helping to more accurately align the exposure of the photoresist. The edge sealing layer 5 can also protect the edges of the gold-plated pattern from physical damage, chemical corrosion or other environmental effects, can reduce side scattering during exposure of the photoresist, and is helpful for maintaining the definition and size of the pattern.
Referring to fig. 1, a solder resist structure is disposed in the formed enclosure, wherein the solder resist structure includes a glue layer 4, an evaporated nickel plating layer 7, and a pre-plating layer 6;
the photoresist layer 4 is arranged on the gold-plated pattern 2 by adopting the photoetching technology which is the prior art; the specific implementation steps are that AZ4620 photoresist is coated in the gold-plated pattern 2 to form a uniform film, and a specific area of the surface of the photoresist is exposed to ultraviolet light through a mask or a template by using a photoetching machine. In the exposure process, the pattern on the mask is transferred to the photoresist, the exposed photoresist is developed, and the developing solution is not reacted with the unexposed part, so that the pattern of the solder resist part is finally formed to form the adhesive layer 4.
Further, the gold-plated pattern 2 is subjected to edge sealing treatment, so that the edge sealing layer 5 can circle the adhesive layer 4 in the gluing process, and the adhesive layer 4 is consistent with the edge sealing layer 5 in height after being smeared.
Referring to fig. 1, the outer surfaces of the edge sealing layer 5 and the adhesive layer 4 are provided with a pre-plating layer 6 by adopting an evaporation plating process, the pre-plating layer 6 adopts one of metal coatings, and common metals comprise chromium plating, zinc plating, nickel plating, copper plating and the like, and one of the metals is selected as the pre-plating layer 6; in which a plurality of caulking grooves 3 are provided on the adhesive layer 4 so that the contact area of the connection can be increased at the time of vapor plating the preplating layer 6, thereby improving the connection strength.
Referring to fig. 1, the surface of the pre-plating layer 6 is smoothed by making better contact with the nickel layer 7 after the plating of the pre-plating layer 6, so that the surface is smooth, and the adhesion between the nickel layer 7 and the pre-plating layer 6 is improved when the nickel layer 7 is evaporated.
After the nickel layer 7 is plated, the unexposed photoresist is reacted by a stripping liquid and put into a stripping machine, the photoresist is easy to be stripped off, and thus a novel ceramic substrate which hinders design is formed by connection; in the process of forming the novel substrate, an evaporation plating process is adopted, and the accurate control of the film thickness can be realized by adjusting the position, the temperature, the evaporation rate and other parameters of the evaporation source, so that the problem of low thickness and shape selectivity can be solved.
In the utility model, the working steps of the device are as follows:
1. firstly, arranging an edge sealing layer 5 at the edge of the shape of the gold-plated pattern 2;
2. secondly, smearing the adhesive layer 4 in the edge-sealed gold-plated pattern 2, and arranging the adhesive layer on the gold-plated pattern 2 through a photoetching technology after being leveled with the edge-sealed layer 5;
3. then, the caulking groove 3 of the adhesive layer 4 enables the pre-plating layer 6 to be arranged on the adhesive layer 4 and the edge sealing layer 5 through an evaporation plating process, and the caulking groove 3 improves the strength in connection;
4. finally, the nickel layer 7 is evaporated and plated on the pre-plating layer 6, so that the adhesive force of the nickel layer 7 is increased, the position accuracy of the solder resist is increased, and the problems of low thickness and shape selectivity of the solder resist are solved.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be appreciated by persons skilled in the art that the present utility model is not limited to the embodiments described above, but is capable of numerous variations and modifications without departing from the spirit and scope of the utility model as hereinafter claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. Novel solder resist structure of ceramic substrate, ceramic substrate include ceramic wafer (1) and plate gilt figure (2) on ceramic wafer (1), solder resist structure locates on gilt figure (2), its characterized in that: the welding-resistant structure comprises a glue layer (4), a sealing edge layer (5), a nickel layer (7) and a pre-plating layer (6);
the edge sealing layer (5) is arranged at the edge of the gold-plated pattern (2);
the adhesive layer (4) is arranged on the gold-plated pattern (2) through a photoetching technology;
the pre-plating layer (6) is plated on the adhesive layer (4) and the edge sealing layer (5) in an evaporation way;
the nickel layer (7) is evaporated and plated on the pre-plating layer (6).
2. The novel solder resist structure of claim 1, wherein: the glue layer (4) adopts AZ4620 photoresist.
3. The novel solder resist structure of claim 2, wherein: the edge sealing layer (5) wraps the adhesive layer (4), and the thickness of the edge sealing layer (5) is consistent with that of the adhesive layer (4).
4. The novel solder resist structure of claim 1, wherein: the surface of the adhesive layer (4) is provided with a plurality of caulking grooves (3).
5. The novel solder resist structure of claim 4, wherein: the pre-plating layer (6) is attached in the caulking groove (3) and the surface is smooth.
6. The novel solder resist structure of claim 1, wherein: the pre-plating layer (6) is one of metal coating layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322344475.XU CN220753424U (en) | 2023-08-30 | 2023-08-30 | Novel solder resist structure of ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322344475.XU CN220753424U (en) | 2023-08-30 | 2023-08-30 | Novel solder resist structure of ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220753424U true CN220753424U (en) | 2024-04-09 |
Family
ID=90562646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322344475.XU Active CN220753424U (en) | 2023-08-30 | 2023-08-30 | Novel solder resist structure of ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220753424U (en) |
-
2023
- 2023-08-30 CN CN202322344475.XU patent/CN220753424U/en active Active
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