CN220671579U

CN220671579U - Drainage device and testing device

Info

Publication number: CN220671579U
Application number: CN202322147122.0U
Authority: CN
Inventors: 薛英贤; 刘剑海; 黄潢
Original assignee: Shanghai Fudan Microelectronics Group Co Ltd
Current assignee: Shanghai Fudan Microelectronics Group Co Ltd
Priority date: 2023-08-09
Filing date: 2023-08-09
Publication date: 2024-03-26
Anticipated expiration: 2033-08-09

Abstract

A drainage device and test device, the drainage device comprising: a main body part provided with a first air inlet; the air delivery pipe is communicated with the first air inlet hole and is provided with at least one first air outlet hole, and the at least one first air outlet hole is uniformly arranged around at least one target area. According to the scheme, the drainage device is designed to realize uniform flow distribution of air flow and reduce loss in the air transmission process, so that the air flow in the testing device additionally provided with the drainage device can be blown to the chip to be tested borne in each target area more pertinently and almost without loss, and the testing efficiency and the testing effect of the chip are improved.

Description

Drainage device and testing device

Technical Field

The utility model relates to the technical field of chip testing, in particular to a drainage device and a testing device.

Background

Chips are often subjected to multiple testing procedures during design and manufacturing to verify performance such as reliability. For example, in performing high reliability product development verification and small lot testing, high and low temperature schemes employing laboratory engineering machines in combination with heat shields are often chosen from multiple points of view of cost and efficiency and feasibility.

The heat flow cover equipment commonly adopted in the market at present comprises two cover structures: one is a circular cover body, but the inner diameter of the circular cover body limits the placing space of the clamp, when the circular cover body is used for products such as large-size chips, the test capacity is too small, and Input/Output (IO) resources of a tester are wasted; the other is a rectangular cover body, compared with a round cover body structure, the rectangular bottom cover body can be matched with a plurality of sample load boards to be detected with larger size, the number of samples to be detected in the same batch can be increased, and the maximization of physical space and IO resource utilization is realized.

However, the rectangular cover body has larger enclosed inner cavity volume, so that the cavity can be filled with air for a longer time, the temperature rise and fall speed of the chip in high and low temperature test is reduced, the test time is prolonged, and the test efficiency is reduced. In addition, the rectangular layout causes inconsistent distances between a plurality of chips and the air tap of the heat flow cover, and differences exist between the heated chips and the air flow in theory, so that the temperature rising and falling speeds of different chips are inconsistent, and the testing accuracy is affected.

At present, for the two defects, a conventional solution is to lengthen the test time. Before formally starting the test, the heat flow cover is heated for a longer time (usually more than 10 minutes), so that the heat flow cover cavity is filled with gas, and the chip farthest from the air tap of the heat flow cover can be heated to the expected temperature. However, practice shows that even if the test time is prolonged, the problems of low chip temperature changing speed and uneven chip temperature changing speeds at different positions cannot be solved, which results in waste of test resources and low test efficiency.

Disclosure of Invention

The utility model solves the technical problem of improving the test efficiency and the test effect of the chip.

In order to solve the above technical problems, an embodiment of the present utility model provides a drainage device, including: a main body part provided with a first air inlet; the air delivery pipe is communicated with the first air inlet hole and is provided with at least one first air outlet hole, and the at least one first air outlet hole is uniformly arranged around at least one target area.

Optionally, the gas delivery pipe includes: the first pipeline group comprises pipelines corresponding to the at least one target area, and each pipeline in the first pipeline group is provided with a first air outlet.

Optionally, the first pipe group includes: at least one first tube is in one-to-one correspondence with the at least one target area.

Optionally, for each first tube, a projection of a first air outlet hole formed in the first tube on a plane where the target area is located falls into the target area.

Optionally, the first pipe group includes: at least one second tube, wherein each of the second tubes corresponds to at least two of the at least one target area.

Optionally, for each second tube, the projection of the first air outlet hole arranged on the second tube on the plane where the target area is located between two adjacent target areas.

Optionally, a distance from the first air outlet hole formed in the second tube to a plane where the target area is located is smaller than a first preset threshold value.

Optionally, the gas delivery pipe includes: and the third pipe is arranged around the at least one target area, the at least one first air outlet holes are arranged on the third pipe at intervals and correspond to the at least one target area, and the number, the total cross-sectional area and/or the distance from the first air outlet holes corresponding to each target area to the first air outlet holes corresponding to the target area are the same.

Optionally, at least one of the following dimensions of the gas delivery conduit is adjustable: the shape of the air delivery pipe, the length of the air delivery pipe along the extending direction and the extending angle of the air delivery pipe, wherein the relative positions of the at least one first air outlet hole and the at least one target area are changed along with the adjustment of the at least one dimension of the air delivery pipe.

Optionally, the main body part has a cavity, the cavity communicates respectively the first inlet port and the gas-supply pipe.

Optionally, the volume of the chamber and the sectional area of the first air inlet hole are matched.

Optionally, the main body portion includes: the cover plate and the base enclose the cavity together, the first air inlet is formed in the cover plate, and the base is formed with a hole communicated with the air pipe.

In order to solve the above technical problem, an embodiment of the present utility model further provides a testing device, including: the chip testing device comprises a load board, a first testing board and a second testing board, wherein the load board is provided with a first surface and a second surface which are opposite, the first surface of the load board is provided with at least one target area, and the target area is used for placing a chip to be tested; the heat flow cover is covered on the first surface of the load plate and is provided with an air supply hole; the drainage device is arranged between the load plate and the heat flow cover, and the air supply hole is communicated with the first air inlet hole.

Optionally, the test device further includes: and the clamp is used for fixing the chip to be tested in the corresponding target area, at least one opening is formed in the clamp, and the first air outlet hole and/or the air flow blown out from the first air outlet hole faces to the at least one opening.

Optionally, the test device further includes: a limiting part arranged around the air supply hole; and the adapting part is arranged around the first air inlet hole, and the limiting part is used for being matched with the adapting part to limit the relative position between the air supply hole and the first air inlet hole.

Compared with the prior art, the technical scheme of the embodiment of the utility model has the following beneficial effects:

the embodiment of the utility model provides a drainage device, which comprises: a main body part provided with a first air inlet; the air delivery pipe is communicated with the first air inlet hole and is provided with at least one first air outlet hole, and the at least one first air outlet hole is uniformly arranged around the at least one target area.

With this embodiment, the air flow input through the first air inlet holes can be finally blown more uniformly to each of the at least one target area by the position setting of the at least one first air outlet holes on the air delivery pipe. Further, the air flow of the first air intake hole can be made to reach the air delivery pipe almost without loss.

Further, the first inlet aperture is adapted to enable the externally supplied gas to reach the at least one first outlet aperture with almost no loss, which is advantageous for increasing the amount of gas flow transported and split by the flow guiding means.

Further, an embodiment of the present utility model further provides a testing device, including: the load board is provided with a first surface and a second surface which are opposite, the first surface is provided with at least one target area, and the target area is used for placing a chip to be tested; the heat flow cover is covered on the first surface of the load plate and is provided with an air supply hole; the drainage device is arranged between the load plate and the heat flow cover, and the air supply hole is communicated with the first air outlet hole.

The vent hole of the existing heat flow cover directly blows air to each chip to be tested on the load board, when the inner cavity of the heat flow cover is large in size, the temperature change speed is low, and when the heat flow cover is in non-circular design, the temperature change speeds of the chips to be tested at different positions are different, so that the chip test efficiency and the effect are poor. In contrast, in this embodiment, by adding the drainage device between the heat flow cover and the load board, the air flow blown out from the air supply hole of the heat flow cover can be blown onto each chip to be tested carried on the load board in a larger air flow and more uniform manner. Specifically, the first air inlet hole and the first air outlet hole of the drainage device are communicated, so that the air flow input by the heat flow cover can reach the air delivery pipe almost without loss. Further, through the position setting of at least one first venthole on the gas-supply pipe, make the air current that the heat flow cover input finally can blow to each of at least one chip more evenly.

Further, the test device further includes: the fixture is used for fixing the chip to be tested in the corresponding target area, and is provided with an opening, and the first air outlet hole and/or air flow blown out from the first air outlet hole face the opening.

The energy of the gas conveyed by the heat flow cover of the existing testing device is mainly radiated to the chip to be tested based on the diffusion effect, specifically, a large space is usually reserved between the cover body and the load board, so that the gas at the vent hole needs to be gradually diffused to the chip to be tested on the load board from top to bottom, the temperature change speed of the whole chamber in the cover body is low, the gas is continuously subjected to heat exchange with the original gas in the cover body in the diffusion process, and finally, the heat (or cold) can be transferred to the chip to be tested, which is fixed on the load board by the clamp, in the target area. This design results in an overall inefficiency of the test device and a large loss of heat (or coldness) during the heat exchange process. Compared with the prior art, the testing device has the advantages that the drainage device is additionally arranged in the heat flow cover, gas sent out by the heat flow cover is more pertinently drained to each chip to be tested, and air flow loss is avoided. Further, through the design of at least one first venthole on the gas-supply pipe, for example, with the design of opening looks adaptation on the anchor clamps, guarantee that the temperature rise and fall speed of each chip that awaits measuring keeps unanimous, wen Biangeng adds evenly.

Drawings

FIG. 1 is a schematic view of a drainage device according to an embodiment of the present utility model;

FIG. 2 is a schematic view of the drainage device of FIG. 1 at another viewing angle;

FIG. 3 is a cross-sectional view taken along line A-A of FIG. 1;

FIG. 4 is an exploded view of the structure shown in FIG. 1;

FIG. 5 is a schematic diagram showing the arrangement of air delivery pipes in a variation of the embodiment of the present utility model;

FIG. 6 is a schematic diagram of a load board according to an embodiment of the utility model;

FIG. 7 is a cross-sectional view of a testing device according to an embodiment of the present utility model;

fig. 8 to 14 are schematic diagrams showing the comparison of the current changes of the chip to be tested on each target area with time when the test device is used for testing before and after the drainage device is added in a typical application scenario according to the embodiment of the present utility model;

fig. 15 to 17 are schematic diagrams showing the comparison of the current variation per second of the chip to be tested with time in each target area when the test device is used for testing before and after the drainage device is added in a typical application scenario according to the embodiment of the present utility model;

fig. 18 is a schematic diagram showing a comparison of time-varying differences between current variation per second of a chip to be tested in each target area when a testing device is used for testing before and after a drainage device is added in a typical application scenario according to an embodiment of the present utility model.

Detailed Description

As described in the background art, in the prior art, when a load board (hereinafter referred to as a load board for short) of a plurality of devices under test (Device Under Test, DUT for short) with larger external dimensions is tested at high and low temperatures by using a rectangular heat flow cover, the temperature rising and dropping speed of a chip (i.e., the device under test, which may also be referred to as a chip under test) is slow, and the temperature rising and dropping speeds of chips at different positions on the load board are different. Under the condition, the high-low temperature test time is long, the test result is not accurate enough, the efficiency is low, and the cost is high.

Specifically, at the present stage, there are several general situations of the high-low temperature test overall scheme:

1. the laboratory engineering machine is matched with a heat flow cover device, the combination is most common, flexible and the cost is lowest, and usually 1-6 test points (sites) are tested simultaneously, so that the laboratory engineering machine can be flexibly designed according to products;

2. the engineering machine of the test factory is matched with a manipulator (normal high temperature or three temperatures), and usually 1-8 site is different in simultaneous measurement, so that the limiting factors are more;

3. the mass production model of the test factory is matched with 256 or 512site, the limit is very high, and the cost is hard to bear.

In the application scenario that the test requirement belongs to the research and development of high-reliability products and small-batch test, the high-temperature and low-temperature test is usually carried out by selecting a heat flow cover device from multiple angles of cost, efficiency and feasibility. The apparatus is typically configured with a circular insulating glass cover fitting, in combination with an associated sealed heat resistant mat, to create a high and low temperature test environment. The circular cover has the defects that the inner diameter of the circular cover limits the placing space of the clamp, and IO resources of the testing machine are wasted.

To improve testing efficiency, some heat shroud devices optionally fit a rectangular glass shroud (Rectangle Glass Cap with Diffusers) fitting with a diffuser to replace the circular insulating glass shroud (Thermal Glass Caps) fitting, with an external dimension that matches the rectangular inner frame support of the load plate. The heat insulation pad special for the upper heat flow cover can fully utilize the physical space of the clamp placed on the load board, and the utilization maximization of the physical space and IO resources is realized.

However, even if a larger rectangular fairing is used, there are problems that need to be solved. Specifically, the power of the heat flow cover device is always fixed, and after the round heat-insulating glass cover fitting is replaced by the rectangular glass cover fitting with the diffuser, the inner cavity space is changed into a rectangular cavity with larger inner cavity volume from a round space with uniformly distributed and symmetrical placing fixtures. There are two disadvantages to this:

1. the rectangular space has larger volume, and the heat flow cover equipment can fill the cavity with gas for a longer time, so that the temperature rise and fall speed of the chip in high and low temperature test is reduced, the test time is prolonged, and the test efficiency is reduced;

2. the rectangular layout causes inconsistent intervals between a plurality of chips and the air tap of the heat flow cover, and differences exist between the heated air flow and the heated air flow in theory, so that the temperature rising and falling speeds of different chips are inconsistent, and the accuracy of the test result is affected.

For these two disadvantages, the current solution is to lengthen the test time. Before formally starting the test, the heat flow cover is heated for a longer time (usually more than 10 minutes), so that the heat flow cover cavity is filled with gas, and the chip farthest from the air tap of the heat flow cover can be heated to the expected temperature.

However, lengthening the warm-up time increases the test cost, and this can not completely solve the problem of slow warm-up speed and inconsistent warm-up speed of each chip after the accessory is replaced to the heat flow cover equipment. The concrete implementation is as follows:

firstly, according to a test result obtained by using a handheld thermometer in practice, finding that the chip cannot be heated to an expected temperature within 10 minutes;

secondly, the temperature of each time point of the chips at different positions on the load board is obviously different, the difference still exists after the temperature is raised for 10 minutes, and the temperature of the chips at different positions on the load board is different when the test is started after the temperature is raised for 10 minutes, so that the error of the final test result is large.

In order to solve the above technical problems, an embodiment of the present utility model provides a drainage device, including: a main body part provided with a first air inlet; the air delivery pipe is communicated with the first air inlet hole and is provided with at least one first air outlet hole, and the at least one first air outlet hole is uniformly arranged around the at least one target area.

In order to make the above objects, features and advantages of the present utility model more comprehensible, embodiments accompanied with figures are described in detail below.

Fig. 1 is a schematic view of a drainage device 1 according to an embodiment of the present utility model, fig. 2 is a schematic view of the drainage device 1 shown in fig. 1 at another viewing angle, fig. 3 is a sectional view of fig. 1 along A-A direction, and fig. 4 is an exploded view of the structure of the drainage device 1 shown in fig. 1.

The flow guiding device 1 of the embodiment can be applied to a chip test scene, and the flow guiding and splitting of the air flow can be realized by arranging the flow guiding device 1 in the chip test environment, so that the air reaches a designated position in a state more meeting the test requirement. The designated location may be, for example, a target area E (as shown in fig. 6) for carrying a chip to be tested. Fig. 6 is a schematic diagram of a load board 61 according to an embodiment of the present utility model, where the drainage device 1 may be supported on the first surface 611 of the load board 61.

For convenience of description, in the present embodiment, the width direction of the drainage device 1 is referred to as the x-direction, the length direction is referred to as the y-direction, and the height direction is referred to as the z-direction. In the present embodiment, the vertical direction means the z direction and the reverse direction, and the gas can flow from above or in the upper side of the flow guiding device 1 and flow from below or in the lower side of the flow guiding device 1. The view shown in fig. 2 can be understood as looking up the drainage device 1 in the z-direction relative to the view shown in fig. 1.

Specifically, in connection with fig. 1 to 4 and 6, the drainage device 1 may comprise a body part 2. In some embodiments, the contour shape of the body portion 2 may be designed to match the shape of the load plate 61. For example, the main body 2 may have a substantially rectangular plate shape. In some embodiments, along the z-direction, the load plate 61 may have opposing first and second faces 611, 612 (as shown in fig. 7), wherein the first face 611 is provided with at least one target area E.

Further, the main body 2 may have a hollow structure.

Further, with continued reference to fig. 1, the main body 2 may be provided with a first air inlet hole 3 for external air to enter the inside of the main body 2. In some embodiments, the specific type, status, of gas may be determined based on the type of chip test that is desired to be performed. For example, in the warm test, the gas input to the flow guiding device 1 may be, for example, a gas for raising/lowering the temperature of the chip to be tested on the target area E.

Further, with continued reference to fig. 2-4, the drainage device 1 may also include a gas delivery tube 4.

Further, the first air intake hole 3 communicates with the air delivery pipe 4, and the air delivery pipe 4 may be located below the first air intake hole 3 in the z direction. The gas delivery conduit 4 may have at least one first gas outlet aperture 5, the at least one first gas outlet aperture 5 being uniformly disposed about at least one target area E.

Therefore, the air flow in the cavity of the main body 2 (for example, accommodated or temporarily stored in the cavity) can be further guided to the target area E through the air pipe 4, so that the air flow directly acts on the chip to be tested fixed on the target area E to raise/lower the temperature of the chip to be tested.

In some embodiments, an end of the air delivery pipe 4 near the target area E may be provided with at least one first air outlet hole 5. By controlling the number relation and the distance between the first air outlet holes 5 and the target area E, the air flow blown out by the first air outlet holes 5 of the air pipe 4 can uniformly surround at least one target area E.

For example, the number of air delivery pipes 4 may be identical to the number of target areas E, and a plurality of air delivery pipes 4 and a plurality of target areas E are in one-to-one correspondence. The first air outlet holes 5 arranged on each air delivery pipe 4 face the corresponding target area E. Further, the cross section area of each first air outlet hole 5 is the same, and the distance between each first air outlet hole 5 and the chip to be tested in the target area E is the same. Thereby, the air flow blown out from each first air outlet hole 5 can uniformly act on the corresponding target area E.

For another example, the number of gas delivery pipes 4 may be a multiple of the number of target areas E under other conditions. In an alternative embodiment, each target area E may correspond to two air delivery pipes 4, and the first air outlet holes 5 of the air delivery pipes 4 are disposed on two sides of each target area E along the x direction, and the distances from each first air outlet hole 5 to the geometric center of the corresponding target area E are the same. Thus, the air flow amount blown to each target area E can be made substantially uniform even when the cross-sectional area of each first air outlet hole 5 is uniform.

Through the design and control of the number/positions of the air delivery pipes 4 and the orientation/sectional area of the first air outlet holes 5, the air flow received by each target area E fixed with the chip to be tested can be ensured to be basically the same, and then the chip to be tested fixed on each target area E can be more uniformly and synchronously heated and cooled.

In one implementation, with continued reference to fig. 1-4, the gas delivery conduit 4 may include a first conduit group 41, where the first conduit group 41 includes conduits corresponding to at least one target area E, and each of the conduits in the first conduit group 41 is provided with a first gas outlet hole 5. Thereby, the air flow flowing in from the first air intake holes 3 is uniformly blown toward the target area E of each chip to be tested by the first duct group 41.

Specifically, the first pipe group 41 may include pipes in one-to-one correspondence with at least one target area E. That is, each target area E has a corresponding duct blowing towards that target area E.

Further, the same pipe in the first pipe group 41 may correspond to a plurality of target areas E. That is, the gas blown out of the first gas outlet holes 5 of the single duct can be dispersed to act on the corresponding plurality of target areas E.

Further, the lengths of the pipes included in the first pipe group 41 may be the same or may be different. The first air outlet holes 5 arranged on the pipelines can be arranged at the same position and in the same direction and can be arranged at different directions.

For example, the first duct group 41 may include a plurality of ducts having different lengths and different orientations of the first air outlet holes 5. By designing the layout of the pipes of different sizes and shapes in the first pipe group 41 on the main body 2, the length of the pipe acting on each target area E and the orientation of the first air outlet holes 5 can be made identical.

In some embodiments, the first gas outlet holes 5 may be provided at the ends of the tubes included in the first tube group 41 in the z-direction.

Further, the duct may extend from the face of the main body 2 facing the load plate 61 downward to just above the corresponding target area E so that the conveyed gas is blown toward the target area E from top to bottom in the z direction.

Alternatively, the conduit may extend further down to a position proximate the load plate 61 and between adjacent target areas E. At this time, the air flow blown out from the first air outlet 5 is dispersed and acted on the adjacent target area E after being rebounded by the load plate 61.

In a variation, the first air outlet 5 may also be formed in a side wall of the duct. Accordingly, the duct may extend downwardly from the body 2 between adjacent target areas E, with the air blown from the first air outlet holes 5 acting generally in the x-direction and/or the y-direction to the target areas E.

In this variation, each target area E may correspond to a plurality of pipes. For example, each target area E may correspond to four pipes, where the four pipes are disposed around the target area E in the plane formed by the x direction and the y direction, and the first air outlet holes 5 of the pipes are spaced from the target area E uniformly. Therefore, when the projection area of the chip to be tested on the first surface 611 along the z direction is larger, each local area of the chip to be tested can be uniformly heated/cooled.

In some embodiments, as shown in fig. 6, six target areas E are uniformly distributed on the same plane. Specifically, the six target areas E may be arranged in two columns in the x-direction and three rows in the y-direction.

In some embodiments, the arrangement manner of the target area E on the plane may be determined according to the size of the chip to be tested fixed on the target area E.

In one implementation, with continued reference to fig. 3 and 4, the first tube set 41 may include at least one first tube 411, with at least one first tube 411 being in one-to-one correspondence with at least one target area E. Among them, the first tube 411 located in front of the second tube 412 in the x-direction is omitted from fig. 3 for more clearly showing the component structure of the present embodiment.

Further, for each first tube 411, the projection of the first air outlet hole 5 formed in the first tube 411 on the plane of the target area E falls into the corresponding target area E.

For example, referring to fig. 7, for each first tube 411 corresponding to the target area E, the first air outlet hole 5 is disposed at the end of the first tube 411 near the side of the target area E. In view of the fluid characteristics, when the air flow is blown out from the first air outlet 5, the air flow is emitted in an umbrella shape toward the target area E due to the disappearance of the pressure from the duct wall. Thus, the projection of the first outlet aperture 5 onto the plane (e.g., the first face 611) in which the target area E lies may fall on the geometric center of the corresponding target area E. Therefore, the sprayed air flow can be more uniformly applied to the surface of the chip to be tested placed on the target area E, so that the temperature of the chip to be tested is more uniform.

In a variation, each target area E may correspond to the same number of the plurality of first tubes 411, and the airflows conveyed by the plurality of first tubes 411 are blown from the respective first air outlet holes 5 toward the corresponding same target area E.

For example, in the case where the projected area of the chip to be tested on the plane in the x-direction and the y-direction is large, the plurality of first air outlet holes 5 may be disposed along the edge of the target area E where the chip to be tested is fixed. Therefore, even when a large chip is tested, the whole chip can be uniformly heated/cooled, and meanwhile, the heating/cooling speed is improved.

Further, in this embodiment, the first tubes 411 may be configured as hoses, and when each target area E corresponds to the same number of the plurality of first tubes 411, the bending degree of each first tube 411 may be adjusted according to the position of the target area E, so that the projection of the first air outlet 5 on the plane of the target area E falls into the corresponding target area E.

Further, in a variation, the first tube 411 may be provided with a nozzle structure (not shown in the figure) at the position of the first air outlet 5, where the nozzle structure is used to make the air flow act on the chip surface more uniformly when being ejected, so as to further improve the uniformity of temperature rise/drop.

In one implementation, with continued reference to fig. 1-4, the first conduit group 41 may further include at least one second conduit 412, wherein each second conduit 412 corresponds to at least two of the at least one target area E.

For example, in a test scenario where a single target area E is disposed on the first side 611, a single second tube 412 may be disposed accordingly.

For another example, in a test scenario with two or more target areas E, the number of second tubes 412 may be increased according to the number and relative positions of the target areas E. Thereby, the amount of air flow blown to each target area E can be increased, and the rise/fall speed can be further increased.

As shown in connection with fig. 7, the second tube 412 may extend to a first face 611 adjacent to the load plate 61, wherein the approaching may refer to approaching but still having a non-zero gap, i.e. the first gas outlet holes 5 are not in direct contact with the first face 611. Therefore, the air flow blown out from the second tube 412 firstly impinges on the first surface 611 where the target area E is located, and then diffuses along the plane to the periphery, and further blows from the side to the chip to be tested disposed in the target area E.

Further, for each second tube 412, the projection of the first air outlet hole 5 formed in the second tube 412 on the plane of the target area E may be located between two adjacent target areas E. For example, in a test scenario in which the first surface 611 is provided with two target areas E, the projection of the first air outlet hole 5 on the plane on which the target areas E are located may be at the midpoint of the geometric center line of the two target areas E, so that the air flow blown by the first air outlet hole 5 can be uniformly blown to the two target areas E.

Further, the first air outlet holes 5 of the second tube 412 may be provided on the side wall of the duct, and the number of the first air outlet holes 5 may be consistent with the number of the corresponding target areas E and face the corresponding target areas E.

In some embodiments, as shown in connection with fig. 7, the distance from the first air outlet hole 5 opened in the second tube 412 to the plane of the target area E may be smaller than the first preset threshold. The magnitude of the first preset threshold may depend on the distance from the surface of the chip to be tested to the plane of the target area E in the z direction, i.e. the thickness of the chip to be tested in the z direction.

Specifically, to ensure that the air flow blown out from the first air outlet 5 of the second tube 412 is blown to the chip to be tested from the side, the distance from the first air outlet 5 to the plane of the target area E should be smaller than the thickness of the chip to be tested along the z direction.

The inventor of the present application found through analysis that if the second tube 412 is too long, the first air outlet hole 5 is too close to the first surface 611 where the target area E is located, the air flow will be blocked in the second tube 412 by the first surface 611, and the air flow blown to the chip to be tested will be reduced, so as to affect the test effect; if the second tube 412 is too short, the first air outlet 5 is too far from the first surface 611 of the target area E, and the air flow will escape to the whole testing space, and cannot be blown to the chip to be tested on the target area E, resulting in waste of the air flow. Therefore, the space between the first air outlet hole 5 and the first face 611 needs to be reasonably designed to ensure a superior test effect.

For example, the first preset threshold may take a value from [0.5cm,2cm ]. For example, the first preset threshold may be 1cm. In practical applications, the specific value of the first preset threshold may be adjusted according to needs, for example, adaptive adjustment may be performed according to the distance from the upper surface of the chip to be tested to the first surface 611 along the z direction. This ensures that the air flows from the side face to the target area E, and prevents the first air outlet hole 5 from being too close to the first face 611, which would cause the air flow to be blocked in the tube, which would affect the testing efficiency.

In some embodiments, the number of first tubes 411 and/or second tubes 412 included in the first tube set 41 may be adjusted according to the area, the relative position of the target area E, and the size of the chip to be tested.

For example, if the areas of the target areas E are large and the distances between the target areas E are small, so that there is not enough space to dispose the second tube 412 between the adjacent target areas E. The amount of air flow blown to the target area E can be increased by increasing the number of the first tubes 411 or the cross-sectional area of the first air outlet holes 5 opened on the single first tube 411, thereby increasing the speed of raising/lowering the temperature.

For another example, if the area of the target area E is smaller, the cross-sectional area of the first tube 411 may be correspondingly smaller in order to ensure that the first tube 411 can blow air in a targeted manner. In this case, the air flow amount blown to the target area E may be increased in an auxiliary manner by increasing the number of the second tubes 412, increasing the cross-sectional area of the second tubes 512, the cross-sectional area of the first air outlet holes 5, and the like, thereby increasing the speed of raising/lowering the temperature.

In a variation of the above embodiment, referring to fig. 5 and 6, the air delivery pipe 4 may include a third pipe 43, the third pipe 43 being disposed around at least one target area E, and at least one first air outlet hole 5 being disposed in spaced relation to the third pipe 43 and being disposed in correspondence with the at least one target area E.

Specifically, the third tube 43 may include a peripheral tube 430 disposed around the periphery of the region collectively constituting the at least one target region E. The peripheral tube 430 has first ventilation apertures 5 spaced apart from each other on opposite long sides 432. In some embodiments, the two opposite short sides 431 of the peripheral tube 430 may also be provided with a first vent 5.

For example, referring to fig. 5, the peripheral tube 430 may be configured as a rectangular tube laid along a plane in which the target area E is located in the x-direction and the y-direction and surrounding all the target area E within an area surrounded by the rectangular tube.

Further, the third tube 43 may further comprise a vent tube 433 disposed inside the area surrounded by the peripheral tube 430 and adapted to communicate with different sides of the peripheral tube 430. Thereby, the gas delivery pipe 4 can be further laid around each target area E.

For example, vent tubes 433 may be used to communicate with opposite sides of peripheral tube 430 in the x-direction or the y-direction (i.e., long side 432 or short side 431). An exemplary vent tube 433 extending in the y-direction is shown in fig. 5. In some embodiments, the vent pipes 433 extending along the y direction may be provided with first air outlet holes 5 at intervals, and the first air outlet holes 5 formed on the vent pipes 433 correspond to the first air outlet holes 5 formed on the two long sides 432 one by one. Thereby, it is ensured that each target area E is symmetrically provided with the first air outlet holes 5 along both sides of the x direction.

Further, a second air inlet 434 may be formed on the air pipe 433, and the second air inlet 434 is further connected to the main body 2, so as to receive the air flow sent from the main body 2. The second air intake hole 434 may be connected to the main body 2, for example, by a duct structure, or directly abutted to communicate with each other. The air flow enters the vent tube 433 from the second air inlet 434 and then flows into the peripheral tube 430 via the guide of the vent tube 433.

Further, with continued reference to fig. 5, the long side 432 of the third tube 43 may be provided with first air outlet holes 5 at intervals, where the first air outlet holes 5 are disposed towards the nearest target area E, so as to blow the air flow in the duct to the target area E in a targeted manner. Therefore, the temperature rise/fall speed of the chip to be tested on the target area E can be increased.

Further, the distance from each first air outlet hole 5 to the geometric center of the corresponding target area E may be kept uniform, and the sectional areas of each first air outlet hole 5 are the same. So as to ensure that the air flow rate blown to each target area E is basically consistent, the temperature rise/fall of each target area E is more uniform, and the temperature rise/fall speed is improved.

In a variation, a nozzle structure or a duct structure may be disposed between the first air outlet 5 and the target area E, so that the air flow blown out from the first air outlet 5 is more concentrated and more targeted to the target area E. This is advantageous in reducing losses.

In a variation, each target area E may correspond to an equal number of the plurality of first air outlet holes 5. For example, in addition to the long side 432, the short side 431 of the third tube 43 may be provided with the first air outlet 5, and a vent tube (not shown) extending in the x direction and communicating the vent tube 433 and the long side 432 may be provided between the vent tube and the long side 432, and the first air outlet 5 may be provided on the attached vent tube. Thus, the first air outlet holes 5 are provided around the periphery of the single target area E, and by making the cross-sectional areas of the first air outlet holes 5 identical and the distances from the corresponding target area E identical, the air flow rate blown to the target area E can be increased, and at the same time, the temperature rise/drop speed of each target area E can be further substantially uniform.

In a variation, the number of the first air outlets 5 corresponding to the same target area E is different, but the sum of the cross-sectional areas of the first air outlets 5 is equal, so that the temperature rising/lowering speed of each target area E is basically consistent.

In a variation, the lay-out shape of third tube 43 may be adjusted according to the arrangement of the plurality of target areas E on first face 611. For example, if the respective target areas E are arranged in a circular arc shape, the third tube 43 may be correspondingly arranged in a circular shape so as to enclose the respective target areas E in a circular area surrounded by the tube.

With continued reference to fig. 1-7, in embodiments of the present application, at least one of the following dimensions of the gas delivery conduit 4 is adjustable: the shape of the air delivery pipe 4, the length of the air delivery pipe 4 in the extending direction, and the extending angle of the air delivery pipe 4, wherein the relative positions of the at least one first air outlet hole 5 and the at least one target area E are changed along with the adjustment of the at least one dimension of the air delivery pipe 4. This is advantageous in that the compatibility of the drainage device 1 is improved and the load board 61 can be adapted to different shapes/sizes and DUT arrangements.

For example, in a variation, in order to increase the occasions where the drainage device 1 of the present application may be applied, each air pipe 4 may be configured as a hose, and adaptively adjusted in a targeted manner according to the relative position of the target area E, so as to ensure that the air flow blown to each target area E is more uniform and concentrated, thereby improving the temperature raising/lowering speed and uniformity of the chip to be tested.

In one implementation, with continued reference to fig. 1-4, the main body 2 may have a chamber 23, the chamber 23 communicating with the first inlet port 3 and the air delivery conduit 4, respectively. After flowing in from the first air inlet hole 3, the air flow can be temporarily stored in the chamber 23 and uniformly spread in the chamber 23. The temperature and flow rate of the air flowing into each air delivery pipe 4 are more uniform through the buffer of the chamber 23.

Further, the volume of the chamber 23 may be adapted to the cross-sectional area of the first inlet aperture 3. Specifically, if the volume of the chamber 23 is too small, the temporarily stored air flow amount is small, and in this case, even if the cross-sectional area of the first air intake hole 3 is large enough, the air flow amount that can be distributed to each air delivery pipe 4 via the chamber 23 is too small, and the purpose of increasing the raising/lowering speed cannot be achieved.

Further, the main body 2 may include a cover 21 and a base 22, the cover 21 and the base 22 together enclosing the chamber 23. As in the embodiment shown in fig. 4, the chamber 23 is provided on the base 22 and is formed recessed downward in the z-direction from the upper surface of the base 22. Further, an annular groove 24 is formed on the base 22 around the chamber 23, and the groove 24 is suitable for mounting a sealing rubber ring to strengthen the air tightness of the chamber 23, so that leakage and loss of air flow are effectively prevented.

In a variation, the chamber 23 may be disposed on the cover 21 and recessed upward from the lower surface of the cover 21 along the z-direction, and the groove 24 for placing the sealing rubber ring may be formed on the cover 21. In a variant, the chamber 23 may also consist of a recess provided in both the cover 21 and the base 22.

Further, the cover 21 and the base 22 of the main body 2 may be connected by fasteners 25. The fastener 25 may be, for example, a bolt-nut mating structure.

In one implementation, referring to fig. 1 and 3, the first air intake hole 3 may be formed in the cover 21, and the air flows from the first air intake hole 3 into the chamber 23. The base 22 is provided with an opening 221 communicating with the air delivery pipe 4, and the air flow temporarily stored in the chamber 23 flows from the opening 221 into the air delivery pipe 4 and finally blows toward the target area E.

By the above, with the present embodiment, the air flow inputted through the first air intake holes 3 can be finally blown more uniformly to each of the at least one target area E by the position setting of the at least one first air outlet holes 5 on the air delivery pipe 4. Further, the air flow of the first air intake hole 3 can be made to reach the air delivery pipe 4 almost without loss.

Further, the first inlet aperture 3 is adapted to allow the externally supplied gas to reach the at least one first outlet aperture 5 with almost no loss, which is advantageous for increasing the amount of gas flow transported and split through the flow guiding device 1.

FIG. 7 is a cross-sectional view of a testing device according to an embodiment of the present utility model.

Specifically, the test device 6 of the present embodiment may be provided with the drainage device 1 shown in fig. 1 to 5 described above.

In the present embodiment, the width direction (x direction shown in the drawing) of the drainage device 1 may be parallel to the width direction of the test device 6, the length direction (y direction shown in the drawing) of the drainage device 1 may be parallel to the length direction of the test device 6, and the height direction (z direction shown in the drawing) of the drainage device 1 may be parallel to the height direction of the test device 6.

Further, referring to fig. 7, the testing device 6 may include a load board 61, the load board 61 having opposite first and second faces 611, 612. The first side 611 of the load board 61 has at least one target area E for placing a chip to be tested. The arrangement of the target areas E on the load board 61 may be, as shown in fig. 6, specifically two columns along the x-direction and three rows along the y-direction, and six target areas E in total.

In a variation, the number and arrangement of the target areas E on the load board 61 may be different, for example, increasing the number of target areas E increases the number of chips that can be tested in the same batch, and the test efficiency of the whole test device 6 increases.

Further, the testing device 6 further includes a heat flow cover 62 covering the first surface 611 of the load board 61, and the heat flow cover 62 is provided with an air supply hole 621. In the embodiment disclosed herein, the heat flow cover 62 is rectangular in shape and is adapted to the arrangement of the target areas E on the load plate 61.

In one variation, the shape of the heat flow shield 62 may be adjusted according to the arrangement of the target areas E on the load plate 61. For example, if the target areas E on the load plate 61 are arranged in a circular arc shape, the heat flow cover 62 may be configured as a circular cover body, so as to improve the utilization efficiency of the space in the cover body as much as possible and increase the speed of raising/lowering the temperature.

Further, a sealing and heat insulating structure such as foam may be added to the contact portion between the heat flow cover 62 and the load plate 61. So as to further improve the air tightness of the testing device 6, prevent the air flow from overflowing and improve the speed of rising/falling.

Further, the testing device 6 further comprises a drainage device 1 as described above, which is arranged between the load board 61 and the heat flow cover 62, and the air supply hole 621 on the heat flow cover 62 is connected with the first air inlet hole 3 of the drainage device 1. In particular, the drainage device 1 may be housed within the space enclosed by the heat flow shield 62 and the first face 611.

In a typical application scenario, the delivery flow of the test up/down airflow may include: first, an air flow (indicated by a chain line with an arrow in fig. 7) is inputted from the air supply hole 621 of the air flow cover 62, and enters the drainage device 1 through the first air intake hole 3 communicating with the air supply hole 621. After entering the drainage device 1, the chip is temporarily stored in the main body 2, specifically, the chip can be buffered and diffused in the cavity 23 of the main body 2, and then blown to the chip to be tested on the target area E along the gas pipe 4 communicated with the main body 2.

The air flow blown to the corresponding chip to be tested through the first air outlet holes 5 finally diffuses in the whole cover body. During the period, the residual heat/cold carried by the air flow can be used for raising/lowering the ambient temperature of the whole test space in the cover body, so that the test effect is further improved.

In one implementation, with continued reference to fig. 7, the test apparatus 6 may further include a fixture 63 for securing the chip under test to the corresponding target area E.

Specifically, the fixture 63 may be provided with at least one opening 631, and the first air outlet 5 and/or the air flow blown out from the first air outlet 5 is directed towards the at least one opening 631.

For example, the jig 63 may be opened with an opening 631 above in the z direction to expose the upper surface of the chip to be tested. The opening 631 is adapted to receive the air flow blown out from the first air outlet aperture 5 of the first tube 411.

For another example, the jig 63 may be provided with an opening 631 at a side in the x or y direction to expose a side of the chip to be tested. The opening 631 is adapted to receive the air flow blown from the second tube 413 that is reflected by the first face 611.

Further, the shape and size of the opening 631 of the clamp 63 may be designed adaptively according to the shape and size of the chip to be tested being clamped.

Therefore, the temperature rising and falling speed of each chip to be tested is kept consistent and Wen Biangeng is uniform through the design of at least one first air outlet hole 5 on the air conveying pipe 4, for example, the design matched with the opening 631 on the clamp 63.

In one implementation, with continued reference to fig. 7, the testing device 6 may further include: a stopper 64 provided around the air supply hole 621; an adapting portion 65 disposed around the first air intake hole 3, and a limiting portion 64 for cooperating with the adapting portion 65 to limit the relative positions of the air supply hole 621 and the first air intake hole 3.

In one embodiment, as shown in fig. 7, the stop 64 may include a cover structure that conforms to the shape of the gasket, and the gasket is inserted into the cover structure when the heat flow cover 62 is mounted down to the first face 611, thereby completing the fitting. Meanwhile, the relative positions of the air supply hole 621 and the first air inlet hole 3 are limited, so that the air flow is ensured to be blown into the first air inlet hole 3 from the air supply hole 621 basically without loss, and the testing efficiency of the testing device 6 is improved.

In a variation, the manner of matching the limiting portion 64 and the adapting portion 65 may be: the stopper portion 64 includes a tubular structure provided below the air supply hole 621, and the fitting portion 65 includes a spacer provided above the cover plate 21 in the z-direction. A through hole 651 matched with the aperture of the first air inlet hole 3 is dug in the middle of the gasket, and the outer diameter of the limiting part 64 is equal to or slightly smaller than the diameter of the through hole 651. Thus, the limiting part 64 can be inserted into the through hole 651 to complete the matching with the matching part 65, and the two parts cooperate to limit the relative movement of the heat flow cover 62 and the drainage device 1 in the plane formed by the x direction and the y direction.

By the above, with the present embodiment, by adding the flow guiding device 1 between the heat flow cover 62 and the load board 61, the air flow blown out from the air supply hole 621 of the heat flow cover 62 can be blown onto each chip to be tested carried on the load board 61 with a larger air flow and in a more uniform manner. Specifically, the first air inlet hole 3 and the first air outlet hole 5 of the flow guiding device 1 are communicated, so that the air flow input by the heat flow cover 62 can reach the air delivery pipe 4 almost without loss. Further, by the position of the at least one first air outlet hole 3 on the air delivery pipe 4, the air flow input by the heat flow cover 62 can be blown to each of the at least one chip more uniformly.

In a typical application scenario, a series of experiments were performed with the test device without the drainage device 1 (i.e., the test device adopted in the prior art) and the test device 6 with the drainage device 1 as a control group in this embodiment, so as to verify that the test device 6 in this embodiment can achieve the technical effects of high test efficiency and more uniform temperature rise/drop. The following describes the specific experimental procedure and experimental results in detail.

With the write protection pin (WP) of the chip to be tested set high, the static (standby) current I at a supply voltage (Voltage at the Common Collector, VCC) of 3.3V _{SB1_WPH_V330} As a parameter for determining when the temperature rise and fall are stable. At current I _{SB1_WPH_V330} And (3) taking an image on an ordinate (in milliamperes, mA) and taking time on an abscissa (in seconds, s), and analyzing the time point when the chip to be tested, which is arranged in each target area E, rises and falls to the expected temperature according to the image. The difference of the temperature rise and fall effects under the condition that whether the drainage device is additionally arranged is compared, whether the test device 6 can lead each target area E to be balanced in temperature rise and fall or not is analyzed, the time required by the temperature rise and fall of each target area E to the expected temperature is reduced, the total test time is shortened, and the test cost is reduced. The load board 61 for testing in the present test procedure is a test load board with six target areas E, and the six target areas E for placing chips to be tested are arranged on the first surface 611 of the load board 61 in three rows and two columns, and the specific arrangement mode is shown in fig. 6.

In the first group of experiments, a 32G chip is taken as a test object, and the current I is analyzed before and after the drainage device 1 is additionally arranged and is cooled from the normal temperature of 25 ℃ to-55 DEG C _{SB1_WPH_V330} (mA) change with time(s).

For convenience of description, a test experiment for a test device without the drainage device 1 is denoted as experiment one, and a current change curve of each target area E is denoted as a first cooling curve; the test experiment for the test device 6 to which the drainage device 1 was added was denoted as experiment two, and the current change curve of each target area E was denoted as a second temperature decrease curve.

Experiment one: before adding the tooling, the current I is reduced to-55 ℃ from normal temperature _{SB1_WPH_V330} The curve of (mA) versus time(s) is shown in fig. 8. In fig. 8, a11 to a16 are first cooling curves of the first to sixth target areas E1 to E6, respectively, before the drainage device 1 is attached.

As shown in fig. 8, the current I _{SB1_WPH_V330} The current is firstly and rapidly reduced from about 0.065mA to below 0.06mA, the reduction speed is firstly increased and then reduced, and then the current is slightly increased to about 0.06mA and then basically kept unchanged.

As shown in fig. 6, during the cooling process, the first temperature change turning point a10 of the second target area E2 and the fifth target area E5 is earliest due to the shortest linear distance between the positions of the second target area E2 and the fifth target area E5 on the load board 61 and the air supply hole 621 on the heat flow cover 62; accordingly, since the straight line distances of the first, third, fourth, and sixth target areas E1, E3, E4, and E6 from the air supply hole 621 are relatively long, the first temperature change turning point a10 thereof occurs later.

As is clear from the image results, the temperature change rate of each target area E on the load plate 61 is not uniform before the drainage device 1 is attached, and the temperature decrease rate of the target area E closer to the air supply hole 621 is faster.

Meanwhile, as shown in fig. 8, the current when the first cooling curve a16 corresponding to the sixth target area tends to be in a stable state is obviously smaller than that of other target areas E, and the cooling curves of the target areas E are loose and sparse in the stable state, which indicates that the temperature difference of the target areas E is still larger after entering the stable state before the drainage device 1 is additionally installed, and the internal temperature of the experimental device is still uneven.

Experiment II: FIG. 9 shows the current I of the chip to be tested in each target area E when the test device 6 is used for temperature reduction test after the drainage device 1 is additionally installed _{SB1_WPH_V330} Schematic of the variation of (mA) over time(s). Wherein a21 to a26 are the first cooling curves of the first target area E1 to the sixth target area E6 after the drainage device 1 is added, respectively.

Referring to fig. 9, after the drainage device 1 is added, the occurrence time of the second temperature change turning point a20 of each target area E is relatively consistent, which indicates that the temperature change speeds of each target area E are relatively synchronous.

Meanwhile, the cooling curves of the target areas E are relatively concentrated in a stable state, which indicates that after the drainage device 1 is additionally arranged, the temperature difference of the target areas E is not large after the target areas E enter the stable state, and the temperatures tend to be consistent.

Further, in order to more intuitively install the influence of the drainage device on the temperature change of the target area, the inventor selects the second target area E2, the third target area E3 and the fourth target area E4 shown in fig. 6 as experimental objects, and obtains the test results shown in fig. 10, fig. 11 and fig. 12 by using the cooling curves before and after installing the drainage device 1 in each target area E as a comparison.

FIG. 10 shows the current I of the chip to be tested in the second target area E2 during the temperature reduction test by using the test device 6 before and after the additional installation of the drainage device 1 _{SB1_WPH_V330} Comparative schematic of (mA) versus time(s).

FIG. 11 shows the current I of the chip to be tested in the third target area E3 during the temperature reduction test by using the test device 6 before and after the additional installation of the drainage device 1 _{SB1_WPH_V330} Comparative schematic of (mA) versus time(s).

FIG. 12 shows the current I of the chip to be tested in the fourth target area E4 when the test device 6 is used for temperature reduction test before and after the drainage device 1 is additionally installed _{SB1_WPH_V330} Comparative schematic of (mA) versus time(s).

Referring to fig. 10, the trend of the first cooling curve a12 corresponding to the second target area E2 before the drainage device 1 is additionally installed is shown, and the current I of the chip to be tested is near 52s _{SB1_WPH_V330} (mA) is minimized, about 0.6mA, and after a period of ascent, begins to go to steady state at about 156 s. In combination with the second target area E2 shown in FIG. 6In this position, since the second target area E2 is closer to the air supply hole 621, the temperature of the chip to be tested fixed on E2 will first drop below the predetermined temperature, and then reach a stable state of the predetermined temperature along with the stable temperature of the entire test environment.

And referring to fig. 10, the second cooling curve a22 corresponding to the second target area E2 after the drainage device 1 is additionally installed has a trend, and when the drainage device 1 is additionally installed, the turning point appears at about 78 s. The time required for the second target region E2 to reach and stably maintain the target temperature is shorter.

According to fig. 11, before the drainage device 1 is installed, the time for generating the turning point of the first cooling curve a13 corresponding to the third target area E3 is later. And after the drainage device 1 is additionally installed, the turning point of the second cooling curve A23 corresponding to the third target area E3 appears earlier. Specifically, when the drainage device 1 is not attached, the turning point appears at about 117 s; after the drainage device 1 is attached, the turning point appears at about 52 s.

In other words, after the drainage device 1 is attached, the time required for the third target area E3 to reach and stably maintain the target temperature is shorter.

In a comparative experiment in which the fourth target area E4 was the test object, it can also be observed that, in conjunction with the illustration of fig. 12: before the drainage device 1 is additionally installed, the occurrence time of the turning point of the first cooling curve A14 corresponding to the fourth target area E4 is obviously later than that of the turning point of the second cooling curve A24 corresponding to the fourth target area E4 after the drainage device 1 is additionally installed. Specifically, when the drainage device 1 is not attached, the turning point appears at about 104 s; after the drainage device 1 is attached, the turning point appears at about 52 s.

In other words, the set of comparative experiments can demonstrate that the temperature change speed of the fourth target area E4 is faster and the target temperature can be reached faster after the drainage device 1 is added.

The three groups of comparison tests can show that the drainage device 1 is additionally arranged, so that the chips to be tested in all target areas E can be cooled to a stable temperature more quickly.

Further, taking a 64G chip as an example, the drainage device is additionally arranged in analysis1, in the heating process from normal temperature to 125 ℃, the current I _{SB1_WPH_V330} (mA) changes with time(s), and the change curves are shown in FIGS. 13 and 14.

For convenience of description, a test experiment without the drainage device 1 is denoted as an experiment three, and a current change curve of each target area E is denoted as a first temperature rise curve; the test experiment in which the drainage device 1 was added was denoted as experiment four, and the current change curve of each target area E was denoted as a second temperature rise curve.

FIG. 13 shows the current I of the chip to be tested in each target area E when the temperature rise test is performed by the test device 6 before the drainage device 1 is attached _{SB1_WPH_V330} Schematic of the variation of (mA) over time(s). Wherein, B11 to B16 are the first temperature rise curves of the first to sixth target areas E1 to E6, respectively, before the drainage device 1 is attached.

FIG. 14 shows the current I of the chip to be tested in each target area E when the temperature rise test is performed by using the test device 6 after the drainage device 1 is added _{SB1_WPH_V330} Schematic of the variation of (mA) over time(s). Wherein, B21 to B26 are respectively second temperature rising curves of the first target area E1 to the sixth target area E6 after the drainage device 1 is added.

Referring to fig. 13 and 14, the current I is measured during the heating process, whether or not the drainage device 1 is additionally installed _{SB1_WPH_V330} The change trend of (a) is that the increase is firstly rapid and then the increase is also firstly increased and then decreased, and then the current I of each target area E _{SB1_WPH_V330} And remains substantially unchanged after reaching a steady state.

By comparing fig. 13 and 14, the steady current in each target area is greater after the installation of the drainage device 1 than before the installation of the drainage device 1. For example, in fig. 13, the first temperature rise curve B15 corresponding to the fifth target region E5 corresponds to the current I when the steady state is reached _{SB1_WPH_V330} Stabilized at about 2 mA. In fig. 14, a second temperature rise curve B25 corresponding to the fifth target region E5 corresponds to the current I when the steady state is reached _{SB1_WPH_V330} Stable at about 2.5 mA. This means that after the addition of the drainage device 1, the heat utilization rate of the gas supplied by the test device 6 is higher and the loss is lower.

Further, with continued reference to fig. 13, the current I when the first temperature rising curve B12 corresponding to the second target area E2 reaches the steady state before the drainage device 1 is additionally installed _{SB1_WPH_V330} Is larger than the current I when the first temperature rising curve B16 corresponding to the sixth target area E6 and the first temperature rising curve B13 corresponding to the third target area E3 reach a stable state _{SB1_WPH_V330} 。

After the drainage device is added, as shown in fig. 14, the current I reaches the steady state when the second temperature rising curve B26 corresponding to the sixth target area E6 and the second temperature rising curve B23 corresponding to the third target area E3 reach _{SB1_WPH_V330} A current I greater than the current when the second temperature rising curve B22 corresponding to the second target area E2 reaches the steady state _{SB1_WPH_V330} . This means that the current I of the chip carried by the third and sixth target areas E3 and E6 increases to a high temperature according to the characteristics of each chip _{SB1_WPH_V330} Should be greater than the current I of the chip carried by the second target area E2 _{SB1_WPH_V330} 。

The opposite result is obtained before the drainage device 1 is added, and the second target area E2 is closer to the ventilation hole 621 in combination with the setting position of each target area E shown in fig. 6, so that the temperature rising speed is faster, and the third target area E3 and the sixth target area E6 are relatively farther from the ventilation hole of the heat flow cover, and the temperature rising speed is relatively slower. And the heat carried by the air flow blowing to the further target area E is theoretically less as the air flow transfers heat with the air in the hood and the target area E.

The additional installation of the drainage device 1 thus improves the problem of uneven temperature change in each target area E2 caused by the different distances between the setting positions of the target areas E and the air supply holes 621.

Further, due to the current I at the time of temperature rise _{SB1_WPH_V330} The curve does not have obvious turning points along with the time, and further processing is needed to be carried out on the test data in order to judge the time point when the chip is heated to a stable state.

The most visual observation mode of the temperature rising speed is to count the current I corresponding to two adjacent test time points _{SB1_WPH_V330} Variation of the difference.

Fig. 15 is a schematic diagram showing the change of the current change Δi (mA) per second of the chip to be tested in each target area E with time(s) when the temperature rise test is performed by using the test device 6 before the drainage device 1 is attached. Before the drainage device is installed, C11 to C16 respectively correspond to a change curve of current change Δi (mA) per second of the chip to be tested on the first target area E1 to the sixth target area E6 with time(s).

Fig. 16 is a schematic diagram showing the change of the current change Δi (mA) per second of the chip to be tested in each target area E with time(s) when the temperature rise test is performed by using the test device 6 after the drainage device 1 is attached. After the drainage devices are respectively and correspondingly arranged from C21 to C26, the current change delta I (mA) per second of the chip to be tested on the first target area E1 to the sixth target area E6 is changed along with the change curve of time(s).

With reference to FIGS. 15 and 16, it can be observed that the measured current variation ΔI per second increases rapidly, i.e. the current I, before and after the addition of the drainage device 1 _{SB1_WPH_V330} The rising speed is increased to about 0.008mA, and then gradually reduced to a value near 0, and oscillation is stable.

As shown in fig. 15, before the drainage device 1 is installed, the temperature rising speed is fastest because the fifth target area E5 is relatively closer to the air supply hole 621 of the heat flow cover 62. Meanwhile, the change curves of the target areas E are loose, which indicates that the temperature rise speed difference between the target areas E is large.

As shown in fig. 16, after the drainage device 1 is additionally installed, the change curves of the target areas E are concentrated, and have clear common change trends. In other words, the temperature rising speeds of the target areas E tend to be uniform, so that the difference in temperature rising speed due to the distance from the air supply hole 621 is avoided, and the accuracy of the test is prevented from being affected.

In order to make the trend of the current change amount delta I per second after the drainage device 1 is added more obvious, the experiment further takes an average value dISB1 of the current change amount delta I per second measured at 5 adjacent time points.

Average value d of current change per second in each target area E _ISB1 The curve of (mA) versus time(s) is shown in fig. 17. Wherein C31 to C36 respectively correspond to the first orderAverage value d of current change per second of target area E1 to sixth target area E6 _ISB1 Change over time.

According to fig. 17, the temperature change trend of each target area E is clearer, but a definite point of time when the chip is warmed up to a steady state cannot be found. Thus, further take two adjacent time points to correspond to d _ISB1 The difference of (d) is recorded as d _2ISB1 。

d _2ISB1 The time(s) profile of (mA) is shown in FIG. 18, in which D21-D26 correspond to D measured in the first target area E1 to the sixth target area E6, respectively _2ISB1 A time-dependent profile; z1 to Z4 represent the first region to the fourth region of the image, respectively.

As can be seen from fig. 17, d corresponds to each target area E _2ISB1 First decreasing to a negative value, then rising slightly, finally remaining oscillating around 0. I.e. the average value d of the current variation per second of each target area E _ISB1 The change speed of (c) is reduced to a negative value, and then slightly rises to about 0 for oscillation.

Further, with continued reference to fig. 17, d corresponds to each target area E _2ISB1 The first time it takes about 100s to decrease to 0, about 200s to decrease to the lowest point, and about 400s to re-rise to around 0.

Specifically, in the region Z1, d corresponds to each target region E _2ISB1 The value of (a) is always greater than 0, and the average value d of the current variation per second of each target area E _ISB1 Rise, but the rise speed gradually decreases. By about 100s, d corresponds to each target region E _2ISB1 The value of (2) is 0, and the average value d of the current variation per second of each target area E _ISB1 Reaching the highest value.

In the regions Z2 and Z3, d corresponds to each target region E _2ISB1 The value of (2) is always smaller than 0, and the average value d of the current change quantity per second of each target area E corresponds to _ISB1 Descending. Wherein d corresponds to each target region E in the region Z2 from about 100s to 200s _2ISB1 The value of (a) decreases to the lowest point (the absolute value increases) and corresponds to the average value d of the current change amount per second of each target area E _ISB1 The speed of the descent becomes greater; in the areaIn the field Z3, d corresponds to each target region E from about 200s to 400s _2ISB1 Gradually rising to zero (decreasing absolute value) corresponding to the average value d of the current variation per second of each target region E _ISB1 The speed of the descent becomes smaller.

In zone Z4, d of each target zone E _2ISB1 The oscillation is kept around 0, i.e. the average value d of the current variation per second of each target area E _ISB1 The change speed of (2) tends to be 0.

Referring to FIG. 17, zone Z1 corresponds to between 0s and about 100s, during which time each target zone E has an average value d of current variation per second _ISB1 Gradually increase the current I corresponding to each target area E _{SB1_WPH_V330} The rising speed increases.

Zones Z2 and Z3 correspond to about 100s to about 400s during which each target zone E has an average d of current changes per second _ISB1 Gradually decrease, corresponding to the current I of each target area E _{SB1_WPH_V330} The rising speed decreases.

Zone Z4 corresponds to approximately 400s to the end of the test, during which time each target zone E has an average value d of current variation per second _ISB1 Tending to 0, corresponding to the current I of each target area E _{SB1_WPH_V330} The change speed tends to 0, i.e. the current I of each target area E _{SB1_WPH_V330} Entering a steady state.

Taking further consideration of the error range of the test, the test is used to measure the current I _{SB1_WPH_V330} The range of the instrument is (-25, 25) mA, the precision is 0.0125mA, and the error range is +/-0.5%. Thus, in practice at 300s, the current I _{SB1_WPH_V330} The value of (2) is about 1mA, and the corresponding error is about 0.004mA, and the current variation per second of each target area E is within the error range. It can be considered that the current I at this time and thereafter _{SB1_WPH_V330} The increment of (c) is very small and the chip temperature has reached substantially steady state.

From the above experimental results, it was found that the temperature of the chip to be tested was raised to a steady state at about 300 seconds (5 minutes) when the temperature raising test was performed using the test device 6 to which the drainage device 1 was attached. Compared with the prior art, the test device without the drainage device 1 needs to take 10 minutes or more to enable the temperature of the chip to reach a stable state, and the test device 6 of the embodiment can save more than half of the temperature rise time.

Therefore, the remarkable shortening of the temperature rise and fall time is beneficial to improving the test efficiency, and the improvement of the test efficiency can further reduce the test cost.

Although the present utility model is disclosed above, the present utility model is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the utility model, and the scope of the utility model should be assessed accordingly to that of the appended claims.

Claims

1. A drainage device, comprising:

a main body part provided with a first air inlet;

the air delivery pipe is communicated with the first air inlet hole and is provided with at least one first air outlet hole, and the at least one first air outlet hole is uniformly arranged around at least one target area.

2. The drainage device of claim 1, wherein the gas line comprises: the first pipeline group comprises pipelines corresponding to the at least one target area, and each pipeline in the first pipeline group is provided with a first air outlet.

3. The drainage device of claim 2, wherein the first tubing set comprises: at least one first tube is in one-to-one correspondence with the at least one target area.

4. The drainage device of claim 3, wherein for each of said first tubes, the projection of a first air outlet opening in said first tube onto the plane of said target area falls within said target area.

5. The drainage device of claim 2, wherein the first tubing set comprises: at least one second tube, wherein each of the second tubes corresponds to at least two of the at least one target area.

6. The drainage device of claim 5, wherein for each of the second tubes, the projection of the first outlet opening of the second tube onto the plane of the target area is located between two adjacent target areas.

7. The drainage device of claim 5, wherein a distance from the first air outlet opening in the second tube to a plane in which the target area is located is less than a first predetermined threshold.

8. The drainage device of claim 1, wherein the gas line comprises: and the third pipe is arranged around the at least one target area, the at least one first air outlet holes are arranged on the third pipe at intervals and correspond to the at least one target area, and the number, the total cross-sectional area and/or the distance from the first air outlet holes corresponding to each target area to the first air outlet holes corresponding to the target area are the same.

9. The drainage device of claim 1, wherein at least one of the following dimensions of the gas line is adjustable: the shape of the air delivery pipe, the length of the air delivery pipe along the extending direction and the extending angle of the air delivery pipe, wherein the relative positions of the at least one first air outlet hole and the at least one target area are changed along with the adjustment of the at least one dimension of the air delivery pipe.

10. The drainage device of claim 1, wherein the body portion has a chamber that communicates with the first air inlet and the air delivery tube, respectively.

11. The drainage device of claim 10, wherein the volume of the chamber and the cross-sectional area of the first inlet aperture are adapted.

12. The drainage device of claim 10, wherein the body portion comprises: the cover plate and the base enclose the cavity together, the first air inlet is formed in the cover plate, and the base is formed with a hole communicated with the air pipe.

13. A test device, comprising:

the chip testing device comprises a load board, a first testing board and a second testing board, wherein the load board is provided with a first surface and a second surface which are opposite, the first surface of the load board is provided with at least one target area, and the target area is used for placing a chip to be tested;

the heat flow cover is covered on the first surface of the load plate and is provided with an air supply hole;

the drainage device of any one of claims 1 to 12, disposed between the load plate and the heat flow shield, the air supply hole communicating with the first air intake hole.

14. The test apparatus of claim 13, further comprising:

And the clamp is used for fixing the chip to be tested in the corresponding target area, at least one opening is formed in the clamp, and the first air outlet hole and/or the air flow blown out from the first air outlet hole faces to the at least one opening.

15. The test apparatus of claim 13, further comprising: a limiting part arranged around the air supply hole; and the adapting part is arranged around the first air inlet hole, and the limiting part is used for being matched with the adapting part to limit the relative position between the air supply hole and the first air inlet hole.