CN220629916U - Heat radiation structure of electronic module - Google Patents

Abstract

The utility model relates to a heat radiation structure of an electronic module, which belongs to the field of heat control of electronic equipment, wherein a shell is provided with a plurality of heat-generating electronic components, an air inlet hole is arranged on any side surface in the direction of a central line of the shell, and an air exhaust device is arranged on the shell and at a position far from the air inlet hole, wherein: under the high-temperature environment, the electronic components in the shell generate a large amount of heat, the air extractor forcibly conveys the air in the environment into the shell through the air inlet, the air extractor exchanges heat with the heat in a convection mode, and the heat-exchanged hot air is discharged from the shell through the air extractor, so that heat dissipation is maximized.

Description

Heat radiation structure of electronic module

Technical Field

The utility model belongs to the field of electronic equipment thermal control, and particularly relates to a heat dissipation structure of an electronic module.

Background

Because the electronic module comprises a functional chip with high heat flux density, and the installation space of the electronic module is limited, the temperature rise of the electronic module in operation is high, and the stability and the reliability of the electronic module are affected. Under the condition that the installation space is very limited, particularly when the thickness of the electronic module is very small, how to fully dissipate heat of the electronic module is realized, so that the chip with high heat flux density works in a reasonable temperature range, and the whole electronic module is ensured to work reliably. In recent years, due to the development of chip integration technology, the traditional electronic modules, such as optical fiber network electronic modules, generate larger heat by the internal electronic components, and the heat is more miniaturized, but the heat is still discharged by the heat dissipation teeth, and under the high-temperature environment, the internal temperature of the chip is easy to exceed the standard.

In view of this, the present utility model has been made.

Disclosure of Invention

The utility model aims to provide a heat radiation structure of an electronic module, which solves the technical problem that an integrated or miniaturized product in the prior art is poor in heat radiation. The technical scheme of the scheme has a plurality of technical advantages, and the following description is provided:

the utility model provides a heat radiation structure of electronic module, includes the casing, the casing is provided with a plurality of fever type's electronic components be provided with the inlet port on arbitrary side in the casing central line direction on the casing and keep away from the position department of inlet port is provided with air extraction device, wherein:

under the high-temperature environment, the electronic components in the shell generate a large amount of heat, the air extractor forcibly conveys the air in the environment into the shell through the air inlet hole, the air extractor exchanges heat with the heat in a convection mode, and the hot air after heat exchange is discharged from the shell through the air extractor.

Compared with the prior art, the technical scheme provided by the utility model has the following beneficial effects:

the air inlet and the air exhaust device form a convection heat dissipation mode, so that internal heat is discharged to the greatest extent. Under the condition that the installation space is very limited, particularly when the thickness of the electronic module is very small, in order to solve the heat dissipation problem of the high heat flux density chip of the electronic module assembled at high density, the small ventilation device is added on the surface of the electronic module, the air inlet hole and the air outlet hole are added, the small radiator and the runner with certain shapes are added inside the electronic module, and the heat of the high heat flux density chip is timely conducted out under the condition that the appearance and the size of the electronic module are not changed, so that the chip is ensured to work in a certain temperature range.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from them without inventive effort for a person skilled in the art.

FIG. 1 is a schematic illustration of an overall structure;

fig. 2 is a schematic diagram of an internal heat dissipation mode, wherein:

1. an air inlet hole; 2. a housing; 3. a chip; 4. maximum power electronic components; 5. an adjustable socket; 6. a handle; 7. an air extracting device; 8. heat exchanged air; 9. heat dissipation teeth.

Detailed Description

Other advantages and effects of the present utility model will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present utility model with reference to specific examples. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. The utility model may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present utility model. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present disclosure, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, an apparatus may be implemented and/or a method practiced using any number of the aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.

It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present utility model by way of illustration, and only the components related to the present utility model are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.

In addition, in the following description, specific details are provided in order to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that aspects may be practiced without these specific details. In order to better understand the aspects of the present utility model, the present utility model will be described in further detail with reference to the accompanying drawings and detailed description. The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

Referring to the heat dissipation structure of the electronic module shown in fig. 1, the heat dissipation structure comprises a housing 2, wherein the housing 2 is provided with a plurality of heat-generating electronic components, an air inlet hole 1 is arranged on any side surface in the direction of a central line of the housing 2, and an air exhaust device 7 is arranged on the housing 2 and at a position far away from the air inlet hole 1, wherein:

under the high-temperature environment, the electronic components in the shell 2 generate a large amount of heat, the air extractor 7 forcibly conveys the air in the environment into the shell 2 through the air inlet hole 1, the air extractor exchanges heat with the heat in a convection mode, and the air 8 after heat exchange is discharged from the shell 2 through the air extractor 7. The air extraction device 7, for example, a small ventilation device or an exhaust fan or an air extraction device 7. Through increasing fresh air inlet and fresh air outlet at the reasonable position in casing 2 surface, design high-efficient heat dissipation runner for electronic components in the casing 2, make medium such as air can in time be derived with the heat that electronic components (e.g. chip 3) produced to high efficiency.

As a specific embodiment provided in the present disclosure, in a conventional manner, the housing 2 is provided with the adjustable socket 5 connected with the electronic component, so that the air inlet 1 and the adjustable socket are located on the same side of the housing 2, and the position of the air inlet is far away from the adjustable socket 5, preferably, the diameter of the air inlet 1 is less than 4mm, so as to avoid electromagnetic leakage of the electronic component, and continuously reduce heat generated after the adjustable socket 5 is abutted to external equipment. The purpose of the air inlet aperture 1 having a diameter below 4mm is: considering the balance of electromagnetic leakage and heat dissipation, electromagnetic leakage is liable to cause interference to electronic devices outside the housing 2, for example, ion inversion occurs in signal reception.

Further, as shown in fig. 2, the housing 2 is provided with a handle 6, and the air intake holes 1 are located between two fixed bars of the handle 6, and the number of the air intake holes 1 is not less than 3, and not less than 10. And the heat dissipation is carried out in a path maximizing mode, more heat can be taken away, the heat exchange is carried out with the environment, and the heat exchange efficiency is improved.

The air extractor 7 is an air extractor fan or an exhaust fan or a blower fan, and is installed in an embedded installation mode.

As a specific embodiment provided in the present case, the side surface on which the air extraction device 7 is installed is parallel to the side surface on which the air intake hole 1 is provided, so as to reduce the flow resistance of the air entering through the air intake hole 1, for example, the air extraction device 7 and the air intake hole 1 are respectively provided at the position of the maximum diagonal line of the housing 2, that is, the air extraction device 7 is provided on the side surface parallel to the side surface on which the air intake hole 1 is provided.

As the specific embodiment provided in the present case, the maximum power electronic component 4 is disposed on the inner side surface of the housing 2 in the conventional manner, so that the air extractor 7 is disposed on the side surface far away from the maximum power electronic component 4, and the air extractor 7 is mounted at the position with the maximum distance from the air inlet hole 1, and the heat dissipation fin or the heat dissipation rib or the heat dissipation tooth 9 is disposed on the side surface of the housing 2, and the heat dissipation fin or the heat dissipation rib or the heat dissipation tooth 9 and the air extractor 7 are located on the same side surface.

According to the utility model, the small ventilation device is added on the surface of the electronic module, the air inlet hole and the air outlet hole are added at reasonable positions, the more efficient radiator is added in the electronic module, and the efficient flow channel is designed, so that the medium such as air can efficiently conduct out the heat generated by the chip in time, and the effects are as follows:

1. the utility model can obviously reduce the temperature of the high heat flux density chip in the electronic module, so that the chip can work in a normal working temperature range, and the reliability of the heat flux density chip is improved.

2. The utility model can obviously reduce the overall temperature of the electronic module, thereby reducing the temperature of the circuit board of the electronic module, leading other chips to be in a proper temperature range and improving the reliability of the electronic module

The product provided by the utility model is described in detail above. The principles and embodiments of the present utility model have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the core concepts of the utility model. It should be noted that it will be apparent to those skilled in the art that several improvements and modifications can be made to the utility model without departing from the inventive concept, and these improvements and modifications fall within the scope of the appended claims.

Claims (9)

1. The utility model provides a heat radiation structure of electronic module, includes the casing, the casing is provided with a plurality of fever type's electronic components, its characterized in that be provided with the inlet port on arbitrary side on the casing central line direction on the casing and keep away from the position department of inlet port is provided with air extraction device, wherein:

under the high-temperature environment, the electronic components in the shell generate a large amount of heat, the air extractor forcibly conveys the air in the environment into the shell through the air inlet hole, the air extractor exchanges heat with the heat in a convection mode, and the hot air after heat exchange is discharged from the shell through the air extractor.

2. The heat dissipating structure of claim 1, wherein the housing is provided with an adjustable socket for connecting with an electronic component, and the air inlet and the adjustable socket are located on the same side of the housing and away from the adjustable socket.

3. The heat dissipating structure of an electronic module of claim 2, wherein the diameter of the air inlet is less than 4mm to avoid electromagnetic leakage of the electronic components.

4. The heat dissipating structure of the electronic module of claim 3, wherein the housing is provided with a handle, the air intake holes are located between two fixing bars of the handle, the number of the air intake holes is not less than 3, and the number of the air intake holes is not less than 10.

5. The heat dissipating structure of an electronic module according to claim 1, wherein the air extraction device is an air extraction fan or an exhaust fan or a blower fan.

6. The heat dissipating structure of an electronic module according to claim 1, wherein a side surface on which the air extracting device is mounted is parallel to a side surface on which the air intake holes are provided, for reducing a flow resistance of air entering through the air intake holes.

7. The heat dissipating structure of the electronic module of claim 6, wherein the air extractor and the air intake hole are respectively disposed at a maximum diagonal position of the housing.

8. The heat dissipating structure of an electronic module according to claim 1, wherein a maximum power electronic component is provided on an inner side surface of the case, the air extracting device is provided on a side surface away from the maximum power electronic component, and the air extracting device is installed at a position having a maximum distance from the air intake hole.

9. The heat dissipating structure of the electronic module according to claim 1, wherein a heat dissipating fin or a heat dissipating rib is provided on a side surface of the housing, and the heat dissipating fin or the heat dissipating rib is located on the same side surface as the air extracting device.