CN220548132U - Automatic polishing solution supply system - Google Patents
Automatic polishing solution supply system Download PDFInfo
- Publication number
- CN220548132U CN220548132U CN202321516266.2U CN202321516266U CN220548132U CN 220548132 U CN220548132 U CN 220548132U CN 202321516266 U CN202321516266 U CN 202321516266U CN 220548132 U CN220548132 U CN 220548132U
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- Prior art keywords
- pipeline
- liquid supply
- storage tank
- recovery
- filter
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- 238000005498 polishing Methods 0.000 title claims abstract description 75
- 239000007788 liquid Substances 0.000 claims abstract description 122
- 238000003860 storage Methods 0.000 claims abstract description 73
- 238000011084 recovery Methods 0.000 claims abstract description 69
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000004140 cleaning Methods 0.000 claims abstract description 14
- 238000001914 filtration Methods 0.000 claims abstract description 4
- 239000000243 solution Substances 0.000 claims description 53
- 239000012670 alkaline solution Substances 0.000 claims description 10
- 238000004064 recycling Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 abstract description 6
- 239000002699 waste material Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 4
- 238000010926 purge Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010808 liquid waste Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The application discloses automatic liquid supply system of polishing solution includes: the storage tank is used for storing the polishing solution; the liquid supply unit is used for conveying the polishing liquid in the storage tank to equipment; the overflow pipeline is connected with the storage tank and discharges excessive polishing solution in the storage tank; the recovery unit is used for collecting and filtering the polishing solution used by the equipment and the polishing solution discharged by the overflow pipeline and then returning the polishing solution to the storage tank to form circulation; the temperature control unit is used for adjusting the temperature of the polishing solution in the storage tank; a water supply line, the water supply unit supplying water to the storage tank and for line cleaning; and the PH value adjusting unit is used for controlling the PH value of the polishing solution in the storage tank. The circulating liquid supply is realized through the cooperation of each unit and the pipeline, the problems that the manual liquid preparation time is long, the labor intensity is high, the efficiency is low, the product quality is unstable due to the deviation of the liquid preparation concentration are solved, the waste of polishing liquid is reduced, and the product cost is reduced.
Description
Technical Field
The application relates to the field of semiconductor production, in particular to an automatic polishing liquid supply system.
Background
Currently, the manufacturing process used to planarize integrated circuit layers is chemical mechanical polishing. The chemical mechanical polishing process combines chemical removal with mechanical polishing. The chemical mechanical polishing process polishes and removes material from the wafer and can be used to planarize multi-material surfaces by adding polishing liquid to the polishing surface during polishing.
In the prior art, polishing solution is placed in a tank body for storage and then is matched with each mechanism for transportation by a pipeline, and in the process of storage in the tank body, the polishing solution is easy to precipitate, so that the use of the polishing solution is affected.
Disclosure of Invention
The utility model aims to provide an automatic polishing liquid supply system which overcomes the defects in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the embodiment of the application discloses automatic liquid supply system of polishing solution, its characterized in that includes:
the storage tank is used for storing the polishing solution;
a liquid supply unit that conveys the polishing liquid in the storage tank to a device;
the overflow pipeline is connected with the storage tank and discharges excessive polishing solution in the storage tank;
the recovery unit is used for collecting and filtering the polishing solution used by the equipment and the polishing solution discharged by the overflow pipeline and then returning the polishing solution to the storage tank to form circulation;
the temperature control unit is used for adjusting the temperature of the polishing solution in the storage tank;
a water supply line that supplies water to the storage tank and is used for line cleaning;
and the PH value adjusting unit is used for controlling the PH value of the polishing solution in the storage tank.
Preferably, in the automatic polishing solution supply system, the solution supply unit comprises a solution supply pipeline, and a solution supply pump, a damper, a solution supply filter and a flowmeter which are sequentially arranged on the solution supply pipeline, wherein the solution supply pipeline is connected with a storage tank and equipment, solution supply control valves are arranged on the solution supply pipelines on two sides of the solution supply filter, a medium inlet and a medium outlet of the solution supply filter are connected with the solution supply pipeline, an exhaust port of the solution supply filter is connected with the storage tank through a first exhaust pipeline, a liquid outlet of the solution supply filter is connected with an overflow pipeline through a first liquid discharge pipeline, a first control valve connected with two solution supply control valves and the solution supply filter in parallel is arranged on the solution supply pipeline, a second control valve is arranged on the first exhaust pipeline, and a third control valve is arranged on the first liquid discharge pipeline.
Preferably, in the automatic polishing liquid supply system, a first cleaning pipeline connected with the water supply pipeline is arranged on the liquid supply pipeline, and a fourth control valve is arranged on the first cleaning pipeline.
Preferably, in the automatic polishing liquid supply system, a liquid supply pipeline between the flowmeter and the liquid supply control valve is provided with a return pipeline connected with the storage tank.
Preferably, in the automatic polishing solution supply system, the recovery unit comprises a recovery barrel, a recovery pump, a recovery filter and a recovery pipeline, the recovery pipeline is connected with the recovery barrel and the storage tank, the recovery pump and the recovery filter are sequentially arranged on the recovery pipeline, a medium inlet and a medium outlet of the recovery filter are connected with the recovery pipeline, an exhaust port of the recovery filter is connected with the storage tank through a second exhaust pipeline, a liquid outlet of the recovery filter is connected with an overflow pipeline through a second liquid discharge pipeline, recovery control valves are arranged on the recovery pipelines on two sides of the recovery filter, a fifth control valve connected with two recovery control valves and the recovery filter in parallel is arranged on the recovery pipeline, a sixth control valve is arranged on the second exhaust pipeline, and a seventh control valve is arranged on the second liquid discharge pipeline.
Preferably, in the automatic polishing liquid supply system, a second cleaning pipeline connected with the water supply pipeline is arranged on the recovery pipeline, and an eighth control valve is arranged on the second cleaning pipeline.
Preferably, in the automatic polishing liquid supply system, the recycling bin is provided with a third liquid drain pipe communicated with the overflow pipeline.
Preferably, in the polishing solution automatic supply system, the temperature control unit comprises a water chiller and a cold heat exchange tube, wherein two ends of the cold heat exchange tube are connected with the water chiller, and the cold heat exchange tube is arranged in the storage tank.
Preferably, in the automatic polishing solution supply system, the PH adjusting unit includes an alkaline solution storage tank, an adjusting pump, a third exhaust pipeline, an adjusting pipeline and a PH sensor, the PH sensor is disposed in the storage tank, the adjusting pipeline is connected with the alkaline solution storage tank and the storage tank, the adjusting pump is disposed on the adjusting pipeline, the third exhaust pipeline is connected with the alkaline solution storage tank and the storage tank, and a ninth control valve is disposed on the adjusting pipeline.
Compared with the prior art, the utility model has the advantages that:
the circulating liquid supply and the polishing liquid state adjustment are realized through the cooperation of the units and the pipelines, the problems of unstable product quality caused by long manual liquid preparation time, high labor intensity, low efficiency and deviation of liquid preparation concentration are solved, the waste of the polishing liquid is reduced, and the product cost is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some of the embodiments described in the present application, and that no inventive effort is made to obtain other drawings from these drawings by a person of ordinary skill in the art.
FIG. 1 is a schematic diagram of an automatic polishing liquid supply system according to an embodiment of the present utility model.
Detailed Description
The following detailed description of the technical solutions according to the embodiments of the present utility model will be given with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1, the polishing liquid automatic liquid supply system in this embodiment includes: a storage tank 1, the storage tank 1 being for storing a polishing liquid; a liquid supply unit 2, wherein the liquid supply unit 2 conveys the polishing liquid in the storage tank 1 to the equipment 3; an overflow pipe 4, wherein the overflow pipe 4 is connected with the storage tank 1 and discharges excessive polishing solution in the storage tank 1; the recovery unit 5 is used for collecting and filtering the polishing solution used by the equipment 3 and the polishing solution discharged by the overflow pipeline 4 and then returning the polishing solution to the storage tank 1 to form circulation; the temperature control unit 6 is used for adjusting the temperature of the polishing solution in the storage tank 1; a water supply line 7, the water supply line 7 supplying water to the tank 1 and for line cleaning; and a pH value adjusting unit 8, wherein the pH value adjusting unit 8 controls the pH value of the polishing solution in the storage tank 1.
Further, the liquid supply unit 2 includes a liquid supply pipeline 201, a liquid supply pump 202, a damper 203, a liquid supply filter 204 and a flowmeter 205 which are sequentially arranged on the liquid supply pipeline 201, the liquid supply pipeline 201 is connected with the storage tank 1 and the equipment 3, liquid supply control valves 206 are respectively arranged on the liquid supply pipelines 201 on two sides of the liquid supply filter 204, a medium inlet and outlet of the liquid supply filter 204 are connected with the liquid supply pipeline 201, an air outlet of the liquid supply filter 204 is connected with the storage tank 1 through a first air exhaust pipeline 207, a liquid outlet of the liquid supply filter 204 is connected with the overflow pipeline 4 through a first liquid exhaust pipeline 208, a first control valve 209 which is connected with the two liquid supply control valves 206 and the liquid supply filter 204 in parallel is arranged on the liquid supply pipeline 201, a second control valve 210 is arranged on the first air exhaust pipeline 207, and a third control valve 211 is arranged on the first liquid exhaust pipeline 208. Accurate liquid supply is carried out through the flowmeter to filter through setting up the filter, ensure the liquid supply quality, and cooperate through a pair of liquid supply control valve and first control valve switch, a pair of liquid supply control valve is closed and first control valve is opened promptly, can realize supplying liquid filter short circuit, thereby can change the filter core of liquid supply filter, otherwise then normally filter the liquid supply, maintenance uninterrupted cycle can, and the effect is better.
Further, the liquid supply line 201 is provided with a first purge line 212 connected to the water supply line 7, and the first purge line 212 is provided with a fourth control valve 213. The liquid supply pipeline and the pipeline connected with the liquid supply pipeline can be cleaned through the cleaning pipeline.
Further, a return line 214 connected to the storage tank 1 is provided in the liquid supply line 201 between the flow meter 205 and the liquid supply control valve 206, a return control valve 215 is provided in the return line 214, a fourth liquid discharge line 216 connected to the overflow line 4 is provided in the return line 201, and a tenth control valve 217 is provided in the fourth liquid discharge line 216. The reflux control valve controls the reflux pipeline and the tenth control valve controls the fourth liquid discharge pipeline to be matched with the flowmeter, so as to control the flow and protect the pipeline.
Further, the recovery unit 5 includes a recovery tank 501, a recovery pump 502, a recovery filter 503 and a recovery pipeline 504, the recovery pipeline 504 is connected with the recovery tank 501 and the storage tank 1, the recovery pump 502 and the recovery filter 503 are sequentially disposed on the recovery pipeline 504, a medium inlet and a medium outlet of the recovery filter 503 are connected with the recovery pipeline 504, an exhaust port of the recovery filter 503 is connected with the storage tank 1 through a second exhaust pipeline 505, a liquid outlet of the recovery filter 503 is connected with the overflow pipeline 4 through a second liquid discharge pipeline 506, recovery control valves 507 are disposed on the recovery pipelines 504 on two sides of the recovery filter 503, a fifth control valve 508 connected with the two recovery control valves 507 and the recovery filter 503 in parallel is disposed on the recovery pipeline 504, a sixth control valve 509 is disposed on the second exhaust pipeline 505, and a seventh control valve 510 is disposed on the second liquid discharge pipeline 506. The overflow is retrieved to the recycling bin and the used polishing solution of equipment filters through retrieving the filter, reaches the circulation in proper order, avoids the waste of polishing solution, reduce cost, analogy liquid supply controller and control valve's cooperation simultaneously realizes retrieving the pipeline short circuit and retrieves the change of filter core, maintains incessantly circulation, and the effect is better.
Further, the recovery line 504 is provided with a second purge line 511 connected to the water supply line 7, and the second purge line 511 is provided with an eighth control valve 512. The recovery pipeline and the pipeline connected with the recovery pipeline can be cleaned through the cleaning pipeline.
Further, the recycling bin 501 is provided with a third liquid drain pipe 513 communicated with the overflow pipeline 4, overflow of the recycling bin is avoided through the third liquid drain pipe, a protection effect is achieved, and a circulation effect is better.
Further, the temperature control unit 6 comprises a water chiller 601 and a cold heat exchange tube 602, wherein two ends of the cold heat exchange tube 602 are connected with the water chiller 601, and the cold heat exchange tube 602 is arranged in the storage tank 1. The constant temperature of the polishing solution is realized by cold-heat exchange, so that the polishing solution is in an optimal state, and the use effect is better.
Further, the PH adjusting unit 8 includes an alkaline solution storage tank 801, an adjusting pump 802, a third exhaust pipe 803, an adjusting pipe 804, and a PH sensor 805, where the PH sensor 805 is disposed in the storage tank 1, the adjusting pipe 804 is connected to the alkaline solution storage tank 801 and the storage tank 1, the adjusting pump 802 is disposed on the adjusting pipe 804, the third exhaust pipe 803 is connected to the alkaline solution storage tank 801 and the storage tank 1, and the adjusting pipe 804 is provided with a ninth control valve 806. The pH value is adjusted by adding alkaline solution into the storage tank, so that the use effect of the polishing solution is ensured, and the gas in the storage tank is discharged by utilizing the third exhaust pipe, so that the pressure in the storage tank is reduced.
In the technical scheme, the circulating liquid supply and the polishing liquid state adjustment are realized through the cooperation of the units and the pipelines, the problems that the manual liquid preparation time is long, the labor intensity is high, the efficiency is low, the product quality is unstable due to the deviation of the liquid preparation concentration are solved, the polishing liquid waste is reduced, and the product cost is reduced.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
The foregoing is merely exemplary of the application and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the application and are intended to be comprehended within the scope of the application.
Claims (9)
1. An automatic polishing liquid supply system, comprising:
the storage tank is used for storing the polishing solution;
a liquid supply unit that conveys the polishing liquid in the storage tank to a device;
the overflow pipeline is connected with the storage tank and discharges excessive polishing solution in the storage tank;
the recovery unit is used for collecting and filtering the polishing solution used by the equipment and the polishing solution discharged by the overflow pipeline and then returning the polishing solution to the storage tank to form circulation;
the temperature control unit is used for adjusting the temperature of the polishing solution in the storage tank;
a water supply line that supplies water to the storage tank and is used for line cleaning;
and the PH value adjusting unit is used for controlling the PH value of the polishing solution in the storage tank.
2. An automatic polishing liquid supply system according to claim 1, wherein: the liquid supply unit comprises a liquid supply pipeline, a liquid supply pump, a damper, a liquid supply filter and a flowmeter, wherein the liquid supply pump, the damper, the liquid supply filter and the flowmeter are sequentially arranged on the liquid supply pipeline, the liquid supply pipeline is connected with a storage tank and equipment, liquid supply control valves are arranged on the liquid supply pipelines on two sides of the liquid supply filter, a medium inlet and a medium outlet of the liquid supply filter are connected with the liquid supply pipeline, an exhaust port of the liquid supply filter is connected with the storage tank through a first exhaust pipeline, a liquid outlet of the liquid supply filter is connected with an overflow pipeline through a first liquid outlet pipeline, a first control valve connected with the two liquid supply control valves and the liquid supply filter in parallel is arranged on the liquid supply pipeline, a second control valve is arranged on the first exhaust pipeline, and a third control valve is arranged on the first liquid outlet pipeline.
3. An automatic polishing liquid supply system according to claim 2, characterized in that: the liquid supply pipeline is provided with a first cleaning pipeline connected with a water supply pipeline, and the first cleaning pipeline is provided with a fourth control valve.
4. An automatic polishing liquid supply system according to claim 2, characterized in that: and a liquid supply pipeline between the flowmeter and the liquid supply control valve is provided with a return pipeline connected with the storage tank.
5. An automatic polishing liquid supply system according to claim 1, wherein: the recovery unit comprises a recovery barrel, a recovery pump, a recovery filter and a recovery pipeline, wherein the recovery pipeline is connected with the recovery barrel and the storage tank, the recovery pump and the recovery filter are sequentially arranged on the recovery pipeline, a medium inlet and a medium outlet of the recovery filter are connected with the recovery pipeline, an exhaust port of the recovery filter is connected with the storage tank through a second exhaust pipeline, a liquid outlet of the recovery filter is connected with an overflow pipeline through a second liquid outlet pipeline, recovery control valves are arranged on the recovery pipelines on two sides of the recovery filter, a fifth control valve connected with the two recovery control valves and the recovery filter in parallel is arranged on the recovery pipeline, a sixth control valve is arranged on the second exhaust pipeline, and a seventh control valve is arranged on the second liquid outlet pipeline.
6. An automatic polishing liquid supply system according to claim 5, wherein: the recovery pipeline is provided with a second cleaning pipeline connected with the water supply pipeline, and the second cleaning pipeline is provided with an eighth control valve.
7. An automatic polishing liquid supply system according to claim 5, wherein: and a third liquid discharge pipe communicated with the overflow pipeline is arranged on the recycling bin.
8. An automatic polishing liquid supply system according to claim 1, wherein: the temperature control unit comprises a water chiller and a cold heat exchange tube, wherein two ends of the cold heat exchange tube are connected with the water chiller, and the cold heat exchange tube is arranged in the storage tank.
9. An automatic polishing liquid supply system according to claim 1, wherein: the PH value adjusting unit comprises an alkaline solution storage barrel, an adjusting pump, a third exhaust pipeline, an adjusting pipeline and a PH value sensor, wherein the PH value sensor is arranged in the storage tank, the adjusting pipeline is connected with the alkaline solution storage barrel and the storage tank, the adjusting pump is arranged on the adjusting pipeline, the third exhaust pipeline is connected with the alkaline solution storage barrel and the storage tank, and a ninth control valve is arranged on the adjusting pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321516266.2U CN220548132U (en) | 2023-06-14 | 2023-06-14 | Automatic polishing solution supply system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321516266.2U CN220548132U (en) | 2023-06-14 | 2023-06-14 | Automatic polishing solution supply system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220548132U true CN220548132U (en) | 2024-03-01 |
Family
ID=90008250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321516266.2U Active CN220548132U (en) | 2023-06-14 | 2023-06-14 | Automatic polishing solution supply system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220548132U (en) |
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2023
- 2023-06-14 CN CN202321516266.2U patent/CN220548132U/en active Active
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