CN220283968U - High-temperature-resistant hot melt adhesive film - Google Patents
High-temperature-resistant hot melt adhesive film Download PDFInfo
- Publication number
- CN220283968U CN220283968U CN202321560729.5U CN202321560729U CN220283968U CN 220283968 U CN220283968 U CN 220283968U CN 202321560729 U CN202321560729 U CN 202321560729U CN 220283968 U CN220283968 U CN 220283968U
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- CN
- China
- Prior art keywords
- hot melt
- adhesive layer
- melt adhesive
- temperature
- resistant
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- 239000004831 Hot glue Substances 0.000 title claims abstract description 40
- 239000010410 layer Substances 0.000 claims abstract description 37
- 239000003522 acrylic cement Substances 0.000 claims abstract description 19
- 239000012790 adhesive layer Substances 0.000 claims abstract description 15
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229920006332 epoxy adhesive Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
A high-temperature-resistant hot melt adhesive film relates to the technical field of hot melt adhesive films. It includes from top to bottom in proper order: the device comprises a first PI base film, a high-temperature-resistant adhesive layer, a second PI base film, a high-temperature-resistant acrylic adhesive layer, a high-temperature-resistant hot-melt adhesive layer and a release film. The technical scheme has the advantages of high temperature resistance and good adhesion.
Description
Technical Field
The utility model relates to the technical field of hot melt adhesive films, in particular to a high-temperature-resistant hot melt adhesive film.
Background
Flexible circuit boards, also known as "flexible boards" and "FPCs", have many advantages over rigid printed circuit boards. For example it can be freely bent, rolled, folded. The flexible circuit board can greatly reduce the volume of the electronic product, and is suitable for the requirement of the development of the electronic product in the high-density, miniaturized and high-reliability directions.
However, the manufacturing process of the flexible circuit board needs hot pressing, reflow soldering and other processes, and the working temperature is high. If the high temperature resistance of the hot melt adhesive film on the flexible circuit board is insufficient, the cohesiveness of the hot melt adhesive film is reduced due to the excessively high temperature, and the phenomena of adhesive opening, foaming and the like occur, so that the quality of products is seriously affected. Therefore, there is a need for a hot melt adhesive film having good heat resistance, insulation, and bending resistance.
Disclosure of Invention
The utility model aims to overcome the defects and shortcomings of the prior art and provide a high-temperature-resistant hot melt adhesive film which has the advantages of high temperature resistance and good adhesion.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the high temperature resistant hot melt adhesive film comprises the following components in sequence from top to bottom: the device comprises a first PI base film, a high-temperature-resistant adhesive layer, a second PI base film, a high-temperature-resistant acrylic adhesive layer and a release film.
The utility model further provides that the thickness of the first PI base film is 0.005mm-0.050mm.
The utility model further provides that the high-temperature-resistant adhesive layer is silica gel or silicon rubber.
The utility model further provides that the thickness of the high-temperature-resistant adhesive layer is 0.010mm-0.030mm.
The utility model further provides that the thickness of the second PI base film is 0.005mm-0.050mm.
The utility model further provides that the high-temperature-resistant acrylic adhesive layer is a special modified acrylic pressure-sensitive adhesive layer.
The utility model further provides that the thickness of the high temperature resistant acrylic adhesive layer is 0.010mm-0.050mm.
The utility model further provides that the high-temperature-resistant hot melt adhesive layer is an epoxy adhesive layer.
The utility model further provides that the thickness of the high-temperature-resistant hot melt adhesive layer is 0.001mm-0.003mm.
The utility model further provides that the release film is a polyester release film, and the thickness of the release film is 0.025mm-0.050mm.
After the technical scheme is adopted, the utility model has the beneficial effects that:
1. in the utility model, the high-temperature-resistant acrylic adhesive layer has good high-temperature resistance and strong cohesiveness, the high-temperature-resistant hot melt adhesive layer below the high-temperature-resistant acrylic adhesive layer can temporarily cover the viscosity of the acrylic adhesive layer, and when the adhesive is used, the high-temperature-resistant hot melt adhesive layer can be heated and melted to be fused with the high-temperature-resistant acrylic adhesive layer to generate strong viscosity, so that the adhesive can be well adhered to a adhered object.
2. In the utility model, by arranging two relatively thinner PI base films, the hot melt adhesive film has better flexibility and better adhesion to an object to be adhered.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is a schematic structural view of the present utility model.
Reference numerals illustrate: 1. a first PI-based film; 2. a high temperature resistant adhesive layer; 3. a second PI-based film; 4. a high temperature resistant acrylic adhesive layer; 5. a high temperature resistant hot melt adhesive layer; 6. and (3) a release film.
Detailed Description
The present utility model will be described in further detail with reference to the accompanying drawings.
The present embodiment is only for explanation of the present utility model and is not to be construed as limiting the present utility model, and those skilled in the art can make modifications to the present embodiment which do not contribute to the utility model as required after reading the present specification, but are protected by the patent laws within the scope of the appended claims.
The embodiment relates to a high temperature resistant hot melt adhesive film, as shown in fig. 1, comprising, in order from top to bottom: the high-temperature-resistant adhesive comprises a first PI base film 1, a high-temperature-resistant adhesive layer 2, a second PI base film 3, a high-temperature-resistant acrylic adhesive layer 4, a high-temperature-resistant hot-melt adhesive layer 5 and a release film 6.
The first PI base film 1 and the second PI base film 3 are connected through the high-temperature-resistant adhesive layer, and the two relatively thin PI base films are used for replacing one thick PI base film in the traditional hot melt adhesive film, so that the hot melt adhesive film of the embodiment has better flexibility and can be used for attaching attached objects better.
The high-temperature-resistant acrylic adhesive layer 4 has good high-temperature resistance and strong cohesiveness, the high-temperature-resistant hot melt adhesive layer 5 below the high-temperature-resistant acrylic adhesive layer 4 can temporarily cover the viscosity of the acrylic adhesive layer, and when the adhesive is used, the high-temperature-resistant hot melt adhesive layer 5 can be heated and melted to be fused with the high-temperature-resistant acrylic adhesive layer 4 to generate strong viscosity through a hot-pressing process, so that the adhesive can be well attached to an object.
The release film 6 is arranged at the lowest layer of the hot melt adhesive film, so that the high temperature resistant hot melt adhesive layer 5 and the high temperature resistant acrylic adhesive layer 4 can be effectively protected from being polluted and damaged.
As a preferred embodiment, the thickness of the first PI base film 1 is set to 0.005mm, 0.010mm, 0.015mm, 0.020mm, 0.025mm, 0.030mm, 0.035mm, 0.040mm, 0.045mm, 0.050mm.
As a preferable scheme, the high-temperature resistant adhesive layer adopts silica gel or silicon rubber. The thickness of the high temperature resistant adhesive layer 2 is set to be 0.010mm, 0.015mm, 0.020mm, 0.025mm and 0.030mm.
As a preferred embodiment, the thickness of the second PI base film 3 is set to 0.005mm, 0.010mm, 0.015mm, 0.020mm, 0.025mm, 0.030mm, 0.035mm, 0.040mm, 0.045mm, 0.050mm.
As a preferable scheme, the high temperature resistant acrylic adhesive layer 4 is a special modified acrylic pressure sensitive adhesive layer. The thickness of the high temperature resistant acrylic adhesive layer 4 is set to be 0.010mm, 0.015mm, 0.020mm, 0.025mm, 0.030mm, 0.035mm, 0.040mm, 0.045mm and 0.050mm.
As a preferable scheme, the high temperature resistant hot melt adhesive layer 5 is set as an epoxy adhesive layer, and the thickness of the high temperature resistant hot melt adhesive layer 5 is set to be 0.001mm, 0.002mm and 0.003mm.
As a preferable embodiment, the release film 6 is a polyester release film, and the thickness of the release film 6 is 0.025mm, 0.030mm, 0.035mm, 0.040mm, 0.045mm, or 0.050mm.
The above description is only for the purpose of illustrating the technical solution of the present utility model and not for the purpose of limiting the same, and other modifications and equivalents thereof by those skilled in the art should be included in the scope of the claims of the present utility model without departing from the spirit and scope of the technical solution of the present utility model.
Claims (9)
1. The high-temperature-resistant hot melt adhesive film is characterized by comprising the following components in sequence from top to bottom: the high-temperature-resistant adhesive comprises a first PI base film (1), a high-temperature-resistant adhesive layer (2), a second PI base film (3), a high-temperature-resistant acrylic adhesive layer (4), a high-temperature-resistant hot melt adhesive layer (5) and a release film (6).
2. The high temperature resistant hot melt adhesive film according to claim 1, characterized in that the thickness of the first PI base film (1) is 0.005mm-0.050mm.
3. The high temperature resistant hot melt adhesive film according to claim 1, wherein the high temperature resistant adhesive layer is silica gel or silicone rubber.
4. The high temperature resistant hot melt adhesive film according to claim 1, wherein the thickness of the high temperature resistant adhesive layer (2) is 0.010mm to 0.030mm.
5. The high temperature resistant hot melt adhesive film according to claim 1, characterized in that the thickness of the second PI base film (3) is 0.005mm-0.050mm.
6. The high temperature resistant hot melt adhesive film according to claim 1, wherein the thickness of the high temperature resistant acrylic adhesive layer (4) is 0.010mm-0.050mm.
7. The high temperature resistant hot melt adhesive film according to claim 1, wherein the high temperature resistant hot melt adhesive layer (5) is an epoxy adhesive layer.
8. The high temperature resistant hot melt adhesive film according to claim 1, wherein the thickness of the high temperature resistant hot melt adhesive layer (5) is 0.001mm to 0.003mm.
9. The high temperature resistant hot melt adhesive film according to claim 1, wherein the release film (6) is a polyester release film, and the thickness of the release film (6) is 0.025mm to 0.050mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321560729.5U CN220283968U (en) | 2023-06-17 | 2023-06-17 | High-temperature-resistant hot melt adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321560729.5U CN220283968U (en) | 2023-06-17 | 2023-06-17 | High-temperature-resistant hot melt adhesive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220283968U true CN220283968U (en) | 2024-01-02 |
Family
ID=89341203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321560729.5U Active CN220283968U (en) | 2023-06-17 | 2023-06-17 | High-temperature-resistant hot melt adhesive film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220283968U (en) |
-
2023
- 2023-06-17 CN CN202321560729.5U patent/CN220283968U/en active Active
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