CN220106449U - Wafer switching device of die bonder - Google Patents
Wafer switching device of die bonder Download PDFInfo
- Publication number
- CN220106449U CN220106449U CN202321675839.6U CN202321675839U CN220106449U CN 220106449 U CN220106449 U CN 220106449U CN 202321675839 U CN202321675839 U CN 202321675839U CN 220106449 U CN220106449 U CN 220106449U
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- crystal
- disc
- placing
- die bonder
- arm
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- 239000013078 crystal Substances 0.000 claims abstract description 80
- 210000000078 claw Anatomy 0.000 claims abstract description 27
- 230000006835 compression Effects 0.000 claims description 24
- 238000007906 compression Methods 0.000 claims description 24
- 239000000178 monomer Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 26
- 239000007787 solid Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a wafer switching device of a die bonder, which belongs to the field of semiconductor die bonders and is characterized by comprising a die bonder workbench, two die disc storage positions and a rotating arm, wherein the rotating arm is arranged above the die disc storage positions; the rotary drive is connected with the rotary arm and used for driving the rotary arm to do rotary motion; the lifting drive is connected with the rotating arm and used for driving the rotating arm to move up and down; the two groups of picking and placing claws are fixedly connected to the rotating arm and symmetrically arranged on two sides of the rotating center of the rotating arm; the sucker is connected to the bottom of the picking and placing claw and is used for carrying out picking and placing operation on the crystal disc; the two crystal disc storage positions and the crystal fixing workbench are both positioned on the rotating track of the picking and placing claw; the utility model can automatically take down the used crystal disc on the crystal fixing workbench and automatically replace a new crystal disc, thereby greatly saving manpower and improving working efficiency.
Description
Technical Field
The utility model relates to the technical field of semiconductor die bonders, in particular to a wafer switching device of a die bonder.
Background
In the process of die bonding, a suction nozzle sucks a single wafer on a wafer disc (usually using a blue film) and sends the single wafer to a designated position of a material sheet along with a swing arm. After all the wafers on one wafer disc are taken out, the blank blue film needs to be taken down and replaced by a new blue film. In the prior art, such blue film replacement is usually accomplished manually. However, in actual production, generally, one worker participates in operating a plurality of die bonders, so that the phenomenon that the machine waits for a blue film due to untimely blue film replacement occurs, and the production efficiency is low; and the frequent operation of replacing the blue film also causes great labor intensity of personnel.
Disclosure of Invention
The utility model aims to solve the technical problem of overcoming the defects of the prior art, and provides a wafer switching device of a die bonder, which can realize automatic switching of wafers, lighten labor intensity of personnel and improve production efficiency of the die bonder.
The technical scheme for solving the technical problems is as follows: the wafer switching device of the die bonder is characterized by comprising
The crystal fixing workbench is used for placing a crystal disc to be subjected to crystal fixing, and an electric clamp for fixing the crystal disc is arranged beside the crystal disc;
the number of the crystal disc storage positions is two, one crystal disc is used for placing used crystal discs, and the other crystal disc is used for placing unused crystal discs;
the rotating arm is arranged above the crystal disc storage position;
the rotary drive is connected with the rotary arm and used for driving the rotary arm to do rotary motion;
the lifting drive is connected with the rotating arm and used for driving the rotating arm to move up and down;
the two groups of picking and placing claws are fixedly connected to the rotating arm and symmetrically arranged on two sides of the rotating center of the rotating arm;
the sucker is connected to the bottom of the picking and placing claw and is used for carrying out picking and placing operation on the crystal disc;
the two crystal disc storage positions and the crystal fixing workbench are both positioned on the rotating track of the picking and placing claw.
Furthermore, the rotary driving adopts a rotary motor, and the output end of the rotary motor is fixedly connected with a connecting plate.
Furthermore, the lifting drive adopts an air cylinder, a cylinder barrel of the air cylinder is fixedly connected to the connecting plate, and a telescopic end of the air cylinder is fixedly connected with the rotating arm.
Further, the wafer disc storage position comprises a bottom plate and at least three guide posts connected to the bottom plate, and a wafer disc storage space is formed among the at least three guide posts. Wherein at least one crystal disc storage position further comprises a bottom support positioned above the bottom plate, a yielding groove matched with the guide post is arranged at the periphery of the bottom support, and the bottom of the bottom support is connected with an adjusting drive for driving the bottom support to lift.
Furthermore, the surface of the bottom plate is provided with a strip-shaped groove corresponding to the guide post, a plurality of mounting holes are formed in the wall edge of the bottom of the strip-shaped groove, and fixing holes are formed in the bottom of the guide post corresponding to the mounting holes.
Further, electronic anchor clamps are including arranging a plurality of anchor clamps monomer at brilliant disc periphery, anchor clamps monomer includes linking arm, ejector pin, compression spring and flexible driving piece, the linking arm level is placed, and the linking arm middle part is rotated through a pivot and is connected on solid brilliant workstation, the inboard of linking arm one end is inconsistent with solid brilliant workstation through compression spring, and the other end fixedly connected with ejector pin of linking arm, ejector pin tip direction orientation brilliant disc, the outside of linking arm is provided with flexible driving piece, and the flexible end of flexible driving piece is close to compression spring's one end towards the linking arm.
Furthermore, the telescopic driving piece adopts an air cylinder, and a cylinder barrel of the telescopic driving piece is fixed on the die bonding workbench.
Furthermore, a groove for placing a compression spring is formed in the die bonding workbench, the compression spring is horizontally placed, one end of the compression spring is fixedly connected in the groove, and the connecting arm is fixedly provided with a contact plate corresponding to the compression spring.
Furthermore, the abutting plate and the connecting arm are of an integrated structure.
The beneficial effects of the utility model are as follows: according to the utility model, the two crystal disc storage positions are additionally arranged at the side of the crystal fixing workbench and are respectively used for placing the used crystal discs and the new crystal discs, and the used crystal discs on the crystal fixing workbench can be automatically taken down and automatically replaced by the rotating arm, the rotating drive and the lifting drive which are connected with the rotating arm and the picking and placing claw with the washing disc, so that the manpower is greatly saved, and the working efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of a front view of an embodiment of the present utility model;
FIG. 2 is a schematic top view of a die bonding table and a two-wafer-tray storage according to an embodiment of the present utility model;
FIG. 3 is a schematic top view of a first storage location according to an embodiment of the present utility model;
FIG. 4 is a schematic top view of a second storage compartment according to an embodiment of the present utility model;
FIG. 5 is a schematic view showing the mounting structure of the clamp unit on the die bonding table according to an embodiment of the present utility model;
FIG. 6 is a schematic side view of a connecting arm according to an embodiment of the present utility model;
in the figure: 1. the device comprises a crystal fixing workbench, a crystal disc storage position, a base plate, a strip-shaped groove, a mounting hole, a guide post, a fixing hole, a base plate, a base support, a position giving groove, a regulating drive, a rotating arm, a rotating drive, a connecting plate, a lifting drive, a taking and placing claw, a sucker, a crystal disc, a clamp monomer, a connecting arm, a rotating shaft, a supporting plate, a push rod, a compression spring and a telescopic driving piece.
Detailed Description
The principles and features of the present utility model are described below with reference to the drawings, the illustrated embodiments are provided for illustration only and are not intended to limit the scope of the present utility model.
As shown in fig. 1 and 2, a wafer switching device of a die bonder of the present embodiment includes:
the crystal fixing workbench 1 is used for placing a crystal disc 8 to be subjected to crystal fixing, and an electric clamp for fixing the crystal disc 8 is arranged beside the crystal disc 8;
the number of the crystal disc storage positions 2 is two, one is used for placing used crystal discs, the embodiment is called a first storage position 201, the other is used for placing unused crystal discs with expanded films, and the embodiment is called a second storage position 202;
the rotating arm 3 is arranged above the crystal disc storage position 2;
the rotary drive 4 is connected with the rotary arm 3 and is used for driving the rotary arm 3 to do rotary motion; the rotary drive 4 is arranged on a frame of the die bonder;
the lifting drive 5 is connected with the rotating arm 3 and is used for driving the rotating arm 3 to move up and down;
the number of the picking and placing claws 6 is two, namely a first picking and placing claw and a second picking and placing claw, the picking and placing claws 6 are fixedly connected to the rotating arm 3, and the picking and placing claws 6 and the rotating arm 3 are symmetrically arranged at two sides of the rotating center of the rotating arm 3;
the sucking disc 7 is connected to the bottom of the picking and placing claw 6 and is used for carrying out picking and placing operation on the crystal disc 8; the vacuum chuck is controlled pneumatically, which is the prior art and will not be described in detail here; the telescopic elastic suction nozzle is preferable, so that buffering can be increased, negative pressure is increased in stretching, and the adsorption is firmer;
the two crystal disc storage positions 2 and the crystal fixing workbench 1 are both positioned on the rotating track of the picking and placing claw 6, namely, along with the rotation of the rotating arm 3, the picking and placing claw 6 can be positioned right above the crystal fixing workbench 1 or the crystal disc storage position 2.
In the specific embodiment, the rotary driving device 4 adopts a rotary motor, and the output end of the rotary motor is fixedly connected with the connecting plate 41; the lifting drive 5 adopts an air cylinder, a cylinder barrel of the air cylinder is fixedly connected to the connecting plate 41, and a telescopic end of the air cylinder is fixedly connected with the rotating arm 3. The rotating motor works to drive the connecting plate 41 to carry the rotating arm 3 to do rotary motion, and the telescopic cylinder can drive the rotating arm 3 to carry the picking and placing claw 6 to move up and down.
Before use, a stack of new wafer disks is stacked on the second storage location 202. When the crystal disc on the crystal fixing workbench is used up, the electric clamp automatically releases the fixation of the crystal disc, the rotating motor is started to rotate until the first picking and placing claw is positioned right above the crystal fixing workbench 1, then the lifting drive 5 is started, the rotating arm 3 moves downwards to enable the first picking and placing claw sucker 7 to be in contact with and suck the used crystal disc, then the lifting drive 5 is controlled to enable the rotating arm 3 to move upwards for resetting, the rotating motor is started to enable the first picking and placing claw to be positioned right above the first storage position 201, the second picking and placing claw is positioned right above the second storage position 202 at the moment, the sucker on the first picking and placing claw releases the used crystal disc to be combined into the first storage position 201, then the lifting drive 5 is started to enable the sucker 7 of the second picking and placing claw to be in contact with and suck the new crystal disc, the lifting drive 5 is controlled to enable the rotating arm 3 to move upwards for resetting, the new crystal disc is placed into the crystal fixing workbench, and the electric clamp is locked. And resetting the wafer taking and placing device to finish wafer replacement.
The crystal disc storage position 2 of the embodiment comprises a bottom plate 21 and at least three guide posts 22 connected to the bottom plate 21, and the guide posts 22 are used for positioning, so that the crystal disc storage position is convenient to take and place; the number of the guide posts 22 in the embodiment is three, and a crystal disc storage space is formed among the three guide posts 22; the top of the guide post 22 is preferably designed to be inclined at 30 ° so as to facilitate the placement of the wafer disc into the positioning area.
In this embodiment, the second storage position 202 further includes a bottom support 23 located above the bottom plate 21, a yielding groove 231 adapted to the guide post 22 is disposed on the periphery of the bottom support 23, and an adjusting drive 232 for driving the bottom support 23 to lift is connected to the bottom of the bottom support 23. With the use of the new crystal disc in the second storage position 202, the height of the bottom support 23 is gradually adjusted by adjusting the drive 232, so that the crystal disc on the outermost layer is always located at a constant height, and the grabbing of the picking and placing claws is facilitated.
In this embodiment, a strip-shaped groove 211 is provided on the surface of the bottom plate 21 corresponding to the guide post 22, a plurality of mounting holes 212 are provided on the bottom wall of the strip-shaped groove 211, the plurality of mounting holes 212 are arranged along the radial direction of the wafer disc, and a fixing hole 221 is provided at the bottom of the guide post 22 corresponding to the mounting hole 212. The size of the space formed by the three guide posts is adjusted by fixing different mounting holes 212 and fixing holes 221 so as to adapt to the placement of the crystal discs with different sizes.
In this embodiment, electronic anchor clamps are including arranging a plurality of anchor clamps monomer 9 at brilliant disc 8 periphery, anchor clamps monomer 9 includes linking arm 91, ejector pin 92, compression spring 93 and flexible driving piece 94, linking arm 91 level is placed, and linking arm 91 middle part is rotated through a pivot and is connected on solid brilliant workstation 1, the inboard of linking arm 91 one end is inconsistent with solid brilliant workstation 1 through compression spring 93, and the other end fixedly connected with ejector pin 92 of linking arm 91, ejector pin 92 tip direction orientation brilliant disc 8, the outside of linking arm 91 is provided with flexible driving piece 94, and the flexible end of flexible driving piece 94 is close to compression spring 93's one end towards linking arm 91. More specifically, the telescopic driving piece 94 adopts the cylinder, and its cylinder is fixed on solid brilliant workstation 1, the recess 11 that is used for placing compression spring 93 is offered to the side terminal surface of solid brilliant workstation 1, and compression spring 93 is the level form and places, and compression spring 93's one end fixed connection is in recess 11, the linking arm 91 corresponds compression spring 93 and fixedly is provided with conflict board 911, and conflict board 911 is as an organic whole structure with linking arm 91.
When the electric clamp is used, the crystal disc 8 is firstly placed on the crystal fixing workbench 1, the height of the crystal disc is higher than that of the crystal fixing workbench 1, the connecting arm 91 is arranged at the outer edge of the crystal fixing workbench 1 through the rotating shaft 910, and the connecting arm 91 has a tendency of rotating around the rotating shaft 910 under the action of the compression spring 93, so that the front end of the ejector rod 92 is abutted against the outer end face of the crystal disc 8. When the wafer disc needs to be taken down, the telescopic driving piece 94 is started, the telescopic end of the telescopic driving piece touches the end part of the connecting arm 91 and presses the compression spring 93, the connecting arm 91 reversely rotates around the rotating shaft 910, the ejector rod 92 releases the interference effect on the wafer disc, and then the wafer disc is released, so that the wafer disc is convenient to take down. When placing the wafer disks, the same operation is performed on the telescoping drive 94 to provide sufficient space for the wafer disks to be placed. And the clamp structure only needs to start the corresponding control cylinder at the moment of releasing the wafer or placing the wafer, and the cylinder is not required to be started under the fixed state, so that the use of gas is saved.
The telescopic driving piece 94 is linked with the rotary driving piece 4 and the lifting driving piece 5, so that the automatic replacement of the crystal disc can be completed, the manpower is greatly saved, and the working efficiency is improved.
Claims (10)
1. The wafer switching device of the die bonder is characterized by comprising
The crystal fixing workbench (1) is used for placing a crystal disc (8) to be subjected to crystal fixing, and an electric clamp for fixing the crystal disc (8) is arranged beside the crystal disc (8);
the number of the crystal disc storage positions (2) is two, one crystal disc is used for placing used crystal discs (8), and the other crystal disc is used for placing unused crystal discs (8);
the rotating arm (3) is arranged above the crystal disc storage position (2);
the rotary drive (4) is connected with the rotary arm (3) and is used for driving the rotary arm (3) to do rotary motion;
the lifting drive (5) is connected with the rotating arm (3) and is used for driving the rotating arm (3) to move up and down;
the two groups of picking and placing claws (6) are fixedly connected to the rotating arm (3) and symmetrically arranged at two sides of the rotating center of the rotating arm (3);
the sucking disc (7) is connected to the bottom of the picking and placing claw (6) and is used for carrying out picking and placing operation on the crystal disc (8);
the two crystal disc storage positions (2) and the crystal fixing workbench (1) are both positioned on the rotating track of the picking and placing claw (6).
2. The wafer switching device of the die bonder according to claim 1, wherein the rotary drive (4) adopts a rotary motor, and an output end of the rotary motor is fixedly connected with a connecting plate (41).
3. The wafer switching device of the die bonder according to claim 2, wherein the lifting drive (5) adopts an air cylinder, a cylinder barrel of the air cylinder is fixedly connected to the connecting plate (41), and a telescopic end of the air cylinder is fixedly connected with the rotating arm (3).
4. Wafer switching device of a die bonder according to claim 1, wherein the die-disc storage location (2) comprises a bottom plate (21) and at least three guide posts (22) connected to the bottom plate (21), and a die-disc storage space is formed between the at least three guide posts (22).
5. The wafer switching device of a die bonder according to claim 4, wherein the at least one wafer storage location (2) further comprises a base (23) located above the bottom plate (21), a yielding groove (231) adapted to the guide post (22) is formed in the periphery of the base (23), and an adjusting drive (232) for driving the base (23) to lift is connected to the bottom of the base.
6. The wafer switching device of a die bonder according to claim 4 or 5, wherein a strip-shaped groove (211) is formed on the surface of the bottom plate (21) corresponding to the guide post (22), a plurality of mounting holes (212) are formed in the bottom wall of the strip-shaped groove (211), and fixing holes (221) are formed in the bottom of the guide post (22) corresponding to the mounting holes (212).
7. The wafer switching device of a die bonder according to claim 1, wherein the electric clamp comprises a plurality of clamp monomers (9) arranged on the periphery of the die disc (8), each clamp monomer (9) comprises a connecting arm (91), a push rod (92), a compression spring (93) and a telescopic driving piece (94), the connecting arms (91) are horizontally arranged, the middle parts of the connecting arms (91) are rotationally connected onto the die bonder workbench (1) through a rotating shaft (910), the inner sides of one ends of the connecting arms (91) are abutted against the die bonder workbench (1) through the compression springs (93), the other ends of the connecting arms (91) are fixedly connected with push rods (92), the end directions of the push rods (92) face the die disc (8), and the outer sides of the connecting arms (91) are provided with telescopic driving pieces (94), and the telescopic ends of the telescopic driving pieces (94) face one ends of the connecting arms (91) close to the compression springs (93).
8. The wafer switching device of the die bonder according to claim 7, wherein the telescopic driving member (94) is a cylinder, and a cylinder thereof is fixed to the die bonder table (1).
9. The wafer switching device of the die bonder according to claim 7, wherein the die bonder workbench (1) is provided with a groove (11) for placing a compression spring (93), the compression spring (93) is horizontally placed, one end of the compression spring (93) is fixedly connected in the groove (11), and the connecting arm (91) is fixedly provided with a contact plate (911) corresponding to the compression spring (93).
10. The wafer switching device of a die bonder according to claim 9, wherein the abutting plate (911) and the connecting arm (91) are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321675839.6U CN220106449U (en) | 2023-06-29 | 2023-06-29 | Wafer switching device of die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321675839.6U CN220106449U (en) | 2023-06-29 | 2023-06-29 | Wafer switching device of die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220106449U true CN220106449U (en) | 2023-11-28 |
Family
ID=88865371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321675839.6U Active CN220106449U (en) | 2023-06-29 | 2023-06-29 | Wafer switching device of die bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220106449U (en) |
-
2023
- 2023-06-29 CN CN202321675839.6U patent/CN220106449U/en active Active
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