CN213901819U

CN213901819U - Baking device for processing wafer cutting ring

Info

Publication number: CN213901819U
Application number: CN202023071351.1U
Authority: CN
Inventors: 蒋松杰
Original assignee: Suzhou Ensberg Precision Machinery Co ltd
Current assignee: Suzhou Ensberg Precision Machinery Co ltd
Priority date: 2020-12-18
Filing date: 2020-12-18
Publication date: 2021-08-06
Anticipated expiration: 2030-12-18

Abstract

The utility model relates to a baking equipment for wafer cutting ring processing, including organism, heating device and conveyor, conveyor sets up in the organism, and the organism is equipped with the open end, and conveyor one end is located the open end outside, heating device sets up in the conveyor top, and heating device includes reflection assembly and light source, and two sets of reflection assemblies set up relatively, and the light source setting includes reflecting plate and fixed part between the reflection assembly, and the reflecting plate sets up on the fixed part, be equipped with airflow channel in the fixed part, the upper surface of fixed part is equipped with the through-hole, through-hole and airflow channel intercommunication. The utility model discloses a baking equipment for wafer cutting ring processing can realize the automatic input/output of wafer cutting ring, can reduce the process, promotes machining efficiency; therefore, the baking temperature and the baking effect can be improved, and the heat dissipation effect of the heating unit is improved.

Description

Baking device for processing wafer cutting ring

Technical Field

The utility model relates to a processing technology field of wafer cutting ring, in particular to a baking equipment for processing of wafer cutting ring.

Background

The wafer cutting ring is an auxiliary tool used in semiconductor wafer processing, during the wafer processing, a layer of adhesive film is adhered on one surface of the wafer cutting ring, redundant adhesive film is cut and removed by a cutter, the wafer cutting ring is adhered to the wafer by the adhesive film, so that subsequent processing operation is facilitated to be carried out smoothly, and the adhesive film can prevent the wafer cutting ring from scratching the wafer. Wafer cutting ring is adding man-hour in production, need toast, and when current baking equipment used, need place the product in the frame box, then put into baking equipment again, need a plurality of workman and a plurality of step go on, has reduced production efficiency.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a solve prior art's problem, provide one kind and can promote production machining efficiency, the baking equipment who is used for wafer cutting ring processing of reinforcing heating device radiating effect.

The specific technical scheme is as follows: the utility model provides a baking equipment for wafer cutting ring processing, includes the organism, heating device and conveyor, conveyor sets up in the organism, and the organism is equipped with the open end, and conveyor one end is located the open end outside, heating device sets up in the conveyor top, and heating device includes reflection assembly and light source, and two sets of reflection assemblies set up relatively, and the light source setting is between the reflection assembly, and the reflection assembly includes reflecting plate and fixed part, and the reflecting plate sets up on the fixed part, be equipped with airflow channel in the fixed part, the upper surface of fixed part is equipped with the through-hole, through-hole and airflow channel intercommunication.

Preferably, the conveying path of the conveying device is S-shaped.

Preferably, the fixing portion is provided with a clamping groove, the reflecting plate is arranged in the clamping groove, and an airflow channel is formed between the reflecting plate and the fixing portion.

Preferably, an auxiliary heating device is arranged at the bottom of the conveying device.

Preferably, the conveying device comprises a conveying belt, the wafer cutting ring is arranged on the conveying belt, and the conveying belt is provided with holes.

Preferably, the auxiliary heating device comprises a fan, and the fan faces the direction of the conveying belt.

The technical effects of the utility model: the utility model discloses a baking equipment for wafer cutting ring processing can realize the automatic input/output of wafer cutting ring, can reduce the process, promotes machining efficiency; therefore, the baking temperature and the baking effect can be improved, and the heat dissipation effect of the heating unit is improved.

Drawings

Fig. 1 is a schematic view of a baking apparatus for wafer dicing ring processing according to an embodiment of the present invention.

Fig. 2 is another schematic diagram of a baking apparatus for wafer dicing ring processing according to an embodiment of the present invention.

Fig. 3 is a schematic view of a heating device according to an embodiment of the present invention.

Fig. 4 is a schematic view of a fixing portion according to an embodiment of the present invention.

Detailed Description

The essential features and advantages of the invention will be further explained below with reference to examples, but the invention is not limited to the embodiments listed.

As shown in fig. 1 to 4, a baking apparatus for processing a wafer dicing ring according to this embodiment includes a body 1, a heating device 2, and a conveying device 3, where the conveying device 3 is disposed in the body 1, the body 1 is provided with an open end 11, and one end of the conveying device is located outside the open end 11. The heating device 2 is arranged above the conveying device 3, the heating device 2 comprises reflection assemblies 4 and light sources 5, the two groups of reflection assemblies 4 are oppositely arranged, and the light sources 5 are arranged between the reflection assemblies 4. The reflection member 4 includes a reflection plate 41 and a fixing portion 42, and the reflection plate 41 is disposed on the fixing portion 42. The fixing portion 42 is provided with an air flow passage 421, the upper surface of the fixing portion 42 is provided with a through hole 422, and the through hole 422 is communicated with the air flow passage 421. Among the above-mentioned technical scheme, through set up open end 11 on organism 1, can make wafer cutting ring 10 put on conveyor 3 at the baking equipment side, then get into baking equipment through conveyor 3, open end 11 can set up sheltering from parts such as baffle to reduce heat and lose. The conveying device 3 can be a material conveying device such as an existing roller conveyor. The wafer cutting ring can be heated and dried by infrared rays emitted by the light source 5, and the infrared rays can be reflected to the conveying device 3 by the reflecting plate 41, so that the drying effect is improved. Through set up airflow channel 421 in fixed part 42, can make outside air current pass through the air inlet 12 entering of organism, then discharge through gas outlet 13, the air current takes away the heat of reflecting plate and organism, avoids its high temperature, and gas outlet 13 corresponds the setting with through-hole 422 for the air current can get into air inlet 12 through the through-hole. Through above-mentioned technical scheme, can make the wafer cutting ring pass through baking equipment drying, be convenient for place and take out the wafer cutting ring, simultaneously, can promote the luminous intensity of light source, promote drying efficiency, avoid reflection assembly high temperature.

In this embodiment, the conveying path of the conveying device 3 is S-shaped, so that the moving path of the dicing ring 10 in the machine body 1 can be extended, and the drying time can be extended. In this embodiment, the fixing portion 42 is provided with a clamping groove 423, the reflection plate 41 is disposed in the clamping groove 423, and an airflow channel 421 is formed between the reflection plate 41 and the fixing portion 42, so that the airflow can contact the reflection plate 41 and the fixing portion 42 to take away heat. In this embodiment, conveyor 3 bottom is equipped with auxiliary heating device 6, through auxiliary heating device 6, can follow the below and dry the wafer cutting ring, can further promote the dry effect of toasting. In this embodiment, the conveying device 3 includes a conveying belt 31, the dicing ring is disposed on the conveying belt, and the conveying belt 31 has a hole 32. The auxiliary heating device 6 comprises a fan 61, and the fan 61 faces the conveying belt 31. Through above-mentioned technical scheme, hot-blast passing through pipeline 7 by external heating system is carried to auxiliary heating device, blows to transmission band 31 through fan 61, through the hole 32 and the contact of wafer cutting ring on the transmission band 31, and the transmission band setting is on conveyor's roller.

The baking device for processing the wafer cutting ring can realize automatic input and output of the wafer cutting ring, can reduce processes and improve processing efficiency; therefore, the baking temperature and the baking effect can be improved, and the heat dissipation effect of the heating unit is improved.

It should be noted that the above-mentioned preferred embodiments are only for illustrating the technical concepts and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention accordingly, and the protection scope of the present invention cannot be limited thereby. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. The utility model provides a baking equipment for wafer cutting ring processing, a serial communication port, includes the organism, heating device and conveyor, conveyor sets up in the organism, and the organism is equipped with the open end, and conveyor one end is located the open end outside, heating device sets up in the conveyor top, and heating device includes reflection assembly and light source, and two sets of reflection assemblies set up relatively, and the light source setting is between the reflection assembly, and the reflection assembly includes reflecting plate and fixed part, and the reflecting plate sets up on the fixed part, be equipped with airflow channel in the fixed part, the upper surface of fixed part is equipped with the through-hole, through-hole and airflow channel intercommunication.

2. The bake apparatus for wafer dicing ring process of claim 1, wherein the transport path of the transport apparatus is S-shaped.

3. The bake apparatus for wafer dicing ring processing as claimed in claim 2, wherein the fixing portion is provided with a slot, the reflector plate is disposed in the slot, and an air flow channel is formed between the reflector plate and the fixing portion.

4. The baking apparatus for processing the wafer cutting ring as claimed in claim 3, wherein the bottom of the conveying device is provided with an auxiliary heating device.

5. The bake apparatus for wafer dicing ring process according to claim 4, wherein the conveying device includes a conveyor belt, the wafer dicing ring is disposed on the conveyor belt, and the conveyor belt is provided with holes.

6. The wafering ring processing bake apparatus of claim 5, wherein said auxiliary heating means comprises a fan, said fan facing in the direction of the conveyor.