CN213484824U - X-frequency-band high-power solid-state amplifier assembly - Google Patents
X-frequency-band high-power solid-state amplifier assembly Download PDFInfo
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- CN213484824U CN213484824U CN202022938399.1U CN202022938399U CN213484824U CN 213484824 U CN213484824 U CN 213484824U CN 202022938399 U CN202022938399 U CN 202022938399U CN 213484824 U CN213484824 U CN 213484824U
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Abstract
The utility model discloses a high-power solid-state amplifier subassembly of X frequency channel, which comprises a housin, the casing is inherent to be provided with nine rows two final power amplifier subassemblies, the left and right sides of final power amplifier subassembly is provided with two six way power distribution units respectively, the side is provided with two way power distribution units respectively about the casing, the below of final power amplifier subassembly is provided with two preceding stage power amplifier subassemblies, be provided with the monitoring module that gathers between two preceding stage power amplifier subassemblies, preceding stage power amplifier subassembly and monitoring module below of gathering are provided with power module, the output of preceding stage power amplifier subassembly links to each other with two way power distribution unit's input electricity, two way power distribution unit's output links to each other with two six way power distribution unit's input electricity respectively, two six way power distribution unit's output electricity is connected with six final stage. The utility model provides a pair of high-power solid-state amplifier subassembly of X frequency channel has advantages such as simple small, light in weight of simple structure, can realize output dozens of watts to hundred watts, signal pulse width several hundred microseconds to several milliseconds.
Description
Technical Field
The utility model relates to a high-power solid-state amplifier subassembly of X frequency channel belongs to radar, radar simulator, electronic countermeasure technical field.
Background
At present, for a solid-state amplifier transmitter, in order to obtain power output of thousands of watts or even tens of kilowatts, we generally adopt a power synthesis method, and there are two specific methods: firstly, a power synthesis technology based on a planar circuit or a waveguide is adopted, and the second method is a method adopting an active array antenna, namely, a high-power output is obtained by adopting space power synthesis based on a free space power synthesis technology. The second technique is superior to the first technique in synthesis efficiency because of no loss of the synthesis network, and is an effective way to generate high-power electromagnetic wave radiation, and is being widely used. Solid state power amplifier components are also gaining increasing attention as an important component of active array antennas. For a long time, the development of the X-band solid-state amplifier is relatively lagged due to the relative lagging of the domestic semiconductor process technology and the blockage of the foreign technology. For a system requiring output power of tens of watts to hundreds of watts and signal pulse width of hundreds of microseconds to milliseconds, the system is difficult to realize.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to overcome prior art's defect, provide one kind and can realize that output dozens of watts to hundred watts, signal pulse width several hundred microseconds to several milliseconds the high-power solid-state amplifier subassembly of X frequency channel.
In order to solve the technical problem, the utility model discloses a technical scheme does:
an X-frequency-band high-power solid-state amplifier assembly comprises a shell, wherein nine rows and two columns of final-stage power amplifier assemblies are arranged in the shell in the vertical direction, two six power distributors are respectively arranged on the left side and the right side of the shell, two front-stage power amplifier assemblies are arranged below the final-stage power amplifier assemblies, a monitoring and summarizing module is arranged between the two front-stage power amplifier assemblies, a power supply module is arranged below the front-stage power amplifier assemblies and the monitoring and summarizing module, the output ends of the front-stage power amplifier assemblies are electrically connected with the input ends of the two power distributors, the output ends of the two power distributors are electrically connected with the input ends of the two six power distributors, the output ends of the two power distributors are respectively electrically connected with the six final-stage power amplifier assemblies and the input ends of the three final-stage power amplifier assemblies, the monitoring and summarizing module is electrically connected with the preceding-stage power amplifier assembly, the final-stage power amplifier assembly and the power module, and the power module supplies power to the preceding-stage power amplifier assembly, the final-stage power amplifier assembly and the monitoring and summarizing module.
The monitoring and gathering module adopts an FPGA chip.
The final-stage power amplifier assembly comprises an X-frequency-band 5W amplifier and a final-stage power amplifier feed board, the output end of the X-frequency-band 5W amplifier is electrically connected with the input end of a phase-matching four-way power divider through an isolator, the output end of the phase-matching four-way power divider is electrically connected with four input ends of X-frequency-band 30W amplifiers, the output end of the X-frequency-band 30W amplifier is connected with the input end of an X-frequency-band 100W amplifier through another isolator, the output end of the X-frequency-band 100W amplifier is connected with another isolator, an energy storage capacitor bank is integrated on the final-stage power amplifier feed board and connected to a drain electrode feed end of a power amplifier tube, and therefore the layout can effectively shorten a current path and reduce the size of the assembly.
The monitoring and gathering module is connected with the preceding-stage power amplifier assembly, the final-stage power amplifier assembly and the power module in a serial CAN bus mode.
And the front surface and the back surface of the shell are provided with heat dissipation systems.
The heat dissipation system is composed of a fan and a uniform temperature plate heat dissipation plate.
The utility model has the advantages that: the utility model provides an X frequency band high power solid-state amplifier component, which has the advantages of simple structure, small volume, light weight and the like; meanwhile, the working pulse width of the component is 0.1 us-2 ms, the single-port output pulse power is greater than 100 watts, the maximum working ratio is 12%, the linearity is good, and the component can play a role in the fields of radar simulation equipment (such as radar targets, radar simulation pods and the like), electronic countermeasure and the like.
Drawings
Fig. 1 is a schematic front view of an X-band high-power solid-state amplifier module according to the present invention;
fig. 2 is a schematic diagram of a rear view structure of an X-band high-power solid-state amplifier assembly according to the present invention;
fig. 3 is a schematic side view of an X-band high-power solid-state amplifier module according to the present invention;
fig. 4 is a schematic structural diagram of a final stage power amplifier group in the present invention;
FIG. 5 is a block diagram of a solid state amplifier assembly according to the present invention;
fig. 6 is a schematic block diagram of the middle-last stage power amplifier module according to the present invention.
The reference numbers in the figures are as follows: 1-a heat dissipation system; 2-final stage power amplifier assembly; 3-a preceding stage power amplifier assembly; 4-monitoring and summarizing module; 5-two-way power divider; 6-six power dividers; 7-a power supply module; an 8-X frequency band 5W amplifier; a 9-X frequency band 30W amplifier; a 10-X frequency band 100W amplifier; 11-phase matching four-path power divider; 12-energy storage capacitor bank; 13-final stage power amplifier feed board; 14-isolator.
Detailed Description
The present invention will be further described with reference to the accompanying drawings, and the following embodiments are only used to illustrate the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
The utility model discloses in the aspect of structural layout, adopt the modular design, when reducing weight and volume, be favorable to batch production and random backup. As shown in fig. 1 to fig. 3, the utility model discloses a high-power solid-state amplifier subassembly of X frequency channel includes the casing, the inherent vertical direction of casing is provided with nine rows two and is listed as final power amplifier subassembly 2, the left and right sides of final power amplifier subassembly 2 is provided with two six way power divider 6 respectively, the side is provided with two way power divider 5 respectively about the casing, the below of final power amplifier subassembly 2 is provided with two preceding stage power amplifier subassemblies 3, be provided with the monitoring between two preceding stage power amplifier subassemblies 3 and gather module 4, preceding stage power amplifier subassembly 3 and monitoring gather the module 4 below and be provided with power module 7.
As shown in fig. 5, the output end of the preceding stage power amplifier component 3 is electrically connected to the input end of the two-way power divider 5, the output end of the two-way power divider 5 is electrically connected to the input ends of the two six-way power dividers 6, and the output ends of the two six-way power dividers 6 are electrically connected to the input ends of the six final stage power amplifier components 2 and the three final stage power amplifier components 2, respectively. The utility model discloses set up two preceding stage power amplifier module 3, two-way power divider 5, four six way power divider 6 and eighteen final power amplifier module 2 altogether. The power amplifier system outputs 72 paths of signals and divides the signals into 2 power amplifier branches, each power amplifier branch corresponds to 36 paths of output signals, and the phase and the power amplitude of the system can be adjusted by controlling an attenuator and a phase shifter in an amplitude-phase control module at the input end of the preceding power amplifier assembly.
The output power of the preceding stage power amplifier component 3 is more than 4 watts, and the preceding stage power amplifier component is divided into 18 paths through a power distributor to drive 18 final stage power amplifier components; a final-stage power amplifier component: the power amplifier comprises 18 final-stage power amplifier components in total, 72 paths of port outputs are provided, and the peak power output by each path of port is larger than 100W. The module energy storage circuit board is required to be close to the power amplifier, the length of a feeder is shortened, otherwise, the voltage waveform of a drain electrode can have larger top drop, an integrated feeder layer is adopted during structural layout, the layout is arranged on the back of a shell of the power amplifier assembly, the integrated feeder layer is connected with a control feeder board in a plug-in mode through a connector, and replacement and maintenance are facilitated. The power amplifier radio frequency circuit is arranged on the front side of the module. The utility model discloses a through the link gain of design preceding stage subassembly and final stage subassembly and increase preceding stage power amplifier subassembly and the isolation of final stage power amplifier subassembly, solve the auto-excitation problem of power amplifier subassembly under-40 ℃ low temperature condition.
The utility model discloses still be provided with heat radiation module, the casing openly is provided with cooling system 1 with the reverse side, comprises 10 special fan and 9 temperature-uniforming plate cooling system, can in time give off nearly 2900W's in the system heat to guarantee that power amplifier is stable work under +55 ℃ high temperature condition.
The monitoring and collecting module 4 adopts an FPGA chip and a full-digital circuit based on FPGA control, and has the main functions of generating working voltage, generating negative pressure, protecting negative pressure, a time sequence circuit, protecting overcurrent, monitoring voltage, current and temperature, indicating state, adopting a CAN bus technology, and being capable of monitoring grid voltage, overcurrent and overvoltage points in real time and being adjustable on line. The stable working point of each stage of power amplifier component under the wide temperature condition of-40 ℃ to +55 ℃, namely the stable static working current under the wide temperature condition of-40 ℃ to +55 ℃, is ensured, and a temperature monitoring circuit and a temperature online self-adaptive circuit are designed; the negative voltage protection circuit ensures the power-on time sequence of the power amplifier tube in the power amplifier, ensures that the drain voltage is switched off under the condition of no negative grid pressure and the time delay is less than 10 milliseconds. The overcurrent protection circuit is arranged to ensure that the drain voltage is timely turned off under the condition of misoperation or large-current fault, the power amplifier tube is protected from being damaged, and the turn-off corresponding time is microsecond order. In order to adapt to the application of domestic power amplifier tubes under the pulse condition, a universal voltage pulse modulation circuit is designed, the voltage range is 28V-50V, the pulse width is 0.1 microsecond-2 milliseconds, and the maximum duty ratio is 12 percent.
The monitoring and gathering module 4 is connected in a serial mode through a CAN bus, is electrically connected with the preceding-stage power amplifier assembly 3, the final-stage power amplifier assembly 2 and the power module 7 and is used for monitoring information, the power amplifier system is in CAN port bus communication, the CAN bus is in a serial communication protocol, and distribution timely control with high safety CAN be effectively supported. The signal transmission of the CAN bus adopts a short frame structure, has short transmission time, an automatic closing function, stronger anti-interference capability, strong real-time property, simple wiring, high transmission speed and good interoperation. The scheme adopts a CAN bus mode, and all power amplifiers and power supplies are controlled and protected in a CAN bus serial mode. Under the pulse working condition, the total system peak power of the power amplifier components is larger than 11000 watts, the peak current is near 390A, each power amplifier component contains an energy storage capacitor near 5000uF, 18 final-stage components contain capacitor capacitors about 90000uF, the system starting current pressure is very large, and the CAN bus control components are adopted to be electrified in batches and in a time-sharing mode so as to reduce the system power supply pressure.
The structure of the system power module 7 adopts the form of direct AC power supply, the power module 7 supplies power to the preceding-stage power amplifier component 3, the final-stage power amplifier component 2 and the monitoring and summarizing module 4, and the power current equalizing technology is adopted, so that the system has the advantages of low transmission loss, no single-point fault, high reliability, small size and weight and simple system capacity expansion. The on-off control and the read-back function of the protection state CAN be realized through the CAN bus. The method has the following functions: voltage, current, temperature display, overvoltage, overcurrent and overtemperature protection. The power supply device has the functions of current limiting and current equalizing, and can realize parallel redundant partition power supply. The self-contained PFC function reduces the harmonic wave of the power grid and reduces the interference of the power grid to the electronic equipment.
The utility model discloses well last power amplifier module 2's structure is shown in fig. 4, the connection relation picture is shown in fig. 6, last power amplifier module 2 includes 5W amplifier 8 of X frequency channel and last power amplifier feed board 13, it is continuous through isolator 14 electricity between the output of 5W amplifier 8 of X frequency channel and the input of joining in marriage looks four ways merit branch ware 11, the output of joining in marriage looks four ways merit branch ware 11 links to each other with four X frequency channel 30W amplifier 9's input end electricity, even there is other isolator 14 between the output of X frequency channel 30W amplifier 9 and the input of X frequency channel 100W amplifier 10, the output of X frequency channel 100W amplifier 10 even has other isolator 14, last power amplifier feed board 13 is last to be integrated with energy storage capacitor group 12, energy storage capacitor group 12 is connected to the drain electrode feed end of power amplifier tube, the overall arrangement can effectively shorten the current route like this, reduce the subassembly size simultaneously.
The utility model discloses a high-power solid-state amplifier subassembly of X frequency channel adopts the active array form of solid-state amplifier can adapt to under the abominable operational environment such as wide temperature range (-40- +55 ℃), strong vibration normal work. The problems of high power and high voltage ignition and breakdown under low pressure are avoided in the whole circuit, the reliability is improved, the weight of equipment is reduced, the size of the equipment is reduced, the cost is reduced, the power consumption of a system is reduced, and the safety of the system is improved. The stable working point of each stage of power amplifier component under the wide temperature condition of-40 ℃ to +55 ℃, namely the stable static working current under the wide temperature condition of-40 ℃ to +55 ℃ is ensured, and a temperature compensation circuit is designed.
The above description is only a preferred embodiment of the present invention, and it should be noted that: for those skilled in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be considered as the protection scope of the present invention.
Claims (6)
1. An X-band high-power solid-state amplifier assembly, characterized in that: the power amplifier comprises a shell, wherein nine rows and two columns of final-stage power amplifier components (2) are arranged in the shell in the vertical direction, two six power distributors (6) are respectively arranged on the left side and the right side of the final-stage power amplifier components (2), two front-stage power amplifier components (3) are arranged below the final-stage power amplifier components (2), a monitoring and summarizing module (4) is arranged between the two front-stage power amplifier components (3), a power supply module (7) is arranged below the front-stage power amplifier components (3) and the monitoring and summarizing module (4), the output ends of the front-stage power amplifier components (3) are electrically connected with the input ends of the two power distributors (5), and the output ends of the two power distributors (5) are electrically connected with the input ends of the two six power distributors (6), two the output of six way power distributor (6) is electrically connected with six respectively final stage power amplifier subassembly (2) and three the input of final stage power amplifier subassembly (2), monitoring gather module (4) with preceding stage power amplifier subassembly (3), final stage power amplifier subassembly (2) and power module (7) electricity are connected, power module (7) give preceding stage power amplifier subassembly (3), final stage power amplifier subassembly (2) and monitoring gather module (4) power supply.
2. The X-band high power solid state amplifier assembly of claim 1, wherein: the monitoring and summarizing module (4) adopts an FPGA chip.
3. The X-band high power solid state amplifier assembly of claim 1, wherein: last stage power amplifier subassembly (2) include 5W amplifier of X frequency channel (8) and last stage power amplifier feed board (13), the output of 5W amplifier of X frequency channel (8) and the input of joining in marriage looks four ways merit and divide and link to each other through isolator (14) electricity between the input of ware (11), the output that joins in marriage looks four ways merit and divide ware (11) and the input electricity of four 30W amplifiers of X frequency channel (9) link to each other, even have between the output of 30W amplifier of X frequency channel (9) and the input of 100W amplifier of X frequency channel (10) in addition isolator (14), the output of 100W amplifier of X frequency channel (10) even has in addition isolator (14), last stage power amplifier feed board (13) is last to be integrated with energy storage capacitor group (12).
4. The X-band high power solid state amplifier assembly of claim 1, wherein: the monitoring and summarizing module (4) is connected with the preceding-stage power amplifier assembly (3), the final-stage power amplifier assembly (2) and the power module (7) in a serial CAN bus mode.
5. The X-band high power solid state amplifier assembly of claim 1, wherein: and the front surface and the back surface of the shell are provided with heat dissipation systems (1).
6. The X-band high power solid state amplifier assembly of claim 5, wherein: the heat dissipation system (1) is composed of a fan and a uniform temperature plate heat dissipation plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022938399.1U CN213484824U (en) | 2020-12-10 | 2020-12-10 | X-frequency-band high-power solid-state amplifier assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022938399.1U CN213484824U (en) | 2020-12-10 | 2020-12-10 | X-frequency-band high-power solid-state amplifier assembly |
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| CN213484824U true CN213484824U (en) | 2021-06-18 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113885355A (en) * | 2021-10-12 | 2022-01-04 | 江西洪都航空工业集团有限责任公司 | Aiming pod simulator |
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- 2020-12-10 CN CN202022938399.1U patent/CN213484824U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113885355A (en) * | 2021-10-12 | 2022-01-04 | 江西洪都航空工业集团有限责任公司 | Aiming pod simulator |
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