CN213426765U - Cabinet cooling system - Google Patents
Cabinet cooling system Download PDFInfo
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- CN213426765U CN213426765U CN202022568419.0U CN202022568419U CN213426765U CN 213426765 U CN213426765 U CN 213426765U CN 202022568419 U CN202022568419 U CN 202022568419U CN 213426765 U CN213426765 U CN 213426765U
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- 238000001816 cooling Methods 0.000 title claims abstract description 43
- 239000007788 liquid Substances 0.000 claims abstract description 219
- 239000000110 cooling liquid Substances 0.000 claims abstract description 71
- 230000017525 heat dissipation Effects 0.000 claims abstract description 41
- 238000005057 refrigeration Methods 0.000 claims description 20
- 239000000498 cooling water Substances 0.000 claims description 12
- 238000007599 discharging Methods 0.000 claims 1
- 238000004891 communication Methods 0.000 abstract description 3
- 239000002826 coolant Substances 0.000 description 22
- 239000007921 spray Substances 0.000 description 9
- 238000005507 spraying Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a rack cooling system relates to electronic communication technical field, can prevent to appear local overheated phenomenon in the rack, guarantees the normal operating of the interior business integrated circuit board of rack. A plurality of service board cards are arranged in the cabinet and arranged in parallel, a heat dissipation gap is reserved between every two adjacent service board cards, and a heat dissipation gap is also reserved between the inner wall of the cabinet and the adjacent service board cards. The cabinet cooling system comprises a liquid homogenizing device and a plurality of liquid leaking pipes. Wherein, a liquid supply cavity for containing insulating cooling liquid is formed in the liquid homogenizing device. The liquid leakage pipes are communicated with the liquid supply cavity, the liquid leakage pipes extend into the plurality of heat dissipation gaps respectively, at least one liquid leakage pipe extends into each heat dissipation gap, and liquid leakage holes are formed in the parts, extending into the heat dissipation gaps, of the liquid leakage pipes.
Description
Technical Field
The utility model relates to an electronic communication technical field especially relates to a rack cooling system.
Background
Optical Transport Networks (OTNs) are transport networks based on wavelength division multiplexing technology, organized in an optical layer network. The OTN cabinet generally includes a cabinet body and a service layer, where the service layer is disposed in the cabinet body and includes a plurality of service boards. In recent years, with continuous progress of communication technology, service boards in an OTN cabinet gradually exhibit characteristics of large capacity, large density, high power and compact structure, so that the service boards in the OTN cabinet can generate a large amount of heat during operation, and further the temperature in the OTN cabinet rises rapidly, and therefore, the OTN cabinet needs to be cooled rapidly and effectively.
Currently, air cooling or liquid cooling techniques may be used to dissipate heat from cabinets. In the prior art, a sealed spraying cavity used for containing insulating cooling liquid can be arranged at the top of the cabinet, and the spraying holes of the pipe pipes are formed in the bottom of the sealed spraying cavity, so that the insulating cooling liquid in the spraying cavity can drip onto the service board card in the cabinet through the spraying holes. At the moment, the heat generated by the service board card during working can be taken away by the insulating cooling liquid, and the temperature of the service board card is reduced, so that the temperature in the cabinet can be reduced, and the normal operation of the service board card in the cabinet is ensured.
At that time, when the number of the service board cards in the cabinet is large, the insulating cooling liquid cannot be uniformly sprayed on each service board card, so that part of the service board cards cannot exchange heat with the insulating cooling liquid, and the temperature of part of the service board cards is too high. At the moment, the phenomenon of local overheating can occur in the cabinet, and the normal operation of the service board card in the cabinet is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a rack cooling system can prevent to appear local overheated phenomenon in the rack, guarantees the normal operating of the interior business integrated circuit board of rack.
In order to achieve the above object, the present invention provides a cooling system for a cabinet. The cabinet is provided with a plurality of service board cards which are arranged in parallel, a heat dissipation gap is reserved between every two adjacent service board cards, and a heat dissipation gap is reserved between the inner wall of the cabinet and the adjacent service board cards.
The cabinet cooling system comprises a liquid homogenizing device and a plurality of liquid leaking pipes. Wherein, a liquid supply cavity for containing insulating cooling liquid is formed in the liquid homogenizing device. The weeping pipe with supply the liquid chamber intercommunication, and a plurality of the weeping pipe stretches into respectively to in the heat dissipation clearance, every all stretch into in the heat dissipation clearance has at least one the weeping pipe, just the weeping pipe stretches into the part in heat dissipation clearance and is equipped with the weeping hole.
Compared with the prior art, the utility model provides an among the rack cooling system, form heat dissipation clearance between a plurality of business integrated circuit boards in the rack, also form heat dissipation clearance between the lateral wall of rack and the adjacent business integrated circuit board. Meanwhile, the liquid supply cavity in the liquid equalizing device can store insulating cooling liquid, and the liquid leakage pipes are communicated with the liquid supply cavity, so that the insulating cooling liquid in the liquid supply cavity can respectively extend into the plurality of heat dissipation gaps through the plurality of liquid leakage pipes. The part that the weeping pipe stretched into to heat dissipation clearance is equipped with the weeping hole, consequently, supplies the insulating coolant liquid of liquid intracavity can spray respectively to every business integrated circuit board through the weeping hole on a plurality of weeping pipes for the heat homoenergetic that produces on every business integrated circuit board can be taken away by insulating coolant liquid, thereby can prevent to appear local overheated phenomenon in the rack, guarantees the normal operating of business integrated circuit board in the rack.
Drawings
The accompanying drawings, which are described herein, serve to provide a further understanding of the invention and constitute a part of this specification, and the exemplary embodiments and descriptions thereof are provided for explaining the invention without unduly limiting it. In the drawings:
fig. 1 is a schematic structural diagram of a cabinet in the prior art;
fig. 2 is a schematic structural diagram of an insulating and cooling device of a cabinet in the prior art;
fig. 3 is one of schematic structural diagrams of a cabinet cooling system provided by the present invention;
fig. 4 is one of the rear views of the cabinet cooling system provided by the present invention;
fig. 5 is a second schematic structural diagram of a cabinet cooling system provided by the present invention;
fig. 6 is a second rear view of the cooling system of the cabinet according to the present invention;
fig. 7 is a schematic structural diagram of the control device provided by the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; the specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
An Optical Transport Network (OTN) cabinet 100 is generally provided with a plurality of service layers, and each service layer includes a plurality of service boards 110. The service cards 110 generate a large amount of heat during operation, so that the temperature in the OTN enclosure 100 rises rapidly. In this case, referring to fig. 1 and 2, in order to cool down the inside of the cabinet 100, in the prior art, an insulating cooling device a is generally provided in the cabinet 100. Insulating cooling device A sprays cavity A1 including locating the airtight chamber A8926 that sprays that is used for holding insulating coolant liquid at rack 100 top, and the bottom of airtight chamber A1 that sprays is equipped with the hole A2 that sprays that runs through for insulating coolant liquid in the chamber that sprays can drip to the business integrated circuit board 110 in the rack 100 through spraying hole A2. At this time, the insulating cooling liquid can take away heat generated by the service board 110 during operation, and reduce the temperature of the service board 110, so that the temperature in the cabinet 100 can be reduced, and the normal operation of the service board 110 in the cabinet 100 is ensured.
However, when the number of the service boards 110 in the cabinet 100 is large, the insulating cooling liquid cannot be uniformly sprayed on each service board 110, so that part of the service boards 110 cannot exchange heat with the insulating cooling liquid, and the temperature of part of the service boards 110 is too high. At this time, a local overheating phenomenon may occur in the cabinet 100, which affects the normal operation of the service board 110 in the cabinet 100.
In order to prevent the local overheat phenomenon in the cabinet 100 and ensure the normal operation of the service board 110 in the cabinet 100, the embodiment of the utility model provides a cabinet cooling system. A plurality of service boards 110 are arranged in the cabinet 100, the service boards 110 are arranged in parallel, a heat dissipation gap 120 is left between two adjacent service boards 110, and a heat dissipation gap 120 is also left between the inner wall of the cabinet 100 and the adjacent service board 110. It should be noted that the arrangement manner of the service board 110 may be selected according to actual situations. For example: the service boards 110 within the cabinet 100 may be oriented parallel to the top of the cabinet 100. At this time, a heat dissipation gap 120 is formed between the uppermost service board 110 and the top plate of the cabinet 100, and a heat dissipation gap 120 is formed between the lowermost service board 110 and the bottom plate of the cabinet 100. In the embodiment of the present invention, referring to fig. 1, the service board 110 is disposed along the direction perpendicular to the top plate of the cabinet 100, and a heat dissipation gap 120 is left between the right side wall of the rightmost service board 110 and the cabinet 100, and a heat dissipation gap 120 is left between the left side wall of the leftmost service board 110 and the cabinet 100.
Referring to fig. 3 and 4, the present invention provides a cabinet cooling system including a liquid equalizer 210 and a plurality of liquid leaking pipes 220. A liquid supply cavity 211 for containing insulating cooling liquid is formed in the liquid homogenizing device 210. It should be understood that there are many choices of the insulating cooling liquid, as long as the insulating cooling liquid has good insulating and heat-conducting properties. For example: the insulating cooling liquid can be mineral oil, silicone oil or fluorinated liquid.
One end of the liquid leaking pipe 220 is communicated with the liquid supply cavity 211, the plurality of liquid leaking pipes 220 respectively extend into the plurality of heat dissipation gaps 120, each heat dissipation gap 120 extends into at least one liquid leaking pipe 220, and the part of the liquid leaking pipe 220 extending into the heat dissipation gaps 120 is provided with a liquid leaking hole 221. It should be appreciated that the cooling system of cabinet 100 described above, in operation, adds insulating cooling fluid to the fluid supply cavity 211. The insulating coolant can be introduced into the plurality of drain pipes 220, respectively. Since the plurality of weep pipes 220 respectively extend into the plurality of heat dissipation gaps 120, and weep holes 221 are formed in the portions of the weep pipes 220 extending into the heat dissipation gaps 120, the liquid in the weep pipes 220 can be sprayed onto the service boards 110 on the two sides of the heat dissipation gaps 120 where the weep pipes 220 are located through the weep holes 221. Since at least one liquid leaking pipe 220 extends into each heat dissipation gap 120, the insulating cooling liquid in the liquid equalizing device 210 can be sprayed onto each service board 110 through the liquid leaking holes 221 on the liquid leaking pipes 220, so as to take away the heat generated when each service board 110 operates.
Known by above-mentioned rack cooling system's structure and working process, the utility model provides a rack cooling system includes a plurality of weeping pipes 220, a plurality of weeping pipes 220 stretch into respectively in a plurality of heat dissipation clearance 120, all stretch into at least one weeping pipe 220 in every heat dissipation clearance 120, and the part that weeping pipe 220 stretched into to heat dissipation clearance 120 is equipped with weeping hole 221, therefore, the insulating coolant liquid that supplies in the liquid chamber 211 can spray respectively on every business integrated circuit board 110 through weeping hole 221 on a plurality of weeping pipes 220, make the heat homoenergetic that produces on every business integrated circuit board 110 can be taken away by insulating coolant liquid, thereby can prevent the local overheated phenomenon from appearing in the rack 100, guarantee the normal operating of business integrated circuit board 110 in the rack 100.
Specifically, the position of the liquid supply device may be selected according to actual conditions, and the insulating cooling liquid in the liquid supply cavity 211 may be sprayed onto the service board 110 through the liquid leakage hole 221 of the liquid leakage pipe 220. In the embodiment of the present invention, the liquid supply device is disposed above the service board 110. At this time, the insulating cooling liquid can be sprayed from the weep hole 221 onto the service board 110 by gravity and the pressure in the liquid supply cavity 211.
And the shape of the drain pipe 220 may be selected in various ways. For example: the liquid leaking pipe 220 may be in a straight shape, may also be in an L shape, and may of course be in an arc shape, etc. The plurality of drain pipes 220 may be identical in shape or different in shape. The number of the leaking pipes 220 extending into each heat dissipation gap 120 can be selected according to the actual situation, for example: two drain pipes 220 extend into one heat dissipation gap 120. The number of the liquid leaking pipes 220 extending into the different heat dissipation gaps 120 may be the same or different, and is specifically arranged according to the actual operation condition.
In one embodiment, the liquid equalizer 210 is provided with a liquid equalizing inlet 212 communicated with the liquid supply chamber 211 so that the insulating cooling liquid can be recycled. The above-described cabinet cooling system further includes an accumulator 230, a refrigeration cycle line 240, and a cooling water circulation line 250. The liquid trap 230 is provided with a liquid trap 231 and a liquid trap outlet 232 communicated with the liquid trap 231, the liquid trap 231 is disposed under the service boards 110, and the liquid trap 231 is used for collecting the insulating coolant dropped from the service boards 110. When a shield is provided between the service board 110 and the sump 231, the insulating coolant drops onto the shield and then flows into the sump 231 from the shield. When there is no shield between the service board 110 and the sump 231, the insulating coolant can directly drip into the sump 231.
The refrigeration cycle pipeline 240 is connected between the liquid equalizing inlet 212 and the liquid collecting outlet 232; the refrigerating cycle pipe 240 is connected in series with a circulation pump 260 and a heat exchanger 270. The cooling water circulation line 250 is used for exchanging heat with the heat exchanger 270.
At this time, after the heat of the service board 110 is taken away by the insulating cooling liquid, the insulating cooling liquid slides down along the service board 110 under the action of gravity and falls to the liquid collecting tank 231, so that the liquid collecting tank 231 can collect the insulating cooling liquid after heat exchange with the service board 110. At this time, the circulation pump 260 is started, and the insulating coolant in the sump 231 is made to flow into the device heat exchanger 270 by the circulation pump 260. And because the cooling water circulation pipeline 250 can exchange heat with the heat exchanger 270, therefore, the insulating cooling liquid can exchange heat with the cooling water in the cooling water circulation pipeline 250, so that after the temperature of the insulating cooling liquid is reduced, the insulating cooling liquid flows into the liquid supply cavity 211 through the refrigeration circulation pipeline 240 and the liquid equalizing liquid inlet 212, thereby realizing the recycling of the insulating cooling liquid and reducing the production cost.
It can be understood that, referring to fig. 3 to 6, when the plurality of service boards 110 in the cabinet 100 are divided into a first row of service boards and a second row of service boards, and the first row of service boards is disposed directly above the second row of service boards, there are two of the liquid homogenizers 210, the liquid accumulators 230 and the refrigeration cycle pipeline 240. The first liquid homogenizing device is arranged right above the first row of service board cards, and the second liquid homogenizing device is arranged right above the second row of service board cards. The liquid collecting groove of the first liquid collector is positioned under the first row of service board cards, and the liquid collecting groove of the second liquid collector is positioned under the second row of service board cards. The two refrigeration circulation pipelines 240 are connected with the circulation pump 260 in series, the two refrigeration circulation pipelines 240 are connected with the heat exchanger 270 in series, the first refrigeration circulation pipeline is connected between the first liquid homogenizing device and the first liquid collector, and the second refrigeration circulation pipeline is connected between the second liquid homogenizing device and the second liquid collector.
Illustratively, the heat exchanger 270 has a first heat exchange cavity and a second heat exchange cavity, which can exchange heat with each other, and the first heat exchange cavity is connected in series with the cooling water circulation pipeline 250, so that the cooling water can flow into the first heat exchange cavity through the cooling water circulation pipeline 250.
The second heat exchange cavity is provided with a heat exchange liquid inlet and a heat exchange liquid outlet. The refrigeration cycle pipeline 240 comprises a liquid supply pipe 241 and a liquid return pipe 242, wherein a first end of the liquid supply pipe 241 is communicated with the liquid equalizing liquid inlet 212, and a second end of the liquid supply pipe 241 is communicated with the heat exchange liquid outlet; the first end of the liquid return pipe 242 is communicated with the liquid collecting outlet 232, and the second end of the liquid return pipe 242 is communicated with the heat exchange inlet. The circulation pump 260 may be provided in the liquid supply pipe 241 or the liquid return pipe 242.
At this time, the insulating coolant with a high temperature in the liquid collecting tank 231 can enter the second heat exchange chamber through the liquid return pipe 242. The insulating cooling liquid in the second heat exchange cavity and the cooling water in the first heat exchange cavity can exchange heat, so that the insulating cooling liquid enters the liquid supply cavity 211 through the liquid supply pipe 241 after the temperature of the insulating cooling liquid is reduced.
Specifically, in order to ensure that the cooled insulating cooling liquid can continuously and stably flow into the liquid supply cavity 211 from the heat exchanger 270, the liquid equalizer 210 has a plurality of liquid equalizing inlet ports 212, and the refrigeration cycle pipeline 240 includes a plurality of liquid supply pipes 241. The plurality of liquid supply pipes 241 are in one-to-one correspondence with the at least two liquid equalizing liquid inlets 212, the first ends of the plurality of liquid supply pipes 241 are communicated with the corresponding liquid equalizing liquid inlets 212, and the second ends of the plurality of liquid supply pipes 241 are communicated with the heat exchange liquid outlets. At this time, when one liquid equalizing inlet 212 or one liquid supply pipe 241 is blocked, the cooled insulating cooling liquid can flow into the heat exchange cavity from the other liquid supply pipes 241 and the liquid equalizing inlet 212.
Specifically, the number of the liquid equalizing inlet 212 and the number of the liquid supplying pipes 241 may be determined according to actual conditions. For example: the liquid equalizer 210 is provided with two liquid equalizing inlets 212, and the refrigeration cycle pipeline 240 includes two liquid supply pipes 241.
Specifically, in order to ensure that the insulating coolant with a high temperature in the liquid collecting tank 231 can continuously and stably flow into the heat exchanger 270, the liquid collector 230 has a plurality of liquid collecting outlets 232; the refrigeration cycle line 240 includes a plurality of return lines 242. A plurality of liquid return pipes 242 and a plurality of album liquid outlet 232 one-to-one, a plurality of first ends that return the liquid pipe 242 all communicate with corresponding album liquid outlet 232, and a plurality of second ends that return the liquid pipe 242 all communicate with the heat transfer inlet. At this time, when one liquid collecting outlet 232 or one liquid return pipe 242 is blocked, the insulating cooling liquid with higher temperature can flow into the heat exchanger 270 through the other liquid collecting outlets 232 and the liquid return pipe 242, so that the insulating cooling liquid with higher temperature in the liquid tank can be ensured to continuously and stably flow into the heat exchanger 270.
Specifically, the number of the liquid collecting outlets 232 and the liquid returning pipes 242 may be determined according to actual conditions. For example: the accumulator 230 is provided with two accumulation liquid outlets 232, and the refrigeration cycle pipe 240 includes two liquid return pipes 242.
Meanwhile, in order to conveniently connect the liquid supply pipe 241 with the liquid equalizing port, the first end of the liquid supply pipe 241 is connected with the liquid equalizing port 212 through a quick coupling.
In addition, for the convenience of connecting the liquid return pipe 242 with the liquid collecting outlet 232, the first end liquid of the liquid collecting pipe is connected with the liquid collecting outlet 232 through a quick coupling.
As a possible implementation manner, the weep pipe 220 is provided with a plurality of weep holes 221, and the weep holes 221 are arranged along the length direction of the weep pipe 220. At this moment, the insulating cooling liquid in the liquid collecting pipe can be sprayed to different positions of the service board card 110 from the plurality of liquid leaking holes 221, so that the speed of taking away heat generated by the service board card 110 by the insulating cooling liquid can be increased, and the cooling speed of the cabinet cooling system on the cabinet 100 can be increased.
Specifically, the service board 110 is provided with a heat dissipation module, and the liquid leakage hole 221 is arranged opposite to the heat dissipation module. At this time, the weep hole 221 can directly spray the insulating cooling liquid onto the heat dissipation module of the service board 110, so that the speed of taking away the heat generated by the service board 110 by the insulating cooling liquid can be further increased, and the cooling speed of the cabinet cooling system on the cabinet 100 can be further increased.
As an embodiment, in order to ensure that the insulating cooling liquid in the liquid supply cavity 211 of the liquid equalizer 210 is pressurized to spray the insulating cooling liquid onto the service board 110 and to better take away heat from the service board 110, referring to fig. 3 to 7, the refrigeration cycle pipeline 240 is connected in series with a valve 280, and the cabinet cooling system further includes a control device 290, and the control device 290 includes a controller 291. The controller 291 is used to receive in real time the temperature of the insulating coolant in the sump 231 and the pressure at the weep hole 221.
The controller 291 is also used to compare the temperature of the insulating coolant in the sump 231 with a preset temperature threshold. The controller 291 is also used to compare the pressure at the weep hole 221 to a preset pressure threshold. It should be noted that the preset temperature threshold may be selected according to actual situations, for example: the temperature threshold of the insulating coolant in the header tank 231 is 40 to 45 ℃. The preset pressure threshold may also be selected according to actual conditions, and the preset pressure threshold may be set such that the insulating cooling liquid is sprayed onto the service board 110. For example: the preset pressure threshold is 3 MPa-4 MPa.
The controller 291 is further configured to control the opening of the valve 280 to increase when the temperature of the insulating coolant in the sump 231 is greater than a preset temperature threshold, or the pressure at the weep hole 221 is less than a preset pressure threshold. For example: when the temperature of the insulating coolant is 50 ℃ and the pressure at the weep hole 221 is 2MPa, the opening degree of the control valve 280 increases.
When the temperature of the insulating cooling liquid in the liquid collecting tank 231 is greater than the preset temperature threshold, it is indicated that the heat exchange capacity of the insulating cooling liquid has reached the upper limit, the insulating cooling liquid can only take away part of the heat generated by the operation of the service board card 110, and the rest of the heat can be radiated into the cabinet 100, so that the temperature of the cabinet 100 rises. When the pressure at the weep hole 221 is less than the predetermined pressure threshold, it indicates that the pressure at the weep hole 221 is too low to be sprayed onto the service board 110. At this time, the opening degree of the control valve 280 is increased, so that the flow rate of the cooled insulating cooling liquid flowing into the liquid supply cavity 211 from the heat exchanger 270 is increased, and further, the pressure at the liquid leakage hole 221 is increased, so that the insulating cooling liquid can be sprayed onto the service board 110. Meanwhile, the dropping speed of the insulating cooling liquid at the liquid leakage hole 221 can be increased, so that the insulating cooling liquid sprayed onto the service board card 110 is increased, and the heat generated when the service board card 110 runs can be fully taken away by the insulating cooling liquid.
The controller 291 is further configured to control the opening of the valve 280 to decrease when the temperature of the insulating coolant in the sump 231 is less than a preset temperature threshold and the pressure at the weep hole 221 is greater than a preset pressure threshold. For example: when the temperature of the insulating coolant is 35 ℃ and the pressure at the weep hole 221 is 5MPa, the opening of the control valve 280 is decreased.
When the temperature of the insulating cooling liquid in the liquid collecting tank 231 is lower than the preset temperature threshold, it indicates that the insulating cooling liquid sprayed on the service board 110 is more, and the insulating cooling liquid is not fully utilized. When the pressure at the weep hole 221 is greater than the predetermined pressure threshold, it indicates that the pressure at the weep hole 221 is too high, which causes the insulating cooling liquid sprayed onto the service board 110 to have a large impact on the service board 110. At this time, the opening degree of the control valve 280 is reduced, so that the flow rate of the cooled insulating cooling liquid flowing into the liquid supply cavity 211 from the heat exchanger 270 is reduced, the pressure at the liquid leakage hole 221 is further reduced, and the impact of the insulating cooling liquid on the service board 110 is reduced. Meanwhile, the dropping speed of the insulating cooling liquid at the liquid leakage hole 221 can be reduced, so that the heat of the service board card 110 can be taken away by the insulating cooling liquid.
The controller 291 is also used to maintain the opening of the valve 280 constant when the temperature of the insulating coolant in the sump 231 is within a preset temperature threshold and the pressure at the weep hole 221 is within a preset pressure threshold. For example: when the temperature of the insulating coolant is 42 ℃ and the pressure at the weep hole 221 is 3MPa, the opening degree of the control valve 280 is maintained.
When the temperature of the insulating cooling liquid in the liquid collecting tank 231 is within the preset temperature threshold, it indicates that the insulating cooling liquid sprayed onto the service board card 110 is proper, and the insulating cooling liquid can take away heat generated during the operation of the service board card 110 and can be fully utilized. When the pressure at the weep hole 221 is within the preset pressure threshold, which indicates that the pressure at the weep hole 221 is used, the insulating cooling liquid can be sprayed onto the service board 110, and simultaneously, the impact of the insulating cooling liquid on the service board 110 can be reduced. At this time, the opening of the control valve 280 is kept unchanged, that is, the cabinet cooling system can sufficiently and efficiently cool the cabinet 100.
Specifically, the control device 290 further includes a pressure sensor 292 and a temperature sensor 293, the pressure sensor 292 and the temperature sensor 293 are both in signal connection with the controller 291, the pressure sensor 292 is disposed in the weep hole 221, and the temperature sensor 293 is disposed in the liquid collecting tank 231. At this time, the temperature sensor 293 can collect the temperature of the insulating cooling liquid in the sump 231 in real time and transmit the temperature of the insulating cooling liquid in the sump 231 to the controller 291 in real time. The pressure sensor 292 can collect the pressure at the weep hole 221 in real time and transmit the pressure at the weep hole 221 to the controller 291 in real time, thereby ensuring the normal operation of the control device 290.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a rack cooling system, its characterized in that, be equipped with a plurality of business integrated circuit boards in the rack, it is a plurality of business integrated circuit board parallel arrangement, adjacent two leave the heat dissipation clearance between the business integrated circuit board, the inner wall of rack and adjacent also leave the heat dissipation clearance between the business integrated circuit board, rack cooling system includes:
the liquid homogenizing device is internally provided with a liquid supply cavity for containing insulating cooling liquid;
a plurality of weeping pipes, the weeping pipe with supply the liquid chamber intercommunication, and it is a plurality of the weeping pipe stretches into respectively to a plurality of in the heat dissipation clearance, every all stretch into in the heat dissipation clearance at least one the weeping pipe, just the part that the weeping pipe stretches into to the heat dissipation clearance is equipped with the weeping hole.
2. The cabinet cooling system of claim 1, wherein the liquid homogenizing device is provided with a liquid homogenizing inlet communicated with the liquid supply cavity;
the cabinet cooling system further comprises a liquid collector, a refrigeration cycle pipeline and a cooling water circulation pipeline, wherein a liquid collecting groove and a liquid collecting liquid outlet communicated with the liquid collecting groove are formed in the liquid collector, the liquid collecting groove is formed right below the plurality of service board cards, and the liquid collecting groove is used for collecting the insulating cooling liquid dropping from the service board cards;
the refrigeration circulation pipeline is connected between the liquid homogenizing liquid inlet and the liquid collecting liquid outlet; and the refrigerating circulation pipeline is connected with a circulating pump and a heat exchanger in series;
and the cooling water circulation pipeline is used for exchanging heat with the heat exchanger.
3. The cabinet cooling system of claim 2, wherein the heat exchanger has a first heat exchange cavity and a second heat exchange cavity capable of exchanging heat with each other, and the first heat exchange cavity is connected in series with the cooling water circulation pipeline; the second heat exchange cavity is provided with a heat exchange liquid inlet and a heat exchange liquid outlet;
the refrigeration circulation pipeline comprises a liquid supply pipe and a liquid return pipe, a first end of the liquid supply pipe is communicated with the liquid homogenizing inlet, and a second end of the liquid supply pipe is communicated with the heat exchange liquid outlet; the first end of the liquid return pipe is communicated with the liquid collection liquid outlet, and the second end of the liquid return pipe is communicated with the heat exchange liquid inlet.
4. The cabinet cooling system of claim 3, wherein the liquid homogenizer has a plurality of the liquid homogenizing inlet ports; the refrigeration cycle piping includes a plurality of the liquid supply pipes;
a plurality of the feed pipe with at least two equal liquid inlet one-to-one, it is a plurality of the first end of feed pipe all with corresponding equal liquid inlet intercommunication, it is a plurality of the second end of feed pipe all with the heat transfer liquid outlet intercommunication.
5. The cabinet cooling system of claim 3, wherein the accumulator has a plurality of the accumulator outlets; the refrigeration cycle pipeline comprises a plurality of liquid return pipes; it is a plurality of return liquid pipe with a plurality of collect liquid outlet one-to-one, it is a plurality of return liquid pipe's first end all with corresponding collect liquid outlet intercommunication, it is a plurality of return liquid pipe's second end all with the heat transfer inlet intercommunication.
6. The cabinet cooling system of claim 3, wherein the first end of the liquid supply pipe is connected to the liquid equalizing inlet via a quick-connect; and/or the presence of a gas in the gas,
the first end of the liquid return pipe is connected with the liquid collecting and discharging port through a quick connector.
7. The cabinet cooling system of claim 1, wherein the weep holes are provided in plurality and are aligned along a length of the weep tubes.
8. The cabinet cooling system of claim 7, wherein the service board has a heat sink module, and the weep hole is opposite the heat sink module of the service board.
9. The cabinet cooling system according to any one of claims 2 to 6, wherein a valve is connected in series to the refrigeration circulation pipeline; the cabinet cooling system further includes a control device, the control device including:
the controller is used for receiving the temperature of the insulating cooling liquid in the liquid collecting tank and the pressure at the liquid leakage hole in real time;
the controller is also used for comparing the temperature of the insulating cooling liquid in the liquid collecting tank with a preset temperature threshold value; the controller is also used for comparing the pressure at the liquid leakage hole with a preset pressure threshold value;
the controller is also used for controlling the opening of the valve to increase when the temperature of the insulating cooling liquid in the liquid collecting tank is greater than the preset temperature threshold value or the pressure at the liquid leakage hole is less than the preset pressure threshold value;
the controller is also used for controlling the opening of the valve to be reduced when the temperature of the insulating cooling liquid in the liquid collecting tank is lower than the preset temperature threshold value and the pressure at the liquid leakage hole is higher than the preset pressure threshold value;
the controller is also used for keeping the opening of the valve unchanged when the temperature of the insulating cooling liquid in the liquid collecting tank is within the preset temperature threshold value and the pressure at the liquid leakage hole is within the preset pressure threshold value.
10. The cabinet cooling system of claim 9, wherein the control device further comprises a pressure sensor and a temperature sensor, the pressure sensor and the temperature sensor are in signal connection with the controller, the pressure sensor is disposed at the weep hole, and the temperature sensor is disposed in the sump.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202022568419.0U CN213426765U (en) | 2020-11-09 | 2020-11-09 | Cabinet cooling system |
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| CN202022568419.0U CN213426765U (en) | 2020-11-09 | 2020-11-09 | Cabinet cooling system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113365478A (en) * | 2021-06-22 | 2021-09-07 | 中国联合网络通信集团有限公司 | Cooling device and cluster router |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113365478A (en) * | 2021-06-22 | 2021-09-07 | 中国联合网络通信集团有限公司 | Cooling device and cluster router |
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