CN213411679U - Diamond grinding wheel easy for chip removal - Google Patents
Diamond grinding wheel easy for chip removal Download PDFInfo
- Publication number
- CN213411679U CN213411679U CN202021963841.XU CN202021963841U CN213411679U CN 213411679 U CN213411679 U CN 213411679U CN 202021963841 U CN202021963841 U CN 202021963841U CN 213411679 U CN213411679 U CN 213411679U
- Authority
- CN
- China
- Prior art keywords
- abrasive material
- base member
- material layer
- air vent
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 14
- 239000010432 diamond Substances 0.000 title claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims abstract description 21
- 239000003082 abrasive agent Substances 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 9
- 238000005253 cladding Methods 0.000 claims abstract description 6
- 125000004122 cyclic group Chemical group 0.000 claims abstract description 4
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical group C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 claims abstract description 4
- 230000007704 transition Effects 0.000 claims abstract description 4
- 230000000694 effects Effects 0.000 abstract description 7
- 230000008901 benefit Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 4
- 229910001651 emery Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The utility model discloses a diamond grinding wheel of easy chip removal belongs to diamond grinding wheel technical field, include the base member that from interior to exterior set up, excessive anchor coat and abrasive material layer, the base member is discoid structure, this base member center is provided with the mounting hole, this base member border position is provided with annular link, the abrasive material layer is connected fixedly through transition anchor coat and annular link, the cyclic annular lateral wall on abrasive material layer evenly is provided with a plurality of chip grooves, be provided with the air vent in the abrasive material piece between two chip grooves, the air vent makes two adjacent chip grooves be linked together, the cladding is fixed with the heat dissipation metal level in the air vent, be provided with the louvre on the annular link, the louvre is linked together with the air. The utility model has the advantages of simple structure, good heat dissipation effect, long service life and easy chip removal.
Description
Technical Field
The utility model belongs to the technical field of the diamond grinding wheel, especially, relate to a diamond grinding wheel of easy chip removal.
Background
A circular bonded grinding tool with a through hole in the center is made of diamond grinding material as raw material and metal powder, resin powder, ceramic and electroplated metal as binding agent.
The diamond grinding wheel majority at present stage only makes the change in the material, the grinding face is mostly continuous grinding face, continuous grinding face is great with work piece frictional resistance, can produce higher heat during continuous grinding, it glues and is difficult to the clearance to produce more piece thereupon, the piece of adhesion is more the heat about be difficult to distribute, form vicious circle, higher heat can make diamond grinding wheel surface produce the thermal expansion, lead to emery wheel surface fracture easily, reduce life.
Disclosure of Invention
The to-be-solved problem of the utility model is to provide a diamond grinding wheel of simple structure, the radiating effect is good, long service life, easy chip removal.
In order to solve the technical problem, the utility model discloses a technical scheme is: the utility model provides a diamond grinding wheel of easy chip removal, includes base member, excessive anchor coat and the abrasive material layer that from interior to exterior set up, the base member is discoid structure, and this base member center is provided with the mounting hole, and this base member border position is provided with annular link, the abrasive material layer is connected fixedly through transition anchor coat and annular link, the cyclic annular lateral wall on abrasive material layer evenly is provided with a plurality of chip grooves, two be provided with the air vent in the abrasive material piece between the chip groove, the air vent makes two adjacent chip grooves be linked together, the cladding is fixed with the heat dissipation metal level in the air vent.
The annular connecting frame is provided with heat dissipation holes, and the heat dissipation holes are communicated with the air vents.
Due to the adoption of the technical scheme, the utility model discloses simple structure sets up the chip groove at abrasive material layer lateral wall to chip groove and abrasive material layer diameter direction become certain angle, make the sweeps that produces in the middle of the emery wheel working process discharge smoothly, and simultaneously, the air vent makes two adjacent chip grooves be linked together, can produce the air current at rotatory in-process like this, do benefit to the chip removal more, and the cladding is fixed with level and smooth heat dissipation metal level in the air vent, still plays radiating effect in the chip removal. In addition, the annular connecting frame is provided with heat dissipation holes, and the heat dissipation holes are communicated with the air vents, so that the heat dissipation effect is improved, chips are prevented from being adhered, the thermal expansion is avoided, and the service life is prolonged.
The utility model has the advantages that: the heat dissipation structure has the advantages of simple structure, good heat dissipation effect, long service life and easiness in chip removal.
Drawings
The advantages and mode of realisation of the invention will become more apparent hereinafter by describing in detail the invention with reference to the attached drawings, wherein the content shown in the drawings is only for explaining the invention, without constituting any limitation to the meaning of the invention, in which:
FIG. 1 is a schematic structural diagram of the present invention
FIG. 2 is a cross-sectional view of the layered structure of the present invention
In the figure:
1. substrate 2, excessive bonding layer 3, abrasive layer
4. Mounting hole 5, annular connecting frame 6, chip groove
7. Air vent 8, heat dissipation metal layer 9 and heat dissipation holes
Detailed Description
As shown in fig. 1 and 2, the utility model relates to a diamond grinding wheel of easy chip removal, include base member 1 from interior to exterior that sets up, excessive anchor coat 2 and abrasive material layer 3, base member 1 is discoid structure, this base member 1 center is provided with mounting hole 4, 1 border position of this base member is provided with annular link 5, abrasive material layer 3 is connected fixedly through transition anchor coat 2 and annular link 5, the cyclic annular lateral wall on abrasive material layer 3 evenly is provided with a plurality of chip grooves 6, be provided with air vent 7 in the abrasive material piece between two chip grooves 6, air vent 7 makes two adjacent chip grooves 6 be linked together, the cladding is fixed with heat dissipation metal level 8 in air vent 7, be provided with louvre 9 on the annular link 5, louvre 9 is linked together with air vent 7.
The utility model discloses simple structure sets up chip groove 6 at 3 lateral walls on abrasive material layer to chip groove 6 and 3 diameter direction in abrasive material layer become certain angle, make the sweeps that produce in the middle of the emery wheel working process discharge smoothly, and simultaneously, air vent 7 makes two adjacent chip grooves 6 be linked together, can be at rotatory in-process production air current like this, do benefit to the chip removal more, the cladding is fixed with level and smooth heat dissipation metal level 8 in the air vent 7, still plays radiating effect in the chip removal. In addition, the annular connecting frame 5 is provided with the heat dissipation holes 9, the heat dissipation holes 9 are communicated with the air vents 7, the heat dissipation effect is improved, adhesion debris and thermal expansion are avoided, and the service life is prolonged.
The embodiments of the present invention have been described in detail, but the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention should be covered by the present patent.
Claims (2)
1. The utility model provides a diamond grinding wheel of easy chip removal which characterized in that: including base member, excessive anchor coat and the abrasive material layer that from interior to exterior set up, the base member is discoid structure, and this base member center is provided with the mounting hole, and this base member border position is provided with annular link, the abrasive material layer is connected fixedly through transition anchor coat and annular link, the cyclic annular lateral wall on abrasive material layer evenly is provided with a plurality of chip grooves, two be provided with the air vent in the abrasive material piece between the chip groove, the air vent makes two adjacent chip grooves be linked together, the cladding is fixed with the heat dissipation metal level in the air vent.
2. The easy chip evacuation diamond wheel as claimed in claim 1, wherein: the annular connecting frame is provided with heat dissipation holes, and the heat dissipation holes are communicated with the air vents.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021963841.XU CN213411679U (en) | 2020-09-10 | 2020-09-10 | Diamond grinding wheel easy for chip removal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021963841.XU CN213411679U (en) | 2020-09-10 | 2020-09-10 | Diamond grinding wheel easy for chip removal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213411679U true CN213411679U (en) | 2021-06-11 |
Family
ID=76260854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021963841.XU Active CN213411679U (en) | 2020-09-10 | 2020-09-10 | Diamond grinding wheel easy for chip removal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213411679U (en) |
-
2020
- 2020-09-10 CN CN202021963841.XU patent/CN213411679U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102814747B (en) | A kind of CBN resin wheel and preparation method thereof | |
| CN102814759B (en) | A kind of diamond-resin grinding wheel and preparation method thereof | |
| CN102814763B (en) | A kind of Polyimide Resin Bonded Diamond Grinding Wheel and preparation method thereof | |
| WO1998014307A1 (en) | Superabrasive tool and method of its manufacture | |
| JP2006501073A (en) | Brazed diamond tools and their manufacturing methods | |
| CN102814745B (en) | A kind of fused alumina zirconia resin wheel and preparation method thereof | |
| MY163735A (en) | Cemented carbide base outer blade cutting wheel and making method | |
| US20180354095A1 (en) | Grinding Tool and Method of Fabricating the Same | |
| CN105563357A (en) | Polished crystal tile abrasive disc and preparation method thereof | |
| CN213411679U (en) | Diamond grinding wheel easy for chip removal | |
| CN102814757B (en) | A kind of pink fused alumina resin wheel and preparation method thereof | |
| CN201922355U (en) | Diamond grinding wheel | |
| CN108687681B (en) | Diamond grinding disc and preparation process thereof | |
| CN110732983A (en) | Repair-free superhard grinding wheel for processing hard and brittle materials and preparation method thereof | |
| CN201565854U (en) | Dismountable combined type diamond grinding wheel | |
| CN201371422Y (en) | A diamond grinding wheel and grinding equipment using the same | |
| CN207930521U (en) | A kind of microbit fluting special diamond grinding wheel | |
| JP2006082187A (en) | Thin blade grinding wheel | |
| EP1053079B1 (en) | Grinding wheel | |
| CN103264358A (en) | Resin diamond grinding tool and manufacturing die thereof | |
| CN211516270U (en) | Novel saw blade | |
| CN202180415U (en) | CMP pad dresser | |
| CN212601307U (en) | Special micro-powder diamond grinding wheel for magnetic material | |
| CN111691627A (en) | Method for manufacturing metal facing composite gypsum board | |
| CN207915294U (en) | A kind of flaring cup wheel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240513 Address after: 436000, Group 10, Baihong Village, Yanji Town, Ezhou City, Hubei Province Patentee after: Hubei Huating Diamond Tools Co.,Ltd. Country or region after: China Address before: 215000 room 3, building 10, mold manufacturing area, Kunshan International Mold City, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Kunshan Wellek Diamond Products Co.,Ltd. Country or region before: China |