CN212542361U - Wafer cleaning device - Google Patents
Wafer cleaning device Download PDFInfo
- Publication number
- CN212542361U CN212542361U CN202020939483.2U CN202020939483U CN212542361U CN 212542361 U CN212542361 U CN 212542361U CN 202020939483 U CN202020939483 U CN 202020939483U CN 212542361 U CN212542361 U CN 212542361U
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- wafer
- nozzle
- nozzle body
- wafer cleaning
- cleaning device
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- 238000004140 cleaning Methods 0.000 title claims abstract description 39
- 239000007788 liquid Substances 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 239000008367 deionised water Substances 0.000 claims description 9
- 229910021641 deionized water Inorganic materials 0.000 claims description 9
- 238000005406 washing Methods 0.000 abstract description 5
- 240000002853 Nelumbo nucifera Species 0.000 abstract description 2
- 235000006508 Nelumbo nucifera Nutrition 0.000 abstract description 2
- 235000006510 Nelumbo pentapetala Nutrition 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 54
- 230000015654 memory Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a wafer cleaning device, includes conveyer pipe and nozzle, the nozzle sets up the one end of conveyer pipe, the other end and the flow valve of conveyer pipe are connected, wherein, the nozzle is seedpod of a lotus form. The utility model provides a nozzle is shower nozzle form to be provided with a plurality of orifices on the surface of treating the washing wafer at the nozzle orientation, a plurality of orifices are the face and distribute, can reduce the velocity of flow of washing liquid, help reducing the impact force to the wafer surface, effectively weaken the damage that high-speed liquid stream impacted wafer surface and caused, thereby improve the yield and the reliability of product.
Description
Technical Field
The utility model relates to a manufacturing process field of semiconductor, in particular to wafer belt cleaning device.
Background
With the development of the planar flash memory, the manufacturing process of the semiconductor has been greatly improved. In recent years, however, the development of planar flash memories has met with various challenges: physical limits, existing development technology limits, and storage electron density limits, among others. In this context, to solve the difficulties encountered by flat flash memories and to pursue lower production costs of unit memory cells, various three-dimensional (3D) flash memory structures, such as 3D NOR (3D NOR) flash memory and 3D NAND (3D NAND) flash memory, have come into force.
The 3D NAND memory is based on the small volume and the large capacity, the design concept of the three-dimensional mode layer-by-layer stacking height integration of the storage units is adopted, the memory with high unit area storage density and high-efficiency storage unit performance is produced, and the mainstream process of the design and production of the emerging memory is formed.
Wafer bonding, which is the bonding of two polished wafers together without the use of adhesives, is an important step in the semiconductor manufacturing process. With the development of electronic components toward high density and miniaturization, the wafer bonding process has received more and more attention because it can realize electrical connection between different wafers and quickly realize stacking of process layers.
Before wafer bonding, the surface of the wafer needs to be subjected to plasma treatment, and then surface cleaning is performed to remove particles on the surface of the wafer.
In the existing wafer bonding equipment, two methods for cleaning the wafer are commonly used: one is surface ultrasonic cleaning, i.e. coating deionized water (DIW) on the surface of the wafer, and using ultrasonic wave to apply the deionized water on the surface of the wafer, thereby removing particles on the surface of the wafer; the other method is to utilize high-pressure gas to spray deionized water at a high speed to directly wash the surface of the wafer so as to remove particles on the surface of the wafer.
However, although the high-speed water flow generated by the high-pressure gas can improve the cleaning effect, the high-speed water flow easily damages the surface of the wafer.
SUMMERY OF THE UTILITY MODEL
In view of the above, an object of the present invention is to provide a wafer cleaning apparatus, which can reduce damage caused by high-speed liquid flow impacting the surface of the wafer.
According to an aspect of the utility model, a wafer belt cleaning device is provided, including conveyer pipe and nozzle, the nozzle sets up the one end of conveyer pipe, the other end and the flow valve of conveyer pipe are connected, wherein, the nozzle is seedpod of a lotus form.
Preferably, the nozzle comprises a nozzle body and a sleeve sleeved outside the nozzle body, and the nozzle body is in a shower shape.
Preferably, the nozzle body has a trapezoidal cross section in the vertical direction.
Preferably, the nozzle body comprises a first surface and a second surface, wherein the first surface faces the sleeve and the second surface faces the wafer to be cleaned.
Preferably, the second surface is provided with a plurality of injection holes.
Preferably, the second surface is circular.
Preferably, the plurality of spray holes are distributed on the second surface around a concentric circle.
Preferably, a sealed cavity is formed between the end of the sleeve and the nozzle body for containing the cleaning liquid sprayed from the nozzle body.
Preferably, the spray washing liquid is deionized water.
The embodiment of the utility model provides a wafer belt cleaning device's nozzle is the shower nozzle form to treating to wash the wafer at the nozzle orientation and being provided with a plurality of orifices on the surface, a plurality of orifices are the face and distribute, and a plurality of orifices enclose into the concentric circles and distribute promptly, can reduce the velocity of flow of washing liquid, help reducing the impact force to the wafer surface, effectively weaken the damage that high-speed liquid stream impacted the wafer surface and caused, thereby improve the yield and the reliability of product.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
FIG. 1 is a schematic diagram of a prior art wafer cleaning apparatus;
FIG. 2 is a schematic top view of the wafer cleaning apparatus of FIG. 1;
fig. 3 shows a schematic view of a wafer cleaning apparatus according to an embodiment of the present invention;
fig. 4 is a schematic top view of the wafer cleaning apparatus of fig. 3.
Detailed Description
Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by the same or similar reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale.
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples.
The term "above" as used herein means above the plane of the substrate, and may refer to the direct contact between the materials or the interval arrangement.
In the present application, the term "semiconductor structure" refers to the general term for the entire semiconductor structure formed in the various steps of manufacturing a memory device, including all layers or regions that have been formed. Numerous specific details of the invention, such as structure, materials, dimensions, processing techniques and techniques of the devices are described below in order to provide a more thorough understanding of the invention. However, as will be understood by those skilled in the art, the present invention may be practiced without these specific details.
The present invention may be presented in a variety of forms, some of which are described below.
Fig. 1 shows a schematic diagram of a wafer cleaning apparatus in the prior art. As shown in fig. 1, the wafer cleaning apparatus includes a delivery pipe 10 and a nozzle 20, wherein the nozzle 20 is disposed at one end of the delivery pipe 10, and the other end of the delivery pipe is connected to a flow valve, and the delivery pipe is used for delivering a cleaning solution, such as deionized water. When the wafer is cleaned, the wafer 30 to be cleaned is positioned below the nozzle 20, the nozzle 20 faces the surface to be cleaned of the wafer 30 to be cleaned, the wafer 30 to be cleaned rotates, and the cleaning solution spreads on the surface of the wafer by virtue of centrifugal force, so that the purpose of cleaning the whole surface of the wafer is achieved.
The nozzle 20 includes a nozzle body 21 and a sleeve 22 covering the nozzle body 21. A sealed chamber is formed between the end of the sleeve 22 and the nozzle body 21 for containing the cleaning liquid ejected from the nozzle body 21. The nozzle body 21 and the sleeve 22 are both cylindrical, as shown in fig. 2. The cleaning liquid is sprayed out from the nozzle under the pressure of high-pressure gas, and the nozzle body is a cylinder and is vertical to the surface of the wafer, so that the high-speed liquid column directly acts on the surface of the wafer to form strong pressure, and the wafer is easily damaged.
In order to effectively reduce the damage caused by the impact of the high-speed liquid flow on the surface of the wafer, thereby improving the yield and reliability of the product. The embodiment of the utility model provides an improve nozzle body 21.
Fig. 3 is a schematic view illustrating a wafer cleaning apparatus according to an embodiment of the present invention. As shown in fig. 3, the wafer cleaning apparatus includes a delivery pipe 10 and a nozzle 20, wherein the nozzle 20 is disposed at one end of the delivery pipe 10, and the other end of the delivery pipe is connected to a flow valve, and the delivery pipe is used for delivering a cleaning solution, such as deionized water (DIW). When the wafer is cleaned, the wafer 30 to be cleaned is positioned below the nozzle 20, the nozzle 20 faces the surface to be cleaned of the wafer 30 to be cleaned, the wafer 30 to be cleaned rotates, and the cleaning solution spreads on the surface of the wafer by virtue of centrifugal force, so that the purpose of cleaning the whole surface of the wafer is achieved.
The nozzle 20 includes a nozzle body 21 and a sleeve 22 covering the nozzle body 21. A sealed chamber is formed between the end of the sleeve 22 and the nozzle body 21 for containing the cleaning liquid sprayed from the showerhead. The sleeve 22 is a cylinder, the nozzle body 21 is a canopy head, the cross section of the nozzle body is trapezoidal along the vertical direction, the surface of the nozzle body 21 close to the sleeve 22 is a first surface 21a, the surface close to the wafer to be cleaned is a second surface 21b, and the size of the first surface is smaller than that of the second surface. The second surface 21b of the nozzle body 21 has a plurality of injection holes 211, and preferably, the second surface 21b is circular, and the plurality of injection holes 211 are distributed on the second surface 21b in a concentric circle.
The embodiment of the utility model provides a wafer belt cleaning device's nozzle is the shower nozzle form to treating at the nozzle orientation and wasing the wafer be provided with a plurality of orifices on the surface, a plurality of orifices are the face and distribute, can reduce the velocity of flow of washing liquid, help reducing the impact force to the wafer surface, effectively weaken the damage that high-speed liquid stream impacted the wafer surface and caused, thereby improve the yield and the reliability of product.
In the above description, the technical details of patterning, etching, and the like of each layer are not described in detail. It will be appreciated by those skilled in the art that layers, regions, etc. of the desired shape may be formed by various technical means. In addition, in order to form the same structure, those skilled in the art can also design a method which is not exactly the same as the method described above. In addition, although the embodiments are described separately above, this does not mean that the measures in the embodiments cannot be used in advantageous combination.
The embodiments of the present invention have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the present invention, and these alternatives and modifications are intended to fall within the scope of the present invention.
Claims (9)
1. The wafer cleaning device is characterized by comprising a conveying pipe and a nozzle, wherein the nozzle is arranged at one end of the conveying pipe, the other end of the conveying pipe is connected with a flow valve, and the nozzle is in a shower shape.
2. The wafer cleaning device according to claim 1, wherein the nozzle comprises a nozzle body and a sleeve sleeved outside the nozzle body, and the nozzle body is shaped like a shower.
3. The wafer cleaning apparatus according to claim 2, wherein the nozzle body has a trapezoidal cross section in the vertical direction.
4. The wafer cleaning apparatus of claim 3, wherein the nozzle body comprises a first surface and a second surface, wherein the first surface faces the sleeve and the second surface faces the wafer to be cleaned.
5. The wafer cleaning device according to claim 4, wherein the second surface is provided with a plurality of nozzles.
6. The wafer cleaning apparatus of claim 5, wherein the second surface is circular.
7. The wafer cleaning apparatus as claimed in claim 6, wherein the plurality of nozzles are distributed on the second surface in concentric circles.
8. The wafer cleaning apparatus according to claim 2, wherein a sealed chamber is formed between the end of the sleeve and the nozzle body for containing the cleaning liquid ejected from the nozzle body.
9. The apparatus of claim 8, wherein the cleaning solution is deionized water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020939483.2U CN212542361U (en) | 2020-05-29 | 2020-05-29 | Wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020939483.2U CN212542361U (en) | 2020-05-29 | 2020-05-29 | Wafer cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212542361U true CN212542361U (en) | 2021-02-12 |
Family
ID=74543820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020939483.2U Active CN212542361U (en) | 2020-05-29 | 2020-05-29 | Wafer cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212542361U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114904841A (en) * | 2022-04-15 | 2022-08-16 | 宁波晶钻科技股份有限公司 | Seed crystal cleaning equipment |
-
2020
- 2020-05-29 CN CN202020939483.2U patent/CN212542361U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114904841A (en) * | 2022-04-15 | 2022-08-16 | 宁波晶钻科技股份有限公司 | Seed crystal cleaning equipment |
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