CN212544348U - Liquid cooling radiator and power assembly - Google Patents
Liquid cooling radiator and power assembly Download PDFInfo
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- CN212544348U CN212544348U CN202020499903.XU CN202020499903U CN212544348U CN 212544348 U CN212544348 U CN 212544348U CN 202020499903 U CN202020499903 U CN 202020499903U CN 212544348 U CN212544348 U CN 212544348U
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Abstract
The utility model discloses a liquid cooling radiator and power component, wherein the liquid cooling radiator includes a plurality of radiator module of arranging in proper order, and radiator module includes that the lateral surface is the metal substrate of cooling surface and forms the plastic substrate of coolant liquid cavity with the metal substrate medial surface, and radiator module is equipped with water inlet and the delivery port with coolant liquid cavity intercommunication. In the liquid cooling radiator that this application provided, the radiating module comprises metal substrate and plastic substrate, because plastic construction is lighter, and then has alleviateed the total weight of liquid cooling radiator. Because the plastic substrate is arranged on the heat dissipation module, the plastic material has the insulating property, and the external electrified device can be directly arranged on the plastic substrate, so that the volume of the liquid cooling radiator provided with the electrified device is reduced, the insulation problem is solved, and the space utilization rate is improved.
Description
Technical Field
The utility model relates to a device heat dissipation technical field that generates heat, in particular to liquid cooling radiator. The utility model discloses still relate to a power component including above-mentioned liquid cooling radiator.
Background
For heat dissipation of a heating device, a liquid cooling radiator is a common method, and particularly, a heat conducting surface of a power module is generally attached to a heat dissipation module.
The liquid cooling radiator used by the traditional electric control product is complex in structure, mostly adopts a die casting process, and is low in heat conductivity coefficient.
Meanwhile, for conventional single-tube parallel products, a ceramic wafer is mostly placed between a transistor and a radiator, the transistor is tightly pressed by using an elastic clamp, the transistor can be in a pin-bent tiled layout or a double-sided radiating vertical layout, and the elastic sheet and the fixing thereof occupy more space.
Meanwhile, the conventional single-tube parallel connection, especially the high-power single-tube parallel connection product, needs to use a laminated bus to connect a transistor, a capacitor and a driving circuit board for current transmission of a main power loop. Because of the requirement of safety regulations, the laminated bus needs to be fixed on the insulating part and cannot be directly connected to the case, the part also occupies a certain space, the volume of the liquid cooling radiator provided with the electrified device is increased, and the weight of the liquid cooling radiator is larger because the whole single heat dissipation module is processed by the metal substrate.
Therefore, it is an urgent technical problem to be solved by those skilled in the art how to reduce the weight of the liquid-cooled heat sink and achieve direct connection with the charged device.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a liquid cooling radiator, the weight reduction of this liquid cooling radiator, and realize with electrified device lug connection. Another object of the present invention is to provide a power module including the above liquid cooling radiator.
In order to achieve the above object, the utility model provides a liquid cooling radiator, including a plurality of heat dissipation module of arranging in proper order, heat dissipation module is equipped with water inlet and delivery port, heat dissipation module include the lateral surface for the cooling surface the metal substrate and with the metal substrate medial surface forms the plastic substrate of coolant liquid cavity, the water inlet with the delivery port all with coolant liquid cavity intercommunication.
Preferably, one of the metal substrate and the plastic substrate is provided with a sealing groove, the other is provided with a sealing surface matched with the sealing groove, and a sealing ring attached to the sealing surface is arranged in the sealing groove.
Preferably, the sealing ring is arranged on the plastic substrate, and the plastic substrate and the sealing ring are of an integrally formed structure.
Preferably, the heat dissipation substrate of the metal substrate is of a flat plate structure, the inner surface of the heat dissipation substrate is a sealing surface, and the inner surface of the plastic substrate protrudes outwards to form a groove structure of the cooling liquid cavity.
Preferably, the inner surface of the metal substrate is provided with heat dissipation teeth extending into the cooling liquid cavity, and a flow channel is formed between every two adjacent heat dissipation teeth.
Preferably, the inner surface of the metal base plate is provided with a convex first groove body, the inner surface of the plastic base plate is provided with a convex second groove body, and the first groove body and the second groove body form a groove body structure of the cooling liquid cavity.
Preferably, the outer surface of the plastic substrate is provided with a power module limiting rib for limiting the power module and a heat conducting pad limiting rib for mounting a heat conducting gasket.
Preferably, the outer end face of the plastic substrate is provided with a power module pin shaping groove for the power module pin to pass through.
Preferably, two adjacent plastic substrates are detachably connected, and the metal substrate is recessed in the cavity of the plastic substrate.
Preferably, the both ends that plastic substrate's the dorsad set up all are equipped with latch device, latch device includes fixed buckle of intergroup and intergroup fixed slot, adjacent two fixed buckle of intergroup and intergroup fixed slot joint on the plastic substrate.
Preferably, still including setting up the heat conduction insulating mattress of metal substrate surface, the surface of plastic substrate is equipped with and is used for the installation the spacing muscle of heat conduction mattress of heat conduction insulating mattress, be equipped with on the surface tip axial of metal substrate with the groove of stepping down of plastic substrate side isolation, the periphery of heat conduction insulating mattress evaginate in the surface of metal substrate.
Preferably, the plastic substrate is provided with a mounting portion for externally connecting a charged device.
Preferably, the metal substrate is an aluminum plate.
A power assembly comprises a liquid cooling radiator and a power module, wherein the liquid cooling radiator is any one of the liquid cooling radiators, and the power module is installed between every two adjacent radiating modules.
Preferably, the plastic substrate comprises a laminated bus and a circuit board, wherein the laminated bus is clamped and connected with the plastic substrate through a laminated bus fixing buckle and a circuit board fixing buckle used for clamping and connecting the circuit board.
In the technical scheme, the utility model provides a liquid cooling radiator includes a plurality of radiator module who arranges in proper order, and radiator module includes that the lateral surface is the metal substrate of cooling surface and forms the plastic substrate of coolant liquid cavity with the metal substrate medial surface, and radiator module is equipped with the water inlet and the delivery port with coolant liquid cavity intercommunication.
As can be seen from the above description, in the liquid cooling radiator provided by the present application, the heat dissipation module is composed of the metal substrate and the plastic substrate, and the plastic structure is lighter, so that the total weight of the liquid cooling radiator is reduced. Meanwhile, the plastic substrate is arranged on the heat dissipation module, and the external electrified device can be directly installed on the plastic substrate, so that the size of the liquid cooling radiator provided with the electrified device is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural view of a plastic substrate of a first liquid-cooled heat sink according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a metal substrate of a first liquid-cooled heat sink according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a power assembly using a first liquid-cooled heat sink according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a plastic substrate of a second liquid-cooled heat sink according to an embodiment of the present invention;
fig. 5 is a schematic structural view of a metal substrate of a second liquid-cooled heat sink according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a power assembly using a second liquid-cooled heat sink according to an embodiment of the present invention;
fig. 7 is a cross-sectional view of a power assembly using a second liquid-cooled heat sink according to an embodiment of the present invention;
fig. 8 is an exploded view of a power module using a second liquid-cooled heat sink according to an embodiment of the present invention;
fig. 9 is a diagram of a power module of a second liquid-cooled heat sink according to an embodiment of the present invention;
fig. 10 is a partial schematic view of a power module according to an embodiment of the present invention;
FIG. 11 is an exploded view of the power assembly shown in FIG. 10;
fig. 12 is an exploded view of the power module according to an embodiment of the present invention.
Wherein in FIGS. 1-12:
1. a metal substrate; 1-1, radiating teeth; 1-2, mounting holes; 1-3, fixing holes; 1-4, sealing surface; 1-5, a heat dissipation surface; 1-6, an abdicating groove;
2. a plastic substrate; 2-1, a cooling liquid cavity; 2-2, a water conveying pipeline; 2-3, sealing grooves; 2-4, power module limiting ribs; 2-5, heat conducting pad limiting ribs; 2-6, forming a groove for pins of the power module; 2-7, fixing a buckle between the groups; 2-8, fixing a clamping groove between the groups; 2-9, fixing the buckle by the laminated bus; 2-10, fixing a buckle on the circuit board;
3. a power module;
4. a thermally conductive insulating pad;
5. an end face plastic substrate;
6. a laminated bus bar; 6-1, laminated bus fixing holes;
7. a circuit board; 7-1 and a circuit board fixing hole.
Detailed Description
The core of the utility model is to provide a liquid cooling radiator, the weight reduction of this liquid cooling radiator, and realize with electrified device lug connection. Another object of the present invention is to provide a power module including the above liquid cooling radiator.
In order to make those skilled in the art better understand the technical solution of the present invention, the present invention will be further described in detail with reference to the accompanying drawings and embodiments.
Please refer to fig. 1 to 12.
In a specific implementation manner, the utility model discloses liquid cooling radiator that specific embodiment provided, including a plurality of heat dissipation module who arranges in proper order, heat dissipation module is equipped with water inlet and delivery port, and is preferred, and water inlet and delivery port set up respectively at heat dissipation module's both ends. The heat dissipation module comprises a metal substrate 1 with a heat dissipation surface 1-5 on the outer side surface and a plastic substrate 2 forming a cooling liquid cavity 2-1 with the inner side surface of the metal substrate 1, and a water inlet and a water outlet are communicated with the cooling liquid cavity 2-1. Specifically, the metal substrate 1 is preferably an aluminum plate. The aluminum plate can be formed by die casting, and in order to improve the thermal conductivity, the aluminum plate is preferably formed by extrusion or cold forging.
Wherein the water inlet and the water outlet of each heat dissipation module are aligned with the same positions of the adjacent heat dissipation modules and are sealed by a sealing ring or a rubber part integrated with the plastic substrate 2.
The plastic substrate 2 and the metal substrate 1 on the same heat dissipation module can be connected into a whole by welding or screws. When the metal substrate 1 is locked by the screw, the metal substrate 1 is provided with fixing holes 1-3 for the screw to pass through, and the screw is screwed into the plastic substrate 2 to fix the metal substrate 1 and the plastic substrate 2.
In a specific embodiment, the plastic substrate 2 is provided with water pipes 2-2 at two opposite ends, and the mounting hole 102 of the metal substrate 1 is sleeved on the outer steps of the water pipes 2-2. Note that, when combined, the surface of the plastic substrate 2 located at the outermost edge, which is away from the metal substrate 1, is the end surface plastic substrate 5 without an opening. The water conveying pipeline 2-2 on the plastic substrate 2 at the middle position is a pipeline with through holes at two ends.
The outer wall of the water pipeline 2-2 is sleeved with a sealing ring, then the metal substrate 1 is sleeved, the water pipelines 2-2 of the plurality of radiating modules are sequentially connected, and then the liquid cooling radiator shown in the figures 3 and 9 can be formed, and the sealing performance of the connecting position is improved through the sealing ring. Preferably, the gasket is integrally formed with the plastic base plate 2.
As can be seen from the above description, in the liquid-cooled heat sink provided in the embodiments of the present application, the heat dissipation module is composed of the metal substrate 1 and the plastic substrate 2, and the overall weight of the liquid-cooled heat sink is reduced due to the lighter plastic structure.
Meanwhile, the plastic substrate is arranged on the heat dissipation module, the plastic material has self insulating performance, and an external electrified device can be directly installed on the plastic substrate, so that the size of the liquid cooling radiator provided with the electrified device is reduced, the insulation problem is solved, and the space utilization rate is improved.
In order to facilitate external connection of the charged device, the plastic substrate 2 is provided with a mounting portion for external connection of the charged device. Specifically, the mounting portion may be a snap structure.
This application adopts the liquid cooling radiator that adopts 2 plastic substrate and 1 integrated configuration of metal substrate, and the structure is more nimble, can the independent assortment, satisfies the demand of different power section products.
As shown in fig. 1 and 2, one of the metal substrate 1 and the plastic substrate 2 is provided with a sealing groove 2-3, the other is provided with a sealing surface 1-4 matched with the sealing groove 2-3, and a sealing ring attached to the sealing surface 1-4 is arranged in the sealing groove 2-3, so that the attachment position sealing of the metal substrate 1 and the plastic substrate 2 is realized. Of course, one of the metal substrate 1 and the plastic substrate 2 is provided with a limiting groove, and the other is provided with a limiting protrusion clamped in the limiting groove.
Specifically, the sealing ring and the plastic substrate 2 can be of a rubber-plastic integrated structure, the assembly process is simplified, the sealing ring at the joint of the plastic substrate 2 and the metal substrate 1 in the same group of radiator assemblies can be omitted, and the metal substrate 1 and the plastic substrate 2 are connected into a whole to form the radiating module by adopting ultrasonic welding or other welding processes.
As shown in fig. 2, the heat dissipation substrate of the metal substrate 1 may be a flat plate structure, the inner surface of the heat dissipation substrate is a sealing surface 1-4, and the inner surface of the plastic substrate 2 protrudes outward to form a groove structure of the cooling liquid cavity 2-1. Specifically, a sealing ring can be arranged in the groove body. The die casting process can be used for manufacturing a complex metal structure, but the material has low heat conductivity coefficient, and the heat dissipation effect of the formed radiator is poor. The heat dissipation substrate is made into a flat plate structure, which is similar to the section form of an air cooling radiator, and then the metal substrate 1 can be processed by using 6 series aluminum alloy with higher heat conductivity, as shown in fig. 1-3. Meanwhile, for the metal substrate 1 with slightly higher structural shape requirement, a forging process can be adopted, and 3-series aluminum alloy is used for manufacturing the substrate with characteristics on only the upper surface and the lower surface, and the metal substrate has higher heat-conducting property as shown in fig. 4-12.
Meanwhile, due to the adoption of the plastic structure, the characteristics of the metal substrate 1 are simplified, so that the metal substrate can be designed into a structure meeting the extrusion or cold forging process, and the heat dissipation capability is improved.
Specifically, the sealing washer sets up on plastic substrate 2, and plastic substrate 2 and sealing washer are integrated into one piece structure, and the sealing washer can be rubber structure, because both integrated into one piece, is convenient for wholly assemble.
In order to improve the heat dissipation effect, preferably, the inner surface of the metal substrate 1 is provided with heat dissipation teeth 1-1 extending into the cooling liquid cavity 2-1, and a flow channel is formed between two adjacent heat dissipation teeth 1-1. Specifically, the heat dissipation teeth 1-1 are positioned between the water inlet and the water outlet, and after the metal substrate 1 is processed, two ends of the heat dissipation teeth 1-1 can be machined and removed.
In another embodiment, the inner surface of the metal base plate 1 is provided with a convex first groove body, the inner surface of the plastic base plate 2 is provided with a convex second groove body, and the first groove body and the second groove body form a groove body structure of the cooling liquid cavity 2-1. That is, the metal substrate 1 is provided with a liquid cooling cavity, and is not suitable for an extrusion process, but can be formed by a process such as die casting or cold forging. The plastic substrate 2 is also provided with a liquid cooling cavity, the metal substrate 1 is wrapped inside, and the two binding surfaces can adopt end surface or radial sealing according to the requirement.
Specifically, the outer surface of the plastic substrate 2 is provided with a plurality of power module limiting ribs 2-4 for limiting the power modules, the power module limiting ribs 2-4 are preferably arranged in a plurality, and the plurality of power module limiting ribs 2-4 are uniformly distributed on one side of the power modules to realize the mounting limitation of the power modules.
In one embodiment, the outer end surface of the plastic substrate 2 is provided with power module pin shaping grooves 2-6 through which the power module pins pass. The pins of the power module are limited by shaping, the pins of the power module arranged on the plastic substrate 2 can be shaped, size control of subsequent procedures (such as welding) is facilitated, and the pins of the power module are accurately positioned by the shaping grooves 2-6 of the pins of the power module, so that welding processing of the module is facilitated.
In order to facilitate the disassembly and assembly of the liquid cooling radiator, the two adjacent plastic substrates 2 are detachably connected, and the metal substrate 1 is inwards concave in the cavity of the plastic substrate 2.
Preferably, the two ends of the plastic substrate 2, which are arranged back to the back, are provided with clamping devices, each clamping device comprises an inter-group fixing buckle 2-7 and an inter-group fixing clamping groove 2-8, and the inter-group fixing buckles 2-7 and the inter-group fixing clamping grooves 2-8 on two adjacent plastic substrates 2 are clamped. Specifically, the arrangement direction of the heat dissipation modules, the inter-group fixing buckles 2-7 and the inter-group fixing clamping grooves 2-8 are preferably arranged in a straight line.
The inter-group fixing buckles 2-7 and the inter-group fixing clamping grooves 2-8 arranged on one plastic substrate 2 are respectively matched with the inter-group fixing clamping grooves 2-8 and the inter-group fixing buckles 2-7 on the adjacent plastic substrates 2, so that the adjacent heat dissipation modules can be connected into a whole. The whole liquid cooling radiator is connected through the buckle, so that the problem of fixing parts is solved, the using amount of screws and the operation time are saved, and the expansibility is strong.
In order to improve the assembly stability, it is preferable that the plastic base plate 2 has at least two clamping devices at the same end.
In order to improve the assembly efficiency, the plastic substrate 2 is preferably formed integrally.
The liquid cooling radiator further comprises a heat conduction insulating pad 4 arranged on the outer surface of the metal substrate 1, heat conduction pad limiting ribs 2-5 used for mounting the heat conduction insulating pad 4 are arranged on the outer surface of the plastic substrate 2, abdicating grooves 1-6 isolated from the side face of the plastic substrate 2 are axially arranged at the end part of the outer surface of the metal substrate 1, and the periphery of the heat conduction insulating pad 4 protrudes out of the outer surface of the metal substrate 1. Specifically, when the combined liquid cooling radiator is assembled, the inter-group fixing buckles 2-7 are embedded into the inter-group fixing clamping grooves 2-8 of the adjacent plastic substrates 2, so that the two groups of radiating modules are connected into a whole, and the power module 3 and the heat-conducting insulating pad 4 between the two groups of radiating modules are simultaneously pressed.
The plastic substrate 2 solves the problems of compression of the power module and the heat-conducting insulating pad 4 and insulation between the bus and the metal heat-radiating substrate, saves elastic sheets for clamping the power module and insulating parts for fixing the bus, and has a more compact overall structure. Meanwhile, compared with a conventional die-casting radiator, the radiating capacity of raw materials is greatly improved, and the radiating performance of the module can be effectively improved.
The edge of the heat dissipation surface 1-5 of the metal substrate 1 and the plastic substrate 2 are provided with the abdication groove 1-6, the length of the heat conduction and insulation pad 4 exceeds the length of the heat dissipation surface 1-5, the distance from the power module 3 to the metal substrate 1 is ensured to meet the safety regulation requirement, and the creepage distance from the metal substrate 1 to the top of the plastic substrate 2 is increased.
The application provides an in liquid cooling radiator metal substrate simple structure, the processing degree of difficulty is low, and optional processing technology and different performance's material variety are various, are applicable to under the different application occasions to the comprehensive demand of heat dissipation, structure and cost (can select 6 systems that coefficient of heat conductivity is higher, or 3 systems aluminum alloy, and the improvement of more conventional die-casting aluminum alloy heat-sinking capability is nearly one time).
The application provides a power component, including liquid cooling radiator and power module 3, wherein, the liquid cooling radiator is any kind of liquid cooling radiator of above-mentioned. The foregoing describes a specific structure of the liquid-cooled heat sink, and the present application includes the liquid-cooled heat sink, which also has the above technical effects.
Between adjacent heat dissipation modules, the power module 3 is pressed on the metal substrate 1 (or the heat conduction insulating pad 4 tightly attached to the metal substrate 1) through the plastic substrate 2.
In a specific embodiment, the power assembly further comprises a laminated bus bar 6 and a circuit board 7, wherein the laminated bus bar 6 comprises a direct current positive electrode, a direct current negative electrode and an alternating current copper plate, and a laminated bus bar fixing hole 6-1 is formed in the alternating current copper plate. The edge of the circuit board 7 is provided with a circuit board fixing hole 7-1. The laminated bus bar 6 and/or the circuit board 7 are attached to the plastic substrate 2 by means of screws or snaps or the like. Specifically, the plastic substrate 2 comprises laminated bus fixing buckles 2-9 for clamping the laminated bus 6 and circuit board fixing buckles 2-10 for clamping the circuit board 7, wherein the laminated bus fixing buckles 2-9 and the circuit board fixing buckles 2-10 are used as installation parts of the plastic substrate 2 and are integrally formed with the plastic substrate 2. Through the laminated bus fixing buckles 2-9 and the circuit board fixing buckles 2-10, insulation problems among the transistor pins, the laminated bus 6 and the liquid cooling radiator are not worried, an elastic device for compressing the power module can be omitted, the space utilization rate of the power module is greatly improved, and the power density of the module is improved.
The power module 3 is arranged on the plastic substrate 2, and one side of the power module is attached to the radiating surfaces 1-5 of the metal substrate 1 through the heat-conducting insulating pad 4, because the power module 3 is directly attached to the radiator, the requirement of the module on the length of a transistor pin is reduced, the power module can be compatible with a transistor with a shorter pin length, and the application range of a product is expanded.
According to the single-tube parallel module power expansion method and device, different numbers of radiator assemblies can be combined according to requirements, and the power expansion of the single-tube parallel module is improved.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (15)
1. The utility model provides a liquid cooling radiator, includes a plurality of radiating module who arranges in proper order, radiating module is equipped with water inlet and delivery port, its characterized in that, radiating module include the lateral surface be cooling surface (1-5) metal substrate (1) and with metal substrate (1) medial surface forms plastic substrate (2) of coolant liquid cavity (2-1), the water inlet with the delivery port all with coolant liquid cavity (2-1) intercommunication.
2. A liquid-cooled heat sink according to claim 1, characterized in that one of the metal substrate (1) and the plastic substrate (2) is provided with a sealing groove (2-3) and the other is provided with a sealing surface (1-4) cooperating with the sealing groove (2-3), and a sealing ring abutting against the sealing surface (1-4) is provided in the sealing groove (2-3).
3. The liquid cooled heat sink of claim 2, wherein said sealing ring is disposed on said plastic substrate (2), said plastic substrate (2) and said sealing ring being of an integrally formed construction.
4. The liquid-cooled heat sink as claimed in claim 1, wherein the heat-dissipating substrate of the metal substrate (1) is a flat plate structure, the inner surface of the heat-dissipating substrate is a sealing surface (1-4), and the inner surface of the plastic substrate (2) protrudes outward to form a groove structure of the cooling liquid cavity (2-1).
5. The liquid-cooled heat sink of claim 1, wherein the inner surface of the metal substrate (1) is provided with heat dissipation teeth (1-1) extending into the cooling liquid cavity (2-1), and a flow channel is formed between two adjacent heat dissipation teeth (1-1).
6. The liquid-cooled heat sink as claimed in claim 1, wherein the inner surface of the metal base plate (1) is provided with a first groove body protruding outwards, the inner surface of the plastic base plate (2) is provided with a second groove body protruding outwards, and the first groove body and the second groove body form a groove body structure of the cooling liquid cavity (2-1).
7. A liquid-cooled heat sink according to claim 1, characterised in that the outer surface of the plastic substrate (2) is provided with power module retaining ribs (2-4) for retaining the power module (3).
8. A liquid-cooled heat sink according to claim 1, characterised in that the outer end surface of the plastic substrate (2) is provided with power module pin shaping grooves (2-6) for the power module pins to pass through.
9. The liquid-cooled heat sink of claim 1, wherein two adjacent plastic substrates (2) are detachably connected, and the metal substrate (1) is recessed in a cavity of the plastic substrates (2).
10. The liquid cooling radiator of claim 9, wherein clamping devices are arranged at two ends of the plastic substrate (2) facing away from the liquid cooling radiator, each clamping device comprises an inter-group fixing buckle (2-7) and an inter-group fixing clamping groove (2-8), and the inter-group fixing buckles (2-7) and the inter-group fixing clamping grooves (2-8) on two adjacent plastic substrates (2) are clamped.
11. The liquid cooling radiator of claim 1, further comprising a heat conducting insulating pad (4) disposed on the outer surface of the metal substrate (1), wherein the outer surface of the plastic substrate (2) is provided with heat conducting pad limiting ribs (2-5) for mounting the heat conducting insulating pad (4), the end portion of the outer surface of the metal substrate (1) is axially provided with a yielding groove (1-6) isolated from the side surface of the plastic substrate (2), and the periphery of the heat conducting insulating pad (4) protrudes outwards from the outer surface of the metal substrate (1).
12. A liquid-cooled heat sink according to claim 1, wherein the plastic substrate (2) is provided with a mounting portion for external connection of an electrically charged device.
13. A liquid-cooled heat sink according to any one of claims 1-12, characterised in that the metal substrate (1) is an aluminium plate.
14. A power assembly comprising a liquid-cooled heat sink and a power module (3), wherein the liquid-cooled heat sink is as claimed in any one of claims 1 to 13, and the power module (3) is mounted between two adjacent heat dissipating modules.
15. The power assembly according to claim 14, further comprising a laminated busbar (6) and a circuit board (7), wherein the plastic substrate (2) comprises laminated busbar fixing clips (2-9) for clipping the laminated busbar (6) and circuit board fixing clips (2-10) for clipping the circuit board (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020499903.XU CN212544348U (en) | 2020-04-08 | 2020-04-08 | Liquid cooling radiator and power assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020499903.XU CN212544348U (en) | 2020-04-08 | 2020-04-08 | Liquid cooling radiator and power assembly |
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| Publication Number | Publication Date |
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| CN212544348U true CN212544348U (en) | 2021-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020499903.XU Active CN212544348U (en) | 2020-04-08 | 2020-04-08 | Liquid cooling radiator and power assembly |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113097079A (en) * | 2021-03-31 | 2021-07-09 | 光华临港工程应用技术研发(上海)有限公司 | Method for manufacturing power semiconductor module |
| WO2023141769A1 (en) * | 2022-01-25 | 2023-08-03 | 华为数字能源技术有限公司 | Packaging device, power module, and electronic device |
-
2020
- 2020-04-08 CN CN202020499903.XU patent/CN212544348U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113097079A (en) * | 2021-03-31 | 2021-07-09 | 光华临港工程应用技术研发(上海)有限公司 | Method for manufacturing power semiconductor module |
| CN113097079B (en) * | 2021-03-31 | 2023-11-17 | 光华临港工程应用技术研发(上海)有限公司 | Manufacturing method of power semiconductor module |
| WO2023141769A1 (en) * | 2022-01-25 | 2023-08-03 | 华为数字能源技术有限公司 | Packaging device, power module, and electronic device |
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