CN212458062U - Heat superconducting heat transfer plate and heat sink - Google Patents
Heat superconducting heat transfer plate and heat sink Download PDFInfo
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- CN212458062U CN212458062U CN202020514523.9U CN202020514523U CN212458062U CN 212458062 U CN212458062 U CN 212458062U CN 202020514523 U CN202020514523 U CN 202020514523U CN 212458062 U CN212458062 U CN 212458062U
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Abstract
The utility model provides a heat superconducting heat transfer plate and radiator, include: a heat-dissipating substrate and a thermal superconducting heat transfer plate; the heat superconducting heat transfer plate comprises a heat conduction plate with a composite plate type structure, a heated area positioned on one side edge of the heat conduction plate, and a condensation heat dissipation and isolation blocking area positioned on the surface of the heat conduction plate; the condensation heat dissipation and isolation blocking areas are sequentially arranged from top to bottom at intervals, and the condensation heat dissipation area is positioned above the condensation heat dissipation area; a heat dissipation pipeline is formed in each condensation heat dissipation area, the heat dissipation pipelines of the condensation heat dissipation areas are connected to form a through closed pipeline, and a heat transfer medium is filled in the closed pipeline; the extending direction of each isolation blocking area is oblique to the side edge of the heat conducting plate, and one end close to the heated area is lower than one end far away from the heated area. The utility model discloses can solve because of the heat source position difference and the high temperature phenomenon that leads to, can also solve a plurality of heating power device's heat dissipation problem simultaneously and avoid appearing local high temperature phenomenon, improve the radiating efficiency and the heat-sinking capability of whole radiator.
Description
Technical Field
The utility model relates to a heat dissipation technical field especially relates to a heat superconducting heat transfer plate and radiator.
Background
Along with the rapid development of the 5G communication technology, the integration level of power components is higher and higher, the power density is higher and higher, and the traditional aluminum radiator can not meet the heat dissipation requirement of 5G communication base station equipment.
The heat superconducting heat transfer technology comprises a phase change heat transfer technology which is characterized in that a working medium is filled in a closed and mutually communicated micro-channel system and the heat superconducting heat transfer is realized through the evaporation and condensation phase change of the working medium; or the phase change suppression (PCI) heat transfer technology of high-efficiency heat transfer is realized by controlling the microstructure state of the working medium in a closed system, namely, the boiling of the liquid medium (or the condensation of the gaseous medium) is suppressed in the heat transfer process, and the consistency of the microstructure of the working medium is achieved on the basis. Due to the rapid heat conduction characteristic of the heat superconducting technology, the equivalent heat conduction coefficient can reach more than 4000W/m ℃, and the temperature equalization of the whole heat superconducting heat transfer plate can be realized.
The heat superconducting fin radiator is formed by using heat superconducting heat transfer plates as radiating fins, and mainly comprises a radiator base plate and a plurality of heat superconducting heat transfer plates arranged on the radiator base plate, wherein a heat source is arranged on the other plane of the radiator base plate. The heat of the heat source is conducted to the plurality of radiating fins through the substrate, and then is radiated to the surrounding environment through the radiating fins. The heat superconducting heat transfer plate is of a thin plate structure, so that the heat conduction rate is high, the size is small, the weight is light, the fin efficiency is high, and the fin efficiency is not changed along with the height of the fin, so that the heat superconducting heat transfer plate is widely applied to heat dissipation of 5G base station equipment.
At present, the structure of a heat superconducting heat transfer plate on a 5G base station equipment radiator is shown in figures 1 and 2, most of the heat superconducting heat transfer plate adopts a hexagonal honeycomb pipeline 11 structure, and the filling amount of a heat transfer working medium 12 is generally smaller than the total volume of the hexagonal honeycomb pipeline 11. Because the radiator is vertically installed for use and is influenced by gravity, the heat transfer working medium 12 is mainly concentrated in the lower space of the heat superconducting heat transfer plate, when the filling amount is too low (as shown in figure 1), a working medium-free area can be formed at the upper part of the heat superconducting heat transfer plate, and the heat of the heat source 13 at the upper part of the radiator can not be conducted through the heat transfer working medium in the heat superconducting heat transfer plate, so that the local heat source is high in temperature. In order to solve the problem of high temperature of the upper heat source 13, the charging amount of the heat transfer working medium 12 can be increased (as shown in fig. 2), the lower heat source 13 of the heat superconducting heat transfer plate is long in starting time and large in bottom thermal resistance due to the influence of gravity, the heat source 13 positioned on the upper part of the radiator is high in temperature, the temperature difference between the upper part and the lower part of the heat superconducting heat transfer plate is large, the effect of the radiator is poor, and the like, and the heating device is easily damaged.
Therefore, it is one of the problems to be solved by those skilled in the art how to solve the problems of high temperature of the local heat source, large temperature difference between the upper portion and the lower portion of the thermal superconducting heat transfer plate, and poor heat sink effect.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a heat superconducting heat transfer plate and a heat sink, which are used for solving the problems of high temperature of local heat source, large temperature difference between the upper part and the lower part of the heat superconducting heat transfer plate, poor effect of the heat sink, etc. in the prior art.
To achieve the above and other related objects, the present invention provides a thermal superconducting heat transfer plate, comprising at least:
the heat conducting plate is of a composite plate type structure and comprises a heated area, at least two condensation heat dissipation areas and isolation blocking areas, wherein the heated area is positioned at one side edge of the heat conducting plate, and the isolation blocking areas correspond to the condensation heat dissipation areas;
the condensation heat dissipation areas and the isolation blocking areas are sequentially arranged from top to bottom at intervals, and each condensation heat dissipation area is positioned above the corresponding isolation blocking area;
the heat-conducting plate of each condensation heat-dissipation area is internally provided with a heat-dissipation pipeline, the heat-dissipation pipelines of each condensation heat-dissipation area are connected through heat-dissipation pipelines positioned at two sides of the isolation blocking area to form a through closed pipeline, and the closed pipeline is filled with a heat-transfer medium;
the extending direction of each isolation blocking area is oblique to the side edge of the heat conducting plate, and one end, close to the heated area, of each isolation blocking area is lower than one end, far away from the heated area, of each isolation blocking area.
Optionally, the thermal superconducting heat transfer plate further comprises a non-pipe blank region disposed in the at least one condensation heat dissipation region.
More optionally, the non-pipe blank area is far away from the heated area side.
Optionally, the heat dissipation pipeline of each condensation heat dissipation area is in a shape of a hexagonal honeycomb, a circular honeycomb, a quadrilateral honeycomb, a plurality of U-shapes connected in series end to end, a diamond shape, a triangle, a circular ring shape, a criss-cross mesh, or any combination of more than one of the above.
Optionally, the filling amount of the heat transfer working medium is 20-70% of the volume of the closed pipeline.
Optionally, the heat conducting plate of the heated region is of a folded edge structure.
More optionally, the heat conducting plate is a phase change suppression heat dissipating plate or a phase change heat dissipating plate.
More optionally, the position of each condensation heat dissipation area corresponds to the installation position of each heat source; the lower end of each isolation blocking area is not higher than the lower end of the corresponding heat source and is not lower than the upper end of the heat source below the corresponding heat source.
To achieve the above and other related objects, the present invention also provides a heat sink, comprising at least:
a heat-dissipating substrate and a plurality of the thermal superconducting heat transfer plates;
grooves which are arranged at intervals are arranged on the first surface of the heat dissipation substrate, the heated areas of the heat superconducting heat transfer plates are inserted into the grooves in a one-to-one correspondence mode, and the heat superconducting heat transfer plates extend in the vertical direction;
and a heat source pasting area is arranged on the second surface of the heat dissipation substrate.
Optionally, a sintered wick heat pipe is embedded in the heat dissipation substrate.
Optionally, the first surface is disposed opposite the second surface.
As described above, the utility model discloses a heat superconducting heat transfer plate and radiator has following beneficial effect:
the heat superconducting heat transfer plate of the utility model is provided with a non-pipeline isolation blocking area with an inclination angle along the direction from the fin root to the fin top at the height near the heat source, steam at the part above the isolation blocking area is condensed and then flows back to the isolation blocking area, and a certain amount of liquid accumulation is formed near the heat source; therefore, the high-temperature phenomenon caused by the fact that heat cannot be conducted out due to different positions of the heat source can be solved.
The utility model discloses a radiator adopts above-mentioned heat superconducting heat transfer plate, fixes on the heat dissipation base plate through connecting, welding, expanding joint and connected modes such as cogs, constitutes the radiator that is used for communication base station equipment or power supply unit to solve the heat dissipation problem of a plurality of heating power devices and avoid appearing local high temperature phenomenon, improve the radiating efficiency and the heat-sinking capability of whole radiator.
Drawings
Fig. 1 shows a schematic diagram of a high temperature of a local heat source of a heat superconducting heat transfer plate in the prior art.
Fig. 2 is a schematic diagram showing the principle of the heat dissipation effect of the prior art, in which the temperature difference between the upper portion and the lower portion of the heat superconducting heat transfer plate is large.
Fig. 3 is a schematic view showing a structure of a thermal superconducting heat transfer plate according to the present invention.
Fig. 4 is a schematic view showing another structure of the heat transfer plate for thermal superconducting according to the present invention.
Fig. 5 is a partial enlarged schematic view of a thermal superconducting heat transfer plate according to a second embodiment of the present invention.
Fig. 6 is a schematic view showing still another structure of the heat transfer plate for thermal superconducting according to the present invention.
Fig. 7 is a schematic structural diagram of the heat sink of the present invention.
Fig. 8 is a partially enlarged schematic view illustrating the connection between the heat superconducting heat transfer plate and the heat dissipation substrate in the heat sink according to the present invention.
Description of the element reference numerals
11 hexagonal honeycomb pipeline
12 Heat transfer working fluid
13 Heat source
2 heat superconducting heat transfer plate
21 heat conducting plate
211 heated region
212 condensation heat dissipation area
213 isolation blocking area
213a Main isolation blocking area
213b Secondary isolation blocking area
214 non-conduit blank area
22 heat radiation pipeline
23 Heat transfer working Medium
3 Heat dissipation substrate
4 heat source
4a main heat source
4b secondary heat source
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
Please refer to fig. 3 to 8. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the invention in a schematic manner, and only the components related to the invention are shown in the drawings rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, quantity and proportion of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.
Example one
As shown in fig. 3, the present embodiment provides a thermal superconducting heat transfer plate 2, the thermal superconducting heat transfer plate 2 including:
a heat conducting plate 21, wherein the heat conducting plate 21 comprises a heated area 211 positioned at one side edge of the heat conducting plate 21, at least two condensation heat-dissipation areas 212 positioned on the surface of the heat conducting plate 21 and an isolation blocking area 213 corresponding to each condensation heat-dissipation area 212; wherein, each condensation heat dissipation area 212 and each isolation blocking area 213 are arranged from top to bottom at intervals in sequence, and each condensation heat dissipation area 212 is positioned above the corresponding isolation blocking area 213; the heat-conducting plate of each condensation heat-dissipation area 212 is formed with a heat-dissipation pipeline 22, the heat-dissipation pipelines 22 of each condensation heat-dissipation area 212 are connected by heat-dissipation pipelines positioned at two sides of the isolation blocking area 213 to form a through closed pipeline, and the closed pipeline is filled with a heat-transfer working medium 23; the extending direction of each isolation blocking area 213 is oblique to the side of the thermal conductive plate 21, and one end of each isolation blocking area 213 near the heated area 211 is lower than one end far away from the heated area 211.
As shown in fig. 3, the heat conducting plate 21 is a composite plate structure. The heat conducting plate 21 includes at least two layers of plates, and the number of the plates can be set according to actual needs, which is not described herein. As an example, the heat conducting plate 21 achieves heat transfer based on a thermal superconducting heat transfer technology; one heat superconducting technology is a phase-change heat transfer technology in which the heat transfer working medium is filled in a sealed and mutually communicated micro-channel system (i.e., the heat dissipation pipeline 22 in this embodiment), and heat superconducting heat transfer is realized through evaporation or condensation phase change of the heat transfer working medium; the other heat superconducting technology is a phase transition suppression (PCI) heat transfer technology which realizes high-efficiency heat transfer by the state of the heat transfer working medium microstructure in a micro-channel system, namely boiling of the liquid heat transfer working medium (or condensation of the gaseous heat transfer working medium) is suppressed in the heat transfer process, and the consistency of the heat transfer working medium microstructure is achieved on the basis.
As shown in fig. 3, one side edge of the heat-conducting plate 21 is a heated area 211, and in this embodiment, the heated area 211 is located at the left side edge of the heat-conducting plate 21. As an example, the heated region 211 is a folded edge structure, and in practical use, the structure of the heated region 211 is not limited, and heat conduction can be achieved.
As shown in fig. 3, a condensation heat dissipation area 212 and an isolation blocking area 213 are disposed on the surface of the heat conducting plate 21, and the condensation heat dissipation area 212 and the isolation blocking area 213 are spaced from top to bottom, and in this embodiment, include two condensation heat dissipation areas 212 and two isolation blocking areas 213.
Specifically, the heat conducting plate 21 of the condensation heat dissipation area 212 is formed with a heat dissipation pipeline 22, the heat dissipation pipeline 22 is a pipeline formed by a protrusion of a plate located on the outer side in the composite plate type structure, and the heat dissipation pipeline 22 may be prepared by a single-sided inflation or double-sided inflation process, which is not repeated herein. The shape of the heat dissipation pipeline 22 in the condensation heat dissipation area 212 includes, but is not limited to, hexagonal honeycomb, circular honeycomb, quadrilateral honeycomb, a plurality of U-shapes connected end to end in series, diamond, triangle, circular ring, criss-cross mesh, or any combination of more than one of them, in this embodiment, hexagonal honeycomb is used. As an example, as shown in fig. 3, the length of the condensation heat dissipation area 212 in the vertical direction on the side close to the heat receiving area 211 is covered (corresponding to the position and having a large length value) or substantially covered (corresponding to the position and having a large length value) with respect to the length of the area where the heat source 4 (the heat source is used for explaining the principle of the heat superconducting heat transfer plate of the present embodiment and is not included in the heat superconducting heat transfer plate) is located in the vertical direction.
Specifically, the isolation blocking area 213 is disposed below the corresponding condensation heat dissipation area 212, and the isolation blocking area 213 is used to block the upper and lower connections between the heat dissipation pipes 22, it should be noted that the isolation blocking area 213 does not completely block the connections between the heat dissipation pipes 22, and the heat dissipation pipes in different condensation heat dissipation areas 212 can still be connected through the pipes at the two ends of the isolation blocking area 213. As an example, the isolation blocking area 213 extends in the left-right direction and has a strip structure, and the isolation blocking area 213 is sequentially inclined upwards from left to right, so that the condensation heat dissipation area 212 above the isolation blocking area 213 can obtain an inclined lower end surface according to the trend, and the heat transfer working medium 23 flows back to the vicinity of the heat source 4; as an example, the isolation blocking area 213 may further include a plurality of stripe structures, so that a plurality of reflow paths may be provided, and the inclination directions of the stripe structures are the same. As an example, as shown in fig. 3, a lower end (the lowermost end located at the left side) of the isolation blocking area 213 is not higher than the lower end of the corresponding heat source and is not lower than the upper end of the heat source located below the corresponding heat source.
As shown in fig. 3, the heat transfer working medium 23 is disposed in the heat dissipation pipeline 22, for example, the filling amount of the heat transfer working medium 23 is 20% to 70% of the volume of the closed pipeline, in this embodiment, the filling amount of the heat transfer working medium 23 is 45% of the volume of the closed pipeline, and in actual use, the filling amount of the heat transfer working medium 23 can be set according to actual needs. By way of example, the heat transfer working medium 23 is a fluid, preferably, the heat transfer working medium 23 may be a gas or a liquid or a mixture of a gas and a liquid, and more preferably, in the present embodiment, the heat transfer working medium 23 is a mixture of a liquid and a gas.
The heat superconducting heat transfer plate of the present embodiment is provided with an inclined non-pipe isolation blocking area 213 near the lower end of the height position of the heat source 4, and divides the heat radiation pipes 23 on the heat superconducting heat transfer plate into several areas, and the heat radiation pipes 23 of the respective areas are communicated with each other through 2 pipes on the outside. When the heat source device works, even if the filling amount of the heat transfer working medium 23 is relatively small, the heat source 4 starts to input heat, the heat source 4 at the lower part transfers the heat to the heat transfer working medium 23 at the heat source accessory, the heat is changed into steam to be vaporized after being heated, the steam is upwards changed into steam, enters the area of the upper heat dissipation pipeline 23 through the pipelines at the two sides, and is condensed into liquid after exchanging heat with the outside. The upper condensed liquid firstly passes through the partition of the upper isolation blocking area 213 and flows to the vicinity of the upper heat source 4 along the inner inclined pipeline, because the temperature of the upper heat source 4 is higher, the condensed liquid near the heat source is evaporated and changed into gas to flow upwards, the condensed heat dissipation area 212 at the upper part carries out heat dissipation and condensation, the circulation is carried out, so that the heat is continuously conducted to all parts of the heat superconducting heat transfer plate to be dissipated, and the condensed liquid participates in phase change heat conduction circulation in the upper condensed heat dissipation area 212; excess fluid will flow down through the piping on either side of the upper isolation barrier 213. The evaporated gas is heated by the lower heat source 4, is condensed in the lower condensation heat dissipation area 212 and flows back to the heat dissipation pipeline 23 near the lower heat source 4 to participate in the heat conduction circulation of continuous evaporation and condensation, when the lower heat is larger, more steam is generated, the pressure of the corresponding gas phase is larger, and the redundant steam enters the upper condensation heat dissipation area 212 along the pipelines at the two sides of the upper isolation blocking area 213 so as to keep the balance and temperature equalization of the temperature and heat dissipation on the whole plate surface.
Example two
As shown in fig. 4 and fig. 5, the present embodiment provides a thermal superconducting heat transfer plate 2, which is different from the first embodiment in that the thermal superconducting heat transfer plate further includes a non-pipe blank region 214 disposed in at least one condensation heat dissipation region 212.
Specifically, as shown in fig. 4, in the present embodiment, the non-pipe blank areas 214 are disposed in each condensation heat dissipation area 212, and in practical use, the non-pipe blank areas 214 may be disposed by selecting one condensation heat dissipation area 212, which is not limited to the present embodiment.
Therefore, the arrangement of the heat dissipation pipeline 23 can be reduced, the filling amount of the heat transfer working medium in the heat superconducting plate 2 is further reduced, the cost is reduced, and meanwhile, the starting speed of the heat superconducting plate is increased.
By way of example, the non-pipe blank area 214 is a block structure, and the length in the vertical direction is greater than the length in the horizontal direction. The non-pipe blank area 214 may also be a strip structure, and the length in the vertical direction is smaller than the length in the horizontal direction, which is not described herein again.
By way of example, the non-pipe blank region 214 is far away from the heated region 21, so that the heat transfer working medium 23 can be ensured to be accumulated on the side close to the heat source 4, and the heat dissipation efficiency is further improved.
As shown in fig. 5, the heat transfer working medium 23 is heated, changes phase to vaporize, changes into steam, flows upward through the heat dissipation pipe 23 on the left side (side close to the heat source) of the condensation heat dissipation area 212, returns downward through the heat dissipation pipe 23 on the right side (side far from the heat source) of the condensation heat dissipation area 212 after condensation, and flows to the vicinity of the heat source along the inner inclined pipe. Other principles are the same as those of the first embodiment, and are not described in detail herein.
EXAMPLE III
As shown in fig. 6, the present embodiment provides a heat superconducting heat transfer plate 2, which is different from the first embodiment in the case where the heat superconducting heat transfer plate is used for a plurality of heat sources.
Specifically, as shown in fig. 6, in the present embodiment, 4 heat sources are provided along the height direction, wherein the middle two heat sources 4 are main heat sources 4a with relatively large power, and the upper and lower two heat sources are sub heat sources 4b with relatively small power. Inclined main isolation blocking areas 213a and sub isolation blocking areas 213b are provided at the lower ends of the main heat source 4a and the sub heat source 4b at the corresponding height positions, respectively. The area of the main isolation blocking area 213a is larger than that of the auxiliary isolation blocking area 213b, so that liquid heat transfer working media are arranged near the heating power devices at different heights, and the heat of a heat source is led out and dissipated by means of rapid heat conduction of evaporation and condensation phase change of the heat transfer working media.
Specifically, as shown in fig. 6, in the present embodiment, the condensation heat dissipation area 212 corresponding to the three heat sources located at the lower side is provided with a non-pipeline blank area 214, and the area of the non-pipeline blank area 214 is smaller than that of the non-pipeline blank area 214 in the second embodiment.
It should be noted that, can set up according to different quantity and different positions of heat source the utility model discloses a position of heat dissipation area 212, isolation blocking area 213, non-pipeline blank area 214 congeals in the heat conduction heat transfer plate, technical personnel in this field can be based on the utility model discloses the content of describing carries out the adaptability adjustment according to actual need, does not repeated here one by one.
Example four
As shown in fig. 7 and 8, the utility model provides a heat sink, the heat sink includes:
the heat-conducting plate comprises a heat-radiating base plate 3 and a plurality of heat-conducting plates 2, wherein grooves which are arranged at intervals are arranged on the first surface of the heat-radiating base plate 3, heated areas of the heat-conducting plates 2 are inserted into the grooves in a one-to-one correspondence manner, and the heat-conducting heat-; a heat source attaching region is provided on the second surface of the heat dissipation substrate 3.
Specifically, in the present embodiment, the heat dissipation substrate 3 is a flat structure, a first surface of the heat dissipation substrate 3 is provided with a groove (not shown in the figure) for inserting each thermal superconducting heat transfer plate 2, and a second surface is provided with a heat source attaching area for mounting a heat generating device. As an example, the first surface is disposed opposite the second surface. The heat generating device includes, but is not limited to, a power device. The grooves extend along a first direction on the surface of the heat dissipation substrate 3 and are arranged at intervals along a second direction, and the first direction is perpendicular to the second direction; in the embodiment, each groove is perpendicular to the surface of the heat dissipation substrate 3, and in practical use, each groove may also be inclined by a certain angle compared to the surface of the heat dissipation substrate 3, and the perpendicular direction is only used for indicating a direction trend, and does not mean that an included angle of 90 degrees is formed with the horizontal plane in a strict sense, which is not limited in the embodiment.
As an example, a sintered wick heat pipe (not shown) is buried in the heat dissipation substrate 3. The sintering core heat pipe is a sintering powder pipe core which is formed by sintering metal powder with a certain mesh number on the inner wall of a metal pipe and is integrated with the pipe wall, the metal powder sintered on the inner wall of the metal pipe forms a liquid absorption core capillary structure, so that the sintering core heat pipe has higher capillary suction force, the heat conduction direction of the sintering core heat pipe is not influenced by gravity, the evaporation heat absorption and condensation heat release are strengthened by the sintering liquid absorption core capillary structure, the heat conduction capability and the transmission power of the heat pipe are greatly improved, and the sintering core heat pipe has larger axial equivalent heat conduction coefficient (which is hundreds times to thousands times of copper). The sintering core heat pipe is embedded in the heat dissipation substrate 3, so that heat generated by a heating device arranged on the surface of the heat dissipation substrate 3 can be quickly diffused to other positions of the heat dissipation substrate 3, the heat distribution on the heat dissipation substrate 3 is uniform, and the heat dissipation efficiency and the heat dissipation capacity of the radiator are effectively improved.
Specifically, the heated area 211 of each thermal superconducting heat transfer plate 2 is vertically (or may have a certain inclination, not limited to this embodiment) inserted into the groove, and each thermal superconducting heat transfer plate 2 is fixedly connected to the heat sink substrate 3 through a mechanical extrusion process, a heat-conducting glue bonding process, or a brazing welding process, so as to increase the bonding strength as much as possible, reduce the bonding thermal resistance, and improve the heat dissipation capability and efficiency of the heat sink.
The working principle of the radiator described in this embodiment is as follows: the heat generated when the heat source on the surface of the heat radiator base plate 3 works is quickly transferred to the whole heat radiator base plate 3 through the sintering core heat pipe, the heat radiator base plate 3 quickly transfers the heat to each heat superconducting heat transfer plate 2, the heat transfer working medium in the heat dissipation pipeline 22 in each heat superconducting heat transfer plate 2 quickly transfers the heat to the surface of the whole heat superconducting heat transfer plate 2, and then the heat is taken away by the air flow flowing through the gap of the heat superconducting heat transfer plates 2. The working principle of each heat transfer plate 2 is not described in detail herein.
To sum up, the utility model provides a heat superconducting heat transfer plate and radiator, include: a heat dissipation substrate and a plurality of thermal superconducting heat transfer plates. The heat superconducting heat transfer plate comprises a heat conduction plate with a composite plate type structure, wherein the heat conduction plate comprises a heated area positioned on one side edge of the heat conduction plate, at least two condensation heat dissipation areas positioned on the surface of the heat conduction plate and isolation blocking areas corresponding to the condensation heat dissipation areas; the condensation heat dissipation areas and the isolation blocking areas are sequentially arranged from top to bottom at intervals, and each condensation heat dissipation area is positioned above the corresponding isolation blocking area; the heat-conducting plate of each condensation heat-dissipation area is internally provided with a heat-dissipation pipeline, the heat-dissipation pipelines of each condensation heat-dissipation area are connected through heat-dissipation pipelines positioned at two sides of the isolation blocking area to form a through closed pipeline, and the closed pipeline is filled with a heat-transfer medium; the extending direction of each isolation blocking area is oblique to the side edge of the heat conducting plate, and one end, close to the heated area, of each isolation blocking area is lower than one end, far away from the heated area, of each isolation blocking area. The heat superconducting heat transfer plate of the utility model is provided with a non-pipeline isolation blocking area with an inclination angle along the direction from the fin root to the fin top at the height near the heat source, steam at the part above the isolation blocking area is condensed and then flows back to the isolation blocking area, and a certain amount of liquid accumulation is formed near the heat source; therefore, the high-temperature phenomenon caused by the fact that heat cannot be conducted out due to different positions of the heat source can be solved. The utility model discloses a radiator adopts above-mentioned heat superconducting heat transfer plate, fixes on the heat dissipation base plate through connecting, welding, expanding joint and connected modes such as cogs, constitutes the radiator that is used for communication base station equipment or power supply unit to solve the heat dissipation problem of a plurality of heating power devices and avoid appearing local high temperature phenomenon, improve the radiating efficiency and the heat-sinking capability of whole radiator. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (11)
1. A thermally superconducting heat transfer plate, characterized in that it comprises at least:
the heat conducting plate is of a composite plate type structure and comprises a heated area, at least two condensation heat dissipation areas and isolation blocking areas, wherein the heated area is positioned at one side edge of the heat conducting plate, and the isolation blocking areas correspond to the condensation heat dissipation areas;
the condensation heat dissipation areas and the isolation blocking areas are sequentially arranged from top to bottom at intervals, and each condensation heat dissipation area is positioned above the corresponding isolation blocking area;
the heat-conducting plate of each condensation heat-dissipation area is internally provided with a heat-dissipation pipeline, the heat-dissipation pipelines of each condensation heat-dissipation area are connected through heat-dissipation pipelines positioned at two sides of the isolation blocking area to form a through closed pipeline, and the closed pipeline is filled with a heat-transfer medium;
the extending direction of each isolation blocking area is oblique to the side edge of the heat conducting plate, and one end, close to the heated area, of each isolation blocking area is lower than one end, far away from the heated area, of each isolation blocking area.
2. A thermally superconducting heat transfer plate according to claim 1, wherein: the thermal superconducting heat transfer plate further comprises a non-pipeline blank area arranged in the at least one condensation heat dissipation area.
3. A thermally superconducting heat transfer plate according to claim 2, wherein: the non-pipeline blank area is far away from one side of the heated area.
4. A thermally superconducting heat transfer plate according to claim 1, wherein: the shape of the heat dissipation pipeline of each condensation heat dissipation area is hexagonal honeycomb, circular honeycomb, quadrilateral honeycomb, a plurality of U-shapes, rhombuses, triangles, circular rings, criss-cross nets connected in series end to end or any combination of more than one of the U-shapes, the rhombuses, the triangles, the circular rings and the criss-cross nets.
5. A thermally superconducting heat transfer plate according to claim 1, wherein: the filling amount of the heat transfer working medium is 20-70% of the volume of the closed pipeline.
6. A thermally superconducting heat transfer plate according to claim 1, wherein: the heat conducting plate of the heated area is of a folded edge structure.
7. A heat transfer plate according to any one of claims 1 to 6, wherein: the heat conducting plate is a phase change suppressing heat radiating plate or a phase change heat radiating plate.
8. A thermally superconducting heat transfer plate according to claim 7, wherein: the position of each condensation heat dissipation area corresponds to the installation position of each heat source; the lower end of each isolation blocking area is not higher than the lower end of the corresponding heat source and is not lower than the upper end of the heat source below the corresponding heat source.
9. A heat sink, characterized in that it comprises at least:
a heat-dissipating substrate and a plurality of heat-superconducting heat transfer plates according to any one of claims 1 to 8;
grooves which are arranged at intervals are arranged on the first surface of the heat dissipation substrate, the heated areas of the heat superconducting heat transfer plates are inserted into the grooves in a one-to-one correspondence mode, and the heat superconducting heat transfer plates extend in the vertical direction;
and a heat source pasting area is arranged on the second surface of the heat dissipation substrate.
10. The heat sink of claim 9, wherein: and a sintering core heat pipe is embedded in the heat dissipation substrate.
11. The heat sink of claim 9, wherein: the first surface is disposed opposite the second surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN202020514523.9U CN212458062U (en) | 2020-04-09 | 2020-04-09 | Heat superconducting heat transfer plate and heat sink |
| PCT/CN2021/070657 WO2021203787A1 (en) | 2020-04-09 | 2021-01-07 | Heat superconducting heat transfer plate and radiator |
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| CN202020514523.9U CN212458062U (en) | 2020-04-09 | 2020-04-09 | Heat superconducting heat transfer plate and heat sink |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111521051A (en) * | 2020-04-09 | 2020-08-11 | 浙江嘉熙科技有限公司 | Heat superconducting heat transfer plate and heat sink |
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2020
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111521051A (en) * | 2020-04-09 | 2020-08-11 | 浙江嘉熙科技有限公司 | Heat superconducting heat transfer plate and heat sink |
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