CN212400068U - Industrial camera mainboard heat dissipation support forming die - Google Patents
Industrial camera mainboard heat dissipation support forming die Download PDFInfo
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- CN212400068U CN212400068U CN202021848189.7U CN202021848189U CN212400068U CN 212400068 U CN212400068 U CN 212400068U CN 202021848189 U CN202021848189 U CN 202021848189U CN 212400068 U CN212400068 U CN 212400068U
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- demoulding
- die
- movable plate
- hole forming
- heat dissipation
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Abstract
A forming die for a heat dissipation bracket of an industrial camera mainboard comprises an upper die base, a lower die base, an upper die demoulding assembly, a lower die and a lower die demoulding assembly; the upper die demoulding component comprises an upper demoulding fixed plate, an upper demoulding movable plate, a plurality of connecting columns, a plurality of upper demoulding thimbles and a plurality of springs; the upper demolding fixing plate is arranged on one side of the upper mold, which is far away from the lower mold, and is connected with the upper mold base; the upper demoulding movable plate is movably positioned between the upper demoulding fixed plate and the upper mould, and the spring is positioned between the upper demoulding movable plate and the upper demoulding fixed plate; the first end of the connecting column is connected with the part of the upper demoulding movable plate close to the edge, and the second end of the connecting column is abutted with the part of the upper mould close to the edge; the first end of the upper demoulding thimble is fixedly connected with the upper demoulding movable plate, the upper mould is provided with a plurality of upper thimble holes, and the second end of the upper demoulding thimble penetrates through the upper thimble holes of the upper mould. So can realize the product automatically and go up the drawing of patterns in the mould support, avoid the protruding muscle deformation damage of product.
Description
Technical Field
The utility model relates to an industry camera production technical field, especially an industry camera mainboard heat dissipation support forming die.
Background
Referring to fig. 7, the back of the heat dissipating bracket 100 of the main board of the industrial camera is provided with a plurality of ribs 110, the side surfaces of the two ends of the heat dissipating bracket are recessed along the length direction to form a handle groove 101 and a plurality of first through holes 102, and the side surfaces of the two ends of the heat dissipating bracket are provided with second through holes 103. The existing mold is only provided with a plurality of ejector pins in a lower mold, and the ejector pins lift the just-formed industrial camera mainboard radiating support 100 upwards in demolding, but because of the existence of a plurality of convex ribs 110, adhesive force is generated between the convex ribs 110 of the industrial camera mainboard radiating support 100 and an upper mold, so that smooth demolding is difficult, or the convex ribs 110 are deformed and damaged in demolding.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a can realize the product automatically and go up the drawing of patterns in the die holder, avoid the protruding muscle of product to warp the industry camera mainboard heat dissipation support forming die who damages to solve above-mentioned problem.
A forming die for a heat dissipation bracket of an industrial camera mainboard comprises an upper die base, a lower die base, an upper die demoulding assembly, a lower die and a lower die demoulding assembly; the upper die base and the lower die base are arranged oppositely, the upper die is arranged on the bottom surface of the upper die base facing the lower die base, and the lower die is arranged on the top surface of the lower die base facing the upper die base; the upper die demoulding component comprises an upper demoulding fixed plate, an upper demoulding movable plate, a plurality of connecting columns, a plurality of upper demoulding thimbles and a plurality of springs; the upper demolding fixing plate is arranged on one side of the upper mold, which is far away from the lower mold, and is connected with the upper mold base; the upper demoulding movable plate is movably positioned between the upper demoulding fixed plate and the upper mould, and the spring is positioned between the upper demoulding movable plate and the upper demoulding fixed plate; the first end of the connecting column is connected with the part of the upper demoulding movable plate close to the edge, and the second end of the connecting column is abutted with the part of the upper mould close to the edge; the first end of the upper demoulding thimble is fixedly connected with the upper demoulding movable plate, the upper mould is provided with a plurality of upper thimble holes, and the second end of the upper demoulding thimble penetrates through the upper thimble holes of the upper mould.
Furthermore, a plurality of lower thimble holes are formed in the lower die, the lower die demolding assembly comprises a plurality of lower demolding thimbles and a lower demolding movable plate, the first ends of the lower demolding thimbles penetrate through the lower thimble holes of the lower die, and the second ends of the lower demolding thimbles are connected with the lower demolding movable plate.
Further, the lower demoulding movable plate is connected with a demoulding cylinder.
Further, the device also comprises a first side hole forming module; the first side hole forming module comprises a first side hole forming block, a first pushing block positioned on one side of the first side hole forming block and a first driving unit for driving the first pushing block to move; a plurality of first hole forming columns are arranged on one side, away from the first pushing block, of the first side hole forming block in a protruding mode.
Furthermore, a pouring gate is arranged on the first pushing block, and a plurality of material guiding grooves are concavely arranged on the first side hole forming block.
Further, the second side hole forming module comprises a second side hole forming block and a second driving unit for driving the second side hole forming block to move; and a second hole forming column is arranged on one side, away from the second driving unit, of the second side hole forming block in a protruding mode.
Further, a handle forming lug is arranged on one side, away from the second driving unit, of the second side hole forming block in a protruding mode.
Furthermore, a flash groove is concavely arranged on one side, away from the first side hole forming module, of the lower die holder.
Compared with the prior art, the utility model discloses an industrial camera mainboard heat dissipation support forming die includes upper die base, die holder, upper die drawing of patterns subassembly, lower mould and lower mould drawing of patterns subassembly; the upper die base and the lower die base are arranged oppositely, the upper die is arranged on the bottom surface of the upper die base facing the lower die base, and the lower die is arranged on the top surface of the lower die base facing the upper die base; the upper die demoulding component comprises an upper demoulding fixed plate, an upper demoulding movable plate, a plurality of connecting columns, a plurality of upper demoulding thimbles and a plurality of springs; the upper demolding fixing plate is arranged on one side of the upper mold, which is far away from the lower mold, and is connected with the upper mold base; the upper demoulding movable plate is movably positioned between the upper demoulding fixed plate and the upper mould, and the spring is positioned between the upper demoulding movable plate and the upper demoulding fixed plate; the first end of the connecting column is connected with the part of the upper demoulding movable plate close to the edge, and the second end of the connecting column is abutted with the part of the upper mould close to the edge; the first end of the upper demoulding thimble is fixedly connected with the upper demoulding movable plate, the upper mould is provided with a plurality of upper thimble holes, and the second end of the upper demoulding thimble penetrates through the upper thimble holes of the upper mould. So can realize the product automatically and go up the drawing of patterns in the mould support, avoid the protruding muscle deformation damage of product.
Drawings
Embodiments of the present invention are described below with reference to the accompanying drawings, in which:
fig. 1 is the utility model provides an industry camera mainboard heat dissipation support forming die's a three-dimensional schematic diagram.
Fig. 2 is the utility model provides an industry camera mainboard heat dissipation support forming die removes the stereogram of upper die base.
Fig. 3 is a side view of fig. 2 from another perspective.
Fig. 4 is a perspective view of fig. 2 with the upper stripper fixing plate removed.
Fig. 5 is a perspective view of fig. 4 with the upper stripper movable plate removed.
Fig. 6 is the utility model provides an industry camera mainboard heat dissipation support forming die's local split schematic diagram.
Fig. 7 is a schematic perspective view of a mold for forming a heat dissipation support of an industrial camera motherboard and an upper mold release thimble.
Detailed Description
The following describes in further detail specific embodiments of the present invention based on the drawings. It should be understood that the description herein of embodiments of the invention is not intended to limit the scope of the invention.
Referring to fig. 1 to 6, the present invention provides a mold for forming a heat dissipating bracket of an industrial camera motherboard, which includes an upper mold base 10, a lower mold base 20, an upper mold 30, an upper mold stripping assembly 40, a lower mold 50, and a lower mold stripping assembly 80.
The upper die holder 10 is disposed opposite to the lower die holder 20, the upper die 30 is disposed on a bottom surface of the upper die holder 10 facing the lower die holder 20, and the lower die 50 is disposed on a top surface of the lower die holder 20 facing the upper die holder 10.
The upper mold stripping assembly 40 includes an upper stripping fixed plate 41, an upper stripping movable plate 42, a plurality of connecting posts 43, a plurality of upper stripping ejector pins 44, and a plurality of springs 45.
The upper stripper fixing plate 41 is disposed on a side of the upper die 30 away from the lower die 50 and connected to the upper die base 10.
The upper stripper moving plate 42 is movably located between the upper stripper fixing plate 41 and the upper die 30, and the spring 45 is located between the upper stripper moving plate 42 and the upper stripper fixing plate 41.
The connecting column 43 has a first end connected to the portion of the upper stripper shoe 42 near the rim and a second end abutting against the portion of the upper die 30 near the rim. The portion of the upper die 30 near the edge is a die frame.
The first end of the upper ejector pin 44 is fixedly connected to the upper ejector moving plate 42, the upper die 30 is provided with a plurality of upper ejector pin holes, and the second end of the upper ejector pin 44 passes through the upper ejector pin hole of the upper die 30 and abuts against the rib 110 of the motherboard heat dissipation bracket 100.
The lower mold 50 has a plurality of lower pin holes, the lower mold stripping assembly 80 includes a plurality of lower stripping pins 81 and a lower stripping plate 82, a first end of the lower stripping pins 81 passes through the lower pin holes of the lower mold 50, and a second end of the lower stripping pins is connected to the lower stripping plate 82. The lower stripper plate 82 is connected to a stripper cylinder.
The utility model provides an industry camera mainboard heat dissipation support forming die still includes first side hole forming module 60 and second side hole forming module 70.
The first side hole forming module 60 includes a first side hole forming block 61, a first pushing block 62 located at one side of the first side hole forming block 61, and a first driving unit 63 for driving the first pushing block 62 to move.
A plurality of first hole forming columns 601 are arranged on one side of the first side hole forming block 61 away from the first pushing block 62 in a protruding mode.
The first pushing block 62 is provided with a pouring gate 621, and the first side hole forming block 61 is concavely provided with a plurality of material guiding grooves 601.
The second side hole forming module 70 includes a second side hole forming block 71 and a second driving unit 72 for driving the second side hole forming block 71 to move. A handle forming protrusion 701 and a second hole forming column 702 are protrudingly disposed on a side of the second side hole forming block 71 away from the second driving unit 72.
The lower die base 20 is also concavely provided with a flash groove 21 at one side far away from the first side hole forming module 60.
The upper die holder 10 is driven by a hydraulic driving unit to move downwards, so that the upper die 30 is in opposite contact with the lower die 50; after the product is removed from the upper mold 30, the hydraulic driving unit drives the upper mold base 10 to move upward, and the upper demolding movable plate 42 moves toward the lower mold 50 under the elastic action of the spring 45, so that the upper demolding ejector pins 44 eject the product downward.
Compared with the prior art, the industrial camera mainboard heat dissipation support forming die comprises an upper die base 10, a lower die base 20, an upper die 30, an upper die demoulding component 40, a lower die 50 and a lower die demoulding component 80; the upper die holder 10 is arranged opposite to the lower die holder 20, the upper die 30 is arranged on the bottom surface of the upper die holder 10 facing the lower die holder 20, and the lower die 50 is arranged on the top surface of the lower die holder 20 facing the upper die holder 10; the upper die stripping assembly 40 comprises an upper stripping fixed plate 41, an upper stripping movable plate 42, a plurality of connecting columns 43, a plurality of upper stripping thimbles 44 and a plurality of springs 45; the upper demolding fixing plate 41 is arranged on one side of the upper mold 30 far away from the lower mold 50 and is connected with the upper mold base 10; the upper demoulding movable plate 42 is movably positioned between the upper demoulding fixed plate 41 and the upper mould 30, and the spring 45 is positioned between the upper demoulding movable plate 42 and the upper demoulding fixed plate 41; the first end of the connecting column 43 is connected with the portion of the upper stripper moving plate 42 close to the edge, and the second end is abutted with the portion of the upper die 30 close to the edge; the first end of the upper demoulding thimble 44 is fixedly connected with the upper demoulding movable plate 42, the upper mould 30 is provided with a plurality of upper thimble holes, and the second end of the upper demoulding thimble 44 passes through the upper thimble holes of the upper mould 30. So can realize the product automatically and go up the drawing of patterns in the mould support, avoid the protruding muscle deformation damage of product.
The above description is only for the preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention, and any modification, equivalent replacement or improvement within the spirit of the present invention is encompassed by the claims of the present invention.
Claims (8)
1. The utility model provides an industry camera mainboard heat dissipation support forming die which characterized in that: comprises an upper die holder, a lower die holder, an upper die demoulding component, a lower die and a lower die demoulding component; the upper die base and the lower die base are arranged oppositely, the upper die is arranged on the bottom surface of the upper die base facing the lower die base, and the lower die is arranged on the top surface of the lower die base facing the upper die base; the upper die demoulding component comprises an upper demoulding fixed plate, an upper demoulding movable plate, a plurality of connecting columns, a plurality of upper demoulding thimbles and a plurality of springs; the upper demolding fixing plate is arranged on one side of the upper mold, which is far away from the lower mold, and is connected with the upper mold base; the upper demoulding movable plate is movably positioned between the upper demoulding fixed plate and the upper mould, and the spring is positioned between the upper demoulding movable plate and the upper demoulding fixed plate; the first end of the connecting column is connected with the part of the upper demoulding movable plate close to the edge, and the second end of the connecting column is abutted with the part of the upper mould close to the edge; the first end of the upper demoulding thimble is fixedly connected with the upper demoulding movable plate, the upper mould is provided with a plurality of upper thimble holes, and the second end of the upper demoulding thimble penetrates through the upper thimble holes of the upper mould.
2. The industrial camera motherboard heat dissipation bracket molding die of claim 1, wherein: the lower mould is provided with a plurality of lower thimble holes, the lower mould demoulding component comprises a plurality of lower demoulding thimbles and a lower demoulding movable plate, the first end of each lower demoulding thimble penetrates through the lower thimble hole of the lower mould, and the second end of each lower demoulding movable plate is connected with the corresponding lower demoulding movable plate.
3. The industrial camera motherboard heat dissipation bracket molding die of claim 2, wherein: the lower demoulding movable plate is connected with a demoulding cylinder.
4. The industrial camera motherboard heat dissipation bracket molding die of claim 1, wherein: the device also comprises a first side hole forming module; the first side hole forming module comprises a first side hole forming block, a first pushing block positioned on one side of the first side hole forming block and a first driving unit for driving the first pushing block to move; a plurality of first hole forming columns are arranged on one side, away from the first pushing block, of the first side hole forming block in a protruding mode.
5. The industrial camera motherboard heat dissipation bracket molding die of claim 4, wherein: the first promotion piece is last to be provided with the sprue gate, and the sunken a plurality of guide troughs that are provided with on the first side hole shaping piece.
6. The industrial camera motherboard heat dissipation bracket molding die of claim 1, wherein: the second side hole forming module comprises a second side hole forming block and a second driving unit for driving the second side hole forming block to move; and a second hole forming column is arranged on one side, away from the second driving unit, of the second side hole forming block in a protruding mode.
7. The industrial camera motherboard heat dissipation bracket molding die of claim 6, wherein: and a handle forming lug is arranged on one side, far away from the second driving unit, of the second side hole forming block in a protruding mode.
8. The industrial camera motherboard heat dissipation bracket molding die of claim 1, wherein: and a flash groove is concavely arranged on one side of the lower die base, which is far away from the first side hole forming module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021848189.7U CN212400068U (en) | 2020-08-28 | 2020-08-28 | Industrial camera mainboard heat dissipation support forming die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021848189.7U CN212400068U (en) | 2020-08-28 | 2020-08-28 | Industrial camera mainboard heat dissipation support forming die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212400068U true CN212400068U (en) | 2021-01-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021848189.7U Active CN212400068U (en) | 2020-08-28 | 2020-08-28 | Industrial camera mainboard heat dissipation support forming die |
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| Country | Link |
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| CN (1) | CN212400068U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111890604A (en) * | 2020-08-28 | 2020-11-06 | 嘉兴合祖机电设备有限公司 | Industrial camera mainboard heat dissipation support forming die |
-
2020
- 2020-08-28 CN CN202021848189.7U patent/CN212400068U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111890604A (en) * | 2020-08-28 | 2020-11-06 | 嘉兴合祖机电设备有限公司 | Industrial camera mainboard heat dissipation support forming die |
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