CN212081681U - Semiconductor heat exchanger assembly and semiconductor air conditioner - Google Patents
Semiconductor heat exchanger assembly and semiconductor air conditioner Download PDFInfo
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- CN212081681U CN212081681U CN202020599490.2U CN202020599490U CN212081681U CN 212081681 U CN212081681 U CN 212081681U CN 202020599490 U CN202020599490 U CN 202020599490U CN 212081681 U CN212081681 U CN 212081681U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 238000001816 cooling Methods 0.000 claims abstract description 82
- 230000017525 heat dissipation Effects 0.000 claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 abstract description 4
- 238000005057 refrigeration Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
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Abstract
The application provides a semiconductor heat exchanger subassembly and semiconductor air conditioner. The semiconductor heat exchanger assembly comprises a plurality of heat exchanger units which are adjacently arranged, each heat exchanger unit comprises a cold dissipation heat exchanger, a heat dissipation heat exchanger and at least one semiconductor refrigerating sheet which is arranged between the cold dissipation heat exchanger and the heat dissipation heat exchanger, and the cold dissipation heat exchangers of the two adjacent heat exchanger units are oppositely arranged and/or the heat dissipation heat exchangers are oppositely arranged. By applying the technical scheme of the utility model, a heat exchanger unit is formed by a cooling heat exchanger, a heat dissipation heat exchanger and at least one semiconductor refrigeration sheet arranged between the cooling heat exchanger and the heat dissipation heat exchanger, and then a plurality of heat exchanger units are adjacently arranged, so that the operation among the heat exchanger units is mutually independent and not influenced, and the fault tolerance rate is improved; meanwhile, when the heat exchanger unit is overhauled, only the heat exchanger unit of the part with the fault needs to be disassembled, and the maintenance difficulty is reduced.
Description
Technical Field
The utility model relates to an air conditioning equipment technical field particularly, relates to a semiconductor heat exchanger subassembly and semiconductor air conditioner.
Background
The air conditioner aiming at the kitchen environment is provided with an air duct type form and is arranged in a kitchen ceiling; the air conditioner has the characteristics that the air conditioner is of a single-side air outlet ceiling type, is flush with a ceiling buckle plate after being installed, and the like, is large in engineering installation amount, and is suitable for a kitchen which is not decorated. If want to install this type of kitchen air conditioner, need demolish the furred ceiling, after the installation unit, recover the furred ceiling again, the work load of installation unit is bigger for the installation cost of unit is great, and the user is difficult to accept.
And the most refrigerant refrigeration modes of present unit, the unit at this moment leads to whole unit heavy owing to have big quality devices such as compressor, even if integral type wall hang-up, also have the problem that the unit occupation space is big, it is the common fault to lead to the too big size of market feedback, and the unit is heavy, inconvenient dismouting is clean, consequently, develop a unit that still can easy to assemble after being suitable for the kitchen fitment, the unit installation work load is little simultaneously, the unit is light, easily settle, it will be necessary nature to maintain simple and convenient air conditioner.
In order to solve the problems, some semiconductor air conditioners which are convenient to install and maintain are also started to appear in the market, but the structural arrangement of the basic heat exchanger functional components of the current semiconductor air conditioner is not reasonable enough, so that the semiconductor air conditioner cannot be used or is difficult to repair after a fault occurs.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a semiconductor heat exchanger subassembly and semiconductor air conditioner to solve the technical problem that basic heat exchanger functional part later maintenance performance is poor that semiconductor air conditioner exists among the prior art.
An embodiment of the present application provides a semiconductor heat exchanger assembly, including: the heat exchanger units are arranged adjacently and comprise a cold dissipating heat exchanger, a heat dissipating heat exchanger and at least one semiconductor refrigerating sheet arranged between the cold dissipating heat exchanger and the heat dissipating heat exchanger, and the cold dissipating heat exchangers of two adjacent heat exchanger units are arranged oppositely and/or the heat dissipating heat exchangers are arranged oppositely.
In one embodiment, the heat-dissipating heat exchanger is provided with heat-dissipating fin flow channels, the heat-dissipating heat exchangers of two adjacent heat exchanger units are arranged oppositely, the heat-dissipating fin flow channels of two heat-dissipating heat exchangers form a heat-dissipating channel together, and/or the heat-dissipating heat exchangers of two adjacent heat exchanger units are arranged oppositely, and the heat-dissipating fin flow channels of two heat-dissipating heat exchangers form a heat-dissipating channel together.
In one embodiment, in the thickness direction of the heat exchanger units, the cooling heat exchangers of two adjacent heat exchanger units are arranged oppositely, and the cooling heat exchangers of two adjacent heat exchanger units are arranged oppositely.
In one embodiment, the heat-dissipating heat exchangers of two adjacent heat exchanger units are arranged side by side and the heat-dissipating heat exchangers of two adjacent heat exchanger units are arranged side by side in the width direction of the heat exchanger units.
In one embodiment, the semiconductor heat exchanger assembly further comprises an encapsulation shell, the plurality of heat exchanger units are arranged in the encapsulation shell, and the encapsulation shell is provided with a cooling air outlet communicated with the cooling fin flow channel and a cooling air outlet communicated with the cooling fin flow channel.
In one embodiment, the cooling air outlet and/or the cooling air outlet are/is provided with reinforcing ribs.
In one embodiment, the cooling fin flow channels are arranged in a first direction and the cooling fin flow channels are arranged in a second direction perpendicular to the first direction.
In one embodiment, the cooling fin flow channels are arranged along the horizontal direction, and the cooling fin flow channels on the cooling heat exchangers of two adjacent heat exchanger units are communicated in the width direction of the heat exchanger units.
In one embodiment, the cool air dissipation openings are formed in the side walls of the enclosure housing and the cool air dissipation openings are formed in the top and bottom walls of the housing.
The embodiment of the application also provides a semiconductor air conditioner which comprises a semiconductor heat exchanger assembly, wherein the semiconductor heat exchanger assembly is the semiconductor heat exchanger assembly.
In the embodiment, one heat exchanger unit is formed by one cooling heat exchanger, one heat radiating heat exchanger and at least one semiconductor refrigerating sheet arranged between the cooling heat exchanger and the heat radiating heat exchanger, and then the heat exchanger units are adjacently arranged, so that the operation among the heat exchanger units is independent and does not influence each other, and the fault tolerance rate is improved; meanwhile, when the heat exchanger unit is overhauled, only the heat exchanger unit of the part with the fault needs to be disassembled, and the maintenance difficulty is reduced. Therefore, the fault rate of the heat exchanger of the semiconductor air conditioner can be improved, when a certain part of the heat exchanger breaks down, the operation of other parts of the heat exchanger is not influenced, and meanwhile, the heat exchanger is accurate and convenient to overhaul. In addition, the heat dissipation heat exchangers of the two adjacent heat exchanger units are arranged oppositely, and the heat dissipation heat exchangers of the two adjacent heat exchanger units are arranged oppositely, so that concentrated heat dissipation can be performed on the oppositely arranged heat dissipation heat exchangers, and the concentrated heat dissipation and the heat dissipation are facilitated. The advantage of this is also that the hot side is closely attached to the hot side between two adjacent heat exchanger units; the cold side is close to the laminating with cold one side, and the effectual cold and hot short circuit of two adjacent heat exchanger units, the phenomenon of neutralization of having prevented. Meanwhile, the air channel is orderly and compact in formation, the air resistance is smaller, and the air quantity is favorably provided.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. In the drawings:
fig. 1 is a schematic overall structural view of an embodiment of a semi-conductive heat exchanger assembly according to the present invention;
FIG. 2 is a schematic view of the semi-conductive heat exchanger assembly of FIG. 1 with a portion of the enclosure housing removed;
FIG. 3 is an exploded schematic view of the semi-conductive heat exchanger assembly of FIG. 1;
FIG. 4 is a perspective schematic view of a heat exchanger unit of the semi-conductive heat exchanger assembly of FIG. 3;
FIG. 5 is an exploded schematic view of the heat exchanger unit of FIG. 4;
FIG. 6 is a schematic view of the construction of the cold rejection heat exchanger of the heat exchanger unit of FIG. 5;
fig. 7 is a schematic view of the construction of a heat rejection heat exchanger of the heat exchanger unit of fig. 5.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the following embodiments and accompanying drawings. The exemplary embodiments and descriptions of the present invention are provided to explain the present invention, but not to limit the present invention.
Fig. 3, fig. 4 and fig. 5 show an embodiment of the semiconductor heat exchanger assembly of the present invention, which includes a plurality of adjacently disposed heat exchanger units c, the heat exchanger units c include a cooling heat exchanger 21, a heat dissipation heat exchanger 22 and at least one semiconductor refrigeration sheet 23 installed between the cooling heat exchanger 21 and the heat dissipation heat exchanger 22, and the cooling heat exchanger 21 and/or the heat dissipation heat exchanger 22 of two adjacent heat exchanger units c are disposed relatively.
By applying the technical scheme of the utility model, a heat exchanger unit c is formed by one cooling heat exchanger 21, one heat-radiating heat exchanger 22 and at least one semiconductor refrigerating sheet 23 arranged between the cooling heat exchanger 21 and the heat-radiating heat exchanger 22, and then a plurality of heat exchanger units c are adjacently arranged, so that the operation among the heat exchanger units c is mutually independent and does not influence each other, and the fault tolerance rate is improved; meanwhile, when the heat exchanger unit c is overhauled, only the heat exchanger unit c of the part with the fault needs to be disassembled, and the maintenance difficulty is reduced. Therefore, the fault rate of the heat exchanger of the semiconductor air conditioner can be improved, when a certain part of the heat exchanger breaks down, the operation of other parts of the heat exchanger is not influenced, and meanwhile, the heat exchanger is accurate and convenient to overhaul. In addition, the heat dissipation heat exchangers 21 of the two adjacent heat exchanger units c are arranged oppositely, and the heat dissipation heat exchangers 22 of the two adjacent heat exchanger units c are arranged oppositely, so that concentrated heat dissipation can be performed on the oppositely arranged heat dissipation heat exchangers 21, and concentrated heat dissipation can be performed on the oppositely arranged heat dissipation heat exchangers 22, so that concentrated heat dissipation and cold dissipation are facilitated. This also has the advantage that the hot side is closely attached to the hot side between two adjacent heat exchanger units c; the cold side is close to the laminating with cold one side, and the effectual cold and hot short circuit of two adjacent heat exchanger unit c, the phenomenon of neutralization have been prevented. Meanwhile, the air channel is orderly and compact in formation, the air resistance is smaller, and the air quantity is favorably provided.
Alternatively, when mounting, bolts may be used to fasten one heat rejection heat exchanger 21 and one heat rejection heat exchanger 22 together.
As shown in fig. 1, 2 and 3, in the solution of the present embodiment, a cooling fin flow passage 211 is formed in the cooling heat exchanger 21, and a cooling fin flow passage 221 is formed in the cooling heat exchanger 22. The cooling heat exchangers 21 of two adjacent heat exchanger units c are oppositely arranged, the cooling fin flow channels 211 on the two cooling heat exchangers 21 jointly form a cooling channel a, and/or the cooling heat exchangers 22 of two adjacent heat exchanger units c are oppositely arranged, and the cooling fin flow channels 221 on the two cooling heat exchangers 22 jointly form a cooling channel b. The cooling fin flow channels 211 on the two cooling heat exchangers 21 of the two adjacent heat exchanger units c together form a cooling channel a, and the cooling fin flow channels 221 on the two cooling heat exchangers 22 of the two adjacent heat exchanger units c together form a cooling channel b, so that the cooling channel a and the cooling channel b can be ventilated, cooled and radiated in a targeted manner.
As shown in fig. 2 and 3, in the thickness direction, 3 heat exchanger units c are distributed in total, a cooling air duct a and a cooling air duct b are formed between the 3 heat exchanger units c, and the cooling fin flow channels 211 and the cooling fin flow channels 221 of the two outermost heat exchanger units c form an air duct separately.
Alternatively, both the heat rejecting heat exchanger 21 and the heat rejecting heat exchanger 22 are made of profiles.
As shown in fig. 2 and 3, alternatively, in the thickness direction of the heat exchanger units c, the cooling heat exchangers 21 of two adjacent heat exchanger units c are arranged oppositely, and the cooling heat exchangers 22 of two adjacent heat exchanger units c are arranged oppositely. Preferably, in order to further increase the power of the semiconductor heat exchanger assembly, a plurality of heat exchanger units c may be provided in the width direction. In the width direction of the heat exchanger units c, the cooling heat exchangers 21 of two adjacent heat exchanger units c are arranged side by side, and the heat-dissipating heat exchangers 22 of two adjacent heat exchanger units c are arranged side by side.
It should be noted that, in the technical solution of the present application, the width direction and the thickness direction refer to the directions shown in fig. 3, and the directions are for more clearly explaining the technical solution of the present invention, and do not constitute a limitation on the structure of the semiconductor air conditioner.
As shown in fig. 1 and fig. 2, in the technical solution of this embodiment, the semiconductor heat exchanger assembly further includes a package housing 10, the plurality of heat exchanger units c are disposed in the package housing 10, and the package housing 10 is provided with a cooling air opening 11 communicated with the cooling fin flow passage 211 and a cooling air opening 12 communicated with the cooling fin flow passage 221. In the technical solution of the present embodiment, the package case 10 functions to relatively separate the cooling fin flow path 211 of the cooling heat exchanger 21 and the cooling fin flow path 221 of the cooling heat exchanger 22. Therefore, the semiconductor heat exchanger component forms an integral product, and when in use, the cold air dissipation opening 11 and the heat air dissipation opening 12 on the packaging shell 10 are directly connected to the air path system of the semiconductor air conditioner respectively. More preferably, since the cooling air outlet 11 and/or the cooling air outlet 12 are relatively large, which may easily cause the strength of the package housing 10 to be reduced, the cooling air outlet 11 and/or the cooling air outlet 12 is/are provided with the reinforcing ribs 13 to improve the overall structural strength of the package housing 10.
As shown in fig. 6 and 7, in the technical solution of the present embodiment, the cooling fin flow channels 211 are arranged along the horizontal direction, the cooling fin flow channels 221 are arranged along the vertical direction, and the cooling fin flow channels 211 on the cooling heat exchangers 21 of two adjacent heat exchanger units c are communicated with each other in the width direction of the heat exchanger unit c. Correspondingly, the cool air dispersing openings 11 are formed in the side wall of the package housing 10, and the cool air dispersing openings 12 are formed in the top wall and the bottom wall of the housing.
As another alternative, the cooling fin flow channels 211 may be arranged in a vertical direction, and the cooling fin flow channels 221 may be arranged in a horizontal direction. In addition, the cooling fin flow channels 211 may be disposed in a first direction different from the above-described direction, and the cooling fin flow channels 221 may be disposed in a second direction perpendicular to the first direction.
The utility model also provides a semiconductor air conditioner, including foretell semiconductor heat exchanger subassembly, adopt the semiconductor air conditioner of above-mentioned semiconductor heat exchanger subassembly, just can improve semiconductor air conditioner's heat exchanger appearance fault rate, when certain part of heat exchanger breaks down, do not influence the operation of other parts of heat exchanger, it is accurate and convenient to overhaul simultaneously.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and it will be apparent to those skilled in the art that various modifications and variations can be made in the embodiments of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A semi-conductive heat exchanger assembly, comprising: the heat exchanger units (c) are arranged adjacently and comprise a cold dissipation heat exchanger (21), a heat dissipation heat exchanger (22) and at least one semiconductor refrigerating sheet (23) arranged between the cold dissipation heat exchanger (21) and the heat dissipation heat exchanger (22), and the cold dissipation heat exchangers (21) and/or the heat dissipation heat exchangers (22) of two adjacent heat exchanger units (c) are arranged oppositely.
2. The semiconductor heat exchanger assembly according to claim 1, characterized in that the heat rejecting heat exchanger (21) is formed with heat rejecting fin flow channels (211), the heat rejecting heat exchanger (22) is formed with heat rejecting fin flow channels (221), the heat rejecting heat exchangers (21) of two adjacent heat exchanger units (c) are oppositely arranged, the heat rejecting fin flow channels (211) on two heat rejecting heat exchangers (21) together form a heat rejecting channel (a), and/or the heat rejecting heat exchangers (22) of two adjacent heat exchanger units (c) are oppositely arranged, the heat rejecting fin flow channels (221) on two heat rejecting heat exchangers (22) together form a heat rejecting channel (b).
3. A semi-conducting heat exchanger assembly according to claim 2, characterized in that in the thickness direction of the heat exchanger units (c), the heat rejecting heat exchangers (21) of two adjacent heat exchanger units (c) are oppositely arranged, and the heat rejecting heat exchangers (22) of two adjacent heat exchanger units (c) are oppositely arranged.
4. A semi-conducting heat exchanger assembly according to claim 3, characterized in that the cold heat exchangers (21) of two adjacent heat exchanger units (c) are arranged side by side and the heat rejecting heat exchangers (22) of two adjacent heat exchanger units (c) are arranged side by side in the width direction of the heat exchanger units (c).
5. The assembly according to claim 2, further comprising a packaging case (10), wherein a plurality of the heat exchanger units (c) are disposed in the packaging case (10), and the packaging case (10) is provided with a cooling air outlet (11) communicated with the cooling fin flow channel (211) and a cooling air outlet (12) communicated with the cooling fin flow channel (221).
6. A semiconducting heat exchanger assembly according to claim 5, characterized in that the cooling air dissipation opening (11) and/or the cooling air dissipation opening (12) is provided with reinforcing ribs (13).
7. The semiconducting heat exchanger assembly according to claim 5, wherein the cooling fin flow channels (211) are arranged in a first direction and the cooling fin flow channels (221) are arranged in a second direction perpendicular to the first direction.
8. The semi-conducting heat exchanger assembly according to claim 7, characterized in that the cooling fin flow channels (211) are arranged in a horizontal direction, and the cooling fin flow channels (211) on the cooling heat exchangers (21) of two adjacent heat exchanger units (c) are communicated with each other in the width direction of the heat exchanger units (c).
9. A semiconducting heat exchanger assembly according to claim 8, characterized in that the cooling air vents (11) open on the side walls of the encapsulating housing (10) and the cooling air vents (12) open on the top and bottom walls of the housing.
10. A semiconductor air conditioner comprising a semiconducting heat exchanger assembly, characterized in that the semiconducting heat exchanger assembly is as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020599490.2U CN212081681U (en) | 2020-04-20 | 2020-04-20 | Semiconductor heat exchanger assembly and semiconductor air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020599490.2U CN212081681U (en) | 2020-04-20 | 2020-04-20 | Semiconductor heat exchanger assembly and semiconductor air conditioner |
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| Publication Number | Publication Date |
|---|---|
| CN212081681U true CN212081681U (en) | 2020-12-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020599490.2U Active CN212081681U (en) | 2020-04-20 | 2020-04-20 | Semiconductor heat exchanger assembly and semiconductor air conditioner |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111397244A (en) * | 2020-04-20 | 2020-07-10 | 珠海格力电器股份有限公司 | Semiconductor heat exchanger assembly and semiconductor air conditioner |
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2020
- 2020-04-20 CN CN202020599490.2U patent/CN212081681U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111397244A (en) * | 2020-04-20 | 2020-07-10 | 珠海格力电器股份有限公司 | Semiconductor heat exchanger assembly and semiconductor air conditioner |
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