CN211896770U - Flexible high-strength polyimide film adhesive tape - Google Patents
Flexible high-strength polyimide film adhesive tape Download PDFInfo
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- CN211896770U CN211896770U CN201922436586.7U CN201922436586U CN211896770U CN 211896770 U CN211896770 U CN 211896770U CN 201922436586 U CN201922436586 U CN 201922436586U CN 211896770 U CN211896770 U CN 211896770U
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- polyimide film
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- phenolic resin
- adhesive layer
- base band
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Abstract
The utility model discloses a flexible high-strength polyimide film adhesive tape, which comprises a polyimide film base band, wherein thermosetting phenolic resin adhesive layers are respectively formed on two side surfaces of the polyimide film base band, a nano aluminum hydroxide particle layer is formed on the inner side of the phenolic resin adhesive layer on one side of the polyimide film base band, and an adhesive layer is coated on the outer side of the phenolic resin adhesive layer and is adhered to a release film or release paper through the adhesive layer; an aramid fiber reinforced layer, a tensile reinforced belt and a protective film layer are sequentially formed on the outer surface of the phenolic resin glue layer on the other side, the length of the tensile reinforced belt is consistent with that of the polyimide film base band, and the tensile reinforced belt and the polyimide film base band are arranged in parallel at equal intervals in the width direction of the polyimide film base band; the aramid fiber reinforced layer and the tensile reinforced belt are pressed into the second thermosetting phenolic resin glue layer during molding. The utility model discloses insulating nature is good, the heat conductivity is strong, high temperature resistance can be superior, mechanical strength is high and the subsides are obeyed well.
Description
Technical Field
The utility model relates to an insulating adhesive tape technical field, concretely relates to flexible polyimide film sticky tape that excels in.
Background
With the development of the electronic industry, film tape materials such as protective films, release films, single-sided adhesive tapes and the like are increasingly applied to the fields of electronics, computers, household appliances and the like, wherein for the single-sided adhesive tapes, the traditional single-sided insulating adhesive tapes often have the defects of single type and low strength, and often fall off and break in a short time during use, so that the requirements of related electronic products cannot be met with the continuous and rapid development of related fields.
Under the circumstances, a polyimide film adhesive tape is produced by taking a polyimide film as a base material and coating a pressure-sensitive adhesive on the surface of the polyimide film adhesive tape, inherits the high-temperature resistance, radiation resistance, chemical corrosion resistance and electrical insulation performance of the polyimide film, has a large working temperature range and a wide application range, and is widely applied to circuit board base materials of high-temperature-resistant motor and electrical appliances. However, the polyimide tape with the above structure also has certain application defects, for example, when the polyimide tape is applied to a specific flexible circuit board, if the bending frequency of the flexible circuit board is high, the tensile strength of the film itself is obviously reduced, the polyimide film substrate in the polyimide tape is easy to influence the overall strength of the tape body due to tensile deformation, edge curling and edge warping deformation are easy to occur at the outer edge in the length direction of bending, the performance realization is influenced, and the risk of fracture is generated after long-time use; in addition, these situations are especially obvious in high-end electronic products with light weight and ultra-thin design requirements, and limit the application range of the polyimide adhesive tape.
SUMMERY OF THE UTILITY MODEL
The technical problem solved by the utility model is to provide a flexible high-strength polyimide film adhesive tape to solve the defects in the technical background.
The utility model provides a technical problem adopt following technical scheme to realize:
a flexible high-strength polyimide film adhesive tape comprises a polyimide film base tape, wherein a first thermosetting phenolic resin adhesive layer and a second thermosetting phenolic resin adhesive layer are respectively formed on two side surfaces of the polyimide film base tape, an adhesive layer is coated on the outer side of the first thermosetting phenolic resin adhesive layer, a release film or release paper is adhered to the outer side of the first thermosetting phenolic resin adhesive layer through the adhesive layer, and a nano aluminum hydroxide particle layer is formed between the first thermosetting phenolic resin adhesive layer and the adhesive layer; an aramid fiber reinforced layer, tensile reinforced belts and a protective film layer are sequentially formed on the outer surface of the second thermosetting phenolic resin glue layer, the length of each tensile reinforced belt is consistent with that of the polyimide film base band, the number of the tensile reinforced belts is more than or equal to 2, and the tensile reinforced belts are arranged in parallel at equal intervals in the width direction of the polyimide film base band; the aramid fiber reinforced layer and the tensile reinforced belt are pressed into the second thermosetting phenolic resin glue layer during molding.
As a further limitation, under the condition of not counting the thickness of the release film or the release paper, the total thickness of the flexible high-strength polyimide film adhesive tape is 120-150 μm, and the thickness of the polyimide film base tape adopted in the flexible high-strength polyimide film adhesive tape is 15-25 μm.
By way of further limitation, the thickness of the first thermosetting phenolic resin adhesive layer is 20-30 μm, and the thickness of the second thermosetting phenolic resin adhesive layer is 50-60 μm.
By way of further limitation, the reinforcing material filled in the aramid fiber reinforcing layer is chopped aramid fiber monofilaments.
The adhesive layer is further limited to be an acrylic adhesive layer with the thickness of 10-15 mu m, and the adhesive in the acrylic adhesive layer is acrylic adhesive subjected to high-temperature desolventizing treatment.
The novel limitation is that the tensile reinforcement belt is preferably an acetate fiber woven belt or an aramid fiber woven belt, the width of a single tensile reinforcement belt is 1/6-1/5 of the width of the polyimide film base belt, and the sum of the widths of the tensile reinforcement belts is 1/2-2/3 of the width of the polyimide film base belt.
As a further limitation, the protective film layer is an aluminum oxide film layer.
Has the advantages that: the utility model has reasonable structure, the polyimide film base band is used as the base material, and the thermosetting phenolic resin glue layers are used as the supporting structures at the two sides of the base material, so that the adhesive tape has the advantages of good insulativity, strong heat resistance, strong high temperature resistance and good corrosion resistance; meanwhile, the short aramid fiber monofilaments are arranged to perform tensile reinforcement in the width direction and the oblique direction, and the tensile reinforcement in the length direction is performed by using the tensile reinforcement, so that the adhesive tape can be better attached to the surface of a flexible material on the basis of improving the overall mechanical strength of the adhesive tape, and the stability of the overall performance of the adhesive tape can be ensured in a long-term bending use state; the adhesive is particularly suitable for the bonding treatment of areas needing insulation of consumer electronic products.
Drawings
Fig. 1 is an enlarged cross-sectional detail view of a preferred embodiment of the present invention.
Wherein: 1. a protective film layer; 2. an aramid fiber reinforcement layer; 3. a second thermosetting phenolic resin adhesive layer; 4. a polyimide film base band; 5. a first thermosetting phenolic resin adhesive layer; 6. a tensile reinforcement band; 7. a layer of nano-aluminum hydroxide particles; 8. an adhesive layer; 9. and (4) release paper.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand and understand, the present invention is further explained by combining with the specific drawings.
Referring to fig. 1, a detailed cross-sectional structure of the flexible high-strength polyimide film adhesive tape in the embodiment in the width direction is shown, in the illustration of the embodiment, a substrate of the flexible high-strength polyimide film adhesive tape is a polyimide film base tape 4, and a second thermosetting phenolic resin adhesive layer 3 and a first thermosetting phenolic resin adhesive layer 5 are respectively formed on an upper surface and a lower surface of the polyimide film base tape 4.
The total thickness of the flexible high-strength polyimide film adhesive tape of the embodiment excluding the thickness of the release paper 9 is 145 μm, wherein the thickness of the polyimide film base tape 4 as the substrate is 20 μm, the thickness of the first thermosetting phenolic resin adhesive layers 5 arranged on both sides of the substrate is 25 μm, and the thickness of the second thermosetting phenolic resin adhesive layer 3 is 55 μm; the release paper 9 had a thickness of 45 μm and was subjected to a peeling treatment at the time of use.
The outer side surface of the first thermosetting phenolic resin glue layer 5 is sprayed with a layer of nano aluminum hydroxide particles to form a nano aluminum hydroxide particle layer 7 when the thermosetting phenolic resin glue layer 5 is not completely hardened, an acrylic adhesive with the thickness of 15 mu m is uniformly coated on the surface of the thermosetting phenolic resin glue layer 5 after the thermosetting phenolic resin glue layer 5 is completely hardened to serve as an adhesive layer 8, and the acrylic adhesive serving as a raw material is an acrylic adhesive subjected to high-temperature solvent removal treatment; and a layer of release paper 9 is adhered to the surface of the adhesive layer 8.
The surface of the second thermosetting phenolic resin glue layer 3 is provided with a layer of aramid fiber reinforced layer 2 and three tensile reinforced belts 6; the aramid fiber reinforced layer 2 is formed by filling chopped aramid fiber monofilaments, the tensile reinforced belts 6 are aramid fiber woven belts, the width of each single aramid fiber woven belt is 1/6 of the width of the polyimide film base belt 4, the adjacent tensile reinforced belts 6 are paved on the surface of the aramid fiber reinforced layer 2 at equal intervals, the aramid fiber reinforced layers 2 of the second thermosetting phenolic resin glue layers 3 are pressed into the second thermosetting phenolic resin glue layers 3 when the second thermosetting phenolic resin glue layers 3 are not completely cured, and in addition, aluminum oxide thin film layers are formed on the surfaces of the aramid fiber reinforced layers 2 of the second thermosetting phenolic resin glue layers 3 and the tensile reinforced belts 6 to serve as the protective film layers 1.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that various changes, modifications and/or alterations to the present invention may be made by those skilled in the art after reading the technical disclosure of the present invention, and all such equivalents may fall within the scope of the present invention as defined by the appended claims.
Claims (8)
1. A flexible high-strength polyimide film adhesive tape comprises a polyimide film base band and is characterized in that a first thermosetting phenolic resin adhesive layer and a second thermosetting phenolic resin adhesive layer are respectively formed on two side surfaces of the polyimide film base band, an adhesive layer is coated on the outer side of the first thermosetting phenolic resin adhesive layer, a release film or release paper is adhered through the adhesive layer, and meanwhile, a nano aluminum hydroxide particle layer is formed between the first thermosetting phenolic resin adhesive layer and the adhesive layer; an aramid fiber reinforced layer, tensile reinforced belts and a protective film layer are sequentially formed on the outer surface of the second thermosetting phenolic resin glue layer, the length of each tensile reinforced belt is consistent with that of the polyimide film base band, the number of the tensile reinforced belts is more than or equal to 2, and the tensile reinforced belts are arranged in parallel at equal intervals in the width direction of the polyimide film base band; the aramid fiber reinforced layer and the tensile reinforced belt are pressed into the second thermosetting phenolic resin glue layer during molding.
2. The flexible high-strength polyimide film adhesive tape according to claim 1, wherein the total thickness of the flexible high-strength polyimide film adhesive tape is 120 to 150 μm, and the thickness of the polyimide film base tape is 15 to 25 μm, excluding the thickness of the release film or the release paper.
3. The flexible high-strength polyimide film adhesive tape according to claim 1, wherein the thickness of the first thermosetting phenolic resin adhesive layer is 20-30 μm; the thickness of the second thermosetting type phenolic resin adhesive layer is 50-60 mu m.
4. The flexible high-strength polyimide film tape according to claim 1, wherein the reinforcing material filled in the aramid fiber reinforcing layer is chopped aramid fiber monofilaments.
5. The flexible high-strength polyimide film adhesive tape according to claim 1, wherein the adhesive layer is an acrylic adhesive layer with a thickness of 10-15 μm; and the adhesive in the acrylic adhesive layer is acrylic adhesive subjected to high-temperature desolventization treatment.
6. The flexible high-strength polyimide film adhesive tape according to claim 1, wherein the tensile reinforcement tape is an acetate fiber woven tape or an aramid fiber woven tape.
7. The flexible high-strength polyimide film adhesive tape according to claim 1, wherein the width of the tensile reinforcement bands is 1/6-1/5 of the width of the polyimide film base band, and the sum of the widths of the tensile reinforcement bands is 1/2-2/3 of the width of the polyimide film base band.
8. The flexible high-strength polyimide film adhesive tape according to claim 1, wherein the protective film layer is an aluminum oxide film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922436586.7U CN211896770U (en) | 2019-12-30 | 2019-12-30 | Flexible high-strength polyimide film adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922436586.7U CN211896770U (en) | 2019-12-30 | 2019-12-30 | Flexible high-strength polyimide film adhesive tape |
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| Publication Number | Publication Date |
|---|---|
| CN211896770U true CN211896770U (en) | 2020-11-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922436586.7U Expired - Fee Related CN211896770U (en) | 2019-12-30 | 2019-12-30 | Flexible high-strength polyimide film adhesive tape |
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| CN (1) | CN211896770U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114686131A (en) * | 2021-12-30 | 2022-07-01 | 江西优钛新材料科技有限公司 | high-Tg cover film and preparation method thereof |
-
2019
- 2019-12-30 CN CN201922436586.7U patent/CN211896770U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114686131A (en) * | 2021-12-30 | 2022-07-01 | 江西优钛新材料科技有限公司 | high-Tg cover film and preparation method thereof |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201110 Termination date: 20211230 |
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| CF01 | Termination of patent right due to non-payment of annual fee |