CN211831310U

CN211831310U - Bowl-hole double-sided circuit board with multiple copper wires on back surface

Info

Publication number: CN211831310U
Application number: CN201920867740.3U
Authority: CN
Inventors: 王定锋; 徐文红; 冉崇友; 李小龙; 琚生涛; 冷求章
Original assignee: Tongling Ruichang Circuit Technology Co ltd
Current assignee: Tongling Ruichang Circuit Technology Co ltd
Priority date: 2019-06-02
Filing date: 2019-06-02
Publication date: 2020-10-30
Anticipated expiration: 2029-06-02

Abstract

The utility model relates to a bowl hole double-sided circuit board of many copper lines in back, particularly, with the single-sided circuit board of positive etching or cross cutting circuit, back insulating film surface rubber coating, the mould dashes or the rig bores the conducting hole, back circuit covers four copper lines on the membrane of taking the glue, then on pasting back circuit with the front haplopore that has the conducting hole, the pressfitting toasts and makes its gluey solidification, see from the front that there are two copper lines to expose in every hole, perhaps there are two copper lines to expose in some holes, only a copper line exposes in another part hole, the double-sided bowl hole circuit board that has two lines to expose in the bowl hole has been made promptly.

Description

Bowl-hole double-sided circuit board with multiple copper wires on back surface

Technical Field

The utility model relates to a circuit board field, concretely relates to bowl hole double-sided circuit board of many copper lines in back.

Background

According to the traditional double-sided circuit board, a through hole is drilled on a copper-clad plate in a drilling or punching mode generally in the conduction of a double-sided circuit, then a conductive layer is formed on the inner wall of the through hole on the double-sided circuit board through a copper electroplating process to electrically conduct the double-sided circuit, the back circuit is a positive circuit and a negative circuit which are manufactured by etching back copper foil generally, the environment is seriously polluted due to the fact that electroplating and etching are needed, and the back circuit is small in current-carrying capacity and large in voltage drop due to the fact that the copper foil is manufactured.

In order to overcome above defect and not enough, the utility model discloses back circuit adopts four metal conductor direct cladding to close at the back of front circuit, and the place that needs to switch on at double-sided circuit sets up the conduction hole and forms bowl form hole, and when the terminal uses, directly adopts soldering tin to weld in bowl hole position department, makes front circuit and back circuit welding switch on, the utility model discloses a double-sided circuit board need not electroplate, and clean environmental protection, back metal conductor are four round wires or flat wire, perhaps strand wire, perhaps weave the wire, and the current-carrying capacity is big, and the pressure drop is little.

SUMMERY OF THE UTILITY MODEL

The utility model relates to a bowl hole double-sided circuit board of many copper lines in the back, particularly, with the single-sided circuit board of positive etching or cross cutting circuit, back insulating film surface rubber coating, the mould dashes or the rig bores the conducting hole, back circuit covers four copper lines on the membrane of taking the glue, then on pasting back circuit with the front haplopore that has the conducting hole, the pressfitting toasts and makes its gluey solidification, there are two copper lines to expose from openly in every hole, perhaps there are two copper lines to expose in some holes, only one copper line exposes in another part hole, the two-sided bowl hole circuit board that has two lines to expose in the bowl hole has been made promptly.

According to the utility model provides a bowl hole double-sided circuit board of many copper lines in back, include: a back side insulating film layer; a back side conductive line circuit layer; an intermediate insulating layer; a front side circuit layer; a front solder mask layer; it is characterized in that the back insulation film layer is provided with welding spot windows or is totally closed, the back lead circuit is 3 or more than 3 metal leads, the leads are round wires, flat leads, twisted leads or braided leads, according to the circuit design, the position of the double-sided circuit needing to be conducted is provided with a conducting hole which penetrates through the middle insulating layer, the front circuit layer and the front solder mask layer, the back circuit is exposed from the hole and faces to the front, two wires are exposed on the front surface in each hole, or two wires are exposed in one part of the holes and one wire is exposed in the other part of the holes, the distance between two lines exposed from the front surface at the bottom of one hole is not less than 0.05mm and not more than 1mm, the circuit on the front side is formed by removing part of copper from copper foil, and the solder mask on the front side is ink solder mask or cover film solder mask.

According to a preferred embodiment of the present invention, the bowl-hole double-sided circuit board with a plurality of copper wires on the back surface is characterized in that the flat wire is a round wire formed by wire pressing or a flat wire cut by cutting a metal foil.

The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.

Drawings

The features, objects, and advantages of the present invention will become more apparent from the reading of the specification in conjunction with the following drawings, a brief description of which follows.

FIG. 1 is a schematic plan view of a front circuit manufactured by etching a single-sided flexible copper-clad plate.

Fig. 2 is a schematic plan view of the circuit on the front side after printing front side solder mask.

Fig. 3 is a schematic plan view of a single-sided circuit board with a front-side circuit having a via hole punched therein, the via hole penetrating through an intermediate insulating layer, a front-side circuit layer and a front-side solder resist layer.

Fig. 4 is a schematic plan view of the rear wiring circuit disposed on the rear insulating film.

Fig. 5 is a schematic plan view of a bowl-hole double-sided circuit board with four copper wires on the back side.

Fig. 6 is a schematic cross-sectional view of a bowl-hole double-sided circuit board with four copper wires on the back side at the position of the bowl hole.

Fig. 7 is a schematic cross-sectional view of a bowl-holed double-sided circuit board with four copper wires on the back side, at the location of a component pad.

Detailed Description

The present invention will be described in detail below by taking preferred embodiments as examples.

It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.

The method comprises the steps of manufacturing a front circuit 1 (shown in figure 1) by adopting a traditional circuit board manufacturing process and carrying out silk-screen printing of circuit anti-corrosion ink, baking and curing, etching and film stripping on a single-sided flexible copper-clad plate, then carrying out silk-screen printing of solder resist 2 on the front circuit 1, exposing a pad 1.2 of a soldering element and a pad 1.1 of a soldering power line, then carrying out silk-screen printing of characters and OSP oxidation resistance to manufacture a single-sided circuit board (shown in figure 2), then coating glue on the back of the single-sided circuit board, punching a through hole 1.3 at a position where a double-layer circuit needs to be conducted by using a designed and manufactured die on a punching machine, and enabling the through hole 1.3 to penetrate through an intermediate insulating layer 3, the front circuit layer 1 and.

Placing a plurality of rolls of flat wires 4 on a pay-off stand of a wire covering machine, positioning, arranging and covering the flat wires on a back insulating film 5 through a spacing rod die arranged on the wire covering machine (as shown in figure 4), and simultaneously, aligning and covering the flat wires on the back with a glue coating surface of a single-sided circuit board punched with a via hole 1.3, wherein the flat wires 4 on the back are exposed from the via hole 1.3 to the front, two flat wires 4 are exposed in each hole (as shown in figure 5), baking and curing the flat wires to manufacture a bowl-hole double-sided circuit board with four copper wires on the back (as shown in figures 5, 6 and 7), wherein figure 6 is a bowl-hole double-sided circuit board with four copper wires on the back, and a cross-sectional schematic diagram at a bowl-hole position is shown in figure 7, and a cross-sectional schematic diagram at a component pad.

The utility model discloses back circuit adopts the direct combination of four metal conductors at the back of front circuit, sets up the hole that switches on and forms bowl form hole in the place that double-sided circuit need switch on, when the terminal uses, directly adopts soldering tin to weld in bowl hole position department, makes front circuit and back circuit welding switch on, the utility model discloses a double-sided circuit board need not electroplate, and clean environmental protection, back metal conductor are four round wires or flat wire, perhaps strand wire, perhaps weave the wire, and the current-carrying capacity is big, and the pressure drop is little.

The present invention has been described in detail with reference to the accompanying drawings, in which the present invention is illustrated in detail with reference to the specific embodiments of a bowl-hole double-sided circuit board with a plurality of copper wires on the back surface. It will be understood by those skilled in the art, however, that the foregoing is illustrative and descriptive of some specific embodiments only, and not limiting as to the scope of the invention, and particularly the scope of the claims.

Claims

1. A bowl hole double-sided circuit board with a plurality of copper wires on the back comprises:

a back side insulating film layer;

a back side conductive line circuit layer;

an intermediate insulating layer;

a front side circuit layer;

a front solder mask layer;

it is characterized in that the back insulation film layer is provided with welding spot windows or is totally closed, the back lead circuit is 3 or more than 3 metal leads, the leads are round wires, flat leads, twisted leads or braided leads, according to the circuit design, the position of the double-sided circuit needing to be conducted is provided with a conducting hole which penetrates through the middle insulating layer, the front circuit layer and the front solder mask layer, the back circuit is exposed from the hole and faces to the front, two wires are exposed on the front surface in each hole, or two wires are exposed in one part of the holes and one wire is exposed in the other part of the holes, the distance between two lines exposed from the front surface at the bottom of one hole is not less than 0.05mm and not more than 1mm, the circuit on the front side is formed by removing part of copper from copper foil, and the solder mask on the front side is ink solder mask or cover film solder mask.

2. The bowl-holed double-sided circuit board with multiple copper wires on the back side according to claim 1, wherein the flat wires are round wires rolled flat wires or metal foils cut into flat wires.