CN211742531U - Display screen module and non-color-cast display screen using same - Google Patents
Display screen module and non-color-cast display screen using same Download PDFInfo
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- CN211742531U CN211742531U CN202020464524.7U CN202020464524U CN211742531U CN 211742531 U CN211742531 U CN 211742531U CN 202020464524 U CN202020464524 U CN 202020464524U CN 211742531 U CN211742531 U CN 211742531U
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- 238000000748 compression moulding Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
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- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
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- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
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Abstract
The utility model discloses a display screen module and use its not colour cast display screen, wherein the display screen module includes a module base plate and a plurality of pixel packaging structure, and a plurality of pixel packaging structure arrange into a encapsulation array on the module base plate. Each pixel packaging structure comprises a plurality of pixels arranged at intervals and a packaging layer covering the pixels, wherein each pixel comprises a plurality of light-emitting elements with different colors, in two adjacent pixels, the light-emitting elements of one pixel are arranged along the column direction of the packaging array, and the light-emitting elements of the other pixel are arranged along the row direction of the packaging array. Therefore, when the display is watched at different angles, the display color can not generate color cast.
Description
Technical Field
The present invention relates to a display module, and more particularly to a display module with RGB three primary color pixels in a single package.
Background
The Light-Emitting Diode (LED) has the advantages of small size, high Light-Emitting efficiency, low energy consumption, environmental protection, and the like, and can emit different colored lights, thus having good application prospects in display screens. In order to have an optimal display effect, an existing LED display screen can be matched with red, green and blue LED chips in a pixel packaging body; however, as the resolution of the LED display screen is higher and higher, the size of the package body needs to be smaller and smaller, so as to make the pixels closer to each other, and the external electrodes connected with the red, green and blue LED chips are also more and more dense, which leads to the complicated circuit design and the relatively increased overall manufacturing difficulty and manufacturing cost.
In addition, in a pixel package used in the conventional LED display screen, red, green, and blue LED chips are generally arranged linearly and longitudinally, so that the distances from the red, green, and blue LED chips to the left and right edges of the package are the same and are not blocked by each other; although the user hardly has color cast in the display image when viewing from the left and right sides, the user perceives that the display image is reddish or bluish when viewing from above or below, and feels that the display image has a straight stripe feeling when viewing at a close distance. Alternatively, when the display screen needs to be changed from the horizontal configuration to the vertical configuration due to the use limitation (e.g., the height or width limitation of the installation space) or the requirement, the arrangement direction of the red, green and blue LED chips is also changed from the vertical configuration to the horizontal configuration, and the color shift phenomenon described above occurs again.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that, not enough to prior art provides a display screen module with high display quality.
In order to solve the above technical problem, the present invention provides a display module, which includes a module substrate and a plurality of pixel package structures. The pixel packaging structures are arranged on the module substrate to form a packaging array, wherein each pixel packaging structure comprises a plurality of pixels arranged at intervals and a packaging layer covering the pixels, and each pixel comprises a plurality of light-emitting elements with different colors. The plurality of light emitting elements of any one of the pixels are arranged along a column direction of the package array, and the plurality of light emitting elements of another adjacent one of the pixels are arranged along a row direction of the package array.
Furthermore, the light emitting elements are a first led chip, a second led chip and a third led chip, respectively, the first led chip has a light emitting wavelength of 450 nm to 485 nm, the second led chip has a light emitting wavelength of 510 nm to 545 nm, and the third led chip has a light emitting wavelength of 605 nm to 650 nm.
Furthermore, the first led chips of two adjacent pixels have a first horizontal distance, the second led chips of two adjacent pixels have a second horizontal distance, and the third led chips of two adjacent pixels have a third horizontal distance, wherein the first horizontal distance is greater than the second horizontal distance, and the second horizontal distance is greater than the third horizontal distance.
Furthermore, each of the pixel package structures further includes a package substrate for disposing a plurality of the pixels, the package substrate has a substrate boundary, the first led chip of each of the pixels is closest to the substrate boundary, and the third led chip is farthest from the substrate boundary.
Furthermore, the packaging layer comprises a plurality of packaging parts and a plurality of connecting parts, the plurality of packaging parts respectively cover the plurality of pixels, and each connecting part is connected between two adjacent packaging parts and defines a groove together with the two adjacent packaging parts.
Furthermore, the bottom surface of the groove is lower than the light-emitting surface of at least one light-emitting element in the pixel.
Furthermore, each pixel defines a reference plane passing through the respective plurality of light emitting elements and perpendicular to the module substrate, and the structures of the corresponding encapsulation parts are bilaterally symmetrical relative to the reference plane.
Furthermore, two adjacent packaging parts are arranged in bilateral symmetry by taking the corresponding connecting parts as a reference.
Furthermore, a plurality of the pixels of each pixel packaging structure are arranged into a 2M×2NThe pixel array of (2); m and N are integers greater than 1.
In order to solve the above technical problem, the utility model discloses another technical scheme who adopts provides a display screen that does not have colour cast, and it includes a plurality of display screen modules that have aforementioned structure, and is a plurality of the display screen module concatenation is in the same place.
The utility model discloses an one of them beneficial effect lies in, the utility model provides a display screen module and display screen that does not have look bias, it can arrange into an encapsulation array on the module base plate through "a plurality of pixel packaging structure, wherein each pixel packaging structure includes the pixel that a plurality of mutual intervals set up, a plurality of light emitting component of arbitrary pixel are arranged along encapsulation array's row direction, and a plurality of light emitting component of another adjacent pixel are arranged along encapsulation array's row direction" technical scheme, in order to provide high definition, high resolution and luminance and the chroma all very even display effect, and different viewing angle's color is almost unchangeable moreover. In use, a plurality of display screen modules can be spliced together by the mechanism to form a larger size display screen.
Furthermore, the manufacturing process of the display screen module of the present invention is simple, easy to operate and master, and the obtained product has stable quality, and is suitable for mass production.
For a further understanding of the nature and technical content of the present invention, reference should be made to the following detailed description and accompanying drawings, which are provided for reference and illustration purposes only and are not intended to limit the invention.
Drawings
Fig. 1 is a schematic partial top view of a display screen module according to the present invention.
Fig. 2 is a schematic cross-sectional view taken along section II-II of fig. 1.
Fig. 3 is another schematic cross-sectional view taken along section II-II of fig. 1.
Fig. 4 is a schematic structural diagram of a display screen without color cast according to the present invention.
Detailed Description
The following is a description of the embodiments of the present invention relating to the display module and the color shift-free display screen by specific embodiments, and those skilled in the art can understand the advantages and effects of the present invention from the disclosure of the present specification. The utility model discloses the concrete embodiment of accessible other differences is implemented or is used, and each item detail in this specification also can be based on different viewpoints and application, does not deviate from the utility model discloses a carry out various modifications and changes under the design. The drawings of the present invention are merely schematic illustrations, and are not drawn to scale, but are described in advance. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
The display screen has wide application, and at least comprises an indoor display, a vehicle display, an outdoor information billboard, a display wall and the like. Therefore, the utility model provides a display screen module, it accords with the required requirement of display application completely, and for example high resolution, jumbo size and picture quality color are more lifelike.
Referring to fig. 1 to 3, a display panel module Z (or called "lamp panel module") of the present invention mainly includes a module substrate 1 and a plurality of pixel encapsulation structures 2, wherein the pixel encapsulation structures 2 are disposed on the module substrate 1 and arranged as an encapsulation array; in practical applications, the module substrate 1 may be a circuit board having a signal transmission line and a plurality of connection interfaces (e.g., external conductive pads), but the present invention is not limited thereto.
Further, each pixel package structure 2 includes a package substrate 21, a plurality of pixels 22 and a package layer 23, the plurality of pixels 22 are disposed on the package substrate 21 at intervals, preferably in a pixel array, which is illustrated as a 2 × 2 pixel array in fig. 1, wherein each pixel 22 includes a plurality of light emitting elements with different colors, and the package layer 23 covers the plurality of pixels 22. It is to be noted that, in two adjacent pixels 22, the light emitting elements of one pixel 22 are arranged along the column direction of the package array, and the light emitting elements of the other pixel 22 are arranged along the row direction of the package array; therefore, the color cast phenomenon of the display screen can be improved, and the user can not perceive the color cast (color difference) of the displayed image when watching at different angles.
Although fig. 1 shows that each pixel package 2 includes four pixels 22 arranged in a 2 × 2 pixel array, the number and arrangement of the pixels may be changed according to the display effect to be achieved, such as standard Resolution (SD, 720 × 480 pixels), high Resolution (HD, 1280 × 720 pixels), Full high Resolution (Full HD, 1920 × 1080 pixels) or 4K Resolution (4K Resolution, 3840 × 2160 pixels or 4096 × 2160 pixels). In other words, a plurality of pixels 22 in each pixel package 2 can be arranged as one 2M×2NThe pixel array of (2); m and N are integers greater than 1.
In practical applications, the package substrate 21 may be an insulating substrate, and a plurality of connection interfaces (e.g., pixel electrodes) and a plurality of signal transmission interfaces (e.g., internal conductive structures) may be formed thereon. The light emitting elements of each pixel 2 can be a first led chip 22a, a second led chip 22b and a third led chip 22c, respectively, wherein the first led chip 22a is used for emitting blue light, the second led chip 22b is used for emitting green light, and the third led chip 22c is used for emitting red light, but the present invention is not limited thereto; the first led chip 22a, the second led chip 22b and the third led chip 22c can be electrically connected to the connection interface on the package substrate 21 through wires, wherein one end of the wire can be first soldered on the package substrate 21, and the other end of the wire is then soldered on the electrode of the light emitting element, so as to ensure stable connection of the wires. The encapsulation layer 3 may be formed of a transparent polymer material (such as epoxy resin and silicone resin) with low moisture and oxygen permeability, so as to protect the plurality of light emitting elements and ensure the plurality of light emitting elements to work normally.
In the present embodiment, the light emitting wavelength of the first LED chip 22a may be 450 nm to 485 nm, and the first LED chip 22a may be a blue LED chip. The light emitting wavelength of the second LED chip 22b may be 510 nm to 545 nm, and the second LED chip 22b may be a green LED chip, or may be composed of a blue LED chip and a wavelength conversion layer formed on the blue LED chip, wherein the wavelength conversion layer may have green phosphor. The light emitting wavelength of the third LED chip 22c may be 605 nm to 650 nm, and the third LED chip 22c may be a red LED chip, or a blue LED chip and a wavelength conversion layer formed on the blue LED chip, wherein the wavelength conversion layer may have red phosphor. However, the present invention is not limited to the above examples, and those skilled in the art can change the light emitting color and the implementation manner of the light emitting element according to actual needs.
The first LED chip 22a, the second LED chip 22b and the third LED chip 22c may be sub-millimeter light emitting diodes (mini LEDs) or micro light emitting diodes (micro LEDs) according to different applications. For example, the sub-millimeter light emitting diode can be applied to products such as mobile phones, televisions, vehicle panels, and notebook computers, and the micro light emitting diode can be applied to products such as mobile phones, televisions, vehicle panels, and wearable devices such as watches, augmented reality, and virtual reality.
Referring to fig. 1 again, the present invention finds that the light mixing of different color lights can be more uniform by the following configuration: in each pixel package structure 2, the first led chips 221a of two adjacent pixels 22 have a first horizontal distance D1, the second led chips 221b of two adjacent pixels 22 have a second horizontal distance D2, the third led chips 221c of two adjacent pixels 22 have a third horizontal distance D3, the first horizontal distance D1 is greater than the second horizontal distance D2, and the second horizontal distance D2 is greater than the third horizontal distance D3; in addition, the package substrate 21 has a substrate boundary 211, the first led chip 221a of each pixel 22 is closest to the substrate boundary 211, and the third led chip 221c is farthest from the substrate boundary 221 c.
Referring to fig. 2 and 3, the package layer 23 includes a plurality of package portions 231 and a plurality of connection portions 232, the package portions 231 respectively cover the pixels 22, and each connection portion 232 is connected between two adjacent package portions 231 and defines a groove R together with the two adjacent package portions 231. The groove R not only can separate two adjacent pixels 22, but also can change the transmission path of light in the encapsulation layer 23, so that the light emitted by the light emitting element in one of the pixels 22 cannot be transmitted to the other adjacent pixel 22 through the same medium, thereby reducing or avoiding crosstalk between the pixels 22. Preferably, the bottom BS of the groove R is lower than the light-emitting surface of at least one light-emitting element in the pixel 22, i.e. lower than the light-emitting surface 221a of the first led chip 22a, the light-emitting surface 221b of the second led chip 22b or the light-emitting surface 221c of the third led chip 22 c; more preferably, the bottom BS of the groove R is lower than the light-emitting surfaces of all the light-emitting elements in the pixel 22, i.e. lower than the light-emitting surfaces 221a of the first led chip 22a, the light-emitting surfaces 221b of the second led chip 22b and the light-emitting surfaces 221c of the third led chip 22 c.
In this embodiment, the grooves R may be formed by a compression molding method, i.e., the grooves R are formed when the encapsulation layer 23 is molded by a compression molding die (not shown), in this way, the side end of each encapsulation portion 231 may be formed with a transition arc TS, as shown in fig. 2. In addition, the groove R may be formed by cutting the encapsulation layer 23 at least once by a cutter (not shown), and in this way, a cutting plane CS may be formed at a side end of each encapsulation portion 231.
In addition, in order to reduce or avoid the total reflection phenomenon of the light inside each pixel 2, thereby improving the color uniformity and the color rendering capability, each pixel 2 defines a reference plane passing through the respective plurality of light emitting elements and perpendicular to the module substrate 1, and the structure of the encapsulation portion 31 is left-right symmetrical with respect to the reference plane. In addition, in order to improve luminance uniformity, two adjacent sealing portions 31 are arranged in bilateral symmetry with respect to the corresponding connecting portion 32.
Referring to fig. 4, the utility model also provides a display screen D that does not have colour cast, it includes a plurality of display screen module Z that have aforementioned structure, and a plurality of display screen module Z can be in the same place through the mechanism piece concatenation to form bigger size's display screen.
Advantageous effects of the embodiments
The utility model discloses an one of them beneficial effect lies in, the utility model provides a display screen module and display screen that does not have look bias, it can arrange into an encapsulation array on the module base plate through "a plurality of pixel packaging structure, wherein each pixel packaging structure includes the pixel that a plurality of mutual intervals set up, a plurality of light emitting component of arbitrary pixel are arranged along encapsulation array's row direction, and a plurality of light emitting component of another adjacent pixel are arranged along encapsulation array's row direction" technical scheme, in order to provide high definition, high resolution and luminance and the chroma all very even display effect, and different viewing angle's color is almost unchangeable moreover. In use, a plurality of display screen modules can be spliced together by the mechanism to form a larger size display screen.
Furthermore, each connecting part and two adjacent packaging parts define a groove together to separate two adjacent pixel regions, wherein the bottom surface of the groove is lower than the light-emitting surface of at least one light-emitting element in the pixel; therefore, the mutual interference of light among the pixels can be avoided, namely, the light emitted by the light-emitting element in one pixel cannot be transmitted to the other adjacent pixel through the same medium, so that the crosstalk phenomenon among the pixels is reduced or avoided.
Furthermore, the manufacturing process of the display screen module of the present invention is simple, easy to operate and master, and the obtained product has stable quality, and is suitable for mass production.
The above disclosure is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the claims of the present invention, so that all the equivalent technical changes made by the contents of the specification and the drawings are included in the scope of the claims of the present invention.
Claims (10)
1. A display screen module, the display screen module comprising:
a module substrate; and
a plurality of pixel package structures arranged in a package array on the module substrate, wherein each pixel package structure comprises a plurality of pixels arranged at intervals and a package layer covering the plurality of pixels, and each pixel comprises a plurality of light emitting elements with different colors;
wherein the plurality of light emitting elements of any one of the pixels are arranged along a column direction of the package array, and the plurality of light emitting elements of another adjacent pixel are arranged along a row direction of the package array.
2. The display screen module of claim 1, wherein the plurality of light emitting devices are a first led chip, a second led chip and a third led chip, respectively, the first led chip has an emission wavelength of 450 nm to 485 nm, the second led chip has an emission wavelength of 510 nm to 545 nm, and the third led chip has an emission wavelength of 605 nm to 650 nm.
3. The display screen module of claim 2, wherein the first LED chip of two adjacent pixels has a first horizontal distance, the second LED chip of two adjacent pixels has a second horizontal distance, the third LED chip of two adjacent pixels has a third horizontal distance, the first horizontal distance is greater than the second horizontal distance, and the second horizontal distance is greater than the third horizontal distance.
4. The display screen module of claim 2, wherein each of the pixel packages further comprises a package substrate for mounting a plurality of the pixels, the package substrate having a substrate boundary, the first LED chip of each of the pixels being closest to the substrate boundary and the third LED chip being farthest from the substrate boundary.
5. The display screen module of claim 1, wherein the encapsulation layer comprises a plurality of encapsulation portions and a plurality of connection portions, the plurality of encapsulation portions respectively cover the plurality of pixels, and each connection portion is connected between two adjacent encapsulation portions and defines a groove together with the two adjacent encapsulation portions.
6. The display screen module of claim 5, wherein a bottom surface of the groove is lower than a light emitting surface of at least one of the light emitting elements in the pixel.
7. The display screen module of claim 5, wherein each of the pixels defines a reference plane passing through the respective plurality of light emitting elements and perpendicular to the module substrate, and the corresponding encapsulation portions are configured to be left-right symmetric with respect to the reference plane.
8. The display screen module of claim 7, wherein two adjacent packaging portions are configured to be left-right symmetric with respect to the corresponding connecting portion.
9. The display screen module of claim 1, wherein the plurality of pixels of each pixel packaging structure are arranged in a row 2M×2NThe pixel array of (2); m and N are integers greater than 1.
10. A color cast-free display screen, wherein the color cast-free display screen comprises a plurality of display screen modules according to claim 1, and the plurality of display screen modules are spliced together.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020464524.7U CN211742531U (en) | 2020-04-02 | 2020-04-02 | Display screen module and non-color-cast display screen using same |
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| CN202020464524.7U CN211742531U (en) | 2020-04-02 | 2020-04-02 | Display screen module and non-color-cast display screen using same |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114639757A (en) * | 2022-03-22 | 2022-06-17 | 东莞市中麒光电技术有限公司 | Display module manufacturing method and display module |
| WO2022176906A1 (en) * | 2021-02-18 | 2022-08-25 | ソニーセミコンダクタソリューションズ株式会社 | Light-emitting device and display device |
| WO2022183393A1 (en) * | 2021-03-03 | 2022-09-09 | 泉州三安半导体科技有限公司 | Led packaging device and preparation method therefor |
| CN115171549A (en) * | 2022-06-29 | 2022-10-11 | 上海勤宽科技有限公司 | VR display screen and VR equipment based on Mini LED |
| TWI780939B (en) * | 2021-09-30 | 2022-10-11 | 隆達電子股份有限公司 | Display device |
| WO2024174398A1 (en) * | 2023-02-22 | 2024-08-29 | 深圳市奥拓电子股份有限公司 | Lamp-driver integrated full-view led packaging structure, and led display module |
-
2020
- 2020-04-02 CN CN202020464524.7U patent/CN211742531U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022176906A1 (en) * | 2021-02-18 | 2022-08-25 | ソニーセミコンダクタソリューションズ株式会社 | Light-emitting device and display device |
| WO2022183393A1 (en) * | 2021-03-03 | 2022-09-09 | 泉州三安半导体科技有限公司 | Led packaging device and preparation method therefor |
| TWI780939B (en) * | 2021-09-30 | 2022-10-11 | 隆達電子股份有限公司 | Display device |
| CN114639757A (en) * | 2022-03-22 | 2022-06-17 | 东莞市中麒光电技术有限公司 | Display module manufacturing method and display module |
| CN115171549A (en) * | 2022-06-29 | 2022-10-11 | 上海勤宽科技有限公司 | VR display screen and VR equipment based on Mini LED |
| CN115171549B (en) * | 2022-06-29 | 2023-12-22 | 上海勤宽科技有限公司 | VR display screen and VR equipment based on Mini LED |
| WO2024174398A1 (en) * | 2023-02-22 | 2024-08-29 | 深圳市奥拓电子股份有限公司 | Lamp-driver integrated full-view led packaging structure, and led display module |
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