CN211455719U - Novel LED integrated light source packaging structure - Google Patents

Abstract

The utility model relates to a lighting device technical field specifically is a novel LED integrated light source packaging structure, including encapsulation base, heat sink column and closing cap, the inside screw thread through-hole of having seted up of encapsulation base lower extreme, the inside light trough of having seted up in encapsulation base upper end, screw thread through-hole through connection is to the light trough in, the draw-in groove has been seted up to the edge in the light trough upper end, encapsulation base upper end outside edge is equipped with fixed thread, inside connection encapsulation support of inlaying in the middle of the encapsulation base both sides, the inside threaded connection heat sink column of screw thread through-hole, heat sink column lower extreme an organic whole takes shape is equipped with the heat-conducting plate, the heat: the sealed effect of encapsulation has been increased, can effectually prevent that steam and dust from entering into the inside LED light source to cause the influence to inside of encapsulation, can increase the protecting effect, improve the result of use of LED light source, and prevent that the LED light source from receiving steam and dust life-shortening, the life of extension LED light source.

Description

Novel LED integrated light source packaging structure

Technical Field

The utility model relates to lighting device technical field specifically is a novel LED integrated optical source packaging structure.

Background

LED (semiconductor light emitting diode) packages refer to packages of light emitting chips, which are significantly different compared to integrated circuit packages. The encapsulation of LEDs is required not only to protect the wick, but also to be transparent. The encapsulation of LEDs places special requirements on the encapsulation material.

The encapsulation sealing performance of LED light source among the prior art is relatively poor, inside steam can be easy entering into the encapsulation, and the entering of steam can influence the result of use of LED light source, but also can cause the damage of LED light source, reduces the life of LED light source, inside the dust also can enter into the encapsulation, piles up on the LED light source and influences illuminance, still can influence the radiating effect of LED light source, harms the LED light source even, for this reason, the utility model provides a novel LED integrated optical source packaging structure is used for solving above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a novel LED integrated optical source packaging structure to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a novel LED integrated light source packaging structure comprises a packaging base, a heat sink column and a sealing cover, wherein a threaded through hole is formed in the lower end of the packaging base, a lamp groove is formed in the upper end of the packaging base, the threaded through hole is communicated and connected into the lamp groove, a clamping groove is formed in the inner side edge of the upper end of the lamp groove, a fixing thread is arranged on the outer side edge of the upper end of the packaging base, a packaging support is embedded and connected in the middle of the two sides of the packaging base, the heat sink column is in threaded connection in the threaded through hole, a heat conducting plate is integrally formed at the lower end of the heat sink column, a plurality of radiating fins are arranged at the lower end of the heat conducting plate in a protruding mode, a fastening screw hole is formed in the middle of the lower end of the heat conducting plate, a circuit board is, the LED lamp is characterized in that a reflecting layer is bonded inside the lamp groove, a fluorescent layer is inserted into a groove in the inner edge of the upper end of the lamp groove, the outer side of the upper end of the packaging base is connected with a sealing cover through threads, and a connecting lens is embedded in the middle of the sealing cover.

Preferably, a die bond adhesive layer is bonded between the circuit board and the heat sink column, the circuit board is fixedly bonded to the upper end of the heat sink column through the die bond adhesive layer, and a transparent colloid is bonded to the outer side of the LED chip on the upper end of the circuit board.

Preferably, the lamp trough is in a round table shape with a large upper part and a small lower part, a reflecting layer is bonded on the inner wall of the lamp trough, and the reflecting layer is made of a mercury plating layer.

Preferably, the sealing ring is arranged at the lower end of the joint between the fluorescent layer and the sealing cover and the packaging base in a padding mode, and the sealing gasket is bonded at the upper end of the heat conducting plate on the outer side of the heat sink column.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses increased the sealed effect of encapsulation, can effectually prevent that steam and dust from entering into the inside LED light source to inside of encapsulation and causing the influence, can increase the protecting effect, improve the result of use of LED light source, and prevent that the LED light source from receiving steam and dust life shortening, the life of extension LED light source.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

In the figure: the LED packaging structure comprises a packaging base 1, a threaded through hole 2, a heat sink column 3, a heat conducting plate 4, a heat dissipation fin 5, a packaging support 6, a lamp groove 7, a light reflecting layer 8, a circuit board 9, a die bonding glue layer 10, an LED chip 11, a gold wire 12, a fluorescent layer 13, a sealing cover 14, a lens 15, a sealing ring 16 and a transparent colloid 17.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, the present invention provides a technical solution: a novel LED integrated light source packaging structure comprises a packaging base 1, a heat sink column 3 and a sealing cover 14, wherein a threaded through hole 2 is formed in the lower end of the packaging base 1, a lamp groove 7 is formed in the upper end of the packaging base 1, the threaded through hole 2 is communicated and connected into the lamp groove 7, a clamping groove is formed in the inner side edge of the upper end of the lamp groove 7, a fixing thread is arranged on the outer side edge of the upper end of the packaging base 1, a packaging support 6 is embedded and connected in the middle of the two sides of the packaging base 1, the heat sink column 3 is connected in a threaded manner in the threaded through hole 2, a heat conducting plate 4 is integrally formed at the lower end of the heat sink column 3, a plurality of radiating fins 5 are arranged at the lower end of the heat conducting plate 4 in a protruding manner, a fastening screw hole is formed in the middle of the lower end of the heat conducting plate 4, a, the inside bonding of light trough 7 has reflection of light layer 8, and fluorescent layer 13 is pegged graft in the recess of light trough 7 upper end inside edge, and encapsulation base 1 upper end outside is through threaded connection closing cap 14, and connecting lens 15 is inlayed in the middle of closing cap 14.

The utility model discloses can further set up to, it has solid brilliant glue film 10 to bond between circuit board 9 and the heat sink column 3, bonds circuit board 9 fixed bonding in the 3 upper ends of heat sink column through solid brilliant glue film 10, and the 11 outsides of circuit board 9 upper end LED chip are glued and are covered with transparent colloid 17, can bond circuit board 9 fixedly through solid brilliant glue film 10, and solid brilliant glue film 10 can play the effect of heat conduction simultaneously, increases heat conduction heat dissipation cooling effect.

The utility model discloses can further set up to, light trough 7 is big-end-up's round platform form, and it has reflector layer 8 to bond on the 7 inner walls of light trough, and reflector layer 8 is made by mercury cladding material, can make the light source concentrate more through reflector layer 8, increases the result of use.

The utility model discloses can further set up to, the terminal pad is equipped with sealing washer 16 under fluorescent layer 13 and the junction between closing cap 14 and the encapsulation base 1, and 4 upper ends of the heat-conducting plate in the 3 outsides of heat sink post bond to have sealed the pad, can improve sealed effect through sealing washer 16 and sealed the pad, prevent that the steam dust from entering into the inside result of use who influences the LED light source of encapsulation, reduce the life of LED light source, increase protection effect, prolong the life of LED light source.

The working principle is as follows: when the LED lamp works, a heat sink column 3 is connected into a threaded through hole 2 at the bottom of a packaging base 1 in a threaded manner, the heat sink column 3 penetrates out of the threaded through hole 2 and is connected into a lamp groove 7, then a circuit board 9 is bonded on the upper end surface of the heat sink column 3 through a die bonding adhesive layer 10, a plurality of LED chips 11 are welded on the circuit board 9, a transparent colloid 17 is bonded on the circuit board 9 outside the LED chips 11, a heat conducting plate 4 is integrally formed at the lower end of the heat sink column 3, a plurality of radiating fins 5 are convexly arranged at the lower end of the heat conducting plate 4, fastening screw holes are arranged in the middle of the lower end of the heat conducting plate 4, packaging supports 6 are embedded and connected inside the left side and the right side of the packaging base 1, electric connection gold wires 12 are arranged on the circuit board 9, the gold wires 12 are electrically connected onto the packaging supports 6, then a reflecting layer 8 is, connecting lens 15 is inlayed in the middle of closing cap 14, and the terminal surface pad is equipped with sealing washer 16 under fluorescent layer 13 and closing cap 14 and packaging base 1's junction, can play sealed effect through sealing washer 16 and heat-conducting plate 4, prevents that the steam dust from entering into the inside result of use that influences the LED light source of encapsulation, can effectively increase the radiating effect through heat-conducting plate 4 and heat dissipation fin 5 of lower extreme moreover, protects the LED light source, prolongs the life of LED light source.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (4)

1. The utility model provides a novel LED integrated optical source packaging structure, includes packaging base (1), heat sink post (3) and closing cap (14), its characterized in that: the LED lamp is characterized in that a threaded through hole (2) is formed in the lower end of the packaging base (1), a lamp groove (7) is formed in the upper end of the packaging base (1), the threaded through hole (2) is connected into the lamp groove (7) in a penetrating manner, a clamping groove is formed in the inner side edge of the upper end of the lamp groove (7), a fixing thread is arranged on the outer side edge of the upper end of the packaging base (1), a packaging support (6) is embedded and connected in the middle of two sides of the packaging base (1), a heat sink column (3) is connected with the inner side of the threaded through hole (2) in a threaded manner, a heat conducting plate (4) is integrally formed at the lower end of the heat sink column (3), a plurality of heat dissipation fins (5) are arranged at the lower end of the heat conducting plate (4) in a protruding manner, a fastening screw hole is formed in the middle, gold thread (12) are connected to circuit board (9) both sides, gold thread (12) end-to-end connection is on encapsulation support (6), the inside bonding of light trough (7) has reflector layer (8), fluorescent layer (13) are pegged graft in the recess of light trough (7) upper end inside edge, threaded connection closing cap (14) is passed through in encapsulation base (1) upper end outside, connecting lens (15) are inlayed in closing cap (14) centre.

2. The novel LED integrated light source package structure of claim 1, wherein: a die bond layer (10) is bonded between the circuit board (9) and the heat sink column (3), the circuit board (9) is fixedly bonded at the upper end of the heat sink column (3) through the die bond layer (10), and a transparent colloid (17) is bonded on the outer side of an LED chip (11) at the upper end of the circuit board (9).

3. The novel LED integrated light source package structure of claim 1, wherein: the lamp groove (7) is in a round table shape with a large upper part and a small lower part, the inner wall of the lamp groove (7) is bonded with a reflecting layer (8), and the reflecting layer (8) is made of a mercury coating.

4. The novel LED integrated light source package structure of claim 1, wherein: and a sealing ring (16) is arranged at the lower end of the joint between the fluorescent layer (13) and the sealing cover (14) and the packaging base (1), and a sealing gasket is bonded at the upper end of the heat conducting plate (4) outside the heat sink column (3).

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