CN211125623U - Modular packaging structure - Google Patents
Modular packaging structure Download PDFInfo
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- CN211125623U CN211125623U CN202020151459.2U CN202020151459U CN211125623U CN 211125623 U CN211125623 U CN 211125623U CN 202020151459 U CN202020151459 U CN 202020151459U CN 211125623 U CN211125623 U CN 211125623U
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Abstract
The utility model discloses a module packaging structure includes: a substrate, wherein the substrate is provided with a first welding pad, a second welding pad and at least one anti-overflow assembly; the surface of the at least one first electronic component is provided with a plurality of first conductive contacts, and the first conductive contacts are attached and welded in an area surrounded by the anti-overflow components; a first encapsulation layer located among the at least one anti-overflow assembly, the at least one first electronic assembly and the substrate; at least one second electronic component, wherein a plurality of second conductive contacts are formed on the surface of the second electronic component, and the second conductive contacts are attached to the substrate outside the area surrounded by the anti-overflow components; and the second packaging layer coats the at least one second electronic component and the at least one second electronic component which are welded on the substrate in an attaching mode, coats the first packaging layer and the at least one anti-overflow component, and forms a closed cavity between the at least one second electronic component and the substrate.
Description
Technical Field
A package structure, and more particularly, to a package structure for modular packaging.
Background
With the rapid development of the electronic industry, various electronic products are required to have light, thin, small and small size while improving performance, and in order to meet the needs of complicated products and miniaturization of size in the industry, System In Package (SiP) technologies have been gradually developed in which related components are integrated into a single Package structure, such as Multi-Chip Package (MCP) and stack on Package (PoP).
In the field of communications, the third generation (3G) and fourth generation (4G) mobile communication technologies have evolved into the fifth generation (5G) mobile communication technology, and the frequency bands used in mobile communications have increased, and the requirements for surface acoustic Wave filters (SAW filters) in the communication system have also increased; the surface acoustic wave filter comprises interdigital electrodes and a substrate with piezoelectric property, an input electric signal is converted into an acoustic wave signal through inverse piezoelectric effect, and the acoustic wave signal is converted into an electric signal through positive piezoelectric effect and output, so that the surface acoustic wave filter has the electric property of filtering, wherein a cavity is required to be provided for transmitting acoustic wave energy when the surface acoustic wave filter is packaged.
In the current industry, a Wafer L ev Chip Scale Package (W L CSP) technology is mostly used to manufacture a cavity required by a surface acoustic wave filter, the surface acoustic wave filter is packaged according to a prototype size, and then the packaged surface acoustic wave filter and related components are packaged in a modular manner, however, the W L CSP technology is adopted to increase the packaging cost of the surface acoustic wave filter by several times to several tens times.
In addition, in the packaging process, the solder joints between the electronic components and the substrate are usually fixed by using a molding material such as liquid epoxy resin to prevent abnormal phenomena such as component offset or bridging during soldering, but the colloid of the liquid epoxy resin is easy to diffuse outward before curing, which affects the soldering effect of the adjacent components.
SUMMERY OF THE UTILITY MODEL
In order to improve the problem of the prior art, the utility model provides a module packaging structure, this module packaging structure includes:
a substrate, wherein a plurality of first bonding PADs (PAD) and a plurality of second bonding PADs are formed on one surface of the substrate, and an electronic circuit connected with the first bonding PADs and the second bonding PADs is arranged in the substrate;
the anti-overflow assembly is formed on the substrate, each anti-overflow assembly surrounds an area on the substrate, the first welding pads are located in the area, and the second welding pads are located outside the area;
at least one first electronic component, wherein a plurality of first conductive contacts are formed on the Surface of the first electronic component, the at least one first electronic component is connected with the corresponding first bonding pads through the first conductive contacts by using Surface Mount Technology (SMT), the at least one first electronic component is bonded on the substrate through the first conductive contacts, and the bonding position of the at least one first electronic component is in the area surrounded by the anti-overflow components;
the first packaging layer is formed by molding materials, is positioned among the at least one anti-overflow assembly, the at least one first electronic assembly and the substrate, coats the first welding pads and the first conductive contacts, and is used for fixing and protecting the first conductive contacts and preventing the first conductive contacts from deviating and flowing during welding;
at least one second electronic component, wherein a plurality of second conductive contacts are formed on the surface of the second electronic component, the at least one second electronic component is connected with the corresponding second bonding pads through the second conductive contacts by using a flip chip technology of Gold-to-Gold interconnection (GGI), the at least one second electronic component is bonded on the substrate through the second conductive contacts, and the bonding position of the at least one second electronic component is outside the area surrounded by the anti-overflow components;
and the second packaging layer is formed by packaging materials and covers the at least one first electronic component and the at least one second electronic component which are welded on the substrate in an attaching mode, the first packaging layer and the at least one anti-overflow component, wherein the second packaging layer covers the at least one second electronic component, and a closed cavity is formed between the at least one second electronic component and the substrate.
The modular packaging structure of the utility model improves the phenomenon that the colloid of the molding material is easy to diffuse outward before curing and affects the welding effect of the adjacent components in the prior art by the at least one anti-overflow component; and no additional die is needed for packaging, so that the packaging cost is reduced, and a closed cavity required by the operation of the surface acoustic wave filter is provided.
Drawings
FIG. 1: the utility model discloses be applied to the schematic diagram of module encapsulation.
FIG. 2A: a cross-sectional view of the base plate and the spill prevention assembly in the first embodiment.
FIG. 2B: a schematic view of the dam of the first embodiment.
FIG. 3: cross-sectional view of the first electronic assembly after soldering in the first embodiment.
FIG. 4: a cross-sectional view of the first encapsulation layer is formed in the first embodiment.
FIG. 5: in another embodiment the dam is a cross-sectional view.
FIG. 6: cross-sectional view of the second electronic assembly after soldering in the first embodiment.
FIG. 7: the first embodiment of the present invention is a cross-sectional view of a modular package structure.
FIG. 8: in a first embodiment of the present invention, the anti-overflow assembly, the first electronic assembly and the second electronic assembly are arranged at a relative distance.
FIG. 9: schematic illustration of a rectangular recess in a second embodiment.
FIG. 10: a cross-sectional view of the first electronic assembly after soldering in the second embodiment.
FIG. 11: second embodiment the cross-sectional view of the modular package structure of the present invention
Detailed Description
The following description of the preferred embodiments of the present invention will be made in conjunction with the drawings and the accompanying drawings to further illustrate the technical means adopted to achieve the objects of the present invention.
Referring to fig. 1, in a first embodiment, the modular package structure of the present invention includes a substrate 10, the substrate 10 has a plurality of units, each of the units includes at least one anti-overflow element 13, at least one first electronic element 20 and at least one second electronic element 40, and the plurality of units of the substrate 10 are modularly packaged at the same time, and a single unit is taken as an example to illustrate the modular package structure of the present invention.
Referring to fig. 2A, fig. 2A is a schematic cross-sectional view of fig. 1 at a cut-off line YY, a plurality of first pads 11, a plurality of second pads 12, and at least one anti-overflow assembly 13 are formed on a surface of the substrate 10, the first pads 11 and the second pads 12 are connected to an electronic circuit existing in the substrate 10, each anti-overflow assembly 13 surrounds an area on the substrate 10, the first pads 11 are located in the area, and the second pads 12 are located outside the area, wherein the substrate 10 may be an organic substrate, a ceramic substrate, a composite substrate, or a wafer, and each anti-overflow assembly 13 may change the shape of the surrounded area, such as a circle, a rectangle, or other irregular patterns, according to design requirements of different assemblies and packages. Referring further to fig. 2B, the at least one anti-overflow assembly 13 is exemplified as at least one rectangular DAM (DAM), and each of the anti-overflow assemblies 13 surrounds a rectangular area on the substrate 10.
Referring to fig. 3, at least one first electronic component 20 is disposed on the substrate 10, a plurality of first conductive contacts 21 are formed on a Surface of the at least one first electronic component 20, the first conductive contacts 21 may be metal bumps formed by metals of gold (Au), tin (Sn), copper (Cu), nickel (Ni), zinc (Zn), lead (Pb), or alloys thereof, the at least one first electronic component 20 is correspondingly connected to the first pads 11 through the first conductive contacts 21 by using Surface Mount Technology (SMT), and the at least one first electronic component 20 is bonded to the substrate 10 through the first conductive contacts 21 by performing a first reflow operation through a reflow oven after the first conductive contacts 21 are connected to the corresponding first pads 11, so that the at least one first electronic component 20 can be connected to the electronic circuit of the substrate 10 through the first conductive contacts 21 and the corresponding first conductive contacts 11, wherein, the height a of the at least one overflow prevention element 13 is greater than the distance B from the bottom surface of the at least one first electronic element 20 to the substrate 10 (i.e., a > B), and the height a of the at least one overflow prevention element 13 is not greater than 1 mm.
Referring to fig. 4, after the bonding operation of the at least one first electronic component 20 is completed, a molding material is injected between the at least one anti-overflow component 13 and the at least one first electronic component 20 to form a first encapsulation layer 30, and the first conductive contacts 21 and the first bonding pads 11 are encapsulated, wherein the first encapsulation layer 30 is made of Epoxy resin (Epoxy), and the proportion of additives such as a curing agent and a diluent in the Epoxy resin can be adjusted according to different requirements of the encapsulation process.
Referring to fig. 5, in another embodiment, the height C of the at least one anti-overflow element 13 is smaller than the distance D between the at least one first electronic element 20 and the substrate 10 (i.e., C < D), and the at least one anti-overflow element 13 may be formed between the position of the at least one first electronic element 20 after soldering and the substrate 10 according to product design requirements.
When the liquid epoxy resin is injected between the at least one anti-overflow element 13 and the at least one first electronic element 20, the flow range of the liquid epoxy resin is limited to the area surrounded by each anti-overflow element 13, so as to prevent the liquid epoxy resin from spreading out before curing, and avoid the phenomenon of affecting the soldering ability between the adjacent area and the electronic element.
Referring to fig. 6, at least one second electronic component 40 is further disposed on the substrate 10, a plurality of second conductive contacts 42 are formed on a surface of the at least one second electronic component 40, the second conductive contacts 42 may be Gold bumps formed of Gold (Au) or a Gold alloy thereof, and the at least one second electronic component 40 is correspondingly connected to the second pads 12 through the second conductive contacts 42 by using a Gold-to-Gold interconnection (GGI) flip-chip technology. Because the temperature of the reflow oven is mostly lower than 300 ℃, the second conductive contacts 42 are not melted to cause bridging phenomenon if reflow operation is needed, the quality after reflow can be ensured, and the first packaging layer 30 wraps the first conductive contacts 21 to prevent abnormal phenomena such as component offset and bridging between the first conductive contacts 21 when the at least one first electronic component 20 is subjected to the second reflow operation.
Referring to fig. 7, after the bonding operation of the at least one second electronic component 40 is completed, the substrate 10, the at least one anti-overflow component 13, the at least one first electronic component 20, the first encapsulation layer 30 and the at least one second electronic component 40 are covered with a dry epoxy resin sheet, and the dry epoxy resin sheet is heated and pressurized to soften and conform to the substrate; the sheet epoxy is softened and attached to the surfaces of the substrate 10, the at least one anti-overflow element 13, the at least one first electronic element 20, the first encapsulating layer 30 and the at least one second electronic element 40 to form the second encapsulating layer 50. The second package layer 50 is used to prevent the electronic components from being corroded and damaged by external force or external moisture, chemicals, etc., and provide protection, wherein the sheet-shaped dry epoxy resin is attached along the surface of the at least one second electronic component 40 after being heated and softened, so that a closed cavity 51 is formed between the substrate 10 and the at least one second electronic component 40 after the sheet-shaped dry epoxy resin is cured, and the sheet-shaped dry epoxy resin with different sizes can be cut or the thickness of the sheet-shaped dry epoxy resin can be increased according to different product designs and package requirements, without using an additional mold for packaging, thereby reducing the packaging cost.
Referring to fig. 8, the following describes the distance relationship between the at least one spill prevention element 13, the at least one first electronic element 20 and the at least one second electronic element 40 in a first embodiment, the side of the at least one first electronic component 20 closest to the at least one second electronic component 40 is a first side, and the first side is a second side, a third side, and a fourth side in sequence along the clock direction, in the present invention, a molding material can be injected from the second, third, or fourth side for packaging, the third side is taken as an example in this embodiment, the shortest distance from the first side of the at least one first electronic component 20 to the at least one spill-proof component 13 is distance E1, the shortest distance from the second side to the fourth side to the at least one spill-proof assembly 13 is respectively distances E2-E4, the distances E1, E2 and E4 can be different distances, and the distance E3 is not less than 0.01mm for performing the packaging operation of the injection molding material; the shortest distance between the at least one anti-overflow assembly 13 and the at least one second electronic assembly 40 is a distance F, and the distance F is not less than 0.01 mm; and a plurality of second electronic components 40 can be welded outside the area surrounded by each overflow preventing component 13, wherein the spacing distance of the second electronic components 40 is not less than 0.01 mm.
Referring to fig. 9, in the second embodiment, the at least one anti-overflow element 13 is formed in at least one recess of the substrate 10, and each recess surrounds a rectangular area on the substrate 10, the first pads 11 are located in the rectangular area, and the second pads 12 are located outside the rectangular area.
The at least one first electronic component 20 is connected to the corresponding first pads 11 through the first conductive contacts 21, and after the first conductive contacts 21 are connected to the corresponding first pads 11, a first reflow operation is performed through a reflow oven, so that the at least one first electronic component 20 is attached to the substrate 10 through the first conductive contacts 21. Referring further to fig. 10, after the bonding operation of the at least one first electronic component 20 is completed, liquid epoxy is injected between the at least one anti-overflow component 13 and the at least one first electronic component 20 to form a first encapsulation layer 30.
When the liquid epoxy resin is injected between the at least one anti-overflow element 13 and the at least one first electronic element 20, the liquid epoxy resin flows into the at least one anti-overflow element 13 before curing and when the liquid epoxy resin is diffused outwards, so that the phenomenon that the liquid epoxy resin is diffused to an adjacent area and the welding capability of the adjacent area and the electronic elements is influenced can be prevented.
Referring to fig. 11, the at least one second electronic component 40 is connected to the corresponding second bonding pad 12 through a plurality of second conductive contacts 42; after the bonding operation of the at least one second electronic component 40 is completed, the substrate 10, the at least one anti-overflow component 13, the at least one first electronic component 20, the first encapsulation layer 30 and the at least one second electronic component 40 are covered with a dry sheet epoxy resin, and the dry sheet epoxy resin is heated and pressurized to soften and conform; the sheet epoxy resin is softened and attached to the surfaces of the substrate 10, the at least one anti-overflow element 13, the at least one first electronic element 20, the first encapsulating layer 30 and the at least one second electronic element 40 to form the second encapsulating layer 50, and after the second encapsulating layer 50 is formed, a sealed cavity 51 is formed between the substrate 10 and the at least one second electronic element 40.
In the current communication field, a switch usually corresponds to a plurality of surface acoustic wave filters and power amplifiers for switching the electronic equipment to the corresponding response frequency. In one embodiment, the modular package structure of the present invention is applied to modular packaging, wherein the at least one first electronic component 20 is a switch, the at least one second electronic component 40 is a surface acoustic wave filter, and the at least one anti-overflow component 13 is at least one dam; the substrate 10 has a plurality of units, each of which can modularly package the switch and the plurality of surface acoustic wave filters, and then the substrate 10 is split or cut according to the product requirement to form a single modularized product.
To sum up, the utility model discloses module packaging structure improves among the prior art shaping material solidification easily outward diffusion through this at least anti-overflow subassembly 13, influences the phenomenon of adjacent subassembly welding effect, uses dry-type epoxy to can be different according to product design and encapsulation demand, cuts the slice dry-type epoxy of not unidimensional or increases its thickness, need not adopt extra mould to encapsulate, can provide the required airtight cavity of surface acoustic wave filter function, reduces the encapsulation cost, improves and adopts W L CSP technique and causes the problem that the encapsulation cost improves among the prior art.
The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above description, and although the present invention has been disclosed with the preferred embodiment, it is not limited to the present invention, and any skilled person in the art can make some modifications or equivalent changes to the equivalent embodiments by using the technical content disclosed above without departing from the technical scope of the present invention, but all the technical matters of the present invention do not depart from the technical content of the present invention, and any simple modification, equivalent changes and modifications made to the above embodiments by the technical matters of the present invention still belong to the scope of the technical solution of the present invention.
Claims (12)
1. A modular package structure, comprising:
the circuit comprises a substrate, a plurality of first welding pads and a plurality of second welding pads are formed on one surface of the substrate, and an electronic circuit connected with the first welding pads and the second welding pads is arranged in the substrate;
the anti-overflow assembly is formed on the substrate, each anti-overflow assembly surrounds an area on the substrate, the first welding pads are located in the area, and the second welding pads are located outside the area;
the surface of the at least one first electronic component is provided with a plurality of first conductive contacts which are connected with the corresponding first welding pads, and the at least one first electronic component is positioned in the area surrounded by the anti-overflow components;
a first packaging layer, which is arranged among the at least one anti-overflow assembly, the at least one first electronic assembly and the substrate and coats the plurality of first conductive contacts and the plurality of first welding pads;
at least one second electronic component, wherein a plurality of second conductive contacts are formed on the surface of the second electronic component, the second conductive contacts are gold bumps made of gold, the second electronic component is connected with the corresponding second welding pads through the second conductive contacts, and the second electronic component is positioned outside the area surrounded by the anti-overflow components;
the second packaging layer coats the at least one first electronic component, the at least one second electronic component, the first packaging layer and the at least one anti-overflow component on the substrate, and a closed cavity is formed between the at least one second electronic component and the substrate.
2. The modular packaging structure of claim 1, wherein the at least one overfill prevention component is at least one dam.
3. The modular package structure of claim 2, wherein the height of the at least one dam is not less than the shortest distance between the at least one first electronic component and the substrate after the at least one first electronic component is attached and soldered.
4. The modular package structure of claim 2, wherein the height of the at least one dam is less than the shortest distance between the at least one first electronic component and the substrate after the at least one first electronic component is attached and soldered.
5. The modular package structure of claim 1, wherein the at least one anti-spill component is at least one recess.
6. The modular package structure of any of claims 1-5, wherein the at least one first electronic component is SMT bonded to the substrate via surface mount technology.
7. The modular package structure of claim 6, wherein the first conductive contacts are metal bumps made of gold, tin, copper, nickel, zinc, lead, or alloys thereof.
8. The modular package structure of claim 7, wherein the molding material is a liquid epoxy.
9. The modular package structure of claim 8, wherein the at least one second electronic component is bonded to the substrate by flip-chip technology using gold-to-gold interconnects (GGIs).
10. The modular package structure of claim 9, wherein the encapsulant material is a dry epoxy.
11. The modular package structure of claim 10, wherein the at least one first electronic component is a switch.
12. The modular package structure of claim 11, wherein the at least one second electronic component is at least one SAW Filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020151459.2U CN211125623U (en) | 2020-02-04 | 2020-02-04 | Modular packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020151459.2U CN211125623U (en) | 2020-02-04 | 2020-02-04 | Modular packaging structure |
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| CN211125623U true CN211125623U (en) | 2020-07-28 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115621212A (en) * | 2022-11-07 | 2023-01-17 | 合肥矽迈微电子科技有限公司 | Anti-overflow packaging structure and chip mounting method thereof |
| CN116845032A (en) * | 2022-04-18 | 2023-10-03 | 锐石创芯(重庆)科技有限公司 | Chip packaging structure |
-
2020
- 2020-02-04 CN CN202020151459.2U patent/CN211125623U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116845032A (en) * | 2022-04-18 | 2023-10-03 | 锐石创芯(重庆)科技有限公司 | Chip packaging structure |
| CN116845032B (en) * | 2022-04-18 | 2024-10-29 | 锐石创芯(重庆)科技有限公司 | Chip packaging structure |
| CN115621212A (en) * | 2022-11-07 | 2023-01-17 | 合肥矽迈微电子科技有限公司 | Anti-overflow packaging structure and chip mounting method thereof |
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