CN211017061U - Heat dissipation device and heat dissipation assembly - Google Patents
Heat dissipation device and heat dissipation assembly Download PDFInfo
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- CN211017061U CN211017061U CN201921926238.1U CN201921926238U CN211017061U CN 211017061 U CN211017061 U CN 211017061U CN 201921926238 U CN201921926238 U CN 201921926238U CN 211017061 U CN211017061 U CN 211017061U
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- 230000017525 heat dissipation Effects 0.000 title claims description 55
- 230000000149 penetrating effect Effects 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 24
- 239000012790 adhesive layer Substances 0.000 claims description 20
- 125000006850 spacer group Chemical group 0.000 claims description 11
- 239000011241 protective layer Substances 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims 2
- 238000009434 installation Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The embodiment of the utility model discloses heat abstractor and radiator unit. The heat dissipating device includes: the radiator is provided with a first side and a second side which are opposite and is provided with a plurality of first through holes, wherein the first side is provided with a plurality of radiating fins; the plurality of fasteners comprise an operating part, a connecting part and an intermediate part positioned between the operating part and the connecting part, and one end of the intermediate part, which is adjacent to the connecting part, is provided with a limiting part mounting part; the fasteners are respectively used for penetrating the first through holes from the first side; the elastic pieces are respectively sleeved on the middle parts of the fasteners; the limiting pieces are respectively used for being arranged on the limiting piece mounting parts of the fasteners; the bracket component comprises a bracket plate and a plurality of fixing parts arranged on the bracket plate at intervals. The embodiment of the utility model provides an effectively solve the poor problem of heat abstractor installation reliability.
Description
Technical Field
The utility model relates to a circuit board heat dissipation technical field especially relates to a heat abstractor and radiator unit.
Background
At present, as more and more electronic products with different purposes are manufactured and used, the requirements for reliability and stability of the electronic products are higher and higher, so that the electronic products can be normally used in various environments.
A chip on a circuit board in an existing electronic product generally needs to be additionally provided with a heat dissipation device for heat dissipation, and the heat dissipation device is fixed on a support component, so that the heat dissipation device is easily stressed by the support component, and the stress received by the chip is too large, so that a solder ball of the chip is broken.
In summary, the problem of poor installation reliability of the heat dissipation device exists in the prior art.
SUMMERY OF THE UTILITY MODEL
Therefore, the embodiment of the utility model provides a heat abstractor and radiator unit effectively solve the poor problem of heat abstractor installation reliability.
On the one hand, the embodiment of the utility model provides a pair of heat abstractor, include: the radiator is provided with a first side and a second side which are opposite and is provided with a plurality of first through holes, wherein the first side is provided with a plurality of radiating fins; the fastener comprises an operating part, a connecting part, an intermediate part positioned between the operating part and the connecting part and a limiting part mounting part arranged at the connecting part of the intermediate part and the connecting part; the fasteners are respectively used for penetrating the first through holes from the first side; the elastic pieces are respectively sleeved on the middle parts of the fastening pieces and positioned between the operating part and the radiator; a plurality of stoppers respectively provided to the stopper mounting portions of the plurality of fasteners to hold the connecting portions of the plurality of fasteners at the second side; the bracket component comprises a bracket plate and a plurality of fixing parts arranged on the bracket plate at intervals, wherein the fixing parts are respectively used for being in threaded connection with the connecting parts of the fasteners.
In the embodiment, the elastic piece releases the stress of the radiator from the bracket part, so that the problem that the radiating fins of the radiating device are not fixed reliably due to the stress is avoided; when the heat dissipation device is used, the heat dissipation device can be fixed only by connecting the connecting parts of the plurality of fasteners and the plurality of fixing parts once; therefore, the heat dissipation device has high reliability and simple and convenient assembly process.
In an embodiment of the present invention, the first side of the heat sink is further provided with a plurality of fan mounting studs, and each distance from the first through hole to a geometric center line of the heat sink is smaller than each distance from the fan mounting studs to the geometric center line.
In an embodiment of the present invention, the first side of the heat sink is further provided with a plurality of fan mounting studs, and each distance from the first through hole to a geometric center line of the heat sink is greater than each distance from the fan mounting studs to the geometric center line.
In an embodiment of the present invention, each of the fastening members is a fastening screw, and the connecting portion is a threaded portion of the fastening screw; each elastic piece is a spring; the limiting piece mounting part is an annular groove, and the limiting piece is a clamp spring; the first through hole is surrounded by the plurality of heat radiation fins.
In an embodiment of the present invention, the fixing portions are respectively a plurality of connecting posts with internal threads protruding from the supporting plate; the heat dissipating device further includes: the spacer rings are respectively used for being sleeved on the connecting columns with the internal threads, and the insulating layer is arranged between the spacer rings and the support plate.
In an embodiment of the present invention, the heat dissipation device further includes a thermal conductive adhesive layer and a protective layer, the thermal conductive adhesive layer is adhered to the surface of the second side of the heat sink, and the protective layer is located the thermal conductive adhesive layer is away from one side of the heat sink.
The embodiment of the utility model provides a pair of heat radiation assembly, include: the radiator is provided with a first side and a second side which are opposite and is provided with a plurality of first through holes; a plurality of elastic members; a plurality of stoppers; the plurality of fasteners are used for sequentially penetrating the plurality of elastic pieces and the plurality of first through holes from the first side and respectively connected with the plurality of limiting pieces on the second side so as to enable the plurality of limiting pieces to be elastically fixed to the radiator; the printed circuit board comprises a first surface, a second surface and a plurality of mounting holes penetrating through the first surface and the second surface, wherein the first surface is provided with a chip, and the mounting holes are distributed around the chip to correspond to the first through holes in position respectively; and the bracket component is provided with a plurality of fixing parts, wherein the fixing parts are respectively and fixedly connected with the connecting parts of the plurality of fasteners, which are positioned on the second side, so that the printed circuit board is clamped between the radiator and the bracket component and the radiator covers the chip.
In the embodiment, the heat dissipation device is mounted on the circuit board, so that the problems that the chip is not stably welded due to the fact that the stress of the chip exceeds the standard caused by poor mounting reliability of the heat dissipation device, and the heat dissipation effect is poor due to the fact that the heat radiator is separated from the chip can be solved.
In an embodiment of the present invention, the first side of the heat sink further has a plurality of fan mounting studs, the heat sink further includes a heat dissipating fan, and the heat dissipating fan is respectively screwed with the plurality of fan mounting studs through a plurality of screws to be mounted on the first side of the heat sink; and each first through hole is less than the distance from each fan mounting stud to the geometric centerline of the heat sink, or each first through hole is greater than the distance from each fan mounting stud to the geometric centerline of the heat sink.
In an embodiment of the present invention, each of the fastening members is a fastening screw, and the connecting portion is a threaded portion of the fastening screw; each elastic piece is a spring; the locating part installation department is the ring channel, just the locating part is the jump ring.
In an embodiment of the present invention, the supporting member includes a supporting plate, and the plurality of fixing portions are respectively a plurality of connecting posts with internal threads protruding from the supporting plate; the heat dissipation assembly further includes: the insulating layer is arranged between the plurality of spacing rings and the support plate; the heat dissipation assembly further comprises a heat conduction adhesive layer, and the heat conduction adhesive layer is clamped between the radiator and the chip.
In summary, the above embodiments of the present application may have one or more of the following advantages or benefits: i) stress of the radiator from the bracket part is released through the elastic part, so that the problem that the radiating fins of the radiating device are not fixed reliably due to the stress is avoided; when the heat dissipation device is used, the heat dissipation device can be fixed only by connecting the connecting parts of the plurality of fasteners and the plurality of fixing parts once; therefore, the heat dissipation device has high reliability and simple and convenient assembly process; ii) the heat dissipation device is arranged on the circuit board, so that the problems that the chip welding is not stable due to the excessive stress of the chip caused by poor installation reliability of the heat dissipation device and the heat dissipation effect is poor due to the separation of a heat radiator and the chip can be solved; ii) wherein adopt the locating part installation department of ring channel structure and carry out the joint with the jump ring, can increase its area of contact, solve the locating part fracture and lead to the radiator fixed unreliable problem.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat dissipation device according to a first embodiment of the present invention.
Fig. 2 is a schematic structural diagram of the heat sink in fig. 1.
FIG. 3 is a perspective view of the fastener of FIG. 1
FIG. 4 is a cross-sectional schematic view of the fastener of FIG. 1.
Fig. 5 is a schematic structural view of another heat dissipation device according to a first embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a heat dissipation assembly according to a second embodiment of the present invention.
Description of the main element symbols:
100 is a heat sink; 10 is a fastener; 11 is an operation part; 12 is a middle part; 13 is a stopper mounting part; 14 is a connecting part; 20 is an elastic piece; 30 is a radiator; 31 is a first through hole, 32 is a heat dissipation fin; 33 is a fan mounting stud; 40 is a limiting part; 50 is a spacer ring; 60 is an insulating layer; 61 is a second through hole; 70 is a bracket component; 71 is a support plate; 72 is a fixed part; 80 is a heat-conducting adhesive layer; 90 is a protective layer; 200 a heat dissipation assembly; 210 is a printed circuit board; 211 is a first surface; 2111 is a chip; 212 is a second surface; 213 is a mounting hole; 220 is a heat dissipation fan; 221 is a third through hole; and 230 is a screw.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
[ first embodiment ] A method for manufacturing a semiconductor device
Referring to fig. 1, which is a schematic structural diagram of a heat dissipation apparatus according to a first embodiment of the present invention, the heat dissipation apparatus 100 is used for dissipating heat of a chip on a circuit board; the heat sink 100 includes, for example: the heat sink assembly comprises a plurality of fasteners 10, a plurality of elastic members 20, a heat sink 30, a plurality of stoppers 40, a plurality of spacer rings 50, an insulating layer 60, and a bracket member 70.
In one embodiment, referring to fig. 2, the heat sink 30 includes a first side and a second side opposite to each other, a face of the heat sink 30 on the first side is provided with a plurality of heat dissipation fins 32, and a face of the heat sink 30 on the second side is a plane for contacting a heat generating body such as a chip; the heat sink 30 is further provided with a plurality of first through holes 31, for example, 2 first through holes 31 are provided and are provided at two opposite corners of the heat sink 30, and the plurality of first through holes 31 penetrate through the heat sink 30; wherein the plurality of first through holes 31 are surrounded by the plurality of radiator fins 32, respectively, so that the size of the heat sink 30 can be reduced.
Referring to fig. 3 and 4, each fastener 10 includes an operating portion 11, a connecting portion 14, and an intermediate portion 12 connected between the operating portion 11 and the connecting portion 14, a stopper mounting portion 13 is disposed at a connection point of the intermediate portion 12 and the connecting portion 14, and the stopper mounting portion 13 may be located at a connection point of the intermediate portion 12 and the connecting portion 14, for example, the stopper mounting portion 13 is located at one end of the intermediate portion 12 close to the connecting portion 14, and the stopper mounting portion 13 is located at one end of the connecting portion 14 close to the intermediate portion 12; further, the fastener 10 may be a screw, and the connection portion 14 is a threaded portion of the screw; further, the intermediate portion 12 may have a columnar structure, or may have another columnar structure.
Referring again to fig. 1, the plurality of elastic members 20 may be a plurality of springs; specifically, the springs are respectively sleeved on the middle portions 12 of the fasteners 10, and the operating portions 11 of the fasteners 10 respectively limit the springs.
Wherein, the connecting portions 14 of the plurality of fasteners 10 sequentially pass through the plurality of elastic members 20 and the plurality of first through holes 31 from the first side of the heat sink 30, and the limiter mounting portions 13 of the plurality of fasteners 10 are located at the second side of the heat sink 30, for example, the portion below the dotted line of each fastener 10 in fig. 4 is located at the second side of the heat sink 30.
The plurality of stoppers 40 are located on the second side of the heat sink 30 and connected to the stopper mounting portions 13 of the plurality of fasteners 10, respectively; specifically, the plurality of limiting members 40 may be a plurality of snap springs, the limiting member mounting portion 13 may be an annular groove, and the plurality of snap springs are respectively clamped in the annular grooves of the plurality of fastening members 10, so that the plurality of fastening members 10 and the plurality of elastic members 20 elastically fix the heat sink 30. It should be noted that, in other embodiments, the position limiting member mounting portion 13 may also be a section of a threaded portion, and accordingly the position limiting member 40 is a nut screwed to the section of the threaded portion.
In one embodiment, the plurality of fasteners 10 may also be a plurality of fastening screws.
The bracket component 70 is located on the second side of the heat sink 30, the bracket component 70 includes a bracket plate 71 and a plurality of fixing portions 72 disposed on the bracket plate 71 at intervals, and the plurality of fixing portions 72 are respectively connected to the connecting portions 14 of the plurality of fasteners 10; the specific connecting part 14 is provided with external threads, the fixing part 72 is provided with matched internal threads, and the operating part 11 of each fastener 10 is screwed to ensure that the connecting part 14 of each fastener 10 is in threaded connection with the corresponding fixing part 72; further, the bracket plate 71 and the plurality of fixing portions 72 may be integrally formed to obtain the bracket member 70.
The insulating layer 60 is positioned between the support plate 71 and the position limiters 40, and the insulating layer 60 exposes the fixing parts 72 connected to the support plate 71; specifically, the insulating layer 60 may be bonded to the support plate 71, and a plurality of second through holes 61 are formed in the insulating layer 60, and the plurality of second through holes 61 respectively expose the plurality of fixing portions 72 disposed on the support plate 71; further, a glue layer is arranged on one side, bonded with the support plate 71, of the insulating layer 60, or a glue layer is arranged on one side, bonded with the insulating layer 60, of the support plate 71, so that the insulating layer 60 is bonded with the support plate 71.
The plurality of spacing rings 50 are respectively disposed between the insulating layer 60 and the plurality of stoppers 40, and the through holes in the middle of the plurality of spacing rings 50 respectively correspond to the plurality of second through holes 61 of the insulating layer 60 to expose the plurality of fixing portions 72 connected to the bracket plate 71.
In one embodiment, the fixing portions 72 may be a plurality of connecting posts with internal threads protruding from the bracket plate 71, the connecting posts with internal threads respectively sequentially passing through the second through holes 61 of the insulating layer 60 and the spacer rings 50, and the connecting portions 14 of the fasteners 10 are respectively screwed to the connecting posts with internal threads.
In one embodiment, four first through holes 31 are provided on the heat sink 30, so that four fixing portions 72 are provided on the holder plate 71 correspondingly, and the shape of the holder plate 71 can be set according to the number and positional relationship of the first through holes 31 on the heat sink 30, and a plurality of fixing portions 72 can be provided on the holder plate 71 correspondingly. Further, in fig. 5, the supporting plate 71 is, for example, a square structure, and four corners of the supporting plate 71 are respectively provided with a fixing portion 72; in fig. 1, the supporting plate 71 is, for example, a strip-shaped structure, and two ends of the supporting plate 71 are respectively provided with a fixing portion 72.
In one embodiment, a plurality of fan mounting studs 33 are spaced apart on a face of the first side of the heat sink 30, each fan mounting stud 33 having internal threads; specifically, the distance from each of the plurality of fan mounting studs 33 to the geometric center line AA 'of the heat sink 30 is greater than the distance from each of the plurality of first through holes 31 to the geometric center line AA' of the heat sink 30 (as shown in fig. 1), for example, four fan mounting studs 33 are respectively disposed at four corners of the heat sink 30, and two first through holes 31 are respectively disposed at one side of the two opposite fan mounting studs 33 facing the geometric center; on the other hand, the distances from the plurality of fan mounting studs 33 to the geometric center line AA ' of the heat sink 30 are respectively smaller than the distances from the plurality of first through holes 31 to the geometric center line AA ' of the heat sink 30 (as shown in fig. 5), for example, four first through holes 31 are respectively disposed at four corners of the heat sink 30, and four fan mounting studs 33 are respectively disposed at one side of the four first through holes 31 facing the geometric center line AA '.
In one embodiment, the heat sink 100 further comprises, for example, a heat sink fan that is threadably connected to the plurality of fan mounting studs 33 of the heat sink 30 by a plurality of screws.
In one embodiment, the heat dissipation apparatus 100 further includes, for example, a thermal conductive adhesive layer 80 and a protective layer 90, wherein the thermal conductive adhesive layer 80 is adhered to the surface of the second side of the heat sink 30, and the protective layer 90 is located on a side of the thermal conductive adhesive layer 80 away from the heat sink 30; when the heat dissipation device 100 is used, the protective layer 90 is torn off, and the heat sink 30 is connected to a heat-generating body, such as a chip, through the thermal conductive adhesive layer 80, which is not described herein again.
In an embodiment, the plurality of fastening members 10, the plurality of elastic members 20, the heat sink 30, the plurality of limiting members 40, the plurality of spacing rings 50, the insulating layer 60 and the bracket member 70 may be in a part shape, and the heat dissipation device 100 provided by the present invention is obtained by assembling according to the connection relationship provided by the above embodiments, which is not described herein again. It should be noted that the heat sink 100 according to the embodiment of the present invention can also omit the spacer ring 50 and the insulating layer 60.
To sum up, in the embodiment of the present invention, the elastic member 20 is used to release the stress of the bracket component 70 received by the heat sink 30, and the heat sink 30 can be fixed and assembled to obtain the heat dissipation device 100 with good reliability through one-time connection between the connecting portion 14 and the fixing portion 72; the contact area between the limiting piece 40 and the limiting piece mounting part 13 is further increased by the limiting piece mounting part 13 and the clamp spring of the annular groove structure, so that the stress of the limiting piece 40 in unit area is reduced, and the fracture of the limiting piece 40 is avoided.
[ second embodiment ]
Referring to fig. 6, which is a schematic structural diagram of a heat dissipation assembly according to a second embodiment of the present invention, the heat dissipation assembly 200 includes the heat dissipation device 100 according to the first embodiment and a printed circuit board 210.
The printed circuit board 210 has a first surface 211 and a second surface 212, the first surface 211 of the printed circuit board 210 is provided with a chip 2111, a plurality of mounting holes 213 penetrating the first surface 211 and the second surface 212 are provided around the chip 2111, and the mounting holes 213 correspond to the first through holes 31 of the heat sink 30.
The printed circuit board 210 is located between the plurality of position-limiting members 40 and the bracket member 70; specifically, the heat sink 30 is located on one side of the first surface 211 of the printed circuit board 210, the bracket member 70 is located on one side of the second surface 212 of the printed circuit board 210, and the surface of the second side of the heat sink 30 covers the chip 2111.
Wherein, the connecting parts 14 of the plurality of fasteners 10 respectively pass through the plurality of mounting holes 213 of the printed circuit board 210, and are respectively connected with the plurality of fixing parts 72 of the bracket member 70 at one side of the second surface 220 of the printed circuit board 210; alternatively, when the fixing portions 72 of the bracket member 70 are connecting posts, the connecting posts respectively pass through the mounting holes 213 of the printed circuit board 210, and are respectively connected to the connecting portions 14 of the fasteners 10 between the printed circuit board 210 and the limiting members 40.
In one embodiment, the heat dissipation assembly 200 further comprises, for example: a plurality of spacer rings 50, an insulating layer 60, and a thermal conductive adhesive layer 80.
The plurality of spacing rings 50 are positioned between the printed circuit board 210 and the bracket component 70, and the plurality of fixing parts 72 of the bracket component 70 respectively penetrate through the plurality of spacing rings 50; an insulating layer 60 interposed between the plurality of spacer rings 50 and the holder plate 71 of the holder member 70; and a thermal conductive adhesive layer 80 sandwiched between the chip 2111 and the surface of the second side of the heat sink 30.
In one embodiment, the heat dissipation assembly 200 further comprises, for example: a heat dissipation fan 220 and a plurality of screws 230.
The heat dissipation fan 220 is provided with a plurality of third through holes 221, and the plurality of third through holes 221 respectively correspond to the plurality of fan mounting studs 33 of the heat sink 30.
The distances from the fan mounting studs 33 to the geometric center line AA 'of the heat sink 30 are smaller than the distances from the first through holes 31 to the geometric center line AA' of the heat sink 30, so that the heat dissipation fan 220 can be mounted on the heat dissipation device 100 first, and then the heat dissipation device 100 can be mounted on the printed circuit board 210.
A plurality of screws 230 sequentially pass through the plurality of third through holes 221 of the heat dissipation fan 220 from the first side of the heat sink 30 and are respectively screwed to the plurality of fan mounting studs 33, so as to fix the heat dissipation fan 220 to the heat dissipation assembly 200.
In one embodiment, the depth of the screw connection between the connection portions 14 of the plurality of fasteners 10 and the fixing portions 72 of the bracket member 70 is adjusted such that the heat spreader 30 is in contact with the chip 2111, and when the thermal conductive adhesive layer 80 is disposed between the heat spreader 30 and the chip 320, the depth of the screw connection may be further increased to compress the thermal conductive adhesive layer 80, so that the thermal conductive adhesive layer 80 can be uniformly laid on the chip 2111.
In the several embodiments provided in the present invention, the units described as separate parts may or may not be physically separate, and the parts displayed as units may or may not be physical units, may be located in one place, or may also be distributed on multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (10)
1. A heat dissipating device, comprising:
a heat sink (30) having opposite first and second sides and provided with a plurality of first through holes (31), wherein the first side is provided with a plurality of heat dissipating fins (32);
a plurality of fasteners (10) including an operating portion (11), a connecting portion (14), an intermediate portion (12) between the operating portion (11) and the connecting portion (14), and a stopper mounting portion (13) provided at a connection of the intermediate portion (12) and the connecting portion (14); the plurality of fasteners (10) are respectively used for penetrating the plurality of first through holes (31) from the first side;
a plurality of elastic members (20) respectively sleeved on the middle parts (12) of the plurality of fasteners (10) and positioned between the operating part (11) and the heat sink (30);
a plurality of stoppers (40) provided to the stopper mounting portions (13) of the plurality of fasteners (10) respectively to hold the connecting portions (14) of the plurality of fasteners (10) at the second side;
the bracket component (70) comprises a bracket plate (71) and a plurality of fixing parts (72) arranged on the bracket plate (71) at intervals, wherein the fixing parts (72) are respectively used for being in threaded connection with the connecting parts (14) of the fasteners (10).
2. The heat sink as recited in claim 1, characterized in that the first side of the heat sink (30) is further provided with a plurality of fan mounting studs (33), and each of the first through holes (31) is located at a distance from a geometric centerline of the heat sink (30) that is smaller than a distance from each of the fan mounting studs (33) to the geometric centerline.
3. The heat sink as recited in claim 1, characterized in that the first side of the heat sink (30) is further provided with a plurality of fan mounting studs (33), and each of the first through holes (31) is located at a distance from a geometric centerline of the heat sink (30) that is greater than a distance from each of the fan mounting studs (33) to the geometric centerline.
4. The heat sink as recited in claim 1, characterized in that each of the fasteners (10) is a fastening screw, the connecting portion (14) being a threaded portion of the fastening screw; each elastic member (20) is a spring; the limiting piece mounting part (13) is an annular groove, and the limiting piece (40) is a clamp spring; the first through-hole (31) is surrounded by the plurality of heat radiation fins (32).
5. The heat dissipating device as claimed in claim 1, wherein the fixing portions (72) are respectively a plurality of connecting posts with internal threads protruding from the supporting plate (71); the heat dissipating device further includes: the insulation layer (60) and a plurality of spacer rings (50), a plurality of spacer rings (50) are respectively used for being sleeved on the plurality of connecting columns with the internal threads, and the insulation layer (60) is used for being arranged between the plurality of spacer rings (50) and the support plate (71).
6. The heat sink according to claim 1, further comprising a thermally conductive adhesive layer (80) and a protective layer (90), wherein the thermally conductive adhesive layer (80) is adhered to the surface of the second side of the heat sink (30), and the protective layer (90) is located on a side of the thermally conductive adhesive layer (80) away from the heat sink (30).
7. A heat sink assembly, comprising:
a heat sink (30) having opposing first and second sides and provided with a plurality of first through holes (31);
a plurality of elastic members (20);
a plurality of stoppers (40);
a plurality of fasteners (10) respectively used for sequentially passing through the plurality of elastic members (20) and the plurality of first through holes (31) from the first side and respectively connected with the plurality of limiting members (40) at the second side so as to enable the plurality of limiting members (40) to be elastically fixed to the heat sink (30);
a printed circuit board (210) comprising a first surface (211) and a second surface (212) which are opposite to each other and a plurality of mounting holes (213) penetrating through the first surface (211) and the second surface (212), wherein the first surface (211) is provided with a chip (2111), and the plurality of mounting holes (213) are distributed around the chip (2111) to respectively correspond in position to the plurality of first through holes (31);
and the bracket component (70) is provided with a plurality of fixing parts (72), wherein the fixing parts (72) are respectively fixedly connected with the connecting parts (14) of the fasteners (10) on the second side and are used for clamping the printed circuit board (210) between the heat radiator (30) and the bracket component (70) and enabling the heat radiator (30) to cover the chip (2111).
8. The heat sink assembly of claim 7, wherein the first side of the heat sink (30) is further provided with a plurality of fan mounting studs (33), the heat sink assembly further comprises a heat sink fan (220), and the heat sink fan (220) is respectively screwed with the plurality of fan mounting studs (33) by a plurality of screws (230) to be mounted on the first side of the heat sink (30); and
each of the first through holes (31) is spaced from a geometric centerline of the heat sink (30) by a distance less than a distance from each of the fan mounting studs (33) to the geometric centerline, or each of the first through holes (31) is spaced from a geometric centerline of the heat sink (30) by a distance greater than a distance from each of the fan mounting studs (33) to the geometric centerline.
9. The heat dissipation assembly of claim 7,
each fastener (10) is a fastening screw, and the connecting part (14) is a threaded part of the fastening screw; each elastic member (20) is a spring;
the limiting piece (40) is a clamp spring.
10. The heat dissipation assembly of claim 7,
the bracket component (70) comprises a bracket plate (71), and the fixing parts (72) are respectively a plurality of connecting columns with internal threads which are convexly arranged on the bracket plate (71);
the heat dissipation assembly further includes: the insulating layer (60) and a plurality of spacing rings (50), the spacing rings (50) are respectively used for being sleeved on the connecting columns with the internal threads, and the insulating layer (60) is used for being arranged between the spacing rings (50) and the support plate (71);
the heat dissipation assembly further comprises a heat conduction adhesive layer (80), and the heat conduction adhesive layer (80) is clamped between the radiator (30) and the chip (2111).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921926238.1U CN211017061U (en) | 2019-11-06 | 2019-11-06 | Heat dissipation device and heat dissipation assembly |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921926238.1U CN211017061U (en) | 2019-11-06 | 2019-11-06 | Heat dissipation device and heat dissipation assembly |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113345371A (en) * | 2021-07-02 | 2021-09-03 | 南京德普达凌云信息技术有限公司 | Anti-interference digital circuit of serial ports and LED show drive with receiving card |
| WO2023124569A1 (en) * | 2021-12-28 | 2023-07-06 | 北京比特大陆科技有限公司 | Fastener, heat dissipation module and electronic device |
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2019
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113345371A (en) * | 2021-07-02 | 2021-09-03 | 南京德普达凌云信息技术有限公司 | Anti-interference digital circuit of serial ports and LED show drive with receiving card |
| WO2023124569A1 (en) * | 2021-12-28 | 2023-07-06 | 北京比特大陆科技有限公司 | Fastener, heat dissipation module and electronic device |
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