CN210999510U

CN210999510U - Silicon rod loading attachment

Info

Publication number: CN210999510U
Application number: CN201921320214.1U
Authority: CN
Inventors: 卢建伟
Original assignee: Tiantong Rijin Precision Technology Co ltd
Current assignee: Tiantong Rijin Precision Technology Co ltd
Priority date: 2019-08-14
Filing date: 2019-08-14
Publication date: 2020-07-14
Anticipated expiration: 2029-08-14

Abstract

The application provides a silicon rod loading attachment for to place and wait to cut the silicon rod and shift to the cutting workspace of a cutting equipment in a storage area, silicon rod loading attachment includes: the first rotating shaft is driven to rotate by a first driving device; and including two at least swing arm subassemblies, according to predetermineeing the interval respectively the hub connection in the first pivot, two at least swing arm subassemblies are used for bearing treat the cutting silicon rod, under the drive of first pivot, treat that the cutting silicon rod is born by swing arm subassembly and transfer to the cutting workspace of cutting equipment. Each swing arm assembly comprises a swing arm body and a bearing mechanism, the swing arm body is in shaft connection with the first rotating shaft, the bearing mechanism is arranged on the swing arm body, the bearing mechanism follows the motion of the swing arm, and the bearing portion is kept in a state of bearing the silicon rod to be cut when in transfer operation.

Description

Silicon rod loading attachment

Technical Field

The application relates to the technical field of multi-wire cutting, in particular to silicon rod feeding equipment of silicon rod cutting equipment for cutting silicon rods.

Background

The wire cutting technology is an advanced silicon material processing technology in the world at present, and the principle of the wire cutting technology is that a steel wire running at a high speed drives cutting edge materials attached to the steel wire or a diamond wire is directly adopted to rub a workpiece to be processed, so that the purpose of wire cutting is achieved. During the cutting process, the steel wire or diamond wire is guided by the wire guide wheel, a wire saw or a wire net is formed on the cutting roller, and the workpiece to be processed is fed by the ascending and descending of the workbench or the ascending and descending of the wire saw or the wire net. Under the action of a pressure pump, a cooling water automatic spraying device assembled on the equipment sprays cold water to cutting parts of the steel wire or the diamond wire and the workpiece, and the steel wire or the diamond wire reciprocates to cut the material to be processed into a plurality of pieces at one time. Compared with the traditional knife saw blade, grinding wheel and internal circle cutting, the linear cutting technology has the advantages of high efficiency, high productivity, high precision and the like.

Generally, in the related art, the operations required by each process operation are independently arranged, the operation devices are distributed in different production units or production workshops or different production areas of the production workshops, the conversion of workpieces performing different process operations requires carrying and allocation, the processes are complicated, the efficiency is low, a large amount of manpower or transfer devices are required, the potential safety hazard is large, in addition, the flowing links among the operation devices of each process are many, the risk of workpiece damage is increased in the workpiece transfer process, and unqualified or unreasonable loss caused by non-production factors is easy to generate.

Disclosure of Invention

In view of the above disadvantages of the prior art, an object of the present application is to provide a silicon rod feeding apparatus for a silicon rod cutting apparatus for cutting a silicon rod, which automates a feeding process and connects the feeding process with a next cutting process, so as to solve the problems in the prior art that a workpiece is easily damaged during transferring and the production efficiency is low due to intermittent processes.

In order to achieve the above objects and other related objects, the present application provides a silicon rod feeding apparatus for a silicon rod cutting apparatus for cutting a silicon rod, including a silicon rod feeding device disposed between a storage area and a cutting work area, for transferring a silicon rod to be cut placed in the storage area to the cutting work area, the silicon rod feeding device including: the first rotating shaft is driven to rotate by a first driving device; the at least two swing arm assemblies are respectively connected to the first rotating shaft in a shaft mode according to preset intervals and used for bearing the silicon rod to be cut and transferring the silicon rod to be cut to a cutting working area of the cutting equipment under the driving of the first rotating shaft; each swing arm assembly comprises a swing arm body and a bearing mechanism, the swing arm body is connected with the first rotating shaft in a shaft mode, the bearing mechanism is arranged on the swing arm body, and the bearing mechanism is used for keeping a bearing portion of the bearing mechanism in a state of bearing the silicon rod to be cut when the bearing mechanism moves along with the swing arm.

In some embodiments of the present application, the supporting mechanism includes a manipulator disposed at the end of the swing arm body, and is configured to follow the movement of the swing arm so that the supporting portion thereof is maintained in a state of supporting the silicon rod to be cut during the transfer operation.

In some embodiments of the present application, the silicon rod truncation apparatus further includes at least two transfer tables corresponding to the swing arm assemblies one to one, and the at least two transfer tables are disposed on the base of the cutting apparatus, and are used for respectively coupling the at least two swing arm assemblies to the first rotating shaft according to a preset interval.

In some embodiments of the present application, the at least two transfer tables include a second motion mechanism for linearly displacing the at least one swing arm assembly on the first rotation shaft to adjust a separation distance of the at least two swing arm assemblies.

In some embodiments of the present application, the number of the swing arm assemblies is 4, and the swing arm assemblies include a first swing arm assembly and a second swing arm assembly respectively disposed at two ends of the first rotating shaft, and a third swing arm assembly and a fourth swing arm assembly respectively coupled between two ends of the first rotating shaft according to a predetermined interval.

In some embodiments of the present application, the transfer stage of the third or fourth swing arm assembly includes a second motion mechanism linearly displaced on the first rotation shaft.

In some embodiments of the present application, the silicon rod cutting apparatus further includes a second rotating shaft driven by a second driving device, the second rotating shaft is parallel to the first rotating shaft, and the second driving device outputs a corresponding rotating speed or/and a corresponding rotation angle to the second rotating shaft according to the working state of the first driving device.

In some embodiments of the present application, the first driving device and the second driving device are respectively disposed at two opposite ends of the first rotating shaft or the second rotating shaft.

In some embodiments of the present application, the second pivot shaft is pivotally connected to the swing arm assembly and is located between the first pivot shaft on the swing arm body and the racking mechanism.

In some embodiments of the present application, the racking mechanism comprises: the manipulator subassembly set up in the end of swing arm body includes: the mechanical arm body and the activity set up in be used for bearing on the mechanical arm body treat the holding piece of cutting the silicon rod, holding piece power is connected the second pivot to drive when the second pivot rotates the holding piece is in the mechanical arm body rotates, so that the holding piece keeps being in when shifting the operation and bears the state of treating cutting the silicon rod.

In some embodiments of the present application, the swing arm body has a built-in space.

In some embodiments of the present application, the racking mechanism comprises: the driving gear is arranged in the built-in space of the swing arm body, is coupled to the second rotating shaft in a shaft mode and is used for rotating under the driving of the second rotating shaft; the driven gear is coupled in the built-in space of the swing arm body in a shaft mode and meshed with the driving gear; the manipulator assembly is arranged at the tail end of the swing arm body and comprises a manipulator body and a bearing part, wherein the manipulator body is movably arranged on the manipulator body and used for bearing the silicon rod to be cut, the bearing part comprises a tooth part meshed with the driven gear and a bearing part used for following the outer contour of the silicon rod to be cut.

In some embodiments of the present application, the number of teeth of the supporting portion is greater than the number of teeth of the driven gear, and the number of teeth of the driven gear is greater than the number of teeth of the driving gear.

In some embodiments of the present application, the contact surface of the support part and the silicon rod to be cut has a buffer material.

In some embodiments of the present application, the swing arm assembly is provided with a detection device for detecting contact of the bearing portion with the silicon rod to be cut.

To sum up, the silicon rod loading attachment of this application sets up can follow and waits to cut two at least swing arm subassemblies of silicon rod axial displacement and run through in the first pivot of swing arm subassembly, through the rotatory motion in order to control the swing arm subassembly of the first pivot of drive arrangement drive to through the cooperation of manipulator or manipulator subassembly and the terminal bearing portion of swing arm subassembly, treat to cut the silicon rod and transfer the in-process and ensure that the silicon rod is in the bearing state all the time in order to realize automatic feeding, effectively improve economic benefits and security.

Drawings

Fig. 1 is a schematic structural view of a silicon rod truncation apparatus according to an embodiment of the present disclosure.

Fig. 2 is a schematic view showing a first cutting state of the silicon rod-cutting apparatus according to the present application.

Fig. 3 is an enlarged schematic view of a in fig. 2.

Fig. 4 is a schematic view showing a second cutting state of the silicon rod truncation apparatus according to the present application in one embodiment.

Fig. 5 is a schematic view showing an intermediate state of the silicon rod-cutting apparatus according to the present application.

Fig. 6 is a schematic view of a cutting frame of the silicon rod truncation apparatus according to an embodiment of the present application.

Fig. 7 is a schematic view showing a first cutting state of the silicon rod-cutting apparatus according to the present application.

Fig. 8 is a schematic view showing a second cutting state of the silicon rod truncation apparatus according to the present application in one embodiment.

Fig. 9 is a schematic view showing an intermediate state of the silicon rod-cutting apparatus according to the present application.

Fig. 10 is a schematic view of a cutting frame in an embodiment of the silicon rod truncation apparatus according to the present application.

Fig. 11 is a schematic view showing a silicon rod loading device in one embodiment of the silicon rod-cutting apparatus according to the present application.

Fig. 12 is an enlarged view of b in fig. 11.

Fig. 13 is an enlarged view of c in fig. 11.

Fig. 14 is a schematic view of a swing arm assembly of the silicon rod staging apparatus according to an embodiment of the present disclosure.

Fig. 15 is a schematic view of a swing arm assembly of the silicon rod staging apparatus according to an embodiment of the present invention.

Fig. 16 is a schematic view of a swing arm assembly of the silicon rod staging apparatus according to an embodiment of the present invention.

Fig. 17 is a schematic view of a swing arm assembly of the silicon rod staging apparatus according to an embodiment of the present disclosure.

Fig. 18 is a schematic view of a swing arm assembly of the silicon rod staging apparatus according to an embodiment of the present invention.

Fig. 19 is a schematic view of a swing arm assembly of the silicon rod staging apparatus according to an embodiment of the present invention.

Fig. 20 is a schematic view showing a silicon rod blanking device according to an embodiment of the silicon rod truncation apparatus of the present application.

Fig. 21a and 21b are schematic views showing a silicon rod blanking device in an embodiment of the silicon rod truncation apparatus according to the present application.

Fig. 22 is a schematic view showing a silicon rod cutting apparatus clamping member according to an embodiment of the present invention.

Fig. 23 is a schematic view showing a driving device of a silicon rod blanking device in one embodiment of the silicon rod chopping apparatus according to the present application.

Fig. 24 is a schematic view showing a driving device of a silicon rod blanking device in one embodiment of the silicon rod chopping apparatus according to the present application.

Fig. 25 is an enlarged view of d in fig. 21 b.

Detailed description of the preferred embodimentsthe following description of the present application will provide specific embodiments, and other advantages and capabilities of the present application will be readily apparent to those skilled in the art from the present disclosure.

In the following description, reference is made to the accompanying drawings that describe several embodiments of the application. It is to be understood that other embodiments may be utilized and mechanical composition, structure, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present application is defined only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Spatially relative terms, such as "upper," "lower," "left," "right," "lower," "below," "lower," "above," "upper," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature as illustrated in the figures.

Although the terms first, second, etc. may be used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the first multi-wire sawing wheel may be referred to as the second multi-wire sawing wheel, and similarly, the second multi-wire sawing wheel may be referred to as the first multi-wire sawing wheel, without departing from the scope of the various described embodiments. The first multi-wire saw wheel and the multi-wire saw wheel are both described in terms of one saw wheel, but they are not the same multi-wire saw wheel unless the context clearly indicates otherwise. The similar situation also includes a first cantilever, a second cantilever and a third cantilever, a first swing arm assembly and a second swing arm assembly, or a first movement mechanism and a second movement mechanism, a first clamping part and a second clamping part, etc.

Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

In the prior art processing of silicon materials, the processing is generally performed by wire cutting techniques based on the inherent hard and brittle nature of silicon rods. The procedure of the silicon rod operation starts with the cutting operation of an original long silicon rod to form a multi-stage short silicon rod (i.e., a silicon rod cut section meeting the specification of a workpiece after cutting the silicon rod), and the cutting operation uses equipment, i.e., silicon rod cutting equipment. Generally, a worktable is arranged on a silicon rod cutting device, for example, a cutting line of a steel wire or a diamond wire forms a wire saw on a cutting roller through the guide of a wire guide wheel to cut a single silicon rod to be processed, and as a pre-process of a subsequent silicon wafer processing operation, a sample wafer needs to be cut in the silicon rod cutting process to check whether the material characteristics of the silicon rod meet the process requirements. The existing sample wafer obtaining means generally removes a cutting frame or a silicon rod after the head or the tail of the silicon rod is cut off, cutting operation is repeated again to cut off a silicon wafer sample wafer, the thickness of the cut-off silicon wafer sample wafer depends on the moving distance of manual control, short-distance movement of the cutting frame or the silicon rod is difficult to accurately control, the specifications of the cut-off sample wafer are difficult to unify, meanwhile, short-distance movement (such as 2 mm-20 mm) required by the silicon wafer sample wafer is difficult to realize, namely, excessive movement is easy to cause waste of silicon rod materials, and sampling operation needing manual control in the traditional process also reduces cutting-off efficiency.

In addition, in general, the work required by each process operation is independently arranged, the work equipment is dispersed in different production units or production workshops or different production areas of the production workshops, the conversion of the workpieces for executing different process operations needs to be carried and allocated, the process is complicated, the efficiency is low, a large amount of manpower or transfer equipment is needed, the potential safety hazard is large, in addition, the flowing links among the work equipment of each process are multiple, the risk of workpiece damage is increased in the workpiece transfer process, and unqualified or unreasonable loss caused by non-production factors is easy to generate.

In the embodiment provided by the application, in order to define the orientation of the space, a three-dimensional space defined by a first dimension direction, a second dimension direction and a third dimension direction is defined, wherein the first dimension direction, the second dimension direction and the third dimension direction are all linear directions and are mutually perpendicular in pairs. Taking a silicon rod to be cut placed in a cutting area as a reference, wherein the first dimension direction is the axial direction or the forward direction and the backward direction of the silicon rod to be cut; the second dimension direction is a left direction and a right direction, for example, the direction of the linear displacement of the feeding device between the material storage area and the cutting working area is the left direction or the right direction; the third dimension direction is a lifting direction, a descending direction or an up-and-down direction, such as a direction of lifting or descending the cutting frame.

Referring to fig. 1, a schematic structural diagram of an applied silicon rod cutting apparatus in one embodiment is shown, which includes a wire cutting device 1, a silicon rod feeding device 2, and a silicon rod discharging device 3.

Referring to fig. 2, a side view of a wire cutting apparatus of the present application in a first cutting state according to one embodiment is shown. As shown in the drawings, the wire cutting device of the present application is used for cutting a silicon rod, such as cutting operation, slicing operation, or the like; in an embodiment, the silicon rod includes a single crystal silicon rod, i.e., a rod-shaped single crystal silicon grown from a melt by a czochralski method or a suspension float zone method, such as a single crystal silicon rod having a length of about 5000mm (e.g., 5360mm gauge, etc.) or a single crystal silicon rod having a length of about 800mm, etc., which are commonly used in silicon rod processing, and a polycrystalline silicon rod, i.e., a silicon rod in which silicon is deposited on the surface of a silicon core wire by a deposition technique such as a chemical vapor deposition technique; but not limited thereto, in other possible embodiments of the present application, the wire cutting apparatus may also be used to sever silicon ingots of polycrystalline silicon, or other hard materials that are long and require a severing process.

As shown in fig. 2, the wire cutting device 1 applied to a silicon rod slicing apparatus for cutting a silicon rod according to the present application includes a cutting frame 111, a first multi-wire cutting wheel 112, a second multi-wire cutting wheel 113, and a cutting wire segment wound between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 to form a multi-wire saw 1121, and a single-wire cutting wheel 114, and a cutting wire segment wound between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 to form a single-wire saw (not shown in the embodiment shown in fig. 2); a winding system 12, a frame 13, a lifting mechanism 14 and a base 15.

As mentioned above, before the silicon rod is cut, it is usually necessary to cut a sample wafer to check whether the material characteristics of the silicon rod meet the process requirements, for example, in the wire cutting apparatus in the first cutting state shown in fig. 2, the lifting mechanism 14 moves up and down to drive the multi-wire saw 1121 (the multi-wire saw in the embodiment shown in fig. 2) formed by the cutting wire segment between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 to move up and down in the lifting direction, so as to cut multiple wires of the silicon rod to be processed (not shown) located below the multi-wire saw 1121, in the cutting operation of one lifting movement, the cutting wire saws parallel to each other cut the silicon rod to be processed at the same time, and at the same time, cut the silicon rod, i.e., the required silicon wafer sample wafer, are also obtained. In an embodiment, the first cutting state is a sheet-taking state.

In the embodiment shown in fig. 2, the wire winding system 12 of the wire cutting apparatus of the present application further includes a cutting wire 121,

wire guide wheels

1221, 1222, and a tension detecting member 123.

The present application further improves the linear cutting device, the cutting frame displacement device is disposed between the frame and the machine base, in an implementation manner of the present embodiment, the frame 13 is movably connected to the machine base of the linear cutting device through a horizontal guide rail (not shown in the figure) in the first dimension direction. The machine base comprises a horizontal guide rail in the first dimension direction, and a guide rail groove matched with the horizontal guide rail is arranged at the bottom of the machine frame 13 of the cutting system. Through cutting frame displacement device drives the cutting frame and carries out linear displacement along the fore-and-aft direction on the cutting workspace (or the cutting workstation) of frame to make the coping saw (single wire saw or multi-wire saw, but in cutting off work, the cutting frame is in the state of single wire saw usually, in this application promptly the second cutting state) follow the axial linear displacement of silicon rod, and then can adjust and cut the length of silicon rod to obtain the single-section silicon rod segmentation that expects accords with the work piece specification.

In one embodiment, the frame 13 is provided with a driving mechanism inside or outside for driving the frame 13 to move on the horizontal guide rail of the base 15. In one embodiment, the rack 13 drive mechanism includes: a traveling screw (not shown) disposed along the base guide rail and connected to the frame 13, and a traveling motor (not shown) connected to the traveling screw. The advancing motor is used for driving the rack 13 to advance along the guide rail, the advancing motor on the rack 13 is connected with the advancing screw rod laid on the guide rail, and the rack 13 moves relative to the rack 13 along the first dimension direction, namely the axial direction of the silicon rod to be cut on the bearing device, on the guide rail. The cutting frame 111 is movably connected with the frame 13 in the lifting direction and fixed on the frame 13 in the first dimension direction, so that the relative displacement of the cutting wire saw on the cutting frame 111 and the silicon rod to be cut on the bearing device in the axial direction of the silicon rod to be cut is realized. In another implementation manner of the present embodiment, the horizontal movement of the cutting frame 111 relative to the machine base can be driven by an external force.

Referring to fig. 3, which is an enlarged schematic view of the wire cutting apparatus of fig. 2 at a, the frame 13 has a rail structure for cooperating with the lifting mechanism 14 to move up and down, in the embodiment shown in fig. 3, the frame 13 includes a lifting rail 131, and the lifting mechanism 14 has a guide groove (not shown) for cooperating with the lifting rail.

In one implementation manner of this embodiment, in order to realize the lifting and lowering of the lifting and lowering mechanism 14 relative to the frame 13, a driving mechanism (not shown) is disposed inside or outside the lifting and lowering mechanism 14 for driving the lifting and lowering mechanism 14 to move on the guide rail 131 of the frame 13. In one embodiment, the driving mechanism of the lifting mechanism 14 includes: a traveling lead screw arranged along the guide rail of the frame 13 and connected with the lifting mechanism 14, and a traveling motor connected with the traveling lead screw. The lifting mechanism 14 is driven to move along the guide rail by the aid of the moving motor, the moving motor on the lifting mechanism 14 is connected with the moving lead screw laid on the guide rail, relative movement of the lifting mechanism 14 and the rack 13 on the guide rail in the vertical direction is achieved, and movement of the lifting mechanism 14 relative to the rack 13 is limited to be in a single degree of freedom in the lifting direction.

In another embodiment of the present application, the connecting assembly of the lifting mechanism 14 and the lifting rail of the frame 13 further includes a limiting block for limiting the lifting mechanism 14 from excessive displacement during the lifting movement.

The wire guide wheel 122 is disposed on the cutting frame and the machine frame to realize the reversing of the cutting wire and guide the cutting wire, and in a specific implementation manner, the wire guide wheel may include a transverse wire guide wheel, a longitudinal wire guide wheel, an oblique wire guide wheel, and the like, and they may be disposed on different mounting structures according to the routing manner of the cutting wire to realize the purpose of guiding the cutting wire.

In some embodiments of this application, wire cutting device adopts non-confined wire winding mode, the line of cut head end is around in a pay off section of thick bamboo, and the tail end is around in a take-up section of thick bamboo to through the mode of a plurality of wire wheel direction around in between first multi-thread cutting wheel, the multi-thread cutting wheel of second and the single line cutting wheel, realize that the cutting frame carries out once lift cutting operation intercepting silicon chip sample piece under first cutting state, the cutting frame carries out once lift cutting operation and carries out the silicon rod and cut under the second cutting state.

Referring to fig. 2, a side view of an embodiment of the wire cutting device according to the present invention using a non-closed winding manner is shown, which includes a cutting frame 111, a first multi-wire cutting wheel 112, a second multi-wire cutting wheel 113, and a cutting line segment wound between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 to form a multi-wire saw 1121, a single-wire cutting wheel 114, and a cutting line segment wound between the second multi-wire cutting wheel 112 and the single-wire cutting wheel 113 to form a single-wire saw (not shown in the cutting state); a winding system 12, and a housing 15.

The cutting frame 111 is rotatably disposed on the lifting mechanism 14, and the rotating frame includes: rotating portion 1111, first suspension arm 1112, second suspension arm 1113, and third suspension arm 1114. The center of the rotating shaft of the rotating portion 1111 is the center of rotation of the cutting frame 111; the first suspension arm 1112 is a beam structure extending in a first direction along the rotating portion 1111; the second suspension arm 1113 is a beam structure extending in a second direction along the rotating portion 1111; the third suspension arm 1114 is a beam structure extending in a third direction along the rotating portion 1111; the first, second and

third cantilevers

1112, 1113, 1114 are all located on the rotation fixing plate of the cutting frame 111, i.e. rotate along with the rotation of the rotating portion 1111.

In an embodiment, a driving motor is coupled to a center of a rotation shaft of the rotation portion 1111, and a motor shaft, i.e., a power output shaft, drives the fixing plate of the cutting frame 111 to rotate along the rotation portion 1111.

The spatial position arrangement of the first suspension arm 1112, the second suspension arm 1113 and the third suspension arm 1114 on the cutting frame 111 approximately form a T-shaped structure, and the rotation center of the cutting frame 111 is arranged at the intersection end region of the three suspension arms of the cutting frame 111. In a specific implementation manner, the position of the rotation center is set in the gravity center area of the cutting frame 111 according to the structure and material characteristics of the cutting frame 111, so that structural wear caused by the self weight of the cutting frame 111 to the moment of the rotating shaft of the rotating part 1111 is reduced. In the embodiment shown in fig. 1, the free ends (i.e. the extending ends) of the first, second and

third cantilevers

1112, 1113, 1114 are rotatably connected to the first, second and single-

wire sawing wheels

112, 113, 114, respectively, such that the multi-wire saw 1121 is formed between the first and second

multi-wire sawing wheels

112, 113, and the single-wire saw 1141 is formed between the second multi-wire sawing wheel 113 and the single-wire sawing wheel 114. The first, second and

third cantilevers

The first multi-wire saw wheel 112 is a cutting wheel provided with at least two wire slots (including two or more wire slots), and is rotatably disposed at the extending end of the first suspension arm 1112 away from the rotation center, wherein the wire slots are arranged in parallel on the cutting wheel to ensure that the cutting wires wound on the cutting wheel are parallel to each other, and the basic structure and the installation manner of the cutting wheel are well known or easily known by those skilled in the art, and will not be described herein again.

The second multi-wire saw 113 is a cutting wheel provided with at least two wire grooves, and is rotatably disposed at the extending end of the second suspension arm 1113 away from the rotation center, wherein the wire grooves are arranged in parallel on the cutting wheel, and particularly, the distance between the adjacent wire grooves of the second multi-wire saw is equal to the distance between the adjacent wire grooves of the first multi-wire saw, so that the cutting segments of the multi-wire saw 1121 formed by winding the cutting wires between the two multi-wire saw wheels satisfy the spatial relationship of being parallel to each other.

The single-wire cutting wheel 114 is rotatably disposed at an extending end of the third suspension arm 1114, which is far away from the rotation center, and conforms to a cutting line segment wound between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 to form a single-wire saw, and a plane of a wire groove of the single-wire cutting wheel 114 in the first dimension direction is the same plane as a plane of at least one wire groove of the second multi-wire cutting wheel 113 in the first dimension direction.

In an exemplary embodiment, the single wire cutting wheel 114 may be provided with a plurality of wire slots, and the wire slots of the single wire cutting wheel may be wound once by the cutting wire in a winding manner, so that a single wire saw can be led out.

In an exemplary embodiment, when the silicon rod is cut, the cutting frame 111 rotates around the rotating portion 1111 thereof to switch between a first cutting state in which the silicon rod is cut by the multi-wire saw 1121 and a second cutting state in which the silicon rod is cut by the single-wire saw.

As shown in fig. 2, in the wire cutting device in the first cutting state, the lifting mechanism 14 moves up and down to drive the multi-wire saw 1121 (in the embodiment shown in fig. 2, the multi-wire saw is a two-wire saw) formed by cutting a cutting wire segment between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 to move up and down in the lifting direction, so as to cut multiple wires of a silicon rod to be processed (not shown) located below the multi-wire saw 1121, and in a cutting operation of one lifting movement, the silicon rod to be processed is cut at the same time with the parallel cutting wires 121, so that a silicon wafer sample wafer required for obtaining the silicon rod can be cut.

In some embodiments of the present application, as shown in fig. 3, the rotating portion 1111 of the cutting frame connected to the lifting mechanism is a rotary flange lock, i.e., the cutting frame 111 and the lifting mechanism 14 are movably connected by the rotary flange lock 1111. The rotary flange plate lock 1111 comprises a first flange, a second flange (not shown in the figure), a bolt and a nut, wherein the first flange is provided with a plurality of first through holes with the diameter larger than the diameter of a bolt screw and smaller than the diameter of the head of the bolt, the second flange is provided with a plurality of second through holes corresponding to the first through holes, the second through holes comprise a large round hole and a small round hole, and the large round hole and the small round hole are communicated with each other from the side wall; in this embodiment, the nut is 7 word nuts, and the one end diameter of nut is greater than the diameter of little round hole and is less than the diameter of big round hole, and the combination in nut and dysmorphism hole makes the ring flange lock dismouting simple laborsaving more. In another embodiment of the present application, the coupling nut in the flange lock may be a wing nut.

In other embodiments of the present application, the connection between the cutting frame and the lifting mechanism may be configured as a rotating part driven by a worm gear, including a worm wheel, a forward rotation worm, a reverse rotation worm, a driver, and a motor. The positive rotation worm and the reverse rotation worm are respectively meshed with the worm wheel, the driver controls the size and the direction of current in the motor, and the motor provides torque for the worm wheel through the worm to realize the rotation of the cutting frame.

As shown in fig. 2, which is a side view of the wire cutting apparatus of the present application in the non-closed winding manner, in the illustrated embodiment, the cutting wire 121 may be a steel wire, a diamond wire formed by embedding fine hard particles such as diamond on the cutting steel wire, or a diamond wire as described in chinese patent 201620281204.1 (title of the invention: diamond wire and multi-wire cutting apparatus), that is, the diamond wire includes: the steel wire is divided into at least two types of cutting sections which are arranged at intervals; at least two diamond-like carbon layers respectively plated on the at least two types of cutting sections, wherein the diamond layers have different particle grades.

In the particular embodiment chosen for diamond wire, the winding of the diamond wire on the wire storage drum (including one pay-off drum 124, one take-up drum 125) may preferably be a single layer winding, in order to avoid wear of the diamond wire wound on the wire storage drum due to the inevitable friction caused by the high speed routing. For the winding mode of the diamond wire on the wire storage cylinder, the wire storage cylinder wire arranging mechanism described in the Chinese patent 200910197800.6 (name of the invention: wire storage cylinder wire arranging mechanism of diamond wire cutting machine) can be adopted.

In some embodiments of the present application, the cutting system formed by each frame 13 and the cutting frame comprises at least one tension detection mechanism, the tension detection mechanism comprises at least one tension wheel 123, and the tension wheel 123 is disposed on the cutting frame 111, the lifting mechanism 14 or the frame 13, and is used for detecting and adjusting the tension between the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114. In a specific implementation manner, the tension wheel 123 may adopt a tension adjusting mechanism described in chinese patent 200910199387.7 (name of the invention: tension adjusting mechanism of diamond wire squarer); the method described in chinese patent 201410245524.7 (title of the invention: multi-wire cutting device and tension adjusting mechanism thereof) can also be used to sense the tension of the steel wire or cutting wire between the drawing assembly and the wire storage drum (bobbin) and the tension of the steel wire or diamond wire between the drawing assembly and the cutting zone in real time, and adjust the tension of the steel wire or diamond wire on the bobbin and the tension of the steel wire or diamond wire in the cutting zone according to the sensed tension values.

In some embodiments of the present application, the tension detection mechanism may also employ a tension transition wheel (not shown) to ensure that the cutting line 121 is in tension equilibrium during the cutting process. After the cutting wire 121 which starts from the pay-off drum 124 bypasses the rack 13, the cutting wire 121 is led into the cutting frame 111 through the first tension transition wheel before sequentially winding the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113 or the single-wire cutting wheel 114 on the cutting frame 111, and after the winding of the cutting wheel on the cutting frame 111 is completed, the cutting wire is led out to the guide wheel 1221 of the rack 13 through the second tension transition wheel and is guided and wound on the take-up drum 125 through the guide wheel 1221. During cutting, the first tension transition wheel is matched with the pay-off drum to adjust the first tension transition wheel and the cutting line 121 between the first multi-wire cutting wheels so as to ensure that the cutting line 121 is in a balanced state, and the second tension transition wheel is matched with the take-up drum to adjust the second tension transition wheel and the cutting line 121 between the second multi-wire cutting wheels or the single-wire cutting wheels so as to ensure that the cutting line 121 is in a balanced state.

In some embodiments of the present application, a winding motor is also included in the cutting system to drive the cutting wire 121 running between the take-up drum 125 and the pay-off drum 124.

The application further improves the wire cutting device and also comprises a locking device which is arranged on the lifting mechanism and used for fixing the cutting state after the cutting frame is converted and completed between different cutting states. The cantilever degree of freedom of the cutting frame is greater than 0, the cutting frame can be rotated by the contact stress of the cutting line 121 and the silicon rod to be cut in the cutting process, and the locking device is an implementation means, so that the cutting frame stops rotating and is in a locking state after the cutting frame reaches a preset cutting state position after being driven to rotate by a driving motor of the rotating part.

In an implementation of the embodiment of the application, the locking device comprises a rotation locking cylinder, the rotation locking cylinder is in a loosening state in a rotation process of the cutting frame for switching the cutting state, and the cutting frame enters a braking state after reaching a preset cutting state.

The application is further improved in that the locking device further comprises a positioning device, in the conversion of the cutting state, the rotation of the cutting frame is driven by a driving motor to rotate passively, the rotation state of the cutting frame is controlled by the motor, the rotation inertia of the cutting frame can maintain the continuous rotation of the cutting frame after the motor stops running, the rotation angular speed and the duration of the rotation motion driven by the rotation inertia are difficult to control artificially, and the positioning of the spatial position where the cutting frame stops running can be influenced. The positioning device is arranged on the lifting mechanism and comprises a fixing module of an automatic detection line and a positioning clamp assembly, when the rotating frame rotates to a first cutting state position or a second cutting state position, the fixing module of the automatic detection line detects that parts are placed behind the positioning clamp assembly in the cutting frame, a cylinder of a rotating locking cylinder stretches out, and the positioning clamp assembly is pushed to clamp the cutting frame to enable the cutting frame and the lifting mechanism to move relatively, so that the degree of freedom is 0.

Referring to fig. 3, in the embodiment shown in the figure, the winding manner of the wire cutting device is non-closed, taking the pay-off drum as a starting point and the take-up drum as an ending point, the cutting wire 121 passes through the rack and the cutting frame on the wire cutting device, the cutting wire 121 starts from the pay-off drum, the winding is performed on the rack according to the arrangement of the wire guiding wheels, then the wire guiding wheels, the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 are wound from the rack 13 to the cutting frame 111, and the cutting wire 121 is guided from the rack to the take-up drum through the wire guiding wheels after the winding on the cutting frame is completed.

For convenience of illustration and understanding of the winding manner of the present application, the cutting line 121 is wound on the cutting frame in such a manner that the cutting line 121 is wound from the frame to the tangent point of the line groove of the line guide wheel 1222 from the frame as a starting point, and the cutting line 121 runs in a tangential direction;

sequentially winding the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113 and the wire guiding wheel 1221, and forming a single-wire cutting wire saw between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 by winding the cutting wire 121 guided by the wire guiding wheel 1221 in one turn;

the cutting wire 121 starting from the tangent line of the wire groove of the wire guide wheel 1221 after the first winding sequentially passes through the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113, and is wound by the second multi-wire cutting wheel 113 to form a second cutting wire saw parallel to the single-wire cutting wire saw of the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 in the first winding, that is, the multi-wire saw 1121 is formed, that is, two mutually parallel cutting wires are finally formed;

an extension wire extending from a tangent line pay-off at the lower edge of the second multi-wire cutting wheel is wound to the wire guiding wheel 1223 on the frame as an end point of the winding on the cutting frame 111.

In some embodiments of the present application, the tension wheel around which the cutting wire passes on one frame in the wire cutting apparatus may be provided in plurality.

In some embodiments of the present application, based on the number of wafers to be taken, the annular winding manner can be repeated more than twice through the first multi-wire saw wheel and the second multi-wire saw wheel, so as to form parallel cutting wire saws, and a plurality of silicon wafer samples can be cut out in one-time up-down cutting of the cutting frame.

As shown in fig. 2, the wire cutting apparatus in the first cutting state is shown, the cutting frame 111 rotates to a state that the horizontal plane of the lower edge of the first multi-wire cutting wheel 112 is the same as the horizontal plane of the lower edge of the second multi-wire cutting wheel 113, and the common horizontal plane is located below the structure of the cutting frame 111 in the first cutting state, and a multi-wire saw is formed around the cutting line 121 between the first multi-wire cutting wheel 111 and the second multi-wire cutting wheel 113, and the multi-wire saw is a horizontal parallel line, that is, the first cutting state is a wafer taking operation state capable of cutting a silicon wafer sample in one cutting operation. In the first cutting state, the single-wire cutter wheel is in a separated state (non-contact state) from the cutting wire 121.

As shown in fig. 4, the wire cutting apparatus is shown in the second cutting state, in which the cutting frame 111 rotates to a state where the horizontal plane of the lower edge of the second multi-wire cutting wheel 113 is the same as the horizontal plane of the lower edge of the single-wire cutting wheel 114, and the common horizontal plane is located below the structure of the cutting frame 111 in the first cutting state, and a horizontal single-wire saw 1141 is formed by winding the cutting wire 121 between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114. That is, the second cutting state is a state in which the silicon rod can be cut in one cutting operation. In the second cutting state, an extension line of the first cantilever 1112 and an extension line of the second cantilever 1113 of the cutting frame 111 form an included angle of 45 degrees, an extension line of the second cantilever 1113 and an extension line of the third cantilever 1114 form an included angle of 45 degrees, and the cantilever structure of the cutting frame 111 uses a center line of the second cantilever 1113 as a symmetric line and is approximately symmetric. The extension line of multi-wire saw with be 90 contained angles between the extension line of single wire saw, when cutting frame 111 rotated around the rotation center in order to carry out the conversion of different cutting states, the interconversion accessible between first cutting state to the second cutting state was in order to realize around rotation axis 90 rotations, perhaps, the conversion accessible around rotation axis 45 of rotation in order to realize from the intermediate state to first cutting state or second cutting state.

Referring to fig. 5, a side view of the wire cutting apparatus of the present application is shown in an intermediate state of the embodiment, where the intermediate state is a natural rest state of the cutting frame 111 under the action of gravity of the cutting frame 111 when the locking device is in a released state, i.e. the cutting frame 111 is separated from the positioning fixture assembly, and the wire saw between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 and the wire saw between the second multi-wire cutting wheel 113 and the wire cutting wheel 114 are both at an angle to the horizontal line, and the wire saw and the wire cutting wheel 114 are in a tangent state; the cutting frame is approximately in a T-shaped structure which is vertically arranged in space, namely, a state that the center of gravity of a part below the horizontal plane of the rotation center of the cutting frame 111 is lowest.

Fig. 2 shows the wire cutting device in a first cutting state, the single-wire cutting wheel 114 being separated from the cutting wire 121. In the switching of the cutting process, when the cutting frame 111 is switched to the second cutting state, the single-wire cutting 114 wheel contacts and tangents with the separation of the cutting line 121 from the first cutting state to the middle state along with the rotation of the third cantilever 1114 of the cutting frame 111 around the rotation center and then reaches the pressing state in the second cutting state, and is locked by the rotation locking cylinder and is still after reaching the position of the second cutting state. The wire groove of the single-wire cutting wheel 114, which is in the same plane with the cutting wire 121 in the first dimension direction, contacts the cutting wire 121 and presses the cutting wire 121 to a horizontal state after rotating to a second cutting state, so as to form the single-wire saw between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114.

In the process of performing one-time complete cutting on the silicon rod on the bearing device by the linear cutting device, the process comprises the following cutting states: adjusting a silicon rod (a silicon rod to be cut) to clamp after the position of a bearing device, keeping the silicon rod static, adjusting the position of a rack in a first dimension direction, enabling a cutting wire saw to be positioned above a joint section of a head part (or a tail part) to be cut (or under the condition of two wire racks, two cutting racks are respectively positioned at the head and the tail of the silicon rod to be cut) and a part conforming to a processing specification, driving the cutting racks to rotate for a certain angle (45 degrees in the embodiment shown in the figure) from a natural static middle state to a first cutting state for cutting by a multi-wire saw, locking the cutting racks by a rotating locking cylinder, descending a lifting mechanism to drive the wire saw to move to contact with the silicon rod and continue cutting, namely cutting a silicon wafer sample wafer when the head part is cut; after the sample is cut, the lifting mechanism rises to be far away from the silicon rod, the position of the rack in the first dimension direction is adjusted by a travelling motor on a horizontal guide rail according to the preset length of the cut section of the silicon rod, a motor connected with a rotating shaft of the cutting rack drives the cutting rack to rotate for a certain angle (90 degrees in the embodiment shown in the figure) to a second cutting state of single-wire cutting, the cutting line and the single-wire cutting wheel are gradually separated to a pressing state in the rotation process until the cutting line winds around the single-wire cutting wheel, a horizontal single-wire saw is formed in the second cutting state, the cutting rack is locked by a rotating locking cylinder, and the lifting mechanism drives the cutting wire saw to descend for cutting to obtain the cut; and repeating the step of the single wire saw to cut off the silicon rod according to the requirement of the crystal section until the cutting operation of the whole silicon rod is completed. After the cutting frame has completed the cutting operation, the locking cylinder is in a relaxed state, and the cutting frame is rotated through an angle (45 ° in the illustrated embodiment) from the second cutting state to an intermediate state.

In other embodiments of the wire cutting apparatus of the present application, as shown in fig. 6, the included angle between the first, second and

third suspension arms

1112, 1113 and 1113 of the second cutting frame 111 can be changed by 120 ° as shown in the figure, and the first, second and single

wire cutting wheels

112, 113 and 114 are fixed on the first, second and

third suspension arms

1112, 1113 and 1114, respectively. An angle of 60 ° is formed between the extension of the multi-wire saw 1121 between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 and the extension of the single-wire saw 1141 between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114. When the cutting frame 111 is rotated about the rotation center 1111 to perform the switching between the different cutting states, the switching between the first cutting state and the second cutting state may be performed by the rotation about the rotation axis by 120 °, and the switching from the intermediate state to the first cutting state or the second cutting state may be performed by the rotation about the rotation axis by ± 60 °.

In other embodiments of the present application, as shown in fig. 7, the winding system of the wire cutting device of the present application adopts a closed winding structure, and the cutting wire 121 is wound around the cutting frame 111 in an endless loop in an end-to-end manner between the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113, and the single-wire cutting wheel 114. The cutting wire 121 is wound around the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 through the cutting grooves, and the formed cutting wire saw is arranged in the tangential direction of the cutting grooves. The cutting wire 121 is guided by the wire guide wheel to wind around the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 at least twice, and guided by the wire guide wheel to wind around the single-wire cutting wheel 114 once. The distance between the plurality of wire grooves surrounded by the cutting wire 121 on the first multi-wire cutting wheel 112 is equal to the distance between the plurality of wire grooves surrounded by the second multi-wire cutting wheel 113, that is, the cutting wires 121 led out along the tangential direction of the wire grooves of the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 satisfy the spatial relationship of being parallel to each other.

The cutting frame 111 is rotatably disposed on a lifting mechanism (not shown), and the cutting frame 111 includes: rotating portion 1111, first suspension arm 1112, second suspension arm 1113, and third suspension arm 1114. The center of the rotating shaft of the rotating part 1111 is the center of rotation of the cutting frame; the first suspension arm 1112 is a beam structure extending in a first direction along the rotating portion 1111; the second suspension arm 1113 is a beam structure extending in a second direction along the rotating portion 1111; the third suspension arm 1114 is a beam structure extending in a third direction along the rotating portion 1111; the first, second and

third cantilevers

In some embodiments of the present application, the rotating shaft of the rotating portion 1111 is coupled to a driving motor, and the cutting frame fixing plate is driven to rotate along the rotating portion by a motor shaft, i.e., a power output shaft.

The spatial position arrangement of the first cantilever 1112, the second cantilever 1113 and the third cantilever 1114 on the cutting frame approximately forms a T-shaped structure, and the rotation center of the cutting frame is arranged at the intersection end region of the three cantilevers of the cutting frame. In a specific implementation mode, the position of the rotating center is arranged in the gravity center area of the cutting frame according to the structure and material characteristics of the cutting frame, and structural abrasion caused by the self weight of the cutting frame to the moment of the rotating part rotating shaft is reduced. In the embodiment shown in fig. 1, the free ends (i.e., the extending ends) of the first, second and

third cantilevers

1112, 1113 and 1114 are fixedly connected to the first, second and single wire saw wheels, respectively, which form a multi-wire saw 1121 therebetween and a single wire saw (not shown) therebetween.

The first multi-wire saw wheel 112 is a cutting wheel with at least two wire slots, and is fixedly disposed at the extending end of the first suspension arm 1112 far from the rotation center, wherein the wire slots are arranged in parallel on the cutting wheel to ensure that the cutting wires wound on the cutting wheel are parallel to each other, and the basic structure and the installation manner of the cutting wheel are well known or easily known by those skilled in the art, and are not described herein again.

The second multi-wire saw 113 is a cutting wheel provided with at least two wire grooves, and is rotatably arranged at the extending end of the second cantilever 1113 far away from the rotation center, wherein the wire grooves are arranged in parallel on the cutting wheel, and particularly, the distance between the adjacent wire grooves of the second multi-wire saw 113 is equal to the distance between the adjacent wire grooves of the first multi-wire saw 112, so that the cutting sections of the multi-wire saw formed by winding the cutting wires between the two multi-wire saw wheels meet the spatial relationship of the parallel wire grooves.

In another embodiment of the present application, the single-wire cutting wheel 114 may be a cutting wheel provided with a plurality of wire grooves, and the cutting wire is wound around the wire groove of the single-wire cutting wheel 114 once in a winding manner, so that a single wire saw can be led out.

In some embodiments of the present application, when the silicon rod is cut, the cutting frame is rotated about the rotating portion thereof to realize the switching of the first cutting state by the multi-wire saw and the second cutting state by the single-wire saw.

In the wire cutting device in the first cutting state shown in fig. 7, the lifting mechanism moves up and down to drive the multi-wire saw 1121 (a dual-wire saw in the embodiment shown in fig. 1) formed by the cutting wire segment between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 to move up and down in the lifting direction, so as to cut multiple wires of a silicon rod to be processed (not shown) located below the multi-wire saw 1121.

In some embodiments of the present application, the rotating portion 1111 of the cutting frame to which the elevator mechanism is coupled is a rotary flange lock. The rotary flange plate lock comprises a first flange, a second flange (not shown in the figure), a bolt and a nut, wherein the first flange is provided with a plurality of first through holes with the diameter larger than the diameter of a bolt screw and smaller than the diameter of the head of the bolt, the second flange is provided with a plurality of second through holes corresponding to the first through holes, each second through hole comprises a large round hole and a small round hole, and the large round hole and the small round hole are communicated with each other from the side wall; in this embodiment, the nut is 7 word nuts, and the one end diameter of nut is greater than the diameter of little round hole and is less than the diameter of big round hole, and the combination in nut and dysmorphism hole makes the ring flange lock dismouting simple laborsaving more. In another embodiment of the present application, the coupling nut in the flange lock may be a wing nut.

In the embodiment shown in fig. 7, the cutting lines 121 are stranded wires formed by twisting at least two cutting lines with each other. The stranded wire cutting line is formed by rotating two or more steel wire single lines or diamond wire single lines for stranding at the same angular speed around a stranded wire shaft and advancing at a constant speed in a manner of matching with stranded wire winding, or is formed by regularly stranding a plurality of single lines for stranding in a certain direction, compared with a single line cutting line with the same sectional area as a stranded wire, the stranded wire cutting line has higher mechanical property and flexibility, and the fatigue life of the cutting line under repeated wear in cutting is prolonged.

Referring to fig. 7, in the illustrated embodiment, the winding manner of the cutting line 121 is a closed loop structure, and for convenience of illustration and understanding, it is assumed that a point in the loop of the cutting line is a cut-off point, and the point is a starting point of the winding, in one embodiment, the winding manner of the cutting line 121 is that a tangent point along the line groove of the single-line cutter 1114 from the single-line cutter 114 is a starting point, and the direction of the cutting line 121 is a tangential direction;

sequentially winding the second multi-wire cutting wheel 113, the first multi-wire cutting wheel 112, the wire guiding wheel 122, the cutting wire 121 guided by the wire guiding wheel 122 in one-time winding to form a single-wire cutting wire saw 1122 between the first multi-wire cutting wheel and the second multi-wire cutting wheel;

the cutting line 121 starting from the tangent line of the wire wheel groove after the first winding sequentially passes through the second multi-wire cutting wheel 113 and the first multi-wire cutting wheel 112 in a surrounding manner, and then is surrounded by the first multi-wire cutting wheel 112 to form a second cutting wire saw parallel to the single-wire cutting wire saw of the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 in the first surrounding manner, namely a multi-wire saw 1121 is formed between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113;

the cutting wire 121 is wound to the single-wire cutting wheel 114 via the tension wheel 123, and reaches the assumed cutting point on the single-wire cutting wheel 114, i.e. the first-to-first loop winding manner is realized in the actual winding.

The contact between the cutting line 121 and the cutting wheel on the cutting groove is a minor arc (an arc with an angle smaller than 180 degrees), the cutting line 121 is in a tensioning state between the cutting wheels, and the winding position is on the outer edge of a convex edge formed by the single-line cutting wheel or the multi-line cutting wheel, the tensioning wheel and the wire guiding wheel.

In some embodiments of the present application, the wire guide wheel 122 through which the annular winding wire passes on one cutting frame 111 in the wire cutting apparatus may be provided in plurality.

In some embodiments of the present application, the tension wheel 123 through which the circular winding wire passes on one cutting frame 111 in the wire cutting apparatus may be provided in plurality.

In some embodiments of the present application, the circular winding manner can be performed more than twice through the first multi-wire saw 112 and the second multi-wire saw 113, so as to form parallel cutting wire saws, and multiple silicon wafer samples can be cut in one up-and-down cutting of the cutting frame.

In some embodiments of the present application, the winding system formed by the circular winding manner further includes a driving motor (not shown) disposed adjacent to the first multi-wire saw wheel 112 or the second multi-wire saw wheel 113, and in this embodiment, the driving motor is a power source for running the cutting wire in the winding system, and the driving motor directly drives the first multi-wire saw wheel 112 or the second multi-wire saw wheel 113 for driving and rotating the cutting wire 121 wound between the first multi-wire saw wheel 112, the second multi-wire saw wheel 113 and the single-wire saw wheel 114.

The tension detection mechanism comprises a tension wheel 123 arranged on the cutting frame and used for detecting and adjusting the tension of the cutting line 121 among the first multi-wire cutting wheel 112, the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114. In the wire cutting process, the tension of the cutting wire 121 affects the yield and the processing precision during cutting, and the tension detection mechanism detects the tension and adjusts the tension of the cutting wire to reach a set certain threshold value, and keeps a constant value or a certain range allowed by taking the constant value as a numerical center during cutting.

The tension wheel 123 is used for adjusting the tension of the cutting line 121, so that the breakage probability of the cutting line 121 can be reduced, and consumables can be reduced. In the cutting operation, the string 121 plays a very important role, but even the best string 121 has a limited extension and wear resistance, that is, the string 121 is tapered in the reciprocating motion until it is finally pulled apart. Therefore, the existing wire cutting equipment is generally designed with a tension compensation mechanism for the cutting wire 121 to compensate for the extension of the cutting wire 121 in the reciprocating motion, and the tensioning wheel 123 is an implementation means.

In some embodiments of the application, the tension detection mechanism comprises at least: tension pulley, tension sensor, servo motor and lead screw. The tensioning wheel is arranged between the single-wire cutting wheel and the first multi-wire cutting wheel and is used for pulling a rigid wire or a diamond wire between the single-wire cutting wheel and the first multi-wire cutting wheel; the tension sensor is arranged on the tension wheel, continuously senses the tension value of the diamond wire on the tension wheel, and sends out a driving signal when the tension value is smaller than a preset value; the servo motor is electrically connected with the tension sensor and is used for starting to work after receiving a driving signal sent by the tension sensor; one end of the screw rod is connected with the tensioning wheel, the other end of the screw rod is connected with the servo motor, and the tensioning wheel is pulled to perform unidirectional displacement when the servo motor works so as to adjust the tension of the steel wire or the diamond wire.

The application of the wire cutting device is further improved in that the tension adjusting mechanism further comprises a slide rail, and the slide rail is arranged between the servo motor and the tension wheel and used for enabling the tension wheel to slide on the slide rail when the tension wheel is pulled by the lead screw. The servo motor is provided with a rotating shaft, and the screw rod is connected to the rotating shaft of the servo motor in a shaft coupling mode; when the tension sensor senses the tension of the steel wire or the diamond wire for the first time, the preset value sensed by the tension sensor is an initial tension value, the tension value sensed by the tension sensor is a current tension value in the cutting operation process, and the preset value sensed by the tension sensor is a tension value at the last moment.

The application further improves the wire cutting device and also comprises a locking device which is arranged on the lifting mechanism and used for fixing the cutting state after the cutting frame is converted and completed between different cutting states. The cantilever freedom degree of the cutting frame is larger than 0, the cutting frame can be rotated by the contact stress of the cutting line and the silicon rod to be cut in the cutting process, and the locking device is an implementation means, so that the cutting frame stops rotating and is in a locking state after the cutting frame reaches a preset cutting state position after being driven to rotate by a driving motor of the rotating part.

As shown in fig. 7, an extension line of the first suspension arm 1112 and an extension line of the second suspension arm 1113 of the cutting frame 111 form an included angle of 45 °, an extension line of the second suspension arm 1113 and an extension line of the third suspension arm 1114 form an included angle of 45 °, and the suspension arm structures of the cutting frame 111 are approximately symmetrical with a center line of the second suspension arm 1113 as a symmetry line. An angle of 90 degrees is formed between an extension line of the multi-wire saw 1121 and an extension line of the single-wire saw 1141, when the cutting frame 111 rotates around a rotation center to perform conversion of different cutting states, mutual conversion between a first cutting state and a second cutting state can be realized by rotation of 90 degrees around a rotation shaft, and conversion from an intermediate state to the first cutting state or the second cutting state can be realized by rotation of ± 45 degrees around the rotation shaft.

The first cutting state is a state that the cutting frame 111 rotates to a horizontal plane where the lower edges of the first multi-wire cutting wheel 112 are located and a horizontal plane where the lower edges of the second multi-wire cutting wheel 113 are located are the same horizontal plane, the common horizontal plane is located below the structure of the cutting frame 111 in the first cutting state, a multi-wire saw 1121 is formed by winding a cutting line segment between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113, and the multi-wire saw 1121 is in a horizontal parallel line. That is, the first cutting state is a wafer taking operation state in which a silicon wafer sample can be taken out in one cutting operation, and particularly, for the wire cutting device in different embodiments, the first cutting state is the wafer taking operation state of the wire cutting device.

Referring to fig. 8, a side view of the wire cutting apparatus of the present application is shown in a second cutting state in an embodiment, in which the cutting frame 111 rotates to a state where a horizontal plane of a lower edge of the second multi-wire cutting wheel 113 is the same as a horizontal plane of a lower edge of the single-wire cutting wheel 114, and the common horizontal plane is located below the structure of the cutting frame 111 in the first cutting state, and a horizontal single-wire saw is formed by winding a cutting wire between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114. That is, the second cutting state is a state in which the silicon rod can be cut in one cutting operation, and particularly, in the case of the wire-cut apparatus in the different embodiments, the second cutting state is a silicon rod cutting state of the wire-cut apparatus.

Referring to fig. 9, a side view of the wire cutting apparatus of the present application is shown in an intermediate state in an embodiment, the intermediate state is a natural rest state of the cutting frame 111 under the action of gravity when the locking device is in a released state, i.e. the cutting frame 111 is separated from the positioning clamp assembly, and at this time, the angles between the multi-wire saw between the first multi-wire cutting wheel 112 and the second multi-wire cutting wheel 113 and the angle between the single-wire saw between the second multi-wire cutting wheel 113 and the single-wire cutting wheel 114 and the horizontal line are all set, and the cutting frame 111 is approximately in a T-shaped structure vertically disposed in a space, i.e. a state that the center of gravity of a portion below the horizontal plane of the rotation center of the cutting.

In the specific implementation process of cutting the silicon rod to be cut by the linear cutting device, after the silicon rod to be cut is conveyed and fed, the silicon rod to be cut placed on the silicon rod bearing device is cut by the cutting system. According to the characteristics of the silicon rod to be cut, the position of the silicon rod on the bearing device or the horizontal position of the rack on the base of the linear cutting device is adjusted according to the length of the head or tail impurity layer to be cut, the position of the cutting rack in the first dimension direction is determined, then the traveling motor on the rack lifting mechanism drives the lifting mechanism to move in the lifting direction, and the driving motor matched with the annular winding of the cutting line drives the running cutting line, so that the cutting operation can be carried out.

In the process of performing one-time complete cutting on the silicon rod on the bearing device by the linear cutting device, the process comprises the following cutting states: adjusting the position of a silicon rod on a bearing device, then clamping the silicon rod to keep the silicon rod static, adjusting the position of a rack in the first dimension direction to enable a cutting wire saw to be positioned above a joint section of a head part to be cut and a part meeting the processing specification, driving a cutting frame to rotate a certain angle (45 degrees in the illustrated embodiment) from a natural static middle state to a first cutting state for cutting a multi-wire saw by a motor, locking the cutting frame by a rotating locking cylinder, descending a lifting mechanism to drive the wire saw to move to contact the silicon rod and continue cutting, namely cutting a silicon wafer sample when the head part is cut; after the sample is cut, the lifting mechanism rises to be far away from the silicon rod, the position of the rack in the first dimension direction is adjusted by a travelling motor on the horizontal guide rail according to the preset length of the cut section of the silicon rod, a motor connected with a rotating shaft of the cutting rack is used for driving the cutting rack to rotate for a certain angle (90 degrees in the embodiment shown in the figure) to reach a second cutting state of single-line cutting, the cutting rack is locked by a rotating locking cylinder, and the lifting mechanism drives the cutting wire saw to descend for cutting to obtain the cut section of the silicon rod; and repeating the operation of the previous step to the tail part of the silicon rod, namely finishing the cutting operation of the whole silicon rod by the cutting frame. After the cutting frame has completed the cutting operation, the locking cylinder is in a relaxed state, and the cutting frame is rotated through an angle (45 ° in the illustrated embodiment) from the second cutting state to an intermediate state.

Referring to fig. 10, in other embodiments of the wire cutting apparatus of the present application, the included angles between the first suspension arm 1112, the second suspension arm 1113 and the third suspension arm 1114 of the first cutting frame 111 can be changed, and the first multi-cutting wheel 112, the second multi-cutting wheel 113 and the single-wire cutting wheel 114 are respectively fixed on the first suspension arm 1112, the second suspension arm 1113 and the third suspension arm 1114. An included angle of 60 degrees is formed between the extension line of the multi-wire saw between the first multi-cutting wheel 112 and the second multi-cutting wheel 113 and the extension line of the single-wire saw between the second multi-cutting wheel 113 and the single-wire cutting wheel 114. When the cutting frame 111 is rotated about the rotation center to perform the switching between the different cutting states, the mutual switching between the first cutting state and the second cutting state may be performed by a rotation of 120 ° about the rotation axis, and the switching from the intermediate state to the first cutting state or the second cutting state may be performed by a rotation of ± 60 ° about the rotation axis.

In some embodiments of the present application, the tension wheel around which the annular winding on one cutting frame of the wire cutting device is wound may be provided in plurality.

In some embodiments of the present application, the annular winding manner can be performed more than twice through the first multi-wire cutting wheel and the second multi-wire cutting wheel, so as to form the cutting wire saws parallel to each other, and a plurality of silicon wafer samples can be cut in one lifting cutting of the cutting frame.

In an actual production process, the silicon rod is usually not a cylinder with the same diameter, but one end is large and the other end is small or other types, the bearing surface of the bearing device is arranged to be horizontal, the axis of the silicon rod to be cut may not be horizontal, at the moment, the cutting section obtained by the vertical lifting motion of the lifting mechanism is not perpendicular to the axis of the cut silicon rod, namely, the obtained cutting surface is an inclined surface, and the obtained silicon rod section does not meet the processing requirements. The linear cutting device of the present application is further improved by further comprising a horizontal detection device (not shown), wherein the horizontal detection device is arranged on the lifting mechanism and is used for detecting the axis levelness of the silicon rod to be cut.

In some embodiments of the present application, further, the level detecting device on the lifting mechanism includes a first contact measuring instrument and a second contact measuring instrument, which are used for detecting the axial level of the silicon rod to be cut. The first contact type measuring instrument is used for measuring the horizontal data of the silicon rod to be cut in the cutting working area at the measuring position corresponding to the first contact type measuring instrument, and the second contact type measuring instrument is used for measuring the horizontal data of the silicon rod to be cut in the cutting working area at the measuring position corresponding to the second contact type measuring instrument.

The linear cutting device further comprises a leveling device (not shown), wherein the leveling device is arranged in the working area and used for leveling the axis of the silicon rod to be cut, which is placed in the cutting working area, according to the detection result of the level detection device. The leveling device drives the workpiece bearing device to rotate by utilizing the rotation driving mechanism to adjust the levelness of the axis of the workpiece when the level detection device detects that the axis of the silicon rod to be cut is in a non-horizontal state through the horizontal aligning structure.

In one embodiment of the present application, a leveling device includes: the device comprises a rotating fulcrum structure, a rotating driving mechanism and an offset limiting mechanism. The rotating fulcrum structure is positioned below the silicon rod bearing device which is used for bearing the silicon rod to be cut in the working area and is used as a rotating fulcrum for the rotation of the silicon rod bearing device. The rotation driving mechanism is positioned below the silicon rod bearing device and used for driving the silicon rod bearing device to rotate around the rotation fulcrum structure so as to adjust the horizontal degree of the axis of the silicon rod to be cut. The deflection limiting mechanism is adjacently arranged on the rotation driving mechanism and used for limiting the deflection of the silicon rod bearing device in the horizontal direction when the silicon rod bearing device rotates (deflects up and down) around the rotation fulcrum structure.

In one embodiment of the leveling device of the wire cutting device, the first contact type measuring instrument corresponds to the rotation fulcrum structure and is used for measuring first height data (which can be absolute height or relative height relative to the silicon rod bearing device) of the top point of the silicon rod to be cut at the rotation fulcrum structure. The second contact-type measuring device corresponds to the rotary drive for measuring second height data (either absolute height or relative height with respect to the silicon rod carrier) of the silicon rod to be cut at the apex of the rotary drive. Subsequently, the adjustment amount of the silicon rod bearing device at the rotation driving mechanism can be calculated by integrating the first height data measured by the first contact type measuring instrument and the second height data measured by the first contact type measuring instrument, and the rotation driving mechanism is used for driving the silicon rod bearing device to rotate around the rotation fulcrum structure according to the adjustment amount, so that horizontal centering is completed, and the axis of the silicon rod to be cut is adjusted to be in a horizontal state.

Optionally, in another embodiment of the present application, a leveling device (not shown) of the wire cutting device of the present application may be further configured to be a horizontal centering mechanism for adjusting the levelness of the silicon rod to be cut by adjusting the cushion block. The leveling device is arranged on the silicon rod bearing device in the working area and used for adjusting the axis of the silicon rod to be cut into a horizontal state. Horizontal aligning mechanism includes: two adjusting cushion blocks, a horizontal detection unit and a driving motor.

And the two adjusting cushion blocks are respectively arranged at the head end and the tail end of the silicon rod bearing device in the corresponding working areas and used for bearing the silicon rod to be cut.

The horizontal detection unit is used for detecting the levelness of the silicon rod to be cut, which is supported by the two adjusting cushion blocks.

The driving motor is associated with at least one of the two adjusting cushion blocks and is used for controlling the associated at least one adjusting cushion block to perform lifting motion so as to ensure that the axis of the silicon rod to be cut is adjusted to be in a horizontal state.

Therefore, the horizontal aligning mechanism of the workpiece can be used for adjusting the horizontal degree of the axis of the workpiece to be cut, which is borne by the silicon rod bearing device, to be in a horizontal state, and the single-section workpiece section which meets the specification of the workpiece can be obtained through cutting. In addition, due to the adoption of the workpiece horizontal centering mechanism, the axis of the workpiece to be cut is ensured to be in a horizontal state, and the cutting section of each section of the cut workpiece is perpendicular to the axis, so that the processing requirement of the workpiece is met, and the cutting quality and the yield of the workpiece are improved.

In summary, the silicon rod cutting equipment disclosed by the application is the wire cutting device provided in the first aspect, wherein a rotatable cutting frame is designed, a single wire cutting wheel and a multi-wire cutting wheel are simultaneously arranged on the cutting frame, different winding systems are designed to realize the rotation conversion of a single wire saw and the multi-wire saw, the cutting frame rotates to different set states to realize the cutting of the multi-wire saw and the single wire saw, the cutting and the sample cutting can be realized by adjusting the cutting frame in the cutting operation of the silicon rod to be cut, so that the purpose of obtaining the sample in one-time lifting cutting and cutting in the silicon rod processing is achieved, and the problems that the efficiency of obtaining the sample by multiple times of cutting is low and the material waste is caused by difficulty in controlling the thickness of the sample are solved; moreover, the cutting frame is arranged on the lifting mechanism on the frame, the frame can move along the machine base in the first dimension direction, the cutting wire saw position can be adjusted according to the processing specification to obtain qualified processed silicon rod cutting, and the problem that the processing sizes required by workpieces are different is solved; the wire cutting device improves the cut-off operation efficiency of equipment, improves the qualification rate of products, improves the utilization rate of processed raw materials, effectively overcomes various defects of the prior art and has high industrial value.

The application applies for a silicon rod loading attachment in the second aspect for will place and will place the silicon rod that treats that the cutting in storage area and shift to the cutting workspace (cutting table) that the device was cut to the silicon rod. In the existing silicon rod feeding technology, a hoisting device is used as a common means, the silicon rod to be cut is conveyed by the hoisting device, the silicon rod needs to be clamped by a clamp made of a non-elastic material, the surface of the silicon rod is damaged due to the direct contact of the clamp material and the silicon rod during clamping, the common single silicon rod has the mass of about 400kg and the length of about 5000mm (such as 5360mm specification) or about 800mm and other different specifications, once the center of gravity of the silicon rod is raised in the hoisting process, a great potential safety hazard exists, and meanwhile, the motion of the hoisting device is generally in the lifting direction and the horizontal direction along a straight line, and the maneuverability is low; another common existing means for loading silicon rods is manual conveying, which seriously affects the production efficiency of enterprises.

Referring to fig. 11, a schematic diagram of a silicon rod feeding device according to the second aspect of the present application is shown, the silicon rod feeding device includes a first rotating shaft 21 and at least two

swing arm assemblies

25A and 25B.

The first rotating shaft 21 is driven to rotate by a first driving device 23, the length direction of the first rotating shaft 21 is arranged in the length direction of a silicon rod 16 to be cut in the silicon rod cutting working area 17, and the first driving device 23 is coupled with the first rotating shaft 21 and arranged at one end of the first rotating shaft 21.

In an embodiment of the present application, the first driving device 23 includes a driving motor 231, and a power output shaft of the driving motor 231 is coupled to the first rotating shaft 21 at one end of the first rotating shaft 21.

The number of the swing arm assemblies is two, the swing arm assemblies are respectively connected to the first rotating shaft 21 in a shaft mode according to preset intervals, the at least two

swing arm assemblies

25A and 25B are used for bearing the silicon rod 16 to be cut, and the silicon rod 16 to be cut is transferred to a cutting working area 17 of the cutting equipment under the driving of the first rotating shaft 21; each of the swing arm assemblies 25 includes a swing arm body coupled to the first rotating shaft 21, and a supporting mechanism disposed on the swing arm body, and the supporting mechanism is configured to keep a state of supporting the silicon rod 16 to be cut and keep a relative position between the silicon rod 16 to be cut and the supporting portion unchanged during the transferring operation, in other words, the unchanged relative position between the silicon rod 16 to be cut and the supporting portion during the transferring operation means that the silicon rod 16 to be cut is in a stationary state relative to the supporting portion during the transferring operation.

In an exemplary embodiment, the at least two

swing arm assemblies

25A, 25B are pivotally coupled to the first shaft 21 at predetermined intervals, for example, according to about 800mm (the shortest length of ingot is usually required).

In some embodiments of the present application, the racking mechanism includes a robot arm disposed at an end of the swing arm body to follow the movement of the swing arm. The swing arm body and the bearing mechanism rotate around the first rotating shaft under the driving of the first driving device. The mechanical arm enables the bearing part to rotate relative to the swing arm body under the action of the mechanical arm in the motion of following the swing arm, namely the rotation of the bearing part relative to the center of a circle circumscribed to the bearing part is determined by the rotation driven by the first driving device and the rotation relative to the swing arm body.

In one embodiment of the application, in the process that the silicon rod feeding device conveys the silicon rod to be cut from the storage area to the cutting area, the manipulator follows the swing arm to make the bearing part generate the angular speed relative to the rotation of the swing arm body and keep equal to and opposite to the angular speed of the swing arm rotating around the first rotating shaft, the angular speed of the bearing part relative to the rotation of the circle center of the circumscribed circle of the bearing part keeps 0, and no relative movement occurs between the bearing part and the silicon rod to be cut on the bearing part.

In some embodiments of the present application, at least two transfer tables corresponding to the swing arm assemblies one to one are disposed on a base of the silicon rod feeding device, and are used for respectively coupling the at least two swing arm assemblies to the first rotating shaft according to a preset interval. In one implementation, the movable connection between the transfer table and the corresponding swing arm assembly limits the movement of the corresponding swing arm assembly relative to the transfer table within a movement form rotating around the first rotating shaft, and the swing arm assembly generates corresponding displacement along with the displacement of the corresponding transfer table. The first rotating shaft penetrates through each swing arm assembly and enables each swing arm assembly which is connected to the rotating shaft through the transfer platform shaft to rotate around the first rotating shaft when the first driving device drives the first rotating shaft to rotate.

Referring to fig. 12, which is an enlarged schematic view of the silicon rod feeding device of the present application at b in fig. 11, as shown in the figure, the swing arm body 251 is driven by the first rotating shaft 21, and the swing arm body 251 can rotate around the first rotating shaft 21 under the driving of the power output shaft of the first rotating shaft 21, i.e., the motor shaft of the first driving device. One end (tail end) of the swing arm body 251 far away from the first rotating shaft 21 is fixedly connected with the supporting mechanism 252, the first rotating shaft 21 drives the swing arm body 251 to rotate on the normal plane of the axis of the first rotating shaft 21, so that the supporting mechanism 252 is driven to change in the spatial position, and the supporting mechanism 252 moves in the swinging direction between the material storage area and the cutting area.

In an embodiment of the present application, each transfer platform 27 has a first motion mechanism for linear displacement between the magazine area and the cutting work area, and includes a horizontal guide rail 271 arranged on two surfaces of the front side and the rear side of the transfer platform 27, the transfer platform 27 is movably connected to a carrier platform 28 provided with a corresponding second dimension direction guide slot (not shown) through the horizontal guide rail 271 in the second dimension direction, and a second motion mechanism is arranged on the carrier platform 28 to realize the linear displacement of the transfer platform 27 relative to the carrier platform 28 in the second dimension direction.

In some embodiments of the present application, a driving mechanism is provided inside or outside the transfer table 27 for driving the transfer table 27 to move on the horizontal guide 271 of the machine base. In one embodiment, the transfer table 27 drive mechanism includes: a traveling screw (not shown) disposed along the horizontal guide rail and connected to the transfer table 27, and a traveling motor (not shown) connected to the traveling screw. Utilize the motor of marcing, the drive the transfer platform 27 is marchd along guide rail 271, the motor of marcing on the transfer platform 27 with lay on the guide rail the lead screw connection of marcing realizes the displacement of transfer platform 27 along the second dimension direction on the guide rail, the shortest distance direction between stock area and the cutting area.

In another embodiment of this application, the transfer station is in the storage area with linear displacement's between the cutting work area first motion can adopt the motor of marcing and the vice complex form of ball, ball is vice including ball and with the screw nut of ball looks adaptation, screw nut with the transfer station links to each other, the motor of marcing drives ball is rotatory, thereby passes through screw nut drives the transfer station is followed linear motion is to the guide slot that sets up on the plummer.

In some embodiments of the present application, a second movement mechanism is provided in the silicon rod feeding device for linearly displacing (i.e. displacing in a first dimension) at least one swing arm assembly 25 on the first rotation shaft 21. In an implementation manner of this embodiment, the bottom of the bearing platform 28 further includes a guide rail assembly in the first dimension direction, and the guide rail assembly is movably connected to the guide rail in the first dimension direction disposed on the machine base 15 through a bottom guide groove (not shown in the figure) of the bearing platform 28. The second motion mechanism is a guide rail assembly of the bearing platform 28, and includes a driving mechanism disposed inside or outside the bearing platform 28, and is configured to drive the bearing platform 28 to move on the guide rail in the first dimension direction of the machine base. The plummer 28 drive mechanism includes: a traveling screw (not shown) disposed along the bottom rail of the carrier 28 and connected to the carrier 28, and a traveling motor (not shown) connected to the traveling screw. Utilize the motor of marcing, the drive plummer 28 is marchd along the frame guide rail, the motor of marcing on the plummer 28 with lay on the frame guide rail the lead screw connection of marcing realizes plummer 28 is on the frame guide rail along the displacement of first dimension direction promptly being on a parallel with first pivot 21 linear direction.

In another embodiment of the present application, the second movement mechanism for linearly moving at least one swing arm assembly on the first rotating shaft may adopt a form of matching a traveling motor with a ball screw assembly, the ball screw assembly includes a ball screw and a screw nut adapted to the ball screw, the screw nut is connected to the bearing table, and the traveling motor drives the ball screw to rotate, so that the bearing table is driven by the screw nut to linearly move along a guide groove provided on the base.

In an actual production process, the silicon rods are not cylinders with equal diameters, but are cylinders with one large end and one small end or other types, the positions of the gravity centers of different silicon rods in the length direction of the silicon rods are determined by specific shapes of the silicon rods, and the requirement that the moment generated by the support of the silicon rods by different supporting mechanisms and the gravity moment are balanced with each other in the silicon rod transfer process is met to ensure that the silicon rods do not drop off axially in the transfer process. In some embodiments of the present application, the plummer that two at least transfer stations correspond has at least one plummer to set up bottom guide rail set spare i.e. the second motion in order to drive the displacement of realizing the transfer station on the plummer in first pivot rectilinear direction, the plummer quantity that can move along first pivot rectilinear direction also can be greater than one. The bearing table provided with the second movement mechanism drives the corresponding transfer table and the swing arm assembly to move in the linear direction of the first rotating shaft so as to adjust the position of the swing arm assembly on the first rotating shaft, namely, the adjustment of the bearing mechanism relative to the silicon rod in the length direction of the silicon rod is realized, and further the adjustment of the position of the bearing mechanism relative to the center of gravity of the silicon rod is realized.

As mentioned above, the length of the silicon rod commonly used in silicon rod processing is about 800mm to 5000mm, the mass of the silicon rod commonly used is about 400kg or more, the balance of the silicon rod is ensured by two silicon rod supporting mechanisms in the silicon rod transferring process, two supporting points or surfaces in the silicon rod transferring process are generally located at two ends of the silicon rod, the pressure borne by the surface of the silicon rod contacting with the supporting points at the two ends is large and may damage the integrity of the silicon rod structure, please refer to the side view of the silicon rod feeding device of the present application shown in fig. 11, in the illustrated embodiment, the number of the swing arm assemblies is four at intervals, and the swing arm assemblies include a first swing arm assembly 25A and a second swing arm assembly 25B located at two ends of the first rotating shaft, and a third swing arm assembly 25C and a fourth swing arm assembly 25D respectively coupled between two ends of the first rotating shaft 21 according to a preset interval. The pressure at the contact surface of each supporting mechanism 252 and the silicon rod during the silicon rod transfer is lower than the contact surface pressure during the transportation of two supporting mechanisms 252 or clamps in the prior art.

In some embodiments of the present application, the bearing platform corresponding to the transfer platform of the third swing arm assembly 25C or the fourth swing arm assembly 25D is provided with a second motion mechanism to realize the displacement of the transfer platform on the bearing platform in the linear direction of the first rotating shaft 21, so as to adjust the bearing position according to the position of the center of gravity of the silicon rod to be cut. In one implementation of this embodiment, the second movement mechanism may be provided as a rail assembly with a driving motor.

In some embodiments of the present application, as shown in fig. 13, which is an enlarged schematic view of c in fig. 11, the silicon rod feeding device further includes a second rotating shaft 22, the second rotating shaft 22 is driven by a second driving device 24, penetrates through the first, second, third and fourth swing arm assemblies in parallel with the first rotating shaft 21, is coupled to the swing arm assembly 25, and is located between the first rotating shaft 21 of the swing arm body 251 and the supporting mechanism 252, and the second driving device 24 is disposed at one end of the second rotating shaft 22.

The application is further improved in that the first driving device and the second driving device are respectively arranged at two ends of the first rotating shaft or the second rotating shaft in the length direction and are respectively located at the rotating shaft end of the first rotating shaft and the first swing arm component coupling part and the rotating shaft end of the second rotating shaft and the second swing arm component coupling part, the quality of the mechanical layout of the swing arm components is balanced in the length direction, the space layout is realized, the structural space utilization rate of the swing arm components is improved, and the size of the swing arm components is correspondingly reduced.

In some implementations of the present application, the swing arm body includes a built-in space, that is, the swing arm body is configured to have a structure with an accommodating space for accommodating the first rotating shaft, the second rotating shaft and the coupling component coupled to the swing arm body.

In some embodiments of the present application, the support mechanism of the swing arm assembly includes a drive gear, a driven gear, and a robot assembly including a robot body and a support.

Referring to fig. 14, which is a cross-sectional view of the swing arm body 251 and the supporting mechanism 252 of the silicon rod feeding device of the present invention, gears engaged with each other are disposed in the built-in space of the swing arm body 251, and a driving gear 2522 and a driven gear 2523 are respectively disposed from the end of the swing arm to the end, and the driving gear 2522 of each swing arm assembly 25 is coupled to the second rotating shaft 22 and driven by the second rotating shaft 22 to rotate; the driven gear 2523 meshes with the driving gear 2522, while the toothed portion 252121 of the carrier 25212 meshes with the driven gear 2523.

As shown in fig. 14, the robot body 25211 is fixedly disposed at the end of the swing arm body 251 of the swing arm structure, and is a U-shaped, C-shaped, or crescent-shaped steel structure (not shown) curved in an arc shape in the longitudinal direction, and the symmetry axis in the arc length direction is coaxial with the symmetry axis of the swing arm structure.

The supporting member 25212 is movably disposed on the manipulator body 25211 and is used for supporting the silicon rod 16 to be cut, and includes a tooth portion 252121 engaged with the driven gear 2523 and a supporting portion 252122 with a contour capable of conformably accommodating the silicon rod 16 to be cut. The tooth 252121 is an arc-shaped rack structure, and is movably disposed on the manipulator body 25211, and the arc of the rack conforms to the arc-shaped inlay of the manipulator body 25211 and is disposed inside the U-shaped, C-shaped, or crescent-shaped cavity of the manipulator body 25211. The retainers 252122 are fixedly disposed on the teeth 252121 and follow the movement of the teeth 252121.

In an embodiment of the present application, the U-shaped, C-shaped, or crescent-shaped steel structure of the robot body 25211 is a U-shaped, C-shaped, or crescent-shaped structure with a notch, as shown in the figure, the notch is disposed at the symmetry axis of the circular arc circumference, so that the driven gear 2523 of the supporting mechanism 252 and the tooth portion 252121 of the supporting member 25212 are engaged at the central notch.

In an embodiment of the present application, a row of parallel cylindrical balls is disposed on the contour of the supporting portion 252122 of the robot assembly 2521, the cylindrical balls directly contact the surface of the silicon rod 16 to be cut during the silicon rod transfer, and the radius of the circular arc formed by the common tangent line along which the cylindrical balls are located is slightly larger than the common radius range of the silicon rod, so as to ensure that the supporting mechanism 252 can place the supported silicon rod in the inner circular groove thereof when supporting the silicon rod, and make the two arc surfaces close to each other to limit the silicon rod from rolling and shifting during supporting.

In an embodiment of the present application, the second driving device may be configured as a driving motor, and a motor shaft is coupled to the second rotating shaft 22 to drive the second rotating shaft 22 to rotate, so as to realize rotation of the driving gear 2522 coupled to the second rotating shaft 22. The driving gear 2522 in the space inside the swing arm main body is driven by the second rotating shaft 22 to rotate at the rotating speed and direction of the second driving rotating shaft. Driven gear 2523, which is driven by driving gear 2522 and engaged with driven gear 2522, rotates in a direction opposite to the rotational direction of driving gear 2522, and the angular velocity at which driven gear 2523 rotates is determined by the tooth number relationship between driving gear 2522 and driven gear 2523 and the rotational speed of driving gear 2522; further, the tooth 252121 meshing with the driven gear 2523 rotates in the direction opposite to the direction in which the driven gear 2523 rotates, and the angular velocity at which the tooth 252121 rotates is determined by the magnitude relationship between the radius of the arc in which the tooth 252121 is located and the radius of the driven wheel and the magnitude of the rotational speed of the driven wheel. That is, the rotational angular velocity of the tooth 252121 is determined (fixed) by the relationship between the motor rotational speed (variable) of the second driving device and the number of teeth or radii of the drive gear 2522, the driven gear 2523, and the rack, that is, the rotational angular velocity of the holder 25212 relative to the robot main body 25211 is determined by the rotational speed output from the second driving device, and the rotational direction is the same as the rotational direction output from the second driving device.

A further development of the application is that there may be a synergistic relationship of the torques between the second drive means and the corresponding drive motors of the first drive mechanism. As shown in fig. 14 to 16, when the support portion 252122 of the support mechanism 252 is in the carrying state during the silicon rod transfer process, the swing arm assembly 25 is driven by the rotation of the first rotating shaft 21 when the support portion 252122 of the support mechanism 252 is in the carrying state, the rotation of the rotating shaft drives the angular displacement of the swing arm body 251 in the normal plane of the first rotating shaft 21, and the rotational angular velocity of the swing arm body 251 is determined by the first driving device. The swing arm body 251 and the robot assembly 2521 at the end thereof rotate along with the swing arm body 251 with the first rotating shaft 21 as the rotation center and the angular velocity of the rotation of the first rotating shaft 21 as the rotation speed.

Specifically, the second driving device drives the second rotating shaft 22 to rotate in a direction opposite to the direction of rotation of the first rotating shaft 21 in the loaded state, so as to realize the rotation of the supporting piece 25212 around the center of the circular arc of the rack, where the rotation of the supporting piece 25212 around the first rotating shaft 21 is defined as a first rotation motion, and the rotation around the center of the circular arc of the rack is defined as a second rotation motion, which is a combination of the first rotation motion controlled by the first rotating shaft 21 and the rotation motion controlled by the second rotating shaft 22 and relative to the manipulator body 25211, performed by the supporting piece 25212 following the swing arm body 251.

The first driving device and the second driving device respectively control two rotation motions of the supporting part 252122, so that the angular speed of the second rotation of the supporting part 25212 is 0, the silicon rod 16 to be cut in the transfer state displaces from the storage area to the cutting area along with the motion of the supporting part 25212, and the relative position of the silicon rod 16 to be cut and the supporting part 252122 is kept unchanged.

In another embodiment of the present application, the first driving device and the second driving device may work independently to control the first rotational motion and the rotational motion of the rack relative to the robot body, respectively, so as to control the change of the spatial position of the supporting portion and the rotation angle of the second rotational motion together. Before transferring the silicon rod to be cut positioned in the storage area, the manipulator assembly swings under the driving of the first rotating shaft until the bearing part and the silicon rod are positioned at the same horizontal height, and the bearing part only has first rotating motion in the swinging process; the conveying turntable guide rail component drives the conveying turntable, the swing arm component and the manipulator component which are arranged on the conveying turntable to feed along the vertical line direction of the silicon rod to be cut on the horizontal plane until the bearing part is contacted with the silicon rod to be cut; the silicon rod transfer device comprises a mechanical arm body, a bearing part, a first rotating shaft, a second rotating shaft, a first driving device, a second driving device and a second driving device, wherein the bearing part is in contact with a silicon rod to be cut and then drives the bearing part to rotate relative to the mechanical arm body through the second rotating shaft, so that the bearing part is positioned under the silicon rod to be cut, the contact position of the bearing part and the silicon rod to be cut is positioned on the arc-shaped symmetrical axis and the adjacent position area of the bearing part, and then the silicon rod transfer process is carried out through. Further, in the silicon rod transferring process, the moving motor of the transfer table guide rail and the moving motor of the bearing table guide rail respectively drive the swing arm assembly and the manipulator arranged on the swing arm assembly to move linearly in the second dimension direction and the first dimension direction. The linear motion of the bearing table along the base guide groove in the first dimension direction, the linear motion of the transfer table relative to the bearing table in the second dimension direction and the rotary motion driven by the first driving device or the second driving device are mutually independent.

The present application further improves the above mentioned structure, the number of teeth of the tooth portion 252121 of the supporting portion 252122 is greater than the number of teeth of the driven gear 2523, the number of teeth of the driven gear 2523 is greater than the number of teeth of the driving gear 2522, the driven gear 2523 and the tooth portion 252121, and the angular velocity of the driving gear 2522, the angular velocity of the driven gear 2523, and the angular velocity of the tooth portion 252121 are sequentially reduced in the second rotational motion determined by the second driving device and the number of teeth or the radius relationship, so as to realize the precise control of the supporting member 25212 in the second rotational motion.

In an embodiment of the present application, the contact surface of the supporting portion 252122 and the silicon rod to be cut has a buffer material. In some implementations of the present embodiment, the contact surface of the supporting portion 252122 and the silicon rod to be cut is made of a rubber material with elasticity, or is made of silica gel or other materials with elastic deformation, damping characteristics or buffering characteristics, so as to protect the surface of the silicon rod to be cut in contact therewith from being scratched or collided.

Referring to fig. 17, which is a cross-sectional view of another embodiment of the swing arm body 251 and the supporting mechanism 252, the supporting mechanism 252 includes a driving gear 2522 disposed in a space defined in the swing arm body 251 and a robot assembly 2521 disposed at an end of the swing arm body 251. The driving gear 2522 is coupled to the second shaft and driven by the second shaft to rotate along with the second shaft. The manipulator assembly 2521 includes a manipulator body 25211 and a holder 25212, wherein the manipulator body 25211 is fixedly disposed at an end of the swing arm body 251 and includes a slot structure curved in an arc in a length direction.

The supporting member 25212 is movably disposed on the manipulator body 25211 and is used for supporting the silicon rod to be cut, and includes a tooth portion 252121 engaged with the driven driving gear 2522 and a supporting portion 252122 with a contour capable of conformably accommodating the silicon rod to be cut. The tooth 252121 is an arc-shaped rack structure movably disposed on the manipulator body 25211, and the arc of the rack is mounted on the manipulator body 25211 in an arc shape conforming to the structural groove of the manipulator body 25211. The tooth 252121 is engaged with the driving gear 2522 disposed in the space of the swing arm body 251, and the driving gear 2522 disposed in the space drives the supporting member 25212 to rotate relative to the robot body 25211 under the rotation of the second shaft. The retainers 252122 are fixedly disposed on the teeth 252121 and follow the movement of the teeth 252121.

The susceptor 25212 follows the robot body 25211 to rotate about the first axis of rotation under the drive of the first drive means, while rotating relative to the robot body 25211 under the drive of the second drive means. In an implementation manner of this embodiment, the second driving device includes a driving motor, and one end of the second rotating shaft is coupled to the second rotating shaft. The second driving device drives the second rotating shaft to rotate, so as to drive the driving gear 2522 in the space inside the swing arm structure and the second rotating shaft to rotate at the same angular speed, and the tooth 252121 is driven by the driving gear 2522 engaged therewith to rotate at a certain angular speed relative to the robot body 25211. The rotation speed of the susceptor 25212 around the first rotation shaft 21 is determined by a first driving device, the rotation of the susceptor 25212 with respect to the robot body 25211 is determined by a second driving device, the ratio of the radius of the tooth portion 252121 to the radius of the driving gear 2522 in the built-in space, and the first driving device and the second driving device independently control two rotational movements of the susceptor 25212.

In an embodiment of the present application, the first driving device and the second driving device drive the first rotating shaft and the second rotating shaft to rotate under a certain cooperative relationship, and the rotation speed of the supporting portion 252122 relative to the center of the circumscribed circle thereof is the vector sum of the rotation of the supporting portion 252122 around the first rotating shaft and the rotation relative to the robot body 25211. As shown in fig. 17 to 19, when the swing arm assembly rotates to different angles around the first rotation axis in the loaded state, the first driving device 23 and the second driving device 24 operating in the cooperative relationship compensate each other for the angle change of the supporting member 25212 relative to the center of the circumscribed circle thereof, so that the angular velocity of the supporting portion 252122 relative to the rotation movement with the center of the circumscribed circle of the supporting portion 252122 as the rotation center is always 0. The first driving device and the second driving device are driven in the cooperative relationship in the transferring operation, so that the supporting piece 25212 does not rotate relative to the silicon rod to be cut in the transferring process in the bearing state.

In another embodiment of the present application, the number of teeth 252121 is greater than that of the driving gear 2522 in the space inside the swing arm body 251, and the angular velocity transmission controlled by the second driving device is a reduction transmission from the second rotating shaft to the teeth 252121, so as to achieve precise control of the susceptor 25212 during the rotation of the susceptor 25212 relative to the robot body 25211.

In another embodiment of the present application, the racking mechanism of the swing arm assembly includes a robot assembly disposed at a distal end of the swing arm body. The manipulator assembly comprises a manipulator body and a supporting piece, and the manipulator body is fixedly arranged on the swing arm body and moves along with the swing arm body; the supporting piece is movably arranged on the manipulator body and used for bearing the silicon rod to be cut. The bearing piece is in power connection with the second rotating shaft and drives the bearing piece to rotate on the manipulator body when the second rotating shaft rotates.

In an implementation manner of this embodiment, the rotation of the supporting member relative to the manipulator is controlled by a second driving device to control the rotation speed of a second rotating shaft, and the second rotating shaft drives the supporting member to rotate at a certain rotation speed; the manipulator body is driven by a first driving device to rotate around the first rotating shaft along with the swing arm body. The first driving device and the second driving device can relatively independently drive the swing arm body to rotate around the first rotating shaft and the supporting piece to rotate relative to the manipulator body respectively.

In another embodiment of the present application, the first driving device and the second driving device drive the first rotating shaft and the second rotating shaft to rotate under a certain cooperative relationship. The bearing part rotates around the first rotating shaft under the driving of the first driving device along with the manipulator body, and simultaneously rotates relative to the manipulator body under the driving of the second driving device, and the first driving device and the second driving device output rotating speeds in a cooperative relationship, so that the angle change of the bearing part relative to the circle center of an external circle of the bearing part is compensated by the operation of the first driving device and the second driving device, and the angular speed of the bearing part relative to the rotating motion taking the circle center of the external circle of the bearing part as a rotating center is always 0. The first driving device and the second driving device are driven in the cooperative relationship in the transferring operation, so that the bearing part and the silicon rod to be cut are prevented from rotating relatively in the transferring process of the bearing state.

In the process of transferring the silicon rod by the silicon rod feeding device, before transferring the silicon rod to be cut positioned in the material storage area, the mechanical arm component swings along with the swing arm body under the driving of the first rotating shaft until the bearing part and the silicon rod are positioned at the same horizontal height, and the rotating motion of the swing arm component is independently driven by the first driving device in the swinging process; the conveying turntable guide rail component drives the conveying turntable, the swing arm component and the manipulator component which are arranged on the conveying turntable to feed along the vertical line direction of the silicon rod to be cut on the horizontal plane until the bearing part is contacted with the silicon rod to be cut; the silicon rod transfer device comprises a mechanical arm body, a bearing part, a first rotating shaft, a second rotating shaft, a first driving device, a second driving device and a second driving device, wherein the bearing part is in contact with a silicon rod to be cut and then drives the bearing part to rotate relative to the mechanical arm body through the second rotating shaft, so that the bearing part is positioned under the silicon rod to be cut, the contact position of the bearing part and the silicon rod to be cut is positioned on the arc-shaped symmetrical axis and the adjacent position area of the bearing part, and then the silicon rod transfer process is carried out through.

Further, in the silicon rod transferring process, the moving motor of the guide rail of the transfer table and the moving motor of the guide rail of the bearing table respectively drive the swing arm assembly and the manipulator arranged on the swing arm assembly to move linearly in the second dimension direction and the first dimension direction. The linear motion of the bearing table along the base guide groove in the first dimension direction, the linear motion of the transfer table relative to the bearing table in the second dimension direction and the rotary motion driven by the first driving device or the second driving device are mutually independent.

The utility model provides a silicon rod loading attachment's further improvement still lies in, the swing arm subassembly is provided with detection device, is used for detecting bearing portion with wait to cut the contact of silicon rod for in the material loading work, detect bearing portion with wait to cut the contact of silicon rod, and after the silicon rod of cutting is waited in the manipulator bearing, the order the driving motor of first pivot and second pivot begins work, and the piece is sent in the execution of lifting swing arm promptly.

In some embodiments of the present application, the detecting device includes a pressure sensor disposed on the supporting portion, and the pressure sensor includes a pressure sensitive element and a signal processing unit. Before transferring the silicon rod to be cut positioned in the material storage area, the manipulator assembly swings along with the swing arm body under the driving of the first rotating shaft until the bearing part and the silicon rod are positioned at the same horizontal height, and the rotating motion of the swing arm assembly is independently driven by the first driving device in the swinging process; the conveying turntable guide rail component drives the conveying turntable, the swing arm component and the manipulator component which are arranged on the conveying turntable to feed along the vertical line direction of the silicon rod to be cut on the horizontal plane until the bearing part is contacted with the silicon rod to be cut; a pressure sensitive element of the pressure sensor contacts the silicon rod to be cut and outputs a contact signal, and the transfer platform performs a short-distance operation of retreating relative to the silicon rod to be cut in a second dimension direction; and the bearing part is driven by a second rotating shaft to rotate relative to the manipulator body under the separation state of the bearing part and the silicon rod to be cut, so that the bearing part is positioned under the silicon rod to be cut, then the swing arm component rotates to lift the silicon rod, and the bearing part is transferred from the storage area to the cutting area under the state of being driven by a first driving device, a second driving device, a running platform guide rail component and a bearing platform guide rail component together. Silicon rod loading attachment will treat to cut the silicon rod and transport to the cutting district, the swing arm body is rotatory will treat to cut the silicon rod and place on the bearing table face of cutting workspace, the order the driving motor drive second pivot antiport of second pivot, the drive bearing portion rotates in order to release treat the bottom of cutting the silicon rod to the order transfer table is kept away from in the second dimension direction and is treated the silicon rod of cutting.

By utilizing the detection device and the pressure sensitive element or the contact sensor which is highly sensitive to pressure, the process that the supporting part is close to the silicon rod to be cut before the silicon rod to be cut is transferred is stopped when the silicon rod to be cut is contacted, and the silicon rod to be cut is subsequently rotated to the position below the silicon rod to be cut for supporting, so that the silicon rod to be cut can be prevented from being stably damaged or the surface structure of the silicon rod to be cut is damaged in the supporting process, and the conveying safety of the whole process of transferring the silicon rod is ensured.

In summary, the following steps: according to the silicon rod stage equipment disclosed by the application, in the silicon rod feeding device provided by the second aspect, the silicon rod to be cut is borne and transferred by arranging the swing arm component structure driven by the first driving device, the corresponding motion following device or the manipulator component driven by the second driving device is arranged on the bearing mechanism of the swing arm component, and when the bearing part of the silicon rod feeding device is in a bearing state, the first driving device and the second driving device are driven simultaneously according to the relationship between the preset driving devices by the mechanical structure, so that the stable conveying effect that the silicon rod to be cut and the bearing part do not move relatively in the conveying process is realized; moreover, the swing arm assembly can be arranged on a transfer platform capable of moving along the second dimension direction, meanwhile, the transfer platform can be movably arranged on a bearing platform capable of moving along the first dimension direction, and all movements are relatively independent, so that the silicon rod feeding device has a large conveying range and flexibility in conveying overshoot; the silicon rod loading attachment of this application realizes automatic material loading, has guaranteed the security of transporting when increasing silicon rod transport efficiency to improve the mobility of transporting the process, effectively overcome all kinds of shortcomings of prior art and had high industrial value.

The silicon rod equipment of cuting of this application applies a silicon rod unloader in the third aspect, silicon rod unloader set up in the discharge end of cutting workspace for the centre gripping and the transportation accord with the single-section silicon rod truncation of work piece specification after cutting, so that the unloading. In the prior art, the silicon rod sections processed by the silicon rod cutting equipment are generally conveyed manually or cut table tops are pushed and pulled, so that the production efficiency of enterprises is influenced; the common silicon rod to be cut has the mass of about 400kg and above, and the manual and push-pull carrying modes require a large amount of manpower, so that the safety and the economical efficiency are low.

As shown in fig. 20, a schematic configuration of a silicon rod blanking device of the silicon rod truncation apparatus according to an embodiment of the present invention includes: a take-out arm 31 and a clamp 32.

The material taking arm 31 is movably arranged on the top frame 19 of the silicon rod cutting equipment in a hanging manner and can translate along the top frame 19, and the material taking arm 31 comprises a telescopic mechanism; the axis of the translational motion of the material taking arm 31 is arranged right above the axis of the silicon rod to be cut in the cutting area.

The clamping piece 32 is arranged at the bottom end of the material taking arm 31 and used for clamping and cutting the single-section silicon rod meeting the workpiece specification after being cut in the cutting area. The material taking arm 31 and the clamping piece 32 are in a bilateral symmetry or mirror symmetry structure on the whole.

In an implementation manner of this embodiment, the material taking arm 31 is movably connected to the top frame 19 through a rail assembly, and the rail assembly includes: a guide groove 312 provided in the upper frame 19, a guide rail 311 fixedly provided on the upper portion of the take-out arm 31, and a take-out arm drive mechanism 313 provided on the upper portion of the take-out arm 31. The guide rail 311 and the guide groove 312 matched with the guide rail are arranged in the first dimension direction, so that the material taking arm 31 generates axial displacement relative to the silicon rod along the guide groove 312, and the position of the material taking arm 31 is adjusted according to the position of the processed silicon rod segment in practice to realize subsequent clamping of the silicon rod segment.

In an embodiment of the present application, the material taking arm driving mechanism 311 includes: a travel screw (not shown) provided along a guide rail 311 on the upper portion of the take-out arm 31 and connected to the take-out arm 31, and a travel motor 313 connected to the travel screw. The material taking arm 31 is driven to move along the guide rail 311 by the aid of the moving motor 313, the moving motor 313 on the material taking arm 31 is connected with the moving lead screw laid on the guide rail 311, and the material taking arm 31 can move on the guide rail 311 along a first dimension direction, namely along the axial direction of a silicon rod or a silicon rod section placed in the cutting area.

In another embodiment of this application, it can adopt the vice complex form of motor and ball to advance to get material arm actuating mechanism, ball includes ball and the screw nut with ball looks adaptation that the screw nut is vice, screw nut with it links to each other to get the material arm, the motor that advances drives ball is rotatory, thereby passes through screw nut drives it follows to get the material arm linear motion is to the guide slot that the roof-rack set up.

In another embodiment of the present application, the guide rail assembly further includes a stopper (not shown) for limiting an excessive displacement of the material taking arm on the top frame. In an implementation manner of this embodiment, the limiting block may be configured to control a stroke, be fixed, or be adjustable according to the movement requirement of the material taking arm.

Fig. 21 is a schematic view illustrating a silicon rod blanking device according to an embodiment of the present invention, wherein fig. 21a is a front view of the silicon rod blanking device, and fig. 21b is a rear view of the silicon rod blanking device. In an embodiment of the present application, the telescoping mechanism 314 may be configured as a lift rail assembly, which includes: lifting guide 3141, guide groove 3142 and lifting guide drive 3143 that cooperate with lifting guide 3141, wherein: the lifting guide rail 3141 is fixedly arranged at the upper part of the clamping piece 32 and is arranged along the lifting direction; the guide groove 3142 matched with the lifting guide rail 3141 is structurally arranged on the material taking arm 31 and is arranged in the lifting direction along the symmetrical axis of the material taking arm 31; lifting guide 3141 actuating mechanism can set up to cylinder telescopic component, and cylinder telescopic component sets up get between material arm 31 and the holder 32, and the both ends are connected respectively and are got material arm 31 and holder 32, through cylinder telescopic component's lift axle 31433 flexible, drive holder 32 is at the motion of direction of going up and down.

In an embodiment of the present application, the cylinder retraction assembly includes: cylinder support 31431, cylinder 31432, and lift axle 31433 that connects cylinder 31432, wherein: the cylinder support 31431 is arranged on the material taking arm 31, is fixedly connected with the material taking arm 31 and is quadrilateral; the cylinder 31432 is arranged on the cylinder support 31431, and the cylinder support 31431 is used as a lower bottom plate for fixedly arranging the cylinder 31432; the cylinder 31432 includes a cylinder taper rod (not shown), which extends through the cylinder support 31431 and into a telescopic space below the cylinder support 31431; the lifting shaft 31433 is arranged at the lower end of the cylinder taper rod and comprises a compound valve capable of realizing bidirectional control of extension and retraction, and the compound valve is also rod-shaped; in one implementation manner of this embodiment, the lower end of the air cylinder taper rod is connected to the lifting shaft 31433 through a coupling; the lower end, i.e. the free end, of the lifting shaft 31433 is fixedly connected to the lifting guide 3141 of the clamping member 32, in the embodiment shown in the figure, a T-shaped frame is fixedly arranged at the end of the lifting guide 3141 of the clamping member 32, and the end of the lifting shaft 31433 is fixedly connected to the T-shaped frame.

In an embodiment of the present application, the cylinder 31432 drives the cylinder taper rod to drive the lifting shaft 31433 to move in a telescopic manner, and the lifting guide 3141 of the clamping member 32 is lifted and transported along the lifting guide groove 3142 of the material taking arm 31 by the pushing and pulling action of the lifting shaft 31433, so as to realize the displacement of the clamping member 32 in the lifting direction as a whole.

Referring to fig. 22, a schematic structural diagram of a clamping member of the silicon rod blanking device of the present application in an embodiment is shown, the clamping member includes a first clamping block 321, a second clamping block 322, and a driving gear, wherein: the first clamping block 321 comprises a first rack and a first clamping portion 3212 linked with the first rack; the second clamping block 322 is arranged in a mirror image manner relative to the first clamping block 321, and comprises a second rack and a second clamping portion 3222 linked with the second rack; one end of the first rack is fixedly arranged on the first clamping portion 3212, and one end of the second rack is fixedly arranged on the second clamping portion 3222; the driving gear is arranged on the horizontal construction plate 35 in the middle of the clamping part, the driving gear is connected with a power output shaft of a motor and is meshed with the first rack and the second rack at the same time, and under the driving of the motor, the driving gear drives the first clamping part 3212 and the second clamping part 3222 to move oppositely when rotating in the forward direction, namely, the distance between the first clamping part 3212 and the second clamping part 3222 is reduced, so that the clamping action can be executed; when the driving gear is driven by the motor to rotate reversely, the driving gear drives the first clamping portion 3212 and the second clamping portion 3222 to move back to back, that is, the distance between the first clamping portion 3212 and the second clamping portion 3222 is increased, and then a releasing action can be performed.

In an embodiment of the present application, the bottom ends of the first clamping portion 3212 and the second clamping portion 3222 are designed to have an arc-shaped clamping surface for contacting a silicon rod segment, and the radius of the arc-shaped clamping surface is designed to be a common silicon rod outer diameter for abutting against the arc-shaped surface of the silicon rod segment; the length of the clamping part is designed to be the length of a common silicon rod section cut according to the processing specification.

The lower surface of the horizontal building plate 35 is provided with two parallel guide rails 351 arranged along the second dimension direction, and the first clamping portion 3212 and the second clamping portion 3222 are movably disposed on the horizontal building plate 35 through the guide rails 351 on the lower surface of the horizontal building plate 35. The top of the first clamping portion 3212 and the top of the second clamping portion 3222 are respectively and fixedly provided with a first horizontal slider assembly 3213 and a second horizontal slider assembly 3223, and the first horizontal slider assembly 3213 and the second horizontal slider assembly 3223 are movably disposed on the guide rail of the horizontal building plate 35, and can slide along the guide rail 351 of the horizontal building plate. Under the driving of the first and second racks, the first and second horizontal sliding

block assemblies

3213 and 3223 respectively move along the guide rails of the horizontal building plate. The first horizontal sliding block assembly 3213 is formed by two sliding blocks whose bottoms are fixedly arranged above the first clamping portion 3212, and a connecting line of fixed positions of the two sliding blocks on the first clamping portion 3212 is in a first dimension direction; the second horizontal slider assembly 3223 is two sliders with bottom portions fixedly disposed above the second clamping portion 3222, and a connection line of the fixed positions of the two sliders on the second clamping portion 3222 is in the first dimension direction.

Referring to fig. 23 to 24, the structure of the clamping member driving device is schematically shown in different states, the view direction is a projection of the structure viewed from bottom to top of the clamping member, the driving gear 323 is disposed on the horizontal building plate 35 of the clamping member and coupled to a power output shaft of a driving motor, and the driving motor 324 is fixedly disposed on the lower surface of the horizontal building plate 35. The first and

second racks

3211 and 3221 are respectively engaged with the front and rear sides of the driving gear 323, and in the illustrated embodiment, the first and

second racks

3211 and 3221 are respectively engaged with the upper and lower sides of the driving gear 323. Under the driving of the driving gear 323, the first rack 3211 and the second rack 3221 respectively generate corresponding movements, and based on a basic rule that gears or gears and racks are externally engaged, the first rack 3211 moves in a direction opposite to a linear velocity of the upper side tooth portion of the driving gear 323 when the driving gear 323 rotates; the second rack 3221 moves in a direction opposite to the linear velocity of the lower tooth portion of the driving gear 323 when the driving gear 323 rotates. The rotation of the driving gear 323 must satisfy the relationship of opposite linear velocity directions of the symmetrical teeth (upper and lower teeth portions in the illustrated embodiment) about the center of the gear, that is, the moving directions of the first and

second racks

3211 and 3221 respectively engaged with both sides of the driving gear 323 are always opposite, and the first and second racks are represented as moving toward and away from each other. As shown in fig. 23, the driving gear 323 is in a forward rotation state, and the first and

second racks

3211 and 3221 are close to each other; in the embodiment shown in fig. 24, the driving gear 323 is in a reverse rotation state, and the first gear rack 3211 and the second gear rack 3221 are far away from each other.

When the driving gear 323 rotates forward or reversely, the first rack 3211 and the second rack 3221 move relatively toward or away from each other, and the movement of the first rack 3211 and the second rack 3221 respectively drives the first horizontal slider assembly 3213 and the second horizontal slider assembly 3223 of the first clamping portion and the second clamping portion to slide toward or away from each other along the mutually parallel guide rails arranged on the bottom surface of the horizontal building plate 35, that is, the first clamping portion and the second clamping portion move toward or away from each other.

In an embodiment of the present application, the process of clamping the processed silicon rod segment by the silicon rod blanking device is as follows:

the silicon rod blanking device comprises a silicon rod blanking device, a material taking arm, a clamping part and a guide groove, wherein the material taking arm of the silicon rod blanking device is driven by a traveling motor of a guide rail at the upper end of the material taking arm to move along the guide groove on the top frame and cut off and move towards the silicon rod along a first dimension direction, the clamping part of the silicon rod blanking device is driven by the material taking arm to move along the first dimension direction, and when the first clamping part and the clamping part move to positions right above a silicon rod section needing to be clamped, the movement of the material taking arm along the guide groove of the top frame.

After the material taking arm and the clamping piece are fixed in the horizontal direction, the driving gear of the clamping piece rotates reversely under the driving of the motor, and in addition, the first clamping part and the second clamping part are separated to a distance larger than the diameter of the silicon rod section, so that the clamping part is prevented from touching the silicon rod section in the descending motion. The telescopic mechanism such as a cylinder telescopic component drives the lifting shaft to move in the lifting direction, so that the first clamping part and the second clamping part move downwards to be close to the silicon rod section to be clamped, and the telescopic movement is stopped when the first clamping part, the second clamping part and the silicon rod section are positioned on the same horizontal plane. The reverse rotation movement of the driving motor is relatively independent to the movement of the telescopic mechanism, and in an implementation mode, the first clamping part and the second clamping part only need to move to the horizontal plane of the silicon rod section (namely the first clamping part and the second clamping part are respectively positioned at the left side and the right side of the silicon rod section), and the clamping part does not collide with the silicon rod section in the movement.

The driving gear rotates positively to control the first clamping portion and the second clamping portion to approach each other, namely approach the silicon rod section, and the silicon rod section stops moving when the first clamping portion and the second clamping portion contact and clamp the silicon rod section.

The clamping part is kept in a clamping state after the silicon rod sections are clamped, the clamping part is correspondingly driven by the telescopic mechanism to move up and down according to the preset placing position of the silicon rod sections, the material taking arm and the clamping part are driven by the guide rail component between the top frame and the material taking arm to move integrally in the first dimension direction, and after the silicon rod sections are placed at the preset position, the first clamping part and the second clamping part are released separately and are separated from each other along with the material taking arm and the clamping part, and the silicon rod sections are placed well.

The application further improves and lies in, silicon rod unloader's first clamping part and second clamping part are used for the centre gripping be provided with buffer material on the clamping face of single section silicon rod subsection, can set up on the clamping face and adopt elastic rubber material, polyethylene foamed plastic, silica gel or have elastic deformation, damping characteristic or the material of buffer characteristic by other to the protection rather than the contact the surface of silicon rod subsection is not by the fish tail or collide with.

A further development of the present application consists in that the silicon rod blanking device is also provided with a sensor means 33 for detecting the position of the end, i.e. the head or the tail, of the silicon rod to be cut.

Referring to fig. 25, which is an enlarged view of fig. 21b at d, the sensor device 33 is fixedly arranged on the mirror symmetry line of the shoe connecting the horizontal build plate of the clamp 32 to the lifting rail. In an implementation manner of this embodiment, the sensing device 33 is a contact sensor, and includes a circular measuring head 331, a signal line 332, and an expansion link 333.

The measuring head 331 is movably arranged at the free end of the telescopic rod 333 and can rotate around the circle center of the circular ring of the measuring head 331, and the fixed end of the telescopic rod 333 is arranged on the mirror symmetry line of the bearing seat.

In the detection, the annular surface of the circular measuring head 331 is a contact surface, and is used for measuring height data (may be absolute height or relative height with respect to the silicon rod carrying device) of a contact position of the corresponding measuring head 331 and the silicon rod 16 to be cut. Particularly, when the circular measuring head 331 rotates along the center of the circular ring, the linear velocity direction of the lowest point of the measuring head 331 is in the first dimension direction, i.e. the axial direction of the silicon rod 16 to be cut, so as to avoid the damage to the circular measuring head 331 or the surface of the silicon rod 16 to be cut, which is generated when the measuring head 331 moves along the surface of the silicon rod 16 to be cut for detecting the end position of the silicon rod.

In the detection process, the telescopic rod 333 controls the measuring head 331 to descend to just contact the surface of the silicon rod 16 to be cut, the contact sensor moves relative to the silicon rod 16 to be cut along the first dimension direction along with the material taking arm 31, the measuring head 331 moves along the surface of the silicon rod 16 to be cut, and the boundary line between the end part (head or tail) to be cut and the middle section of the silicon rod which can be processed is detected by acquiring height data of different positions in real time and changing the diameter of the end part of the silicon rod 16 to be cut.

The end position of the silicon rod to be cut is detected through the sensing device 33, waste caused by overlong cut ends or the cut parts are too short to enable the cut sections of the processed silicon rod at the head end and the tail end to be not in accordance with the specification of a workpiece due to the fact that the cut ends are not accurately judged manually is avoided, the qualified rate of the workpiece of the silicon rod sections adjacent to the head end and the tail end of the silicon rod is effectively improved, and the utilization rate of materials is improved.

The further improvement of the silicon rod truncation setting of this application lies in that still includes tip extracting device. The end part taking device is arranged at least one end of the cutting working area and is used for receiving the cutting tailings at the end part of the silicon rod to be cut. In the silicon rod cutting operation, a silicon wafer sample wafer needs to be cut from a silicon rod to be cut, wherein the thickness of the sample wafer is usually 2-20 mm, and the silicon wafer sample wafer cannot be conveyed through a silicon rod blanking device.

The end part material taking device comprises a rotating arm and an arc-shaped containing groove; the rotating arm is arranged on the adjacent cutting frame at the discharge end of the silicon rod cutting equipment, and is movably arranged at the bottom of the adjacent cutting frame at the discharge end through a rotating shaft of which the axis is in the lifting direction. The arc holds the fixed setting of groove and is in the free end of swinging boom, the arc holds the groove and is half open architecture to make silicon chip sample wafer can hold the side in groove from the arc and put into.

In an embodiment of the application, the end material taking device further includes a driving device, and the driving device has a power output shaft such as a motor for coupling the rotating arm rotating shaft to drive the rotating arm to rotate around the rotating shaft at the bottom of the cutting frame. Furthermore, the end part material taking device further comprises a rotating arm locking device which is used for locking the rotating arm when the rotating arm rotates to a position below the silicon wafer sample to be cut.

In the process of intercepting the silicon wafer sample, the rotating arm is driven by a driving device of the end part material taking device to rotate, the rotating arm stops rotating when the arc-shaped containing groove is positioned below the silicon wafer sample to be cut, and the rotating arm is locked by the rotating arm locking device. The cutting frame that the discharge end is adjacent rotates to the first cutting state of double-line cutting under the driving motor drive of cutting frame to drive the cutting coping saw by elevating system and feed and cut, the cutting is accomplished the back and is intercepted the silicon chip sample piece that is located and holds the inslot, the cutting frame is kept away from in the rotation of swinging boom under power output shaft's drive, accepts and gains promptly the silicon chip sample piece.

In summary, the silicon rod blanking device provided by the third aspect of the silicon rod truncation equipment of the present application is configured such that the material taking arm and the clamping member are movably connected to each other through the cylinder telescopic assembly by the material taking arm and the clamping member arranged on the frame, and the driving device is used to drive the two clamping portions of the clamping member to move in the direction of the second dimension in the opposite direction or away from the direction, so as to complete clamping and releasing of the cut silicon rod segments; moreover, silicon rod unloader's of this application get the material arm and pass through drive arrangement and drive the setting that can slide in the frame, and the elevating movement of cooperation holder and the centre gripping or the release action of clamping part can realize effectively realizing the automation of silicon rod unloading process and linking up different processes with transporting between the preset position, have effectively improved enterprise production efficiency, have high industrial value.

The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.

Claims

1. The utility model provides a silicon rod loading attachment for will place the silicon rod that treats that places in a storage area and cut and shift to the cutting workspace of a cutting equipment, its characterized in that includes:

the first rotating shaft is driven to rotate by a first driving device; and

the at least two swing arm assemblies are respectively connected to the first rotating shaft in a shaft mode according to preset intervals and used for bearing the silicon rod to be cut and transferring the silicon rod to be cut to a cutting working area of the cutting equipment under the driving of the first rotating shaft; each swing arm assembly comprises a swing arm body and a bearing mechanism, the swing arm body is connected with the first rotating shaft in a shaft mode, the bearing mechanism is arranged on the swing arm body, and the bearing mechanism is used for keeping a bearing portion of the bearing mechanism in a state of bearing the silicon rod to be cut when the bearing mechanism moves along with the swing arm.

2. The silicon rod loading device as recited in claim 1, wherein the support mechanism comprises a manipulator disposed at a distal end of the swing arm body for following the movement of the swing arm to maintain the support portion thereof in a state of supporting the silicon rod to be cut during the transfer operation.

3. The silicon rod feeding device as recited in claim 1, further comprising at least two transfer tables corresponding to the swing arm assemblies one to one, and disposed on a base of the cutting apparatus, for respectively pivotally connecting the at least two swing arm assemblies to the first rotating shaft according to a predetermined interval.

4. The silicon rod loading device as recited in claim 3, wherein the at least two transfer tables comprise a first movement mechanism that is linearly displaceable between the magazine area and the cutting work area.

5. The silicon rod loading device as set forth in claim 3, wherein the at least two transfer tables comprise a second movement mechanism for linearly displacing the at least one swing arm assembly on the first rotary shaft to adjust a spacing distance of the at least two swing arm assemblies.

6. The silicon rod feeding device as recited in claim 5, wherein the number of the swing arm assemblies is 4, and the swing arm assemblies include a first swing arm assembly and a second swing arm assembly respectively disposed at two ends of the first rotating shaft, and a third swing arm assembly and a fourth swing arm assembly respectively coupled between two ends of the first rotating shaft at predetermined intervals.

7. The silicon rod loading device as recited in claim 6, wherein the transfer stage of the third or fourth swing arm assembly comprises a second motion mechanism linearly displaced on the first rotary shaft.

8. The silicon rod loading device as recited in claim 3, further comprising a second shaft driven by a second driving device, wherein the second shaft is parallel to the first shaft, and the second driving device outputs a corresponding rotation speed or/and rotation angle to the second shaft according to the operating state of the first driving device.

9. The silicon rod feeding device as recited in claim 8, wherein the first driving device and the second driving device are disposed at opposite ends of a first rotating shaft or a second rotating shaft, respectively.

10. The silicon rod loading device as recited in claim 8, wherein the second shaft is pivotally connected to the swing arm assembly and is located between the first shaft on the swing arm body and the holding mechanism.

11. The silicon rod loading device as set forth in claim 10, wherein the supporting mechanism comprises: the manipulator subassembly set up in the end of swing arm body includes: the mechanical arm body and the activity set up in be used for bearing on the mechanical arm body treat the holding piece of cutting the silicon rod, holding piece power is connected the second pivot to drive when the second pivot rotates the holding piece is in the mechanical arm body rotates, so that the holding piece keeps being in when shifting the operation and bears the state of treating cutting the silicon rod.

12. The silicon rod loading device as set forth in claim 10, wherein the swing arm body has a built-in space.

13. The silicon rod loading device as set forth in claim 12, wherein the supporting mechanism comprises:

the driving gear is arranged in the built-in space of the swing arm body, is coupled to the second rotating shaft in a shaft mode and is used for rotating under the driving of the second rotating shaft;

the driven gear is coupled in the built-in space of the swing arm body in a shaft mode and meshed with the driving gear;

the manipulator assembly is arranged at the tail end of the swing arm body and comprises a manipulator body and a bearing part, wherein the manipulator body is movably arranged on the manipulator body and used for bearing the silicon rod to be cut, the bearing part comprises a tooth part meshed with the driven gear and a bearing part used for following the outer contour of the silicon rod to be cut.

14. The silicon rod feeding device as recited in claim 13, wherein the number of teeth of the supporting portion is greater than the number of teeth of the driven gear, and the number of teeth of the driven gear is greater than the number of teeth of the driving gear.

15. The silicon rod loading device as recited in claim 13, wherein the contact surface of the support portion with the silicon rod to be cut has a buffer material.

16. The silicon rod loading device as recited in claim 1, characterized in that the swing arm assembly is provided with a detection device for detecting contact of the support with the silicon rod to be cut.