CN210579811U

CN210579811U - Heat sink device

Info

Publication number: CN210579811U
Application number: CN201921019752.7U
Authority: CN
Inventors: 黄顺治; 毛黛娟; 郭春亮
Original assignee: Giga Byte Technology Co Ltd
Current assignee: Giga Byte Technology Co Ltd
Priority date: 2019-07-03
Filing date: 2019-07-03
Publication date: 2020-05-19
Anticipated expiration: 2029-07-03

Abstract

The utility model provides a heat dissipation device, which is suitable for being configured on a main heat source and a primary heat source. The heat dissipation device comprises a water-cooling head module and a heat conduction piece. The water cooling head module is configured on the main heat source. The heat conducting piece is thermally coupled with the secondary heat source and extends into the water cooling head module. The utility model discloses a heat abstractor can reach more efficient radiating effect in finite space to wider range of application has.

Description

Heat sink device

Technical Field

The utility model relates to a heat abstractor especially relates to a can be to radiating heat abstractor of many heat sources.

Background

Generally, a water-cooled head heat sink is usually disposed on a circuit board to dissipate heat from a heat source on the circuit board. Common water-cooled head heat dissipation devices can be divided into closed water-cooled and open water-cooled structures, and in any structure, a part of the water-cooled head heat dissipation device is usually thermally coupled to a heat source, and the heat of the heat source is conducted to heat dissipation fins through liquid to discharge the heat energy.

Today's computer equipment has a trend towards high performance and small size. The circuit board typically has a plurality of heat sources thereon. In view of this, how to simultaneously dissipate multiple heat sources and improve the overall heat dissipation effect with a simple device under the condition of small occupied space is a problem that needs to be solved at present.

SUMMERY OF THE UTILITY MODEL

The utility model provides a heat dissipation device, it can dispel the heat to a plurality of heat sources.

The heat dissipation device of the present invention is suitable for being disposed in a main heat source and a primary heat source. The heat dissipation device comprises a water-cooling head module and a heat conduction piece. The water cooling head module is configured on the main heat source. The heat conducting piece is thermally coupled with the secondary heat source and extends into the water cooling head module.

In an embodiment of the present invention, the water-cooling head module has a water-cooling tank and a plurality of fins, the fins are extended along a first direction and arranged in the water-cooling tank in parallel along a second direction, and a portion of the heat conducting member is disposed through the plurality of fins along the second direction.

In an embodiment of the present invention, the heat conducting member includes a heat pipe.

In an embodiment of the present invention, the water-cooling head module has a water-cooling tank, a water inlet, a water outlet, and a plurality of fins. The water inlet and the water outlet are respectively communicated with the water cooling tank. The water cooling head module comprises at least one side wall and at least one inner partition plate, wherein the at least one side wall extends along the first direction and is positioned on at least one side of the fins, and the at least one inner partition plate extends along the second direction and is connected to at least one of the at least one side wall and the outermost side of the fins.

In an embodiment of the present invention, the at least one side wall includes two side walls, the at least one inner partition includes two inner partitions, the two side walls extend along the first direction and are located at two sides of the plurality of fins, the two inner partitions extend along the second direction and connect two outermost sides of the two side walls and the plurality of fins, the water inlet is located at one side of the line of the two side walls, and the water outlet is located at the other side of the line of the two side walls.

In an embodiment of the present invention, the water-cooling head module has a water-cooling tank, a water inlet, a water outlet and a plurality of fins, the water-cooling tank includes a first region and a second region, the water inlet is connected to the first region, the water outlet is connected to the second region, the plurality of fins extend from the first region to the second region, the heat conducting member has a first end, a second end and a middle section located between the first end and the second end, the middle section is thermally coupled to the secondary heat source, the first end extends into and communicates with the first region of the water-cooling tank, and the second end extends into and communicates with the second region of the water-cooling tank.

In an embodiment of the present invention, the heat conducting member is a flow channel tube, and an inner diameter of the first end of the flow channel tube is larger than an inner diameter of the second end.

In an embodiment of the present invention, the heat dissipation device further includes a heat dissipation plate, wherein the heat dissipation plate is disposed on the secondary heat source, and the heat conduction member is thermally coupled to the secondary heat source through the heat dissipation plate.

In an embodiment of the invention, the water-cooling head module further includes a bottom plate disposed on the main heat source, and the heat conducting member contacts the bottom plate.

In an embodiment of the present invention, the water-cooling head module further includes a bottom plate disposed on the main heat source, and the heat conducting member is suspended in the bottom plate.

Based on the above, the utility model discloses a heat abstractor includes water-cooling head module and heat-conducting part. The water-cooling head module is thermally coupled to the primary heat source, and a portion of the heat conducting member extends into the water-cooling head module and another portion is thermally coupled to the secondary heat source. Therefore, the heat dissipation device of the present invention can dissipate a plurality of heat sources simultaneously by using only one water-cooling head module. That is to say, the utility model discloses a heat abstractor can reach more efficient radiating effect in finite space to wider range of application has.

In order to make the aforementioned and other features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1A is an assembly diagram of a heat dissipation device disposed on a circuit board according to an embodiment of the present invention.

Fig. 1B is a schematic top view of the heat dissipation device of fig. 1A disposed on a circuit board.

Fig. 1C is a schematic view of the heat dissipation device of fig. 1A disposed on a circuit board at another viewing angle.

3 FIG. 3 1 3 D 3 is 3 a 3 partial 3 cross 3- 3 sectional 3 view 3 of 3 the 3 heat 3 dissipation 3 device 3 of 3 FIG. 3 1 3 A 3 disposed 3 on 3 a 3 circuit 3 board 3 along 3 section 3 line 3 A 3- 3 A 3' 3. 3

Fig. 2 is a schematic diagram of a heat dissipation device disposed on a circuit board according to another embodiment of the present invention.

Fig. 3 is a schematic top view of a heat dissipation device disposed on a circuit board according to another embodiment of the present invention.

Description of reference numerals:

1: circuit board

10: main heat source

50: secondary heat source

100. 100a, 100 b: heat sink device

110. 110a, 110 b: water-cooling head module

111: water cooling tank

1112: first region

1114: second region

112. 112 a: fin plate

113: water inlet

114: water outlet

115: side wall

116: inner partition board

117: base plate

118: upper cover

120. 120a, 120 b: heat conducting member

122 b: first end

124 b: second end

126 b: middle section

130: heat sink

D1: a first direction

D2: second direction

H: opening holes

3 A 3- 3 A 3' 3: 3 Section line

Detailed Description

Fig. 1A is a schematic diagram of a heat dissipation device disposed on a circuit board according to an embodiment of the present invention. Referring to fig. 1A, in the present embodiment, the heat dissipation device 100 is suitable for being disposed on a primary heat source 10 (fig. 1D) and a secondary heat source 50, and is used for dissipating heat of the primary heat source 10 and the secondary heat source 50. It should be noted that, the number of the main heat sources 10 in the present embodiment is shown as 1, and the number of the secondary heat sources 50 is shown as a plurality, but the present invention does not limit the number of the main heat sources 10 and the secondary heat sources 50.

It should be noted that the heat dissipation device 100 of the present invention is disposed on the circuit board 1 for taking charge of the main heat source 10 and the sub-heat source 50 on the heat dissipation circuit board 1. In the embodiment, the circuit board 1 is an expansion card, the main heat source 10 is a Graphics Processing Unit (GPU), and the secondary heat source is a MOSFET chip. Of course, the present invention does not limit the heat source of the heat sink 100, and the circuit board 1 may be a motherboard. In addition, for the sake of clarity of describing the internal structure of the heat dissipation device 100 of the present invention, except fig. 1A, the structure of the upper cover 118 is omitted in the following figures.

Fig. 1B is a schematic top view of the heat dissipation device of fig. 1A disposed on a circuit board. Referring to fig. 1A and 1B, in the present embodiment, the heat dissipation device 100 includes a water-cooling head module 110 and a heat conducting member 120. Wherein the water-cooled head module 110 is disposed on the main heat source 10, and a part of the heat conductive member 120 extends into the water-cooled head module 110, and the other part is thermally coupled to the sub-heat source 50 on the circuit board 1. Further, the main heat source 10 of the present embodiment is thermally coupled to the water-cooling head module 110, so that the heat energy generated by the main heat source 10 is directly conducted out through the water-cooling head module 110. Moreover, the heat energy generated by the secondary heat source 50 of the present embodiment can also be transferred to the water-cooling head module 110 through the heat conducting member 120 in a heat conduction manner, and also be conducted out through the water-cooling head module 110.

Based on this design, the heat dissipation apparatus 100 of the present embodiment only needs to be equipped with one water-cooling head module 110 to achieve the overall heat dissipation effect of the circuit board 1. That is, the heat dissipation device 100 of the present embodiment can dissipate heat of the main heat source 10(CPU) and the sub-heat source 50 (other components) at the same time without occupying too much space.

In addition, as shown in fig. 1A and 1B, the heat dissipation device 100 of the present embodiment may further include a heat sink 130 disposed on the secondary heat source 50, and the heat conducting element 120 is thermally coupled to the secondary heat source 50 through the heat sink 130. Based on this design, the heat sink 130 can simultaneously conduct heat and dissipate the heat of the secondary heat source 50 into the air. Of course, the present invention is not limited to the form and type of the heat sink 130, and the heat sink 130 is not necessarily disposed on the secondary heat source 50 or only a portion of the heat sink 130 may be disposed thereon, and the heat conducting member 120 may be directly thermally coupled to the secondary heat source 50.

Referring to fig. 1A and fig. 1B, the water-cooling head module 110 of the present embodiment has a water-cooling tank 111, and the water-cooling tank 111 includes an upper cover 118 (fig. 1A). In detail, the water cooling tank 111 has an opening H (fig. 1C) corresponding to the outer contour of the heat conducting member 120, and the heat conducting member 120 of the present embodiment is U-shaped. Further, one section of the U-shaped heat conduction member 120 extends into the water cooling tank 111 through the opening H, and the other corresponding section of the U-shaped heat conduction member 120 is thermally coupled to the secondary heat source 50. Of course, the shape of the heat-conducting member 120 is not limited in the present invention.

Further, in the present embodiment, the water cooling tank 111 has, for example, a heat dissipation fluid therein. Therefore, an O-ring (not shown) is disposed between the inner wall of the opening H (fig. 1C) and the heat conducting member 120 to prevent the heat dissipating fluid from leaking. Of course, the present invention is not limited to the form of the O-ring. Moreover, in other embodiments, other forms of leakage prevention structures or elements may be selected, and the present invention is not limited thereto. It should be noted that, although the water cooling tank 111 is disposed with a liquid heat dissipation fluid in the embodiment, in other embodiments, the heat dissipation fluid may be a two-phase fluid or other non-liquid heat dissipation medium, and the present invention does not limit the kind of the heat dissipation medium.

In the present embodiment, the heat conducting member 120 is a heat pipe (heat pipe). In detail, the heat pipe (the heat conducting member 120) is a closed cavity (not shown) containing a two-phase fluid, and forms convection by the change of the liquid state and the gaseous state of the two-phase fluid, so as to achieve the purpose of heat conduction. Of course, the present invention does not limit the form of the heat conductive member 120.

Further, in the embodiment, the water-cooling head module 110 includes a plurality of fins 112, the fins 112 are disposed in the water-cooling tank 111, and the fins 112 extend along a first direction D1 and are disposed on a bottom plate 117 of the water-cooling tank 111 in parallel along a second direction D2, and the bottom plate 117 of the water-cooling head is thermally coupled to the main heat source 10. In the present embodiment, the heat pipe is disposed beside the fins 112 and spaced apart from the fins 112 by a distance. Of course, in other embodiments, the heat pipe may be attached to or pass through the fins 112. The present invention is not limited thereto. Moreover, in other embodiments, the present invention does not limit the arrangement of the fins 112.

Referring to fig. 1A and 1B, in the present embodiment, the water-cooling head module 110 has a water outlet 114 and a water inlet 113 connected to the water-cooling tank 111. As shown in fig. 1, the water outlet 114 and the water inlet 113 of the present embodiment are disposed on the upper cover 118 of the water-cooling head module 110, and the heat dissipation fluid flows into and out of the water-cooling tank 111 in a direction perpendicular to the upper cover 118. Of course, the present invention is not limited to the form and position of the water outlet 114 and the water inlet 113, and in other embodiments, the water outlet 114 and the water inlet 113 may also be disposed on the side of the water cooling tank 111 or other suitable forms of design, which is not limited to the present invention.

In detail, as shown in fig. 1B, in the present embodiment, the water-cooling head module 110 includes at least one sidewall 115 and at least one inner partition 116. For example, in the present embodiment, the number of the side walls 115 is, for example, four, and the number of the inner partition plates 116 is two. Two of the four sidewalls 115 extend along the first direction D1 and are located on two opposite sides of the fins 112, and two inner spacers 116 extend along the second direction D2 and connect the two sidewalls 115 and two outermost fins among the fins 112. In addition, the water inlet 113 is located on one side of the connecting line of the two side walls 115, and the water outlet 114 is located on the other side of the connecting line.

Further, in the present embodiment, the water cooling tank 111 includes a first area 1112 and a second area 1114. In detail, the water inlet 113 is connected to the first region 1112, and the water outlet 114 is connected to the second region 1114. The first region 1112 and the second region 1114 are separated by the inner partitions 116, and the fins 112 extend from the first region 1112 to the second region 1114. As a result, the heat dissipation fluid flows into the first region 1112 through the water inlet 113, flows through the fins 112, flows to the second region 1114, and then flows out from the water outlet 114.

Of course, in other embodiments, the inner partition 116 may be disposed at other positions, or only one inner partition 116 may be disposed in the water cooling tank 111, or even no inner partition 116 may be disposed. For example, in one embodiment, the fins 112 may be disposed with one side directly against one of the side walls 115, and the inner spacer 116 is connected to the fin 112 on the other (outermost) side of the fins 112 and the corresponding side wall 115.

Alternatively, in another embodiment, the fins 112 may also be directly arranged in parallel from one side wall 115 (for example, the side wall 115 located above the side wall in fig. 1B) to the other side wall 115 (for example, the side wall 115 located below the side wall in fig. 1B) along the second direction D2, and the water outlet 114 and the water inlet 113 are disposed at two ends of the fins along the first direction D1. As such, the water head module 110 does not need to have the internal partition 116, and the heat dissipation fluid can flow through the fins. Of course, the present invention is not limited thereto, as long as the fluid can flow through the fins 112 and then flow to the water outlet 114, so as to maintain a good heat dissipation effect. Furthermore, the present invention does not limit the number of the side walls 115, the number of the inner partitions 116, the positions of the inner partitions 116, and the positions of the fins 112.

Fig. 1C is a schematic view of the heat dissipation device of fig. 1A disposed on a circuit board at another viewing angle. 3 FIG. 3 1 3 D 3 is 3 a 3 partial 3 cross 3- 3 sectional 3 view 3 of 3 the 3 heat 3 dissipation 3 device 3 of 3 FIG. 3 1 3 A 3 disposed 3 on 3 a 3 circuit 3 board 3 along 3 section 3 line 3 A 3- 3 A 3' 3. 3 As shown in fig. 1C and 1D, the opening H of the water cooling tank 111 of the present embodiment is higher than the bottom plate 117 of the water cooling tank 111, in other words, a certain distance is provided between the edge of the opening H and the bottom plate 117. Therefore, when the thermal conductive member 120 is disposed on the opening H, the thermal conductive member 120 is suspended above the bottom plate 117. In this way, the heat dissipation fluid can flow through the bottom surface of the heat conducting member 120, so as to increase the heat dissipation efficiency. Of course, in other embodiments, the heat conducting member 120 may directly contact the bottom plate 117, and the present invention does not limit the relative position between the heat conducting member 120 and the bottom plate 117.

It should be noted that, in the present embodiment, the water-cooling head module 110 of the heat dissipation device 100 can adopt a standard design, and the shape and the length of the heat conducting member 120 can be adjusted according to the position of the secondary heat source 50 to be dissipated. Thus, the designer can select a specific heat conduction member 120 to match with the water cooling head modules 110 with uniform specifications according to the positions of the secondary heat sources 50 on different circuit boards 1. This allows the heat sink 100 to be cost effective without having to open the mold for each circuit board 1 to produce a separate dedicated heat sink 100.

Other embodiments will be described below, and the same or similar structural configurations, design principles, and technical effects in the embodiments are not repeated, and the design differences between the embodiments are mainly described.

Fig. 2 is a schematic diagram of a heat dissipation device disposed on a circuit board according to another embodiment of the present invention. Referring to fig. 2, the heat dissipating device 100a of the present embodiment is different from the heat dissipating device 100 of the previous embodiment in that in the present embodiment, a portion of the heat conducting member 120a (heat pipe) is disposed through the fins 112a of the water-cooled head module 110a along the second direction D2. As a result, when the heat dissipating fluid flows through the fins 112a, most of the heat dissipating fluid will necessarily flow through the heat conducting member 120a, thereby increasing the conduction efficiency of the heat conducting member 120 a.

Note that the heat-conducting member 120a shown in fig. 2 is a part of the fins 112a that is inserted through the right side (in the direction of fig. 2) of the fins 112 a. Of course, in other embodiments, the heat conducting member 120 may also be disposed through the middle portion (in the direction of fig. 2) or the left portion (in the direction of fig. 2) of the fins 112a, which is not limited by the invention.

Fig. 3 is a schematic top view of a heat dissipation device disposed on a circuit board according to another embodiment of the present invention. Referring to fig. 3, the heat dissipating device 100b of the present embodiment is different from the heat dissipating device 100 of the previous embodiment mainly in that in the present embodiment, the heat conducting member 120b is a hollow runner pipe. That is, the heat dissipation fluid in the water cooling tank 111b of the water cooling head module 110b of the present embodiment can flow through the heat conductive member (flow channel tube) 120b and the water cooling tank 111.

In detail, in the present embodiment, the heat conducting member (flow channel tube) 120b has a first end 122b, a second end 124b and a middle section 126b between the first end 122b and the second end 124 b. Further, the intermediate section 126b of the heat conducting member (runner tube) 120b is thermally coupled to the secondary heat source 50, and the first end 122b of the heat conducting member (runner tube) 120b extends into and communicates with the first region 1112 of the water cooling tank 111, and the second end 124b extends into and communicates with the second region 1114 of the water cooling tank 111. In this way, the heat-dissipating fluid can flow from the first region 1112 to the first end 122b of the heat-conducting member (runner tube) 120b, and then flow through the intermediate section 126b, and then flow from the second end 124b to the second region 1114, so as to carry the heat of the secondary heat source 50 to the second region 1114 of the water cooling tank 111 b.

Also, in the present embodiment, the first end 122b of the heat-conducting member (runner pipe) 120b has an inner diameter larger than that of the second end 124 b. As shown in fig. 3, the inner diameter of the portion of the heat-conducting member (flow channel tube) 120b extending from the first end 122b up to the intermediate section 126b thermally coupled to the secondary heat source 50 is greater than the inner diameter of the portion of the heat-conducting member (flow channel tube) 120b extending from the intermediate section 126b thermally coupled to the secondary heat source 50 to the second end 124 b. Thus, the flow resistance of the first end 122b of the heat conducting member (channel tube) 120b can be smaller than that of the second end 124b, so that the heat dissipating fluid flows from the first region 1112 to the second region 1114, thereby preventing the heat dissipating fluid from flowing back to affect the heat dissipating efficiency. The heat conducting member (flow channel tube) 120b of the present embodiment allows the heat dissipation fluid to flow through a wider area through the hollow tube, thereby efficiently dissipating the heat generated by the main heat source 10 and the sub-heat source 50 on the whole circuit board 1.

In addition, in the present embodiment, the heat conducting member (flow channel tube) 120b is, for example, a hollow copper tube. Of course, in other embodiments, the material of the runner pipe may be other heat conductive metal materials or other non-metal heat conductive materials, which is not limited by the present invention.

To sum up, the heat dissipation device of the present invention includes a water-cooling head module and a heat conducting member. The water-cooling head module is thermally coupled to the primary heat source, and a portion of the heat conducting member extends into the water-cooling head module and another portion is thermally coupled to the secondary heat source. Therefore, the heat dissipation device of the present invention can dissipate a plurality of heat sources simultaneously by using only one water-cooling head module. That is to say, the utility model discloses a heat abstractor can reach more efficient radiating effect in finite space to wider range of application has. On the other hand, the utility model discloses a heat conduction spare can also directly wear to locate in these fins, or supply the position that radiating fluid flows to inferior heat source, so that the utility model discloses a water-cooling head module reaches splendid radiating effect.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the invention.

Claims

1. A heat dissipation device, adapted to be disposed between a primary heat source and a secondary heat source, the heat dissipation device comprising:

a water-cooling head module configured on the main heat source; and

a heat conducting element thermally coupled to the secondary heat source and extending into the water-cooling head module.

2. The heat dissipating device of claim 1, wherein the water cooling head module has a water cooling tank and a plurality of fins extending along a first direction and arranged in parallel along a second direction in the water cooling tank, and a portion of the heat conducting member is disposed through the fins along the second direction.

3. The heat dissipating device of claim 2, wherein said heat conducting member comprises a heat pipe.

4. The heat dissipating device of claim 1, wherein the water cooling head module has a water cooling tank, a water inlet, a water outlet and a plurality of fins, the water inlet and the water outlet are respectively connected to the water cooling tank, the plurality of fins are disposed in the water cooling tank in parallel along a first direction, the water cooling head module includes at least one side wall and at least one inner partition, the at least one side wall extends along the first direction and is disposed on at least one side of the plurality of fins, and the at least one inner partition extends along the second direction and is connected to at least one of the at least one side wall and an outermost side of the plurality of fins.

5. The heat dissipating device of claim 4, wherein said at least one side wall comprises two side walls, said at least one inner partition comprises two inner partitions, said two side walls extending along said first direction and being located on two sides of said plurality of fins, said two inner partitions extending along said second direction and connecting said two side walls and two outermost ones of said plurality of fins, said water inlet is located on one side of a line connecting said two side walls, and said water outlet is located on the other side of said line connecting said two side walls.

6. The heat dissipating device of claim 1, wherein the water cooling head module has a water cooling tank, a water inlet, a water outlet, and a plurality of fins, the water cooling tank includes a first region and a second region, the water inlet is connected to the first region, the water outlet is connected to the second region, the plurality of fins extend from the first region to the second region, the heat conducting member has a first end, a second end, and a middle section located between the first end and the second end, the middle section is thermally coupled to the secondary heat source, the first end extends into and communicates with the first region of the water cooling tank, and the second end extends into and communicates with the second region of the water cooling tank.

7. The heat dissipating device of claim 6, wherein said heat conducting member is a flow channel tube and said first end has an inner diameter greater than an inner diameter of said second end.

8. The heat dissipating device of claim 1, further comprising a heat sink, wherein the heat sink is disposed on the secondary heat source, and the heat conducting element is thermally coupled to the secondary heat source via the heat dissipating element.

9. The heat dissipating device of claim 1, wherein said water-cooled head module further comprises a base plate disposed on said primary heat source, said heat conducting member contacting said base plate.

10. The heat dissipating device of claim 1, wherein the water-cooled head module further comprises a bottom plate disposed above the primary heat source, the heat conducting member being suspended from the bottom plate.