CN210576587U - A kind of electroplating layer for terminal surface, terminal and electronic interface - Google Patents
A kind of electroplating layer for terminal surface, terminal and electronic interface Download PDFInfo
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- CN210576587U CN210576587U CN201921635947.4U CN201921635947U CN210576587U CN 210576587 U CN210576587 U CN 210576587U CN 201921635947 U CN201921635947 U CN 201921635947U CN 210576587 U CN210576587 U CN 210576587U
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- 238000009713 electroplating Methods 0.000 title claims abstract description 31
- 238000007747 plating Methods 0.000 claims abstract description 74
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 53
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052737 gold Inorganic materials 0.000 claims abstract description 37
- 239000010931 gold Substances 0.000 claims abstract description 37
- 238000005260 corrosion Methods 0.000 claims abstract description 34
- 230000007797 corrosion Effects 0.000 claims abstract description 30
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 27
- YPPQDPIIWDQYRY-UHFFFAOYSA-N [Ru].[Rh] Chemical compound [Ru].[Rh] YPPQDPIIWDQYRY-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims description 55
- 239000011248 coating agent Substances 0.000 claims description 54
- 239000002131 composite material Substances 0.000 claims description 28
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 5
- 229910052703 rhodium Inorganic materials 0.000 description 4
- 239000010948 rhodium Substances 0.000 description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 210000004243 sweat Anatomy 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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Abstract
Description
技术领域technical field
本实用新型涉及电镀技术领域,尤指一种用于端子表面的电镀层及端子、电子接口。The utility model relates to the technical field of electroplating, in particular to an electroplating layer used on the surface of a terminal, a terminal and an electronic interface.
背景技术Background technique
随着电子产品的普及,电子产品的应用越来越广泛,电子产品在使用过程中,电子接口经常出现插拔,对于插拔频率较高的电子接口,其磨损性较大,磨损的地方容易被氧化和腐蚀,经常出现电接触不良,为了提高耐磨性和抗腐蚀氧化性,目前很多电子接口的端子都电镀有电镀镀层,电镀镀层中一般包含有一层耐磨层和抗氧化腐蚀层,为了增强电镀镀层与基底材料的结合性,电镀镀层与基底材料之间设置有过渡层,可以增加粘附力。但是现有过渡层的选材大都是金、银、金合金等材质,导致成本较高;并且为了产品达到耐插拔、耐磨损、防腐蚀的效果不得不电镀很厚的贵金属(如铑、铑钌、钯等)成本非常高。With the popularization of electronic products, the application of electronic products is becoming more and more extensive. During the use of electronic products, electronic interfaces are often plugged and unplugged. For electronic interfaces with high plugging and unplugging frequencies, their wear and tear is relatively large, and the places of wear are easy to wear. It is oxidized and corroded, and poor electrical contact often occurs. In order to improve wear resistance and corrosion resistance, many terminals of electronic interfaces are currently electroplated with electroplating. In order to enhance the bonding between the electroplating layer and the base material, a transition layer is arranged between the electroplating layer and the base material, which can increase the adhesion. However, the existing transition layers are mostly made of gold, silver, gold alloy and other materials, resulting in high cost; and in order to achieve the effects of plug resistance, wear resistance, and corrosion resistance, thick precious metals (such as rhodium, rhodium, rhodium, etc.) have to be electroplated. Rhodium, ruthenium, palladium, etc.) are very expensive.
发明内容SUMMARY OF THE INVENTION
为解决上述问题,本实用新型提供一种用于端子表面的电镀层及端子、电子接口,成本较低。In order to solve the above problems, the present invention provides an electroplating layer for the surface of the terminal, the terminal, and the electronic interface, and the cost is low.
为实现上述目的,本实用新型采用的技术方案是提供一种用于端子表面的电镀层,包括依次电镀于端子表面的耐腐蚀组合层及耐磨组合层,所述耐磨组合层包括依次电镀的钯镀层、第一金镀层和铑钌镀层,所述钯镀层表面积小于耐腐蚀组合层表面积。In order to achieve the above purpose, the technical solution adopted by the present invention is to provide an electroplating layer for the surface of the terminal, which includes a corrosion-resistant composite layer and a wear-resistant composite layer that are sequentially electroplated on the terminal surface, and the wear-resistant composite layer includes sequentially electroplating. The palladium coating, the first gold coating, and the rhodium-ruthenium coating have a surface area smaller than that of the corrosion-resistant composite layer.
作为一种优选方案,所述钯镀层表面积大于耐腐蚀组合层表面二分之一的面积。As a preferred solution, the surface area of the palladium plating layer is greater than half of the surface area of the corrosion-resistant composite layer.
作为一种优选方案,所述钯镀层的厚度为0.25~5微米。As a preferred solution, the thickness of the palladium plating layer is 0.25-5 microns.
作为一种优选方案,所述第一金镀层的厚度为0.025~0.75微米。As a preferred solution, the thickness of the first gold plating layer is 0.025-0.75 microns.
作为一种优选方案,所述铑钌镀层的厚度为0.015~3微米。As a preferred solution, the thickness of the rhodium-ruthenium coating is 0.015-3 microns.
作为一种优选方案,还包括设置于耐腐蚀组合层与端子之间的铜镀层,所述铜镀层的厚度为0.3~5微米。As a preferred solution, it also includes a copper plating layer disposed between the corrosion-resistant composite layer and the terminal, and the thickness of the copper plating layer is 0.3-5 microns.
作为一种优选方案,所述耐腐蚀组合层包括依次电镀的第一镍钨镀层、第二金镀层、第二镍钨镀层和第三金镀层,所述第二金镀层表面积小于第一镍钨镀层表面积。As a preferred solution, the corrosion-resistant composite layer includes a first nickel-tungsten coating, a second gold coating, a second nickel-tungsten coating and a third gold coating which are electroplated in sequence, and the surface area of the second gold coating is smaller than that of the first nickel-tungsten coating coating surface area.
作为一种优选方案,所述第一镍钨镀层的厚度为0.5~5微米,所述第二金镀层的厚度为0.025~0.5微米,所述第二镍钨镀层的厚度为0.25~8微米,所述第三金镀层的厚度为0.005~0.8微米。As a preferred solution, the thickness of the first nickel-tungsten coating is 0.5-5 microns, the thickness of the second gold coating is 0.025-0.5 microns, the thickness of the second nickel-tungsten coating is 0.25-8 microns, The thickness of the third gold plating layer is 0.005-0.8 microns.
本实用新型还提供了一种端子,其表面电镀有上述所述的电镀层。The utility model also provides a terminal, the surface of which is electroplated with the above-mentioned electroplating layer.
本实用新型还提供了一种电子接口,包括上述所述的端子。The utility model also provides an electronic interface, which includes the above-mentioned terminal.
本实用新型的有益效果在于:The beneficial effects of the present utility model are:
本实用新型在端子表面的依次镀有耐腐蚀组合层以耐磨组合层,以上镀层组合的镀层结构具有较好的耐磨性以及腐蚀性,并且电镀镀层与基材材料之间的粘合性较好;其中耐磨组合层主要由钯镀层、第一金镀层和铑钌镀层组成,钯镀层的硬度较大,可以提高端子的硬度,防止其弯曲延伸,耐插拔,其次具有一定防腐蚀性和防氧化性;铑钌镀层可以提高端子的电接触性能,其接触电阻小;同时还具有较高的硬度和良好的抗腐蚀,耐插拔以及耐手汗电解;而第一金镀层作为过渡层,金具有较好延展性,可以缓冲或消减上述两种镀层的内应力,防止镀层出现裂缝。从而使得电镀镀层具有较好的性能;The utility model is sequentially plated with a corrosion-resistant composite layer and a wear-resistant composite layer on the surface of the terminal. The above-mentioned composite coating structure has good wear resistance and corrosion resistance, and the adhesion between the electroplating layer and the base material is excellent. Better; the wear-resistant composite layer is mainly composed of palladium coating, first gold coating and rhodium-ruthenium coating. The hardness of palladium coating is relatively high, which can improve the hardness of the terminal, prevent it from bending and extending, and resist plugging and unplugging. Secondly, it has certain anti-corrosion properties. The rhodium-ruthenium coating can improve the electrical contact performance of the terminal, and its contact resistance is small; at the same time, it also has high hardness and good corrosion resistance, plug resistance and hand sweat resistance electrolysis; and the first gold coating as a As the transition layer, gold has good ductility, which can buffer or reduce the internal stress of the above two coatings and prevent cracks in the coating. So that the electroplating coating has better performance;
最重要的是钯镀层采用局部电镀的方式设置于上一镀层(即耐腐蚀组合层) 表面,钯镀层的电镀面积小于耐腐蚀组合层的电镀面积,有效节约了成本。The most important thing is that the palladium plating layer is disposed on the surface of the previous plating layer (ie, the corrosion-resistant composite layer) by local electroplating. The plating area of the palladium plating layer is smaller than that of the corrosion-resistant composite layer, which effectively saves costs.
附图说明Description of drawings
图1是本实用新型的截面示意图。Figure 1 is a schematic cross-sectional view of the present invention.
附图标号说明:1-铜镀层;2-钯镀层;3-第一金镀层;4-铑钌镀层;51-第一镍钨镀层;52-第二金镀层;53-第二镍钨镀层;54-第三金镀层。Description of reference numerals: 1-copper coating; 2-palladium coating; 3-first gold coating; 4-rhodium-ruthenium coating; 51-first nickel-tungsten coating; 52-second gold coating; 53-second nickel-tungsten coating ; 54 - The third gold coating.
具体实施方式Detailed ways
下面将结合附图对本实用新型的技术方案进行清楚、完整地描述,显然,所描述的实施例是本实用新型一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.
在本实用新型的描述中,需要说明的是,术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本实用新型和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本实用新型的限制。此外,术语“第一”、“第二”、“第三”仅用于描述目的,而不能理解为指示或暗示相对重要性。In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner" and "outer" The orientation or positional relationship indicated by etc. is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, with a specific orientation. Therefore, it should not be construed as a limitation on the present invention. Furthermore, the terms "first", "second", and "third" are used for descriptive purposes only and should not be construed to indicate or imply relative importance.
在本实用新型的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本实用新型中的具体含义。In the description of the present invention, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a connectable connection. Detachable connection, or integral connection; may be mechanical connection or electrical connection; may be direct connection, or indirect connection through an intermediate medium, or internal communication between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.
请参阅图1所示,本实用新型关于一种用于端子表面的电镀层,包括依次电镀于端子表面的耐腐蚀组合层及耐磨组合层,所述耐磨组合层包括依次电镀的钯镀层2、第一金镀层3和铑钌镀层4,所述钯镀层2表面积小于耐腐蚀组合层表面积。Please refer to FIG. 1 , the present invention relates to an electroplating layer for the surface of a terminal, including a corrosion-resistant composite layer and a wear-resistant composite layer plated on the terminal surface in sequence, and the wear-resistant composite layer includes a palladium plating layer plated in sequence. 2. For the first
本实用新型在端子表面的依次镀有耐腐蚀组合层以耐磨组合层,以上镀层组合的镀层结构具有较好的耐磨性以及腐蚀性,并且电镀镀层与基材材料之间的粘合性较好;其中耐磨组合层主要由钯镀层2、第一金镀层3和铑钌镀层4组成,钯镀层2的硬度较大,可以提高端子的硬度,防止其弯曲延伸,耐插拔,其次具有一定防腐蚀性和防氧化性;铑钌镀层4可以提高端子的电接触性能,其接触电阻小;同时还具有较高的硬度和良好的抗腐蚀,耐插拔以及耐手汗电解;而第一金镀层3作为过渡层,金具有较好延展性,可以缓冲或消减上述两种镀层的内应力,防止镀层出现裂缝。从而使得电镀镀层具有较好的性能;The utility model is sequentially plated with a corrosion-resistant composite layer and a wear-resistant composite layer on the surface of the terminal. The above-mentioned composite coating structure has good wear resistance and corrosion resistance, and the adhesion between the electroplating layer and the base material is excellent. Better; wherein the wear-resistant composite layer is mainly composed of
最重要的是钯镀层采用局部电镀的方式均匀设置于上一镀层(即耐腐蚀组合层)表面,钯镀层2的电镀面积小于耐腐蚀组合层的电镀面积,有效节约了成本。具体地,所述钯镀层2表面积大于耐腐蚀组合层表面二分之一的面积。The most important thing is that the palladium plating layer is uniformly arranged on the surface of the previous plating layer (ie, the corrosion-resistant composite layer) by local electroplating, and the plating area of the
目前电子产品中为了提高导电性能,其端子的基底一般使用铜材;在耐腐蚀组合层与端子之间设置有铜镀层1,铜镀层1可以与基底很好的结合起来,其次可以将基底表面的缺陷(如细微的凹坑等)进行弥补,平整度较高,有利于后续的电镀。另外所述铜镀层1的厚度为0.3~5微米,所述钯镀层2的厚度为 0.25~5微米,所述第一金镀层3的厚度为0.025~0.75微米,所述铑钌镀层4的厚度为0.015~3微米。At present, in order to improve the electrical conductivity of electronic products, the substrate of the terminal is generally made of copper; a
所述耐腐蚀组合层包括第一镍钨镀层51、第二金镀层52、第二镍钨镀层53 和第三金镀层54,所述第二金镀层52表面积小于第一镍钨镀层51表面积。通过采用双层镍钨镀层后,可有效降低耐磨层的厚度,降低成本,同时镍钨镀层具有较好耐磨性能和防腐蚀,尤其是耐酸性能;而起到过渡作用的第二金镀层 52和第三金镀层54,一方面防止镀层出现裂缝,从而使得电镀镀层具有较好的性能,另一方面,第二金镀层52同样采用局部电镀的方式,其电镀面积大大地缩减,节省了成本,并且所述第二金镀层52表面积大于第一镍钨镀层51表面二分之一的面积。优选地,所述第一镍钨镀层51的厚度为0.5~5微米,所述第二金镀层52的厚度为0.025~0.5微米,所述第二镍钨镀层53的厚度为0.25~8 微米,所述第三金镀层54的厚度为0.005~0.8微米。The corrosion-resistant composite layer includes a first nickel-tungsten coating 51 , a
所述钯镀层2和第二金镀层52是通过局部电镀方式电镀出镀层,由于采用局部方式电镀,使得其上一层镀层的表面会存在未镀区域,在局部电镀后,下一电镀层将自动填充未镀区域,并且所述局部电镀的镀层还可以采用点状、直线条纹、斜纹等其他局部电镀方式均匀电镀,在此不再赘述。The
以上实施方式仅仅是对本实用新型的优选实施方式进行描述,并非对本实用新型的范围进行限定,在不脱离本实用新型设计精神的前提下,本领域普通工程技术人员对本实用新型的技术方案作出的各种变形和改进,均应落入本实用新型的权利要求书确定的保护范围内。The above embodiments are only to describe the preferred embodiments of the present invention, and do not limit the scope of the present invention. On the premise of not departing from the design spirit of the present invention, ordinary engineers and technicians in the art make the technical solutions of the present invention. Various deformations and improvements should fall within the protection scope determined by the claims of the present utility model.
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