CN210532733U

CN210532733U - Radiator for semiconductor refrigerating device

Info

Publication number: CN210532733U
Application number: CN201820033397.8U
Authority: CN
Inventors: 张奇
Original assignee: Individual
Current assignee: Individual
Priority date: 2018-01-09
Filing date: 2018-01-09
Publication date: 2020-05-15
Anticipated expiration: 2028-01-09

Abstract

The utility model discloses a semiconductor is radiator for refrigerating plant, including heat-conducting plate and heat conduction piece, the heat-conducting plate upper end is fixed with the semiconductor wafer, and installs first water inlet in the heat-conducting plate left side to the heat-conducting plate lower extreme is provided with the heating panel, semiconductor wafer external fixation has the semiconductor mounting, and semiconductor mounting lower extreme is fixed with the heat-conducting plate, the inside cooling tube that is fixed with of cooling tube mounting, and cooling tube mounting right side are fixed with the second delivery port, the cooling tube right side is provided with the second water inlet, first fan right side is fixed with the second fan, first delivery port external connection has the heat-conducting plate, heat conduction piece internally mounted has the cooling tube, and heat conduction piece external connection has the heating panel, the louvre external fixation has the heating panel. The semiconductor refrigerating device radiator is internally provided with a multiple radiating structure, so that the semiconductor refrigerating sheet can be effectively radiated, and the refrigerating effect is prevented from being influenced by overhigh temperature of the semiconductor refrigerating sheet.

Description

Radiator for semiconductor refrigerating device

Technical Field

The utility model relates to a semiconductor heat dissipation technical field specifically is a radiator for semiconductor refrigerating plant.

Background

A semiconductor refrigerating plate, also called thermoelectric refrigerating plate, is a heat pump, its advantage is that there is no sliding part, apply to some space and is limited, the reliability is required to be high, the occasion without refrigerant pollution, utilize Peltier effect of semiconductor material, when the direct current passes through the galvanic couple that two kinds of different semiconductor materials are connected in series, can absorb the heat and emit the heat separately at both ends of the galvanic couple, can realize the purpose of refrigerating, it is a refrigeration technology producing negative thermal resistance, its characteristic is there is no moving part, the reliability is higher too.

The general semiconductor refrigeration piece all needs installation heat abstractor, but general heat abstractor structure is fairly simple, just at semiconductor refrigeration piece externally mounted cooling fan, and the radiating effect is relatively poor like this, can influence the refrigeration effect of semiconductor refrigeration piece.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a radiator for semiconductor refrigerating plant to solve the problem that the poor effect of cooling to is influenced to the cooling effect that leads to the radiating effect fairly simply of the heat abstractor structure on the last semiconductor refrigeration piece of existing market that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a radiator for a semiconductor refrigerating device comprises a heat conducting plate and a heat conducting block, wherein a semiconductor wafer is fixed at the upper end of the heat conducting plate, a first water inlet is arranged at the left side of the heat conducting plate, a heat radiating plate is arranged at the lower end of the heat conducting plate, a semiconductor fixing piece is fixed at the outer part of the semiconductor wafer, the heat conducting plate is fixed at the lower end of the semiconductor fixing piece, a cooling pipe fixing piece is installed at the outer part of the heat radiating plate, a first water outlet is fixed at the right side of the heat radiating plate, a bottom plate is installed at the lower end of the heat radiating plate, a cooling pipe is fixed at the inner part of the cooling pipe fixing piece, a second water outlet is fixed at the right side of the cooling pipe fixing piece, a second water inlet is arranged at the right side of the cooling pipe, a first fan is installed at, and the heat conduction block is externally connected with a heat dissipation plate, and the heat dissipation plate is fixed outside the heat dissipation hole.

Preferably, the bottom plate comprises a bottom plate main body, a first heat dissipation hole and a second heat dissipation hole, the first heat dissipation hole is arranged inside the bottom plate main body, the second heat dissipation hole is arranged inside the bottom plate main body, and the second heat dissipation hole is arranged on the right side of the first heat dissipation hole.

Preferably, the first heat dissipation hole and the second heat dissipation hole are bilaterally symmetrical about the central line of the bottom plate main body, and the central points of the first heat dissipation hole and the second heat dissipation hole are respectively positioned on the same straight line with the central points of the first fan and the second fan.

Preferably, the inner diameter of the heat conduction block is equal to the outer diameter of the cooling pipe, and the distance between the width of the heat conduction block and the heat dissipation plate is zero.

Preferably, the diameter of the inside of the heat dissipation holes is 1-3mm, and the heat dissipation holes are uniformly distributed in the heat dissipation plate.

Compared with the prior art, the beneficial effects of the utility model are that: the semiconductor refrigerating device radiator is internally provided with a multiple radiating structure, so that the semiconductor refrigerating sheet can be effectively radiated, and the refrigerating effect is prevented from being influenced by overhigh temperature of the semiconductor refrigerating sheet. The device's bottom plate plays the effect of fixed first fan and second fan, and perforation on the bottom plate makes things convenient for first fan and second fan to lead-in between the heating panel with the air of external world, improves the radiating effect, and the heat conduction piece can be with on the heat transfer to the cooling tube on the heating panel, improves the radiating effect of heating panel, the inside louvre of heating panel improves thermal giving off the effect, make the heat in the heating panel can give off fast, improve the heating panel radiating effect.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic side view of the present invention;

FIG. 3 is a schematic view of the bottom plate structure of the present invention;

FIG. 4 is a schematic view of the structure of the heat dissipation holes of the present invention;

fig. 5 is an enlarged schematic view of a portion a in fig. 2 according to the present invention.

In the figure: 1. the heat-conducting plate, 2, the semiconductor wafer, 3, the semiconductor mounting, 4, first water inlet, 5, the heating panel, 6, the cooling tube mounting, 7, the cooling tube, 8, the bottom plate, 801, the bottom plate main part, 802, first louvre, 803, second louvre, 9, first fan, 10, second fan, 11, first delivery port, 12, the second water inlet, 13, the second delivery port, 14, the heat conduction piece, 15, the louvre.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: a heat radiator for a semiconductor refrigerating device comprises a heat conducting plate 1 and a heat conducting block 14, wherein a semiconductor wafer 2 is fixed at the upper end of the heat conducting plate 1, a first water inlet 4 is arranged at the left side of the heat conducting plate 1, a heat radiating plate 5 is arranged at the lower end of the heat conducting plate 1, a semiconductor fixing piece 3 is fixed at the outer part of the semiconductor wafer 2, the heat conducting plate 1 is fixed at the lower end of the semiconductor fixing piece 3, a cooling pipe fixing piece 6 is arranged at the outer part of the heat radiating plate 5, a first water outlet 11 is fixed at the right side of the heat radiating plate 5, a bottom plate 8 is arranged at the lower end of the heat radiating plate 5, a cooling pipe 7 is fixed at the inner part of the cooling pipe fixing piece 6, a second water outlet 13 is fixed at the right side of the cooling pipe 7, a second water inlet 12 is arranged at the right side of the cooling, the bottom plate 8 of the structure plays a role of fixing the first fan 9 and the second fan 10, the first fan 9 and the second fan 10 are prevented from being directly fixed on the heat dissipation plate 5 and are not easy to fall off, the first heat dissipation hole 802 and the second heat dissipation hole 803 are bilaterally symmetrical about the central line of the bottom plate body 801, and the central points of the first heat dissipation hole 802 and the second heat dissipation hole 803 are respectively positioned on the same straight line with the central points of the first fan 9 and the second fan 10, the first heat dissipation hole 802 and the second heat dissipation hole 803 of the structure facilitate the first fan 9 and the second fan 10 to guide outside air between the heat dissipation plate 5, thereby improving the heat dissipation effect of the heat dissipation plate 5, the second fan 10 is fixed on the right side of the first fan 9, first delivery port 11 external connection has heat-conducting plate 1, heat conduction piece 14 internally mounted has cooling tube 7, and heat conduction piece 14 external connection has cooling plate 5, the inside diameter of heat conduction piece 14 equals with cooling tube 7's outside diameter, and the distance between heat conduction piece 14's width and the cooling plate 5 is zero, heat conduction piece 14 of this structure can be with the leading-in cooling tube 7 of the heat on the cooling plate 5 on, improve cooling tube 7 heat absorption's effect, just so improve the radiating effect of whole device, louvre 15 external fixation has cooling plate 5, louvre 15 inside diameter is 1-3mm, and louvre 15 evenly distributed is in the inside of cooling plate 5, louvre 15 of this structure makes outside air enter into the inside of cooling plate 5, can improve cooling plate 5 radiating effect.

The working principle is as follows: when the radiator for the semiconductor refrigerating device is used, the radiator is firstly installed at a proper place, then the radiator is started, cooling water enters the interior of the heat conducting plate 1 through the first water inlet 4 and then flows out of the first water outlet 11, the cooling water can also enter the cooling pipe 7 through the second water inlet 12 and then flows out of the second water outlet 13, then in the using process, heat emitted by the semiconductor chip 2 is transferred to the heat conducting plate 1, part of wind heat on the heat conducting plate 1 is absorbed and taken away by the cooling water, so that the temperature of the heat conducting plate 1 is reduced, the heat on the conductor chip 2 can be continuously absorbed, the heat conducting plate 1 can also transfer the heat to the heat radiating plate 5, and the first fan 9 and the second fan 10 guide air with lower external temperature into the space between the heat radiating plates 5 through the first radiating hole 802 and the second radiating hole 803, can accelerate the radiating effect of heating panel 5 like this, and the air of temperature ratio low can enter into in louvre 15, improve heating panel 5's radiating effect, heat on heating panel 5 can be absorbed to heat conduction piece 14 simultaneously, and heat conduction piece 14 contact cooling tube 7's area is bigger, heat on the heat conduction piece 14 can be absorbed by the cooling water in the cooling tube 7 fast, accelerate heating panel 5's radiating effect, and above refrigeration effect can move alone, so alright in order to make semiconductor wafer 2's temperature can keep in certain within range, can not influence refrigeration effect, thereby accomplish a series of works.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. A radiator for a semiconductor refrigerating device comprises a heat conducting plate (1) and a heat conducting block (14), and is characterized in that: the semiconductor wafer (2) is fixed at the upper end of the heat conducting plate (1), the first water inlet (4) is installed on the left side of the heat conducting plate (1), the heat radiating plate (5) is arranged at the lower end of the heat conducting plate (1), the semiconductor fixing piece (3) is fixed outside the semiconductor wafer (2), the heat conducting plate (1) is fixed at the lower end of the semiconductor fixing piece (3), the cooling pipe fixing piece (6) is installed outside the heat radiating plate (5), the first water outlet (11) is fixed on the right side of the heat radiating plate (5), the bottom plate (8) is installed at the lower end of the heat radiating plate (5), the cooling pipe (7) is fixed inside the cooling pipe fixing piece (6), the second water outlet (13) is fixed on the right side of the cooling pipe fixing piece (6), the second water inlet (12) is arranged on the right side of, and bottom plate (8) upper end is fixed with louvre (15), first fan (9) right side is fixed with second fan (10), first delivery port (11) external connection has heat-conducting plate (1), heat conduction piece (14) internally mounted has cooling tube (7), and heat conduction piece (14) external connection has heating panel (5), louvre (15) external fixation has heating panel (5).

2. The heat sink for a semiconductor cooling device according to claim 1, wherein: the base plate (8) comprises a base plate main body (801), a first heat dissipation hole (802) and a second heat dissipation hole (803), the first heat dissipation hole (802) is arranged inside the base plate main body (801), the second heat dissipation hole (803) is arranged inside the base plate main body (801), and the second heat dissipation hole (803) is arranged on the right side of the first heat dissipation hole (802).

3. The heat sink for a semiconductor cooling device according to claim 2, wherein: the first heat dissipation hole (802) and the second heat dissipation hole (803) are bilaterally symmetrical about the central line of the bottom plate main body (801), and the central points of the first heat dissipation hole (802) and the second heat dissipation hole (803) are respectively positioned on the same straight line with the central points of the first fan (9) and the second fan (10).

4. The heat sink for a semiconductor cooling device according to claim 1, wherein: the inner diameter of the heat conduction block (14) is equal to the outer diameter of the cooling pipe (7), and the distance between the width of the heat conduction block (14) and the heat dissipation plate (5) is zero.

5. The heat sink for a semiconductor cooling device according to claim 1, wherein: the diameter of the inside of the heat dissipation holes (15) is 1-3mm, and the heat dissipation holes (15) are uniformly distributed in the heat dissipation plate (5).