CN210512286U

CN210512286U - Breast milk refrigerating device and thin efficient heat dissipation mechanism

Info

Publication number: CN210512286U
Application number: CN201921411423.7U
Authority: CN
Inventors: 高俊岭; 卢汉华; 黄日升
Original assignee: Guangdong Fuxin Electronic Technology Co ltd
Current assignee: Guangdong Fuxin Electronic Technology Co ltd
Priority date: 2019-08-28
Filing date: 2019-08-28
Publication date: 2020-05-12
Anticipated expiration: 2029-08-28

Abstract

The utility model relates to a breast milk cold storage plant and slim high-efficient heat dissipation mechanism, slim high-efficient heat dissipation mechanism include radiator and radiator fan. The radiator comprises a first end face and a second end face which are oppositely arranged. The first end face is used for being in contact with the hot end face of the semiconductor refrigerator. The air outlet surface of the heat radiation fan faces the second end surface, and the air outlet surface of the heat radiation fan is obliquely arranged relative to the first end surface. According to the thin efficient heat dissipation mechanism, the first end face of the radiator is in contact with the hot end face of the semiconductor refrigerator, so that heat on the hot end face of the semiconductor refrigerator can be taken away in time; the air outlet surface of the radiating fan supplies air towards the radiator, so that heat on the radiator is taken away, and the efficient radiating effect can be realized. In addition, the air outlet surface of the heat radiation fan is obliquely arranged relative to the first end surface, so that the whole thickness of the thin efficient heat radiation mechanism can be reduced as much as possible, the size of the device can be reduced, and the device can be conveniently carried, stored and transported.

Description

Breast milk refrigerating device and thin efficient heat dissipation mechanism

Technical Field

The utility model relates to a cold storage plant technical field especially relates to a breast milk cold storage plant and slim high-efficient heat dissipation mechanism.

Background

Breast feeding is always the first choice for infant feeding from the nutritional and health perspective. When the mother is not around the baby, for example, the mother can not feed the baby to the next place after taking a rest, the mother needs to express the breast milk from the mother, store and transport the breast milk, and feed the baby. Generally, after breast milk is squeezed out of a mother body and then is packaged and stored in separate bags, the current storage and transportation mode is that a breast milk carrier with emulsion and a cold storage device (such as a cold storage device with ice blocks and/or cold storage liquid) for cold storage in advance are placed in a heat preservation bag with a heat preservation function, and the breast milk is cooled by means of cold stored in the cold storage device and is continuously transferred by a cold chain in the transportation process. In the traditional storage and transportation mode, because the cold energy comes from the cold accumulation device, if the storage and transportation are convenient to carry, the total cold accumulation amount is limited due to the limitation of volume and weight, so that the cold energy which can be consumed is gradually reduced along with the time lapse in the breast milk refrigeration and continuation process, the breast milk temperature has a temperature fluctuation change process of firstly reducing and then increasing, and the longer the time, the more obvious the temperature rise effect.

SUMMERY OF THE UTILITY MODEL

Accordingly, there is a need to overcome the drawbacks of the prior art and to provide a breast milk refrigerating device and a thin and efficient heat dissipation mechanism, which can reduce the size of the device and facilitate carrying, storage and transportation.

The technical scheme is as follows: a thin, efficient heat dissipation mechanism, comprising: the radiator comprises a first end face and a second end face which are oppositely arranged, and the first end face is used for being in contact with the hot end face of the semiconductor refrigerator; and the air outlet surface of the heat radiation fan faces the second end surface, and is obliquely arranged relative to the first end surface.

According to the thin efficient heat dissipation mechanism, the first end face of the radiator is in contact with the hot end face of the semiconductor refrigerator, so that heat on the hot end face of the semiconductor refrigerator can be taken away in time; the air outlet surface of the radiating fan supplies air towards the radiator, so that heat on the radiator is taken away, and the efficient radiating effect can be realized. In addition, the air outlet surface of the heat radiation fan is obliquely arranged relative to the first end surface, so that the whole thickness of the thin efficient heat radiation mechanism can be reduced as much as possible, the size of the device can be reduced, and the device can be conveniently carried, stored and transported.

In one embodiment, the heat sink includes a heat dissipation plate and a plurality of fin plates disposed on the heat dissipation plate at intervals, and the heat dissipation plate is used for contacting with the hot end surface.

In one embodiment, the side edge of the fin plate facing away from the heat dissipation plate is an oblique edge inclined relative to the plate surface of the heat dissipation plate, and the oblique edge is in contact with the air outlet surface of the heat dissipation fan.

In one embodiment, the thin efficient heat dissipation mechanism further includes a bracket, a power supply and a control board, the heat sink, the heat dissipation fan, the power supply and the control board are all mounted on the bracket, the power supply is electrically connected with the control board, and the control board is electrically connected with the heat dissipation fan.

In one embodiment, the thin efficient heat dissipation mechanism further comprises a protective cover, the protective cover is arranged on the support, the control board is located in the protective cover, and the protective cover is provided with a plurality of first ventilation openings.

In one embodiment, the power supply and the control board are respectively located at two sides of the heat dissipation fan.

In one embodiment, the thin efficient heat dissipation mechanism further comprises a bottom cover, the heat sink, the heat dissipation fan, the power supply, the control board and the bracket are all arranged in the bottom cover, and a main vent corresponding to an air inlet end of the heat dissipation fan is arranged on the bottom wall of the bottom cover; and a plurality of second ventilation openings are formed in the side wall of the bottom cover.

In one embodiment, the bottom of the bottom cover is provided with a plurality of anti-slip pads.

A breast milk refrigerating device comprises the thin efficient heat dissipation mechanism, and also comprises an inner container, a shell, a semiconductor refrigerator and a cold guide block; the inner container is provided with a cavity for accommodating a breast milk carrier; the inner container is arranged in the shell; the semiconductor refrigerator comprises a cold end face and a hot end face, the cold end face is in contact with the cold guide block, the cold guide block is in contact with the outer side wall of the inner container, and the first end face is in contact with the hot end face of the semiconductor refrigerator.

Foretell breast milk refrigerating plant, owing to include thin high-efficient heat dissipation mechanism, its technical effect has thin high-efficient heat dissipation mechanism bring, beneficial effect with thin high-efficient heat dissipation mechanism the same, do not give unnecessary details.

In one embodiment, the inner container is provided with an opening communicated with the cavity, the outer shell comprises an openable cover body, a lining is arranged on the end face of the cover body, the lining is provided with a boss, the outer side wall of the boss is a conical surface, and the inner side face of the opening of the outer shell is a concave face matched with the conical surface.

Drawings

Fig. 1 is a schematic view illustrating the flow of air when the thin efficient heat dissipation mechanism according to an embodiment of the present invention works;

fig. 2 is a simplified schematic view of a thin efficient heat dissipation mechanism according to an embodiment of the present invention;

fig. 3 is an exploded view of a breast milk cooler according to an embodiment of the present invention;

fig. 4 is a schematic structural view illustrating the combination of the inner container and the cooling guide block according to an embodiment of the present invention;

fig. 5 is a schematic structural view of the cold conduction block and the semiconductor refrigerator according to an embodiment of the present invention;

fig. 6 is a schematic structural view of the cold conduction block and the semiconductor refrigerator according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a breast milk carrier according to an embodiment of the present invention;

fig. 8 is a schematic structural view of an inner container according to an embodiment of the present invention;

fig. 9 is a schematic structural view of two breast milk carriers installed in the inner container according to an embodiment of the present invention;

FIG. 10 is a schematic cross-sectional view of one embodiment of FIG. 9 at A-A;

FIG. 11 is a cross-sectional schematic view of another embodiment of FIG. 9 at A-A;

FIG. 12 is a cross-sectional schematic view of the further embodiment of FIG. 9 at A-A;

fig. 13 is a schematic structural view of the inner container with a temperature equalizing plate installed therein according to an embodiment of the present invention;

fig. 14 is a schematic cross-sectional view at B-B of fig. 13.

Reference numerals:

100. a thin high-efficiency heat dissipation mechanism, 110, a heat sink, 111, a heat dissipation plate, 112, a fin plate, 1121, a bevel edge, 120, a heat dissipation fan, 130, a bracket, 140, a power supply, 150, a control panel, 160, a protective cover, 161, a first ventilation opening, 170, a bottom cover, 171, a second ventilation opening, 172, a non-slip mat, 200, a semiconductor refrigerator, 300, an inner container, 310, a heat conduction shell, 311, a chamber, 312, a first convex hull, 313, a second convex hull, 314, an opening, 315, a smooth guide surface, 320, a temperature equalization plate, 330, a connector, 340, a first installation part, 350, a second installation part, 400, a housing, 410, a partition, 411, an installation opening, 420, a cover body, 421, a top cover, 422, a plate cover, 423, a circuit board, 430, a lining, 431, a boss, 440, a concave surface, 500, a cold conduction block, 510, a first concave part, 520, a second concave part, 530, a hollowed-out hole, 540, 600. breast milk carrier, 710, heat preservation, 720, sealing washer, 730, insulating block.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

In the description of the present invention, it is to be understood that the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the description of the present invention, it is to be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly connected" to another element, there are no intervening elements present.

In one embodiment, referring to fig. 1 to 3, a thin efficient heat dissipation mechanism 100 includes a heat sink 110 and a heat dissipation fan 120. The heat sink 110 includes a first end surface and a second end surface opposite to each other. The first end face is for contacting the hot end face of the semiconductor cooler 200. The air outlet surface of the heat dissipation fan 120 faces the second end surface, and the air outlet surface of the heat dissipation fan 120 is inclined with respect to the first end surface.

In the thin efficient heat dissipation mechanism 100, the first end surface of the heat sink 110 contacts with the hot end surface of the semiconductor cooler 200, so that heat on the hot end surface of the semiconductor cooler 200 can be taken away in time; the air outlet surface of the heat dissipation fan 120 supplies air to the heat sink 110, and takes away heat from the heat sink 110, so that an efficient heat dissipation effect can be achieved. In addition, the air outlet surface of the heat dissipation fan 120 is inclined relative to the first end surface, so that the overall thickness of the thin efficient heat dissipation mechanism 100 can be reduced as much as possible, the device size can be reduced, and the device can be conveniently carried, stored and transported.

Wherein the total height of the thin efficient heat dissipation mechanism 100 is set as D₂A radiator 110 is set to D_sThe thickness and the frame length of the heat dissipation fan 120 are set to D_fAnd L_f. Further, the air outlet surface of the heat dissipation fan 120 is inclined with respect to the hot end surface, and the inclination angle of the heat dissipation fan 120 is a, and accordingly, D₂＝D_fcos a+D_s. Thus, as a increases from small to large, the thickness D of the heat sink 110_sThe value gradually becomes smaller, which is beneficial to the thickness D of the radiator 110_sThe heat dissipation wind resistance of the heat dissipation fan 120 is reduced, and the noise is reduced. However, as the angle a increases, the heat dissipation area of the heat dissipation fan 120 also gradually decreases, and the fan elevation thickness L is increased_fsin a (see FIG. 2) increases when L_fsina>D_sThickness D of the heat sink 110_sAnd the effective thickness D of the heat dissipation fan 120_fcosa will be larger than the conventional structure value, so the maximum value of a is

Considering the above three factors, in this embodiment, the value a is specifically in the range of 5 ° to 45 °.

Radiating fan 120 model 9025 (thickness D)_fIs 25mm, side length L_f90mm), the height D of the thin efficient heat dissipation mechanism 100 corresponds to when a is 45 degrees₂Approximately 63mm when the design thickness D of the heat sink 110 is_sWhen reducing, a needs to be further reduced in combination with the thickness D of the heat sink 110_sWind resistance, heat dissipation area, etc., and finally find the optimal value of a. Height D of thin efficient heat dissipation mechanism 100₂The smaller the size of the breast milk refrigerating device, the smaller the overall size of the breast milk refrigerating device. In addition, since the heat dissipation fan 120 is disposed by side blowing in the manner of the inclination angle a, on the basis of reducing the overall height, dead corners of the air flow caused by directly blowing the semiconductor heat sink 110 are avoided (when directly blowing, the projection of the motor portion of the heat dissipation fan 120 on the heat sink 110 is generally located at the position of the semiconductor heat sink 110, which happens to be the dead area of the air flow of the heat dissipation fan 120), so as to improve the heat dissipation efficiency.

Further, the heat sink 110 includes a heat dissipation plate 111 and a plurality of fin plates 112 disposed on the heat dissipation plate 111 at intervals. The heat dissipation plate 111 is used for contacting with the hot end face. Specifically, the fin plate 112 is an aluminum fin or a copper fin or the like. Thus, the heat of the hot end surface of the semiconductor cooler 200 is guided to the heat dissipating plate 111, and the heat is guided to the fin plate 112 by the heat dissipating plate 111, thereby achieving a good heat dissipating effect.

Furthermore, the side of the fin plate 112 facing away from the heat dissipation plate 111 is an inclined edge 1121 inclined with respect to the plate surface of the heat dissipation plate 111, and the inclined edge 1121 is in contact with the air outlet surface of the heat dissipation fan 120. Therefore, on one hand, the air outlet surface of the heat dissipation fan 120 is closer to the heat sink 110, so that the heat on the heat sink 110 can be better taken away; on the other hand, the air outlet surface of the heat dissipation fan 120 contacts the inclined edge 1121 of the fin plate 112, so as to reduce the effective thickness D of the heat dissipation fan 120 as much as possible_fcosa, so that the total height of the thin efficient heat dissipation mechanism 100 can be greatly reduced is set as D₂The device is beneficial to reducing the volume of the device and is convenient to store, transport and carry.

In one embodiment, the thin and efficient heat dissipation mechanism 100 further includes a bracket 130, a power source 140, and a control board 150. The heat sink 110, the heat dissipation fan 120, the power source 140 and the control board 150 are all mounted on the bracket 130, the power source 140 is electrically connected with the control board 150, and the control board 150 is electrically connected with the heat dissipation fan 120. Specifically, the bracket 130 is provided with a first mounting position for mounting the heat sink 110, a second mounting position for mounting the power source 140, and a third mounting position for mounting the control board 150. Through the first, second and third mounting positions, the heat sink 110, the heat dissipation fan 120, the power source 140 and the control board 150 can be stably and rapidly mounted on the bracket 130. The power source 140 is a rechargeable battery or a storage battery, and provides the power source 140 for the control board 150, and the control board 150 controls the cooling fan 120 and the semiconductor refrigerator 200 to operate.

In one embodiment, the thin, efficient heat dissipation mechanism 100 further comprises a protective cover 160. The protective cover 160 is installed on the bracket 130, the control board 150 is located in the protective cover 160, and a plurality of first ventilation openings 161 are formed in the protective cover 160. The shield 160 protects the control board 150 from being damaged by the control board 150.

In one embodiment, the power source 140 and the control board 150 are respectively disposed at two sides of the heat dissipation fan 120. The purpose is that the main airflow at the bottom of the cooling fan 120 drives the side branch airflow to flow, so as to play a certain role in cooling the power supply 140 and the control panel 150 which are arranged on the side, and to facilitate the stability of the performance of the power supply 140. The whole airflow flows as shown in figure 1, and a compact scheme that main air is fed into the bottom, air is fed into the side face as an auxiliary air, and air is discharged from the other side is formed.

In one embodiment, referring to fig. 3, the thin efficient heat dissipation mechanism 100 further includes a bottom cover 170. The heat sink 110, the heat dissipation fan 120, the power supply 140, the control board 150 and the bracket 130 are all disposed in the bottom cover 170, a main vent corresponding to the air inlet end of the heat dissipation fan 120 is disposed on the bottom wall of the bottom cover 170, and a plurality of second vents 171 are disposed on the side wall of the bottom cover 170. The arrangement of the bracket 130, the heat sink 110, the heat dissipation fan 120, the power source 140 and the control board 150 can reduce the volume of the bottom cover 170 as much as possible, thereby facilitating carrying. In addition, a main ventilation opening corresponding to the air inlet end of the heat dissipation fan 120 is disposed on the bottom wall of the bottom cover 170, and when the heat dissipation fan 120 works, the outside air is drawn into the bottom cover 170 through the main ventilation opening to perform heat dissipation and cooling functions on the heat sink 110, the power supply 140, and the control board 150. The side wall of the bottom cover 170 is provided with a plurality of second ventilation openings 171, and when the cooling fan 120 works, the outside air can enter the bottom cover 170 through the second ventilation openings 171 to perform the functions of heat dissipation and cooling on the heat sink 110, the power supply 140 and the control board 150.

Further, the bottom of the bottom cover 170 is provided with a plurality of anti-slip pads 172. Thus, the non-slip mat 172 serves as a non-slip function when the breast milk refrigerating apparatus is placed on a table or a work bench.

In one embodiment, please refer to fig. 3, a breast milk refrigerating apparatus includes the thin efficient heat dissipation mechanism 100 of any of the above embodiments, further includes an inner container 300, a housing 400, a semiconductor refrigerator 200, and a cold guide block 500. The inner container 300 is provided with a chamber 311 for receiving a milk carrier 600. The inner container 300 is installed in the outer case 400. The semiconductor refrigerator 200 includes a cold end surface and a hot end surface, the cold end surface contacts with the cold guide block 500, the cold guide block 500 contacts with the outer sidewall of the inner container 300, and the first end surface contacts with the hot end surface of the semiconductor refrigerator 200.

The breast milk refrigerating device comprises the thin efficient heat dissipation mechanism 100, the technical effect of the thin efficient heat dissipation mechanism 100 is brought, the beneficial effects of the thin efficient heat dissipation mechanism 100 are the same as those of the thin efficient heat dissipation mechanism 100, and the details are omitted.

In addition, the hot end face of the semiconductor refrigerator 200 diffuses heat outwards through the thin efficient heat dissipation mechanism 100, and the cold quantity of the cold end face of the semiconductor refrigerator 200 is continuously conducted to the inner container 300 through the cold guide block 500, so that the inner container 300 continuously conducts the cold quantity to the breast milk carrier 600 arranged in the cavity 311 for a long time. In addition, the semiconductor cooler 200, the cold conducting block 500 and the thin efficient heat dissipation mechanism 100 are combined on the housing 400, so that the whole volume is small, the weight is light, and the carrying is convenient.

Further, referring to fig. 3, the inner container 300 is provided with an opening 314 communicating with the cavity 311, and the outer shell 400 includes an openable cover 420. The end face of the cover body 420 is provided with a lining 430, the lining 430 is provided with a boss 431, the outer side wall of the boss 431 is a conical surface, and the inner side face of the mouth part of the shell 400 is a concave surface 440 matched with the conical surface. After the cover body 420 is closed, the outer side surface of the boss 431 is abutted against the concave surface 440, so that the sealing performance can be improved, and the cold energy in the inner container 300 is prevented from leaking outwards.

Further, referring to fig. 5, the shape of the end surface of the cold block 500 contacting with the cold end surface is adapted to the cold end surface. That is, the area of the end surface of the cold block 500 contacting the cold end surface is the same as the area of the cold end surface. The other end surface of the cold conducting block 500 contacts with the bottom of the inner container 300. Thus, a thermal short between the cold block 500 and the thin efficient heat dissipation mechanism 100 can be avoided.

In one embodiment, one of the sidewalls of the cold block 500 is provided with a first recess 510, and the other sidewall of the cold block 500 is provided with a second recess 520. Specifically, the first recess 510 and the second recess 520 have a semi-cylindrical shape. The size of the first recess 510 and the second recess 520 is set according to the actual situation, and the cold conduction block 500 is not affected to transfer cold, so that the weight of the cold conduction block 500 can be reduced to a certain extent, and the weight of the breast milk refrigerating device can be reduced. Furthermore, first and

second recesses

510 and 520 make cold block 500 a variable cross-sectional block, i.e., the cross-sectional area of cold block 500 is first smaller and then larger in the direction from semiconductor cooler 200 to inner container 300.

Further, referring to fig. 6, a hollow hole 530 is formed in the middle of the cold conducting block 500. The size of the hollow-out hole 530 is set according to actual conditions, as long as the cold quantity transferred by the cold guide block 500 is not affected, so that the weight of the cold guide block 500 can be reduced to a certain extent, and the weight of the breast milk refrigerating device can be reduced.

In one embodiment, referring to fig. 5, one end surface of the cold guide block 500 is in close contact with the cold end surface, and the other end surface of the cold guide block 500 is in close contact with the outer sidewall of the inner container 300. The end surface area S1 of the cold guide block 500 contacting with the cold end surface is smaller than the end surface area S2 of the cold guide block 500 contacting with the outer side wall of the inner container 300.

Further, referring to fig. 4 and 5, a wing 540 is formed by extending outward a side surface of the cold guide block 500 facing one end of the inner container 300. Specifically, both side surfaces of one end of the inner container 300 are extended outward to form wing parts 540, and both wing parts 540 are connected to the inner container 300 through the connecting member 330. The wing 540 increases the end surface area of the end of the cold guide block 500 facing the inner container 300 to a certain extent, so that the contact area of the cold guide block 500 and the outer side wall of the bottom of the inner container 300 can be increased, and the cold conduction thermal resistance is reduced, thereby being beneficial to the cold guide block 500 to conduct cold to the inner container 300. In addition, the cold energy is favorably and uniformly transmitted to the bottom of the inner container 300, and the refrigerating performance of the inner container 300 is enhanced. In addition, the wing 540 can facilitate the connecting member 330 to interconnect and assemble the cold block 500 and the inner container 300 together.

Further, the breast milk refrigerating apparatus further includes a connector 330. The outer side wall of the inner container 300 is provided with a first mounting part 340 and a second mounting part 350, and two ends of the connecting member 330 are detachably mounted on the first mounting part 340 and the second mounting part 350 respectively. The wing 540 is fixed between the connecting member 330 and the outer sidewall of the inner container 300. The connecting member 330 is, for example, a steel strip, a copper strip, an aluminum strip, etc., and ends of the connecting member 330 are detachably mounted to the first mounting portion 340 and the second mounting portion 350 by bolts, screws, etc. The connecting member 330 is, for example, a steel wire rope or a plastic rope, and can also be directly tied to the first mounting portion 340 and the second mounting portion 350. Furthermore, a groove 541 is disposed on a sidewall of the wing 540 facing away from the inner container 300, and the connecting member 330 is disposed in the groove 541, so that the wing 540 can be stably mounted and fixed on the inner container 300.

In one embodiment, referring again to FIG. 3, the breastmilk cooler further includes an insulation layer 710. The bottom wall of the shell 400 is provided with a mounting opening 411, the cold conducting block 500 is arranged in the shell 400, the semiconductor refrigerator 200 is arranged in the mounting opening 411, the thin efficient heat dissipation mechanism 100 is positioned outside the shell 400, and the heat insulation layer 710 is filled in the interval between the inner container 300 and the shell 400.

Further, referring to fig. 1, fig. 3 and fig. 4, the insulation layer 710 is a foamed insulation layer 710. Thus, the pressure generated in the foaming process of the foaming insulation layer 710 is applied to the wing part 540 of the cold guide block 500, so that the cold guide block 500 is more tightly jointed with the bottom of the liner 300, and the cold conduction thermal resistance is reduced; in addition, the foamed insulating layer 710 enables the cold guide block 500 and the inner container 300 to be combined into a whole, and the structure is firmer and more reliable. Specifically, the housing 400 includes a detachable partition 410, and the mounting opening 411 is disposed on the partition 410.

Further, referring to fig. 3, the breast milk refrigerating apparatus further includes a sealing ring 720 disposed between the boss 431 and the inner container 300. The sealing ring 720 can further improve the sealing performance and avoid the leakage of the cold energy in the inner container 300.

Further, the breast milk refrigerating device further comprises a heat preservation block 730. The thermal insulation block 730 is detachably disposed at the opening of the inner container 300, and the liner 430 is circumferentially disposed around the thermal insulation block 730. So, lid 420 closes the back, and the top surface of heat preservation block 730 and the bottom surface contact cooperation of lid 420, the bottom surface of heat preservation block 730 are located the opening position of inner bag 300, occupy integrative space, avoid lid 420 to get into and stay the oral area at shell 400 opening and shutting in-process external hot-air to can improve breast milk refrigerating plant's freezing performance, also avoid appearing the condensation phenomenon on the lateral wall of shell 400 simultaneously.

In one embodiment, the cover 420 includes a top cover 421, a board cover 422, and a circuit board 423. The circuit board 423 is disposed between the top cover 421 and the board cover 422, and the board cover 422 is detachably connected to the top cover 421. The circuit board 423 is electrically connected to the control board 150 through a wire. An alarm is arranged on the circuit board 423. The breast milk refrigerating device further comprises at least two temperature sensors electrically connected with the circuit board 423, wherein one temperature sensor is used for sensing the temperature of the hot end face, and the other temperature sensor is used for sensing the temperature of breast milk of the breast milk carrier 600 in the inner container 300. Specifically, the temperature sensor that senses the temperature of the milk carrier 600 in the liner 300 is attached to the side wall of the liner 300, and can sense the temperature of the milk carrier 600 more accurately. The alarm is used for alarming when the temperature in the inner container 300 cannot be reduced to the preset temperature in the preset time period and alarming when the temperature of the hot end face is too high. The alarm device is also used to alarm when the semiconductor refrigerator 200 and the cooling fan 120 are short-circuited. The alarm is also used for alarming when the temperature sensor is in fault.

Further, be provided with the display screen with circuit board 423 electric connection on the top cap 421, the display screen is used for showing temperature sensor's temperature in real time. This is useful for understanding the specific operation of the breastmilk cooler. In particular, the display screen may be a touch display screen. The working power of the semiconductor refrigerator 200 can be adjusted by touching the display screen, so that the refrigerating effect of the breast milk carrier 600 in the inner container 300 can be adjusted. Of course, the top cover 421 can also be provided with a plurality of mechanical control buttons, and the operating power of the semiconductor refrigerator 200 can be adjusted by the control buttons.

Generally, referring to fig. 7, the milk carrier 600 is a flowable and deformable square plastic bag, and after the milk carrier 600 is filled with milk, the thickness of the top portion of the milk carrier gradually increases toward the bottom portion of the milk carrier, the thickness of the milk carrier from the middle portion to the bottom portion of the milk carrier is substantially constant, and the milk carrier is flat with a height greater than the thickness of the milk carrier. Furthermore, the breast milk carrier 600 may also be a breast milk bottle or a breast milk box or the like.

In one embodiment, referring to fig. 8-14, the inner container 300 includes a thermally conductive shell 310. The heat-conductive housing 310 is provided with a cavity 311 for accommodating the mother milk carrier 600, and one of inner sidewalls of the heat-conductive housing 310 is formed with a first convex hull 312. The first convex hull 312 and the other inner sidewall of the heat-conducting shell 310 are respectively attached to two opposite outer sidewalls of the milk carrier 600.

Foretell inner bag 300, put into the cavity 311 after encapsulating the breast milk carrier 600 of the full breast milk of splendid attire, two relative lateral walls of breast milk carrier 600 laminate mutually with the inside wall of heat conduction casing 310 respectively, be the face-to-face contact between breast milk carrier 600 and the heat conduction casing 310, avoid having the air of low coefficient of heat conductivity between breast milk carrier 600 and the heat conduction casing 310, be favorable to heat conduction casing 310 to transmit cold volume for breast milk carrier 600 to realize high-efficient cold volume conduction, so can realize fast that the temperature with breast milk carrier 600 reduces, the cooling effect of breast milk carrier 600 is better. In addition, when the temperature sensor and the breast milk carrier 600 are respectively attached to the outer side wall and the inner side wall of the heat-conducting shell 310, the temperature sensor can more accurately sense the temperature of the breast milk carrier 600.

Further, referring to fig. 8 to 10, a second convex hull 313 is formed on another inner sidewall of the heat conductive housing 310. The second convex hull 313 is opposite to the first convex hull 312, and the first convex hull 312 and the second convex hull 313 are respectively attached to two opposite outer sidewalls of the breast milk carrier 600. Therefore, on one hand, the first convex hull 312 and the second convex hull 313 are respectively attached to two opposite outer side walls of the breast milk carrier 600, the surface surfaces are in close contact fit, the contact area is large, the thermal conduction resistance from the heat conduction shell 310 to the breast milk is reduced, and the cold conduction is facilitated; on the other hand, the inner side wall of the heat conducting shell 310 is locally convex inwards, so that the distance between the convex part and the shell 400 (filled with heat insulating materials) is relatively increased, and the heat leakage between the inner container 300 and the outside is reduced; in addition, the inner sidewall of the heat conductive housing 310 is partially protruded inward to increase the mechanical strength of the wall surface, so that the deformation of the inner container 300 caused by the foaming process of the heat insulating material filled in the outside thereof can be reduced.

Further, referring to fig. 8 to 10, an opening 314 communicating with the cavity 311 is formed at the top of the heat conducting shell 310. The end surface of the first convex hull 312 facing the opening 314 is a smooth guiding surface 315, and the end surface of the second convex hull 313 facing the opening 314 is a smooth guiding surface 315. In this way, in the process that the milk carrier 600 is put into the cavity 311 through the opening 314, the smooth guide surface 315 plays a guiding role, which is beneficial for the milk carrier 600 to slide into the space between the first convex hull 312 and the second convex hull 313, and when the milk carrier 600 slides into the space between the first convex hull 312 and the second convex hull 313, the first convex hull 312 and the second convex hull 313 are respectively closely attached to two side walls of the milk carrier 600, so that the good cold guiding to the milk carrier 600 is realized.

In one embodiment, referring to fig. 8 to 10, the first convex hull 312 is located in the middle of one inner sidewall of the heat conductive shell 310, and the second convex hull 313 is located in the middle of the other inner sidewall of the heat conductive shell 310. Thus, a gap is formed between the first convex hull 312 and the bottom wall of the heat conducting shell 310 to form a concave portion; similarly, the second convex hull 313 is spaced apart from the bottom wall of the heat conductive casing 310 to form a concave portion, so that the first convex hull 312 and the second convex hull 313 can guide the cold to the breast milk carrier 600 well, and the materials of the inner container 300 can be reduced as much as possible, thereby reducing the weight.

As an alternative, referring to fig. 11, only the first convex hull 312 or only the second convex hull 313 is disposed on the inner sidewall of the heat conductive housing 310.

As an alternative, referring to fig. 12, the first convex hull 312 and the second convex hull 313 extend to the bottom wall of the heat conductive shell 310.

In one embodiment, the wall of the first convex hull 312A distance D from the wall surface of the second convex hull 313₁Is not more than the distance D between two opposite outer side walls of the breast milk carrier 600 filled with breast milk when naturally placed₀。

Further, a distance D between the wall surface of the first convex hull 312 and the wall surface of the second convex hull 313₁A distance D between two opposite outer side walls of the breast milk carrier 600 containing full breast milk when naturally placed₀Satisfies the relationship: d ═ D₀-D₁Wherein, Delta d is 2mm to 3 mm. Furthermore, D₁50mm and the height H of the thermally conductive housing 310 is 105 mm.

In one embodiment, more than two milk carriers 600 containing full milk are installed in the heat-conducting shell 310, and the milk carriers 600 are sequentially arranged along the first convex hull 312. Thus, more than two breast milk carriers 600 are placed in rows in the heat-conducting shell 310 and carried by the heat-conducting shell 310, so that more than two breast milk carriers 600 can be carried; in addition, two opposite outer side walls of more than two breast milk carriers 600 are respectively tightly attached to the first convex hull 312 and the second convex hull 313, and the first convex hull 312 and the second convex hull 313 can realize that cold energy is better and synchronously transmitted to more than two breast milk carriers 600, can realize the cooling treatment of more than two breast milk carriers 600, and can also realize that the temperature of more than two breast milk carriers 600 is maintained at a preset temperature.

In one embodiment, referring to fig. 13 and 14, a detachable temperature equalizing plate 320 is disposed in the heat conducting casing 310. Specifically, the temperature-equalizing plate 320 is a metal temperature-equalizing plate 320, which may be a copper plate or an aluminum plate, for example, and has a good thermal conductivity. The vapor plate 320 can separate more than two milk carriers 600 in the chamber 311 from each other. Contacts the milk carrier 600 while separating adjacent milk carriers 600 within the thermally conductive housing 310 from one another. When the inner side walls of the temperature equalizing plate 320 and the heat conducting shell 310 are in contact with the breast milk carrier 600, cold can be quickly transferred to breast milk in the breast milk carrier 600. In addition, after the temperature equalizing plate 320 in the heat conducting shell 310 is removed, the milk carrier 600 with larger capacity can be loaded into the heat conducting shell 310 for cooling and storage and transportation, that is, the milk carrier 600 with larger capacity can be cooled and stored and transported.

Further, the bottom of the vapor chamber 320 is connected to the bottom wall of the heat conductive housing 310. Part of cold energy of the heat conduction shell 310 is conducted to the temperature equalizing plate 320 through the bottom wall of the heat conduction shell, and then the cold energy is conducted to the breast milk carrier 600 contacted with the heat equalizing plate 320 through the temperature equalizing plate 320, so that a good cooling effect on the breast milk carrier 600 is achieved, and the temperature equalizing performance is good.

In addition, the temperature-equalizing plate 320 may be, for example, a straight-line-shaped temperature-equalizing plate 320, and when 4 breast milk carriers 600 filled with breast milk are placed in the cavity 311 of the heat-conducting casing 310, the temperature-equalizing plate 320 is placed in the middle of the cavity 311, 2 breast milk carriers 600 filled with breast milk are placed between one side surface of the temperature-equalizing plate 320 and the first convex hull 312, and the remaining 2 breast milk carriers 600 filled with breast milk are placed between the other side surface of the temperature-equalizing plate 320 and the second convex hull 313. Thus, two opposite outer side walls of 2 breast milk carriers 600 are respectively contacted with one side surface of the temperature equalizing plate 320 and the surface of the first convex hull 312; two opposite outer side walls of the other 2 breast milk carriers 600 are respectively in contact with the other side surface of the temperature equalizing plate 320 and the surface of the second convex hull 313, so that the heat conducting shell 310 can well transmit cold to the breast milk carriers 600, and the temperature equalizing performance is good.

In addition, the temperature-uniforming plate 320 may also be, for example, a cross-shaped temperature-uniforming plate 320, when, for example, 4 breast milk carriers 600 filled with breast milk are placed in the cavity 311 of the heat-conducting casing 310, the temperature-uniforming plate 320 is placed in the cavity 311, the bottom of the temperature-uniforming plate 320 is in contact with the bottom wall of the heat-conducting casing 310, the temperature-uniforming plate 320 can realize mutual isolation of the 4 breast milk carriers 600, one part of the side wall of the breast milk carrier 600 is in surface-to-surface contact with the inner side wall of the heat-conducting casing 310, and the other part of the side wall of the breast milk carrier 600 is in surface-to-surface contact with the temperature-uniforming plate 320, so that.

In one embodiment, the heat conducting shell 310 is formed by stretching aluminum. Specifically, the stretching width D is first determined₁Ratio to the drawing depth H

For example, 2.5 to 2.6, the soft aluminum plate is stretched to form the main body of the heat conductive housing 310, and then the two opposite inner sidewalls of the main body are stretched to form the first convex hull 312 and the second convex hull 313. Thus, the heat conductive housing 310 has good heat conductivity, and can reduce the cooling energy conduction loss on the inner container 300 as much as possible.

As an alternative, the heat-conducting shell 310 is formed by welding a plurality of heat-conducting metal blocks. Specific examples of the heat conductive metal block include a copper block and an aluminum block. The thermal conductivity of the thermal conductive case 310 integrally formed by stretching aluminum is better than that of the thermal conductive case 310 formed by, for example, tailor welding aluminum or copper.

When the mother is not around the baby, such as when the mother normally goes to work or works after parturition and the like, and the baby cannot be fed next to the body, the breast milk refrigerating device can ensure that the temperature of the breast milk in the breast milk carrier 600 is in a constant temperature range in the whole process from extrusion, storage and transportation to feeding, so as to ensure that the breast milk is in an optimal temperature range, and further ensure the nutrition and safety of the breast milk.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A thin efficient heat dissipation mechanism, comprising:

the radiator comprises a first end face and a second end face which are oppositely arranged, and the first end face is used for being in contact with the hot end face of the semiconductor refrigerator; and

and the air outlet surface of the heat radiation fan faces the second end surface and is obliquely arranged relative to the first end surface.

2. The thin and efficient heat dissipation mechanism as claimed in claim 1, wherein the heat sink comprises a heat dissipation plate and a plurality of fin plates disposed on the heat dissipation plate at intervals, and the heat dissipation plate is configured to contact the hot end surface.

3. The thin type efficient heat dissipation mechanism of claim 2, wherein a side of the fin plate facing away from the heat dissipation plate is an oblique side inclined with respect to a plate surface of the heat dissipation plate, and the oblique side is in contact with an air outlet surface of the heat dissipation fan.

4. The thin efficient heat dissipation mechanism of claim 1, further comprising a support, a power supply and a control board, wherein the heat sink, the heat dissipation fan, the power supply and the control board are all mounted on the support, the power supply is electrically connected to the control board, and the control board is electrically connected to the heat dissipation fan.

5. The thin efficient heat dissipation mechanism as claimed in claim 4, further comprising a protective cover, wherein the protective cover is mounted on the support, the control board is located in the protective cover, and the protective cover is provided with a plurality of first ventilation openings.

6. The thin and efficient heat dissipation mechanism as claimed in claim 4, wherein the power source and the control board are respectively located at two sides of the heat dissipation fan.

7. The thin efficient heat dissipation mechanism according to any one of claims 4 to 6, further comprising a bottom cover, wherein the heat sink, the heat dissipation fan, the power supply, the control board and the bracket are all disposed in the bottom cover, and a main ventilation opening corresponding to an air inlet end of the heat dissipation fan is disposed on a bottom wall of the bottom cover; and a plurality of second ventilation openings are formed in the side wall of the bottom cover.

8. The thin efficient heat dissipation mechanism as claimed in claim 7, wherein the bottom of the bottom cover is provided with a plurality of anti-slip pads.

9. A breast milk refrigerating device is characterized by comprising the thin efficient heat dissipation mechanism as claimed in any one of claims 1 to 8, and further comprising an inner container, a shell, a semiconductor refrigerator and a cold guide block; the inner container is provided with a cavity for accommodating a breast milk carrier; the inner container is arranged in the shell; the semiconductor refrigerator comprises a cold end face and a hot end face, the cold end face is in contact with the cold guide block, the cold guide block is in contact with the outer side wall of the inner container, and the first end face is in contact with the hot end face of the semiconductor refrigerator.

10. The breast milk refrigerating device of claim 9, wherein the inner container is provided with an opening communicated with the cavity, the housing comprises an openable cover body, a lining is arranged on the end face of the cover body, a boss is arranged on the lining, the outer side wall of the boss is a conical surface, and the inner side face of the opening of the housing is a concave face matched with the conical surface.