CN210458392U - A tape transport device for electroplate - Google Patents
A tape transport device for electroplate Download PDFInfo
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- CN210458392U CN210458392U CN201920256979.7U CN201920256979U CN210458392U CN 210458392 U CN210458392 U CN 210458392U CN 201920256979 U CN201920256979 U CN 201920256979U CN 210458392 U CN210458392 U CN 210458392U
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- tape transport
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Abstract
The utility model discloses a tape transport device for electroplate, it is used for carrying the copper film to the plating bath with electroplating device cooperation, and it is including unreeling unit, at least a set of tape transport unit, rolling unit, the control unit, unreel unit, at least a set of tape transport unit, rolling unit and arrange in proper order, the control unit is connected with unreeling unit and rolling unit respectively and is used for adjusting the tape transport speed and the tension value of copper film in electroplating device, like this, the utility model discloses a control unit, unreel unit and rolling unit can unreel unit and rolling unit according to the concentration of electrolyte in the plating bath, real-time adjustment to adjustment tape transport speed, thereby obtain the cladding material that thickness is even.
Description
Technical Field
The utility model belongs to the technical field of electroplate device, concretely relates to tape transport device for electroplate.
Background
Electroplating processes are widely used in various fields, and are also used in the manufacture of circuit boards, semiconductor chips, LED conductive substrates, and semiconductor packages, in addition to the conventional surface treatment methods. The electroplating is to immerse the workpiece in the ion solution containing electroplating metal, to electrically connect the power source with the cathode and the anode (consumable or non-consumable) in the electroplating bath, and to deposit a metal film on the surface of the workpiece after DC power is applied to the anode and the workpiece.
The electroplating can prevent metal oxidation (such as corrosion), improve the wear resistance, conductivity, reflectivity, corrosion resistance (such as copper sulfate) and beautify appearance, and the like, and through electroplating, decorative protective and various functional surface layers can be obtained on mechanical products, and workpieces with abrasion and processing errors can be repaired, and the electroplating quality is directly influenced by the quality of an electroplating device.
The thickness uniformity of the plating layer is an important index for evaluating the electroplating efficiency; factors affecting the thickness uniformity can be roughly classified into two types, physical and chemical, including the surface shape and surface area of the workpiece to be plated, the temperature of the plating solution, the mixing properties of the plating solution, the distance between electrodes, whether a shield is used, the material of the electrodes, and the like; the latter includes plating solution composition and concentration, additive type, etc.; particularly, the synergistic effect of the concentration of the electrolyte and the travelling speed directly affects the thickness of the coating, and in the prior art, the travelling speed cannot be adjusted in real time according to the change of the concentration of the electrolyte, so that the electrolyte layer is not uniform.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide a tape deck for electroplating.
The technical scheme of the utility model is realized like this:
the embodiment of the utility model provides a tape transport device for electroplate, it is used for carrying the copper film to the plating bath with electroplating device cooperation, and it is including unreeling unit, at least a set of tape transport unit, rolling unit, the control unit, unreel unit, at least a set of tape transport unit, rolling unit and arrange in proper order, the control unit is connected with unreeling unit and rolling unit respectively and is used for adjusting the tape transport speed and the tension value of copper film in electroplating device.
In the above scheme, the unreeling unit comprises a copper film unreeling unit, an unreeling tension detection roller set and an unreeling servo motor, wherein the unreeling tension detection roller set and the unreeling servo motor are both connected with the control unit and used for transmitting the tape speed and the tension value of the copper film when the copper film is unreeled to the control unit.
In the above scheme, the rolling unit includes copper film rolling, rolling tension detection roller set and rolling servo motor all are connected with the control unit, be used for to the control unit conveys the tape transport speed and the tension value of copper film when the rolling.
In the above scheme, the at least one set of belt units includes four sets, and the four sets of belt units correspond to four electroplating baths.
In the scheme, the tape transport unit comprises lower liquid rollers, conductive roller sets and conductive cathode plates, the lower liquid rollers are arranged in corresponding electroplating baths, and the conductive roller sets, the conductive cathode plates and the lower liquid rollers of each tape transport unit are sequentially arranged to form tape transport gaps of copper films to be electroplated.
In the above scheme, the device further comprises a cleaning unit, wherein the cleaning unit is arranged on one side of at least one group of the tape transport units close to the winding unit.
In the above scheme, the device further comprises a drying unit, wherein the drying unit is arranged between the tape conveying unit and the winding unit.
Compared with the prior art, the embodiment of the utility model provides a tape transport device for electroplate, it is used for carrying the copper film to the plating bath with electroplating device cooperation, and it is including unreeling unit, at least a set of tape transport unit, rolling unit, the control unit, unreel unit, at least a set of tape transport unit, rolling unit and arrange in proper order, the control unit is connected with unreeling unit and rolling unit respectively and is used for adjusting the tape transport speed and the tension value of copper film in electroplating device, like this, the utility model discloses a control unit, unreel unit and rolling unit can be according to the concentration of electrolyte in the plating bath, and real-time adjustment unreels unit and rolling unit to adjustment tape transport speed, thereby obtain the cladding material that thickness is even.
Drawings
FIG. 1 is a schematic structural view of a deck for electroplating according to an embodiment of the present invention.
The reference numbers are as follows:
1-unwinding unit, 11-copper film unwinding, 12-unwinding tension detection roller set, 2-belt conveying unit, 21-submerged roller, 22-conductive roller set, 23-conductive cathode plate, 3-winding unit, 31-copper film winding, 32-winding tension detection roller set, 4-cleaning unit, 5-drying unit and 6-electroplating bath.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The embodiment of the utility model provides a tape transport device for electroplate, as shown in fig. 1, it is used for carrying the copper film to the plating bath with electroplating device cooperation, and it is including unreeling unit 1, at least a set of tape transport unit 2, rolling unit 3, the control unit, unreel unit 1, at least a set of tape transport unit 2, rolling unit 3 and arrange in proper order, the control unit is connected the tape transport speed and the tension value that are used for adjusting the copper film in electroplating device with unreeling unit 1 and rolling unit 3 respectively.
The utility model discloses a control unit, unreel unit and rolling unit, can adjust in real time according to the concentration of electrolyte in the plating bath and unreel unit and rolling unit to the speed of taking is walked in the adjustment, thereby obtains the even cladding material of thickness.
Wherein, at least one group of the belt units 2 comprises four groups, and the four groups of the belt units 2 correspond to four electroplating baths 6.
The tape transport unit 2 comprises lower liquid rollers 21, a conductive roller group 22 and a conductive cathode plate 23, the lower liquid rollers 21 are arranged in the corresponding electroplating baths 6, and the conductive roller group 22, the conductive cathode plate 23 and the lower liquid rollers 21 of each group of the tape transport unit 2 are sequentially arranged to form a tape transport gap of a copper film to be electroplated.
Specifically, the electroplating process is totally divided into four groups of electroplating parts, four groups of belt units 2 are arranged corresponding to the electroplating parts, specifically, a first belt unit, a second belt unit, a third belt unit and a fourth belt unit are sequentially arranged, each belt unit 2 is provided with a conductive roller group 22 with different currents and conductive cathode plates 23 with different thicknesses corresponding to each group of electroplating baths 6, a copper film is tightly attached to each conductive roller of the conductive roller group 22 in the belt moving process, and wrap angles of the front surface and the back surface of the copper film opposite to the conductive rollers are consistent; the positive current is transmitted to the copper film through the conducting roller group 22, so that equal positive ions are accumulated on the front surface and the back surface of the copper film, the conducting negative plate 23 is connected with the current negative electrode, the electroplating solution is prepared electrolyte containing equal negative ion concentration, the current trend is the copper film → the electrolyte → the cathode conducting plate after the power is connected, and meanwhile, the negative ions in the electrolyte are accumulated in the copper film to finish the electroplating process.
The unwinding unit 1 and the winding unit 3 are arranged to control the tension of winding and unwinding so as to keep the speed and the tension of a belt in the copper film electroplating process constant;
wherein, unreel unit 1 and include that the copper film unreels 11, unreel tension and detect roller set 12 and unreel servo motor, it all is connected with the control unit with unreel servo motor to unreel tension and detect roller set 12, be used for to the control unit conveys the speed of walking of copper film when unreeling and tension value.
Wherein, rolling unit 3 includes copper film rolling 31, rolling tension detection roller set 32 and rolling servo motor all are connected with the control unit, be used for to the control unit conveys the tape transport speed and the tension value of copper film when the rolling.
Specifically, through the real-time detection feedback of the unwinding tension detection roller group 12 and the winding tension detection roller group 32 on the tension in the copper film tape running process, the control unit can accurately control the change of the rotating speed of the unwinding servo motor, and the change of the rotating speed of the winding servo motor in turn accurately controls the tension value in the copper film tape running process, and the whole process is automatically controlled in a closed loop manner, so that the control unit automatically adjusts and controls the tension value and the tape running in the copper film tape running process within the process requirement range according to the preset tape running speed and the preset tension value of the copper film.
In addition, the preset travelling speed and tension value of the copper film are adjusted according to the concentration of the electrolyte, and when the decrease of the concentration of electrolyte ions is detected, the control unit automatically adjusts the travelling speed, so that the staying time of the copper film in the electrolyte is prolonged, and the aim of ensuring the thickness of an electroplated layer to be consistent is finally fulfilled;
the adjustment of the electroplating current is also a mode for controlling the thickness of the electroplated layer, when the ion concentration sensor detects that the ion concentration in the electrolyte is reduced, the control unit automatically adjusts the size of the electroplating current, and finally the consistency of the thickness of the electroplated layer is achieved; the two adjusting modes can be used independently or in combination, so that the thickness of the electroplated layer from the beginning to the end of the same coil material in the whole electroplating process is uniform and stable.
The cleaning device further comprises a cleaning unit 4, wherein the cleaning unit 4 is arranged between the third belt unit and the fourth belt unit, and the cleaning unit 4 is a cleaning and spraying device.
The device also comprises a drying unit 5, wherein the drying unit 5 is arranged between the tape conveying unit 2 and the winding unit 3.
To sum up, the embodiment of the utility model provides a tape transport device for electroplate, it is used for carrying the copper film to the plating bath with electroplating device cooperation, and it is including unreeling unit, at least a set of tape transport unit, rolling unit, the control unit, unreel unit, at least a set of tape transport unit, rolling unit and arrange in proper order, the control unit is connected with unreeling unit and rolling unit respectively and is used for adjusting the tape transport speed and the tension value of copper film in electroplating device, like this, the utility model discloses a control unit, unreel unit and rolling unit can unreel unit and rolling unit according to the concentration of electrolyte in the plating bath, real-time adjustment to the adjustment tape transport speed to obtain the cladding material that thickness is even.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention.
Claims (7)
1. The tape transport device for electroplating is characterized by being matched with an electroplating device and used for conveying a copper film to an electroplating bath, and comprising an unreeling unit, at least one group of tape transport units, a reeling unit and a control unit, wherein the unreeling unit, the at least one group of tape transport units and the reeling unit are sequentially arranged, and the control unit is respectively connected with the unreeling unit and the reeling unit and used for adjusting the tape transport speed and the tension value of the copper film in the electroplating device.
2. The tape transport device for electroplating according to claim 1, wherein the unwinding unit comprises a copper film unwinding unit, an unwinding tension detection roller set and an unwinding servo motor, and the unwinding tension detection roller set and the unwinding servo motor are both connected with the control unit and are used for transmitting the tape transport speed and the tension value of the copper film during unwinding to the control unit.
3. The belt conveying device for electroplating according to claim 1, wherein the winding unit comprises a copper film winding unit, a winding tension detection roller set and a winding servo motor, and the winding tension detection roller set and the winding servo motor are both connected with the control unit and used for conveying the belt conveying speed and the tension value of the copper film during winding to the control unit.
4. The deck device for plating according to claim 1, wherein said at least one deck unit comprises four sets, and said four sets of deck units correspond to four plating tanks.
5. The apparatus as claimed in claim 4, wherein the belt unit comprises a submerged roller, a conductive roller set and a conductive cathode plate, the submerged roller is disposed in the corresponding plating tank, and the conductive roller set, the conductive cathode plate and the submerged roller of each belt unit are sequentially arranged to form a belt gap of the copper film to be plated.
6. A tape deck for plating according to any one of claims 1 to 5, further comprising a cleaning unit provided on a side of at least one set of tape deck units adjacent to the take-up unit.
7. A tape deck for electroplating according to claim 6, further comprising a drying unit disposed between the tape deck and the take-up unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920256979.7U CN210458392U (en) | 2019-02-28 | 2019-02-28 | A tape transport device for electroplate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920256979.7U CN210458392U (en) | 2019-02-28 | 2019-02-28 | A tape transport device for electroplate |
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| Publication Number | Publication Date |
|---|---|
| CN210458392U true CN210458392U (en) | 2020-05-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920256979.7U Active CN210458392U (en) | 2019-02-28 | 2019-02-28 | A tape transport device for electroplate |
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| CN (1) | CN210458392U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024082493A1 (en) * | 2022-10-19 | 2024-04-25 | 重庆金美新材料科技有限公司 | Cathode conductive mechanism, and electroplating system |
-
2019
- 2019-02-28 CN CN201920256979.7U patent/CN210458392U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024082493A1 (en) * | 2022-10-19 | 2024-04-25 | 重庆金美新材料科技有限公司 | Cathode conductive mechanism, and electroplating system |
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Effective date of registration: 20220909 Address after: Room 101, No. 3, Xingyihui Industrial Park, Tianliao Community, Yutang Street, Guangming District, Shenzhen, Guangdong 518107 Patentee after: ADVANCED PRECISION TECHNOLOGY Co.,Ltd. Address before: Room A304, No. 2, Longgang Tianan Digital Innovation Park, No. 441, Huangge Road, Longcheng Street, Longgang District, Shenzhen, Guangdong 518000 Patentee before: SHENZHEN HUIMEI NEW TECHNOLOGY CO.,LTD. |