CN210319515U - Integrated LED lamp strip - Google Patents
Integrated LED lamp strip Download PDFInfo
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- CN210319515U CN210319515U CN201921368565.XU CN201921368565U CN210319515U CN 210319515 U CN210319515 U CN 210319515U CN 201921368565 U CN201921368565 U CN 201921368565U CN 210319515 U CN210319515 U CN 210319515U
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- insulating
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Abstract
The utility model discloses an integrated LED lamp belt, which comprises a plurality of circuit boards, wherein each circuit board is provided with a bonding pad, the integrated LED lamp belt also comprises a wire guide plate, the wire guide plate comprises a wire and an insulating layer, the insulating layer wraps the wire, and gaps are arranged on the insulating layer at intervals; the circuit board is placed on the insulating layer, and the pad and the lead are welded together at the notch. High-speed automatic processing can be realized; the processing difficulty of the wire guide plate is low, and the cost for realizing automatic investment is low. The utility model also provides a manufacturing approach of integrated form LED lamp area, this manufacturing approach realizes automated manufacturing with low costs. The utility model relates to a lamp area field.
Description
Technical Field
The utility model belongs to the technical field of the LED illumination and specifically relates to a design LED flexible light strip.
Background
The LED flexible high-voltage lamp strip is divided into a non-conducting wire lamp strip and a conducting wire lamp strip at present.
At present, the material cost of the lamp belt with the wire is low, the style is diversified and flexible, the individualized requirements of consumers can be met, but the key process in the production process flow, namely the splicing of the light source plate, cannot realize the automatic production, only can be operated manually, needs a large amount of labor force, has low labor efficiency, and has unstable product quality due to the manual operation. And relatively, "no wire" lamp area can realize the automation, but its material cost is high, and the input cost of production facility is high.
The current process flow of the lamp strip with the conducting wire is as follows: the first step is as follows: pasting, namely pasting the LED particles of the light-emitting element and the resistor on the flexible circuit board; meanwhile, conducting wire encapsulation, namely wrapping molten plastics on 2 or more wires through an extruder to prepare 1 wire belt, wherein the wires are insulated from each other and are provided with open rectangular grooves for supporting and fixing the patch flexible circuit board; the second step is that: two ends of the flexible circuit board are welded with leads, and for a circuit board with the length of 0.5 meter, two 0.5 meter boards are spliced into a board with the length of 1 meter, and the length of each flexible circuit board is 1 meter; the third step: the 'plug lamp panel' and the 'punch parallel connection' are used for completing the splicing of the patch flexible circuit board and the lead belt. The 'plug lamp plate' is to plug the patch flexible circuit board into the rectangular groove of the conductor strip, the leads at the two ends are placed outside the rectangular groove, and the 'parallel connection' is to connect the leads at the two ends of the patch flexible circuit board with the conductor on the conductor strip. At certain intervals, splicing the lower 1 light source plates on the wire belt by the same method, and splicing a plurality of light source plates on the 1 wire belt according to requirements, thereby preparing a semi-finished product; the fourth step: and (4) encapsulating the finished product, namely wrapping the insulating outer layer outside the semi-finished product prepared in the third step by using molten plastic through an extruder.
In the process flow of the wire lamp strip, the third step of plugging the lamp plate and connecting the lamp plate in parallel is complex in operation, automatic production cannot be realized, and a large amount of labor force is needed. In addition, due to manual operation, in the process of plugging the lamp panel, the intervals among the flexible circuit boards are difficult to ensure to be uniform, and the sizes of the parallel ports are different; in the 'parallel connection' procedure, the connection between the lead and the power supply lead is not very reliable, and the non-electrified state is easy to cause the product quality problem.
In the current process flow of the wire-free lamp strip, a flexible circuit board and a wire are spliced into a whole in advance, namely a wire-free circuit board, a semi-finished product of the lamp strip is manufactured after the wire-free circuit board is pasted, and then the semi-finished product is encapsulated to manufacture the finished product of the lamp strip. The process flow is simple, automatic operation can be carried out, the labor productivity is high, but the circuit board made of the main material is a circuit board without a lead, dozens of meters or even one hundred meters is continuously molded during manufacturing, in order to meet the precision required by finished products, the precision requirement on the flexible circuit board and the chip mounter is very high, a plurality of tool and die clamps are required, the cost of required raw materials is high, and the input cost of production equipment is high, so that the integral cost of the circuit board without the lead is high; in addition, the tooling and die clamps are required to be manufactured again when the style of the product is changed, the investment cost is high, the style is limited, and the diversified requirements of consumers cannot be met.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is: the utility model provides an integrated form LED lamp area, its simple structure, with low costs, the steady quality is reliable, and the product style is nimble various, and the while production simple process can carry out automated production, and the personnel selection is few, a novel LED flexible lamp area product that productivity ratio is high.
The utility model provides a solution of its technical problem is:
an integrated LED lamp strip comprises a plurality of circuit boards, LED particles and resistor patches are arranged on the circuit boards, each circuit board is provided with a bonding pad, each bonding pad is provided with a through hole, the integrated LED lamp strip also comprises a wire guide plate, each wire guide plate comprises a wire and an insulating layer, each insulating layer wraps the corresponding wire, and gaps are formed in the insulating layers at intervals; the circuit board is placed on the insulating layer, and the pad and the lead are welded together at the notch.
The utility model has the advantages that: compared with a wire-contained lamp strip, the integrated LED lamp strip has the advantages that the circuit board and the wire board are conducted through the soldering tin at the through hole of the bonding pad, the complex processes of 'lamp plugging plate' and 'parallel connection' are replaced, and high-speed automatic processing can be realized; compared with a wire-free lamp strip, the circuit board is arranged on the insulating layer in units; when the conducting wire and the insulating layer are continuously formed, the conducting wire and the insulating layer have no positioning requirement in the length direction, the processing difficulty of the conducting wire plate is low, and the cost of realizing automatic investment is low.
The bonding pad is communicated with the built-in circuit of the circuit board and serves as a power supply access point of the circuit. The circuit board and the lead plate are connected by welding through the through holes and the leads; besides, an external insulating shell can be additionally arranged for wrapping, or a circuit board and an insulating layer are connected together in a gluing mode.
The conducting wire is one of the following three, or two of the following three in combination. The first wire is a columnar wire bundle formed by winding a plurality of metal wires, the second wire is a flat ribbon formed by weaving a plurality of metal wires, and the third wire is a flat copper foil or a flat copper-clad aluminum foil. The material of the multi-strand metal wires of the first and second conducting wires can be copper, or copper-plated zinc, or copper-plated nickel; aluminum may also be used, but it is desirable to coat or plate the outer surface with a layer of a solder-susceptible metal, such as zinc, nickel, etc.
As a further improvement of the integrated LED strip, a through hole is formed in the pad, and a solder bump is disposed in the through hole and connects the pad and the wire. The through hole is formed in the bonding pad, so that the molten solder can be guided into the bonding pad by melting the solder above the through hole, flows to the lead exposed at the notch below the bonding pad, and forms a solder block after cooling, thereby realizing the conduction between the bonding pad and the lead. The solder mass may be a tin mass or a mass formed by melting a conventional solder and then cooling the solder. By adopting the structure, the conductive connection between the bonding pad and the lead can be simply and conveniently realized.
As a further improvement of the above integrated LED strip, the circuit board is attached to the insulating layer. The circuit board and the insulating layer can be partially attached, or the whole circuit board and the insulating layer are completely attached. The adhering mode may be specifically adhering with a double-sided tape, or brushing glue on the insulating layer. The two attaching modes are adopted to connect the two, so that the material cost is low, and the process is simple.
As a further improvement of the above integrated LED strip, the insulating layer includes a plurality of unit insulating layers, the unit insulating layers are disposed at intervals, and a gap is formed between adjacent unit insulating layers. The unit insulating layers are spaced to form gaps when being wrapped, so that the process of machining the gaps is not required to be additionally added, the machining process of the lamp strip is more simplified, and the production cost is lower.
As a further improvement of the above-mentioned integrated LED strip, each of the unit insulating layers includes two layers of insulating plastic films, and the wires are wrapped between the two layers of insulating plastic films. The material of the insulating plastic film is preferably PVC, PE, PI or PET. The mode of adopting insulating plastic film parcel, it has the advantage of processing portably.
As a further improvement of the above integrated LED strip, in the two layers of insulating plastic films: one layer of the insulating plastic film is flat, and the flat insulating plastic film is attached to the circuit board.
As a further improvement of the integrated LED light strip, the wire is made of copper foil, or a cylindrical wire bundle formed by winding multiple metal wires, or a ribbon formed by weaving multiple metal wires.
As a further improvement of the above-mentioned integrated LED strip, the insulating layer is an injection molded body. The insulating layer is formed by injection molding.
Drawings
In order to more clearly illustrate the technical solution in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is clear that the described figures represent only some embodiments of the invention, not all embodiments, and that a person skilled in the art can also derive other designs and figures from these figures without inventive effort.
FIG. 1 is a first structural schematic diagram of a "wired" LED flexible light strip;
fig. 2 is a structural schematic diagram two of the LED flexible light strip with wires;
fig. 3 is a first schematic structural diagram of the present invention;
FIG. 4 is a second schematic structural view of the present invention;
FIG. 5 is a schematic view of the flexible circuit board assembly after the mounting of the present invention;
FIG. 6 is a schematic structural view of the circuit board after the chip mounting of the present invention;
FIG. 7 is a first schematic view of a flexible wire splice plate according to the manufacturing method of the present invention;
fig. 8 is a schematic diagram of a flexible conductor board structure according to an embodiment of the present invention;
FIG. 9 is a schematic view of the flexible circuit board and the flexible wire board being assembled together according to the method of the present invention;
fig. 10 is embodiment 1 of the wire guide plate of the present invention;
fig. 11 is embodiment 2 of the wire guide plate of the present invention;
fig. 12 is embodiment 3 of the wire guide plate of the present invention;
fig. 13 is embodiment 4 of the wire guide plate of the present invention;
fig. 14 shows an embodiment 5 of the wire guide plate of the present invention.
In the drawings: 1-an insulating housing; 2-a circuit board; 211-a solder mass; 22-LED particles; 23-resistance; 3-a wire guide plate; 21-a through hole; 31-a cell insulating layer; 32-a wire; 321-a columnar wire harness; 322-a flat ribbon; 323-Flat copper foil.
Detailed Description
The conception, the specific structure, and the technical effects produced by the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the features, and the effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and other embodiments obtained by those skilled in the art without inventive labor based on the embodiments of the present invention all belong to the protection scope of the present invention. In addition, all the connections or connection relationships mentioned herein are not directly connected to each other, but rather, the connection configurations may be better combined by adding or subtracting connection accessories according to the specific implementation. The utility model provides an each technical feature can the interactive combination under the prerequisite of conflict each other.
The embodiments are described in detail below with reference to fig. 3-14.
Referring to fig. 3, 4, 7 and 8, the integrated LED lamp strip includes a plurality of circuit boards 2, each circuit board 2 is 0.5 meter or 1 meter in length, a lamp bead and a resistor 23 are attached to each circuit board 2, and pads are disposed at two ends of each circuit board 2; the integrated LED lamp strip further comprises a wire guide plate 3, wherein the wire guide plate 3 comprises two or more wires 32 and an insulating layer, the wires 32 are wrapped in the insulating layer, and gaps are formed in the insulating layer at intervals; the circuit board 2 is arranged on the insulating layer at intervals, and the through hole 21 is arranged above the lead 32 at the gap of the insulating layer; the solder of the through-hole 21 and the corresponding wire 32 are soldered together at the notch. The pad is communicated with the built-in circuit of the circuit board 2 and is used as a power supply access point of the circuit. The circuit board 2 and the lead plate 3 are connected by soldering through the through hole 21 and the lead 32. Besides, an external insulating shell 1 can be additionally arranged for wrapping.
Compared with a wire lamp strip, the circuit board 2 and the wire board 3 are conducted through soldering tin at the welding pad, complex processes of 'plug lamp board' and 'parallel connection' are replaced, and high-speed automatic processing can be realized; compare "no wire" lamp area, because circuit board 2 becomes to set up on the insulating layer of wire guide plate 3 with uniting, the wire guide plate 3 processing degree of difficulty is low, realizes that the cost of automatic input is low.
Referring to fig. 10-14, the wire 32 is one of the following three, or a combination of two thereof. The first wire 32 is a cylindrical wire bundle 321 formed by winding a plurality of wires, the second wire 32 is a flat ribbon 322 formed by weaving a plurality of wires, and the third wire 32 is a flat copper foil 323 or a flat copper-clad aluminum foil. The first and second wires 32 are made of copper, or copper-plated zinc, or copper-plated nickel; aluminum may also be used, but it is desirable to coat or plate the outer surface with a layer of a solder-susceptible metal, such as zinc, nickel, etc. The flat band-shaped body 322 or the columnar wiring harness 321 woven by adopting a plurality of metal wires has larger conductive area, can keep better flexibility and avoid the finished product lamp strip from being broken when being repeatedly bent. Each wire 32 may be wrapped with two layers of insulating plastic or formed by injection molding or extrusion.
As a further improvement of the embodiment of the integrated LED strip, the circuit board 2 is attached to the insulating layer.
Referring to fig. 6, in another embodiment of the integrated LED strip, through holes 21 are provided on the pads, solder bumps 211 are provided in the through holes 21, and the solder bumps 211 conduct the pads and the wires 32. The pad is provided with a through hole 21, so that the molten solder can be introduced into the pad by melting the solder above the through hole 21, flows to the lead 32 exposed at the notch under the pad, and forms a solder block 211 after cooling, thereby realizing the conduction between the pad and the lead 32. The solder mass 211 may be a solder mass or other solder commonly used to form solder masses 211 by melting and then cooling. With this structure, the conductive connection of the pad and the wire 32 can be easily achieved.
In another embodiment of the integrated LED strip, the insulating layer includes a plurality of unit insulating layers 31, the length of the unit insulating layers 31 is shorter than that of the circuit board 2, the unit insulating layers 31 are arranged at intervals, and gaps are formed between adjacent unit insulating layers 31. The gaps are reserved between the unit layers during wrapping to form the notches, so that the process of machining the notches is not required to be additionally added, the machining process of the lamp strip is more simplified, and the production cost is lower.
As a further improvement to the above-described embodiment of an integrated LED strip, the insulating layer comprises two layers of insulating plastic films, and the wires 32 are wrapped between the two layers of insulating plastic films. The two layers of insulating plastic films are fused and fixed with the middle lead 32 under heating and pressurizing, so that the plastic films and the lead 32 are integrated; one side of the insulating layer is flat and the other side forms a partial bump due to the shape of the wire 32. The material of the insulating plastic film is preferably PVC, PE, PI or PET. The mode of adopting insulating plastic film parcel, it has the advantage of processing portably.
As a further improvement of the above embodiment of the integrated LED strip, the insulating layer is an injection molded body. The insulating layer is formed on the surface of the wire 32 by means of segmented injection molding, and gaps are formed among the segments.
A manufacturing method of an LED flexible lamp strip comprises the following steps:
step 1.1): referring to fig. 5, flexible circuit tile patch: each flexible circuit jointed board comprises a plurality of circuit boards 2 which are arranged side by side, bonding pads are arranged at two ends of each circuit board 2, and through holes 21 are formed in the bonding pads; the light-emitting element LED particles 22 and the resistors 23 are pasted on each circuit board 2, and each unit of the flexible circuit jointed board is precut before pasting, so that the flexible circuit jointed board is convenient to divide the board;
step 1.2): manufacturing a flexible wire splicing plate: each flexible lead jointed board comprises a plurality of parallel lead boards 3, the number of the parallel lead boards is the same as that of the circuit board 2, the width of the circuit board 2 is the same as that of the jointed board of the lead 32, the length of each flexible lead jointed board is equal to or slightly greater than that of the jointed board of the circuit board 2, each lead board 3 comprises a lead 32 and an insulating layer, the lead 32 is wrapped in the insulating layer, the insulating layer comprises a plurality of spaced unit insulating layers 31, gaps are arranged between the unit insulating layers 31, the lead 32 is exposed at the gaps, and each lead board 3 on each flexible lead jointed board is precut so as to be convenient for board splitting;
step 2): and gluing the back surface of the flexible circuit jointed board after the chip is pasted on the flexible lead jointed board, enabling the through hole 21 of the circuit jointed board to be opposite to the exposed lead 32 of the flexible lead jointed board, and soldering tin at the through hole 21 to connect the flexible circuit jointed board and the flexible lead jointed board. A circuit board 2 is correspondingly glued on each unit insulating layer 31 included in each conductor plate 3 on the flexible conductor jointed plate to form a plurality of flexible circuit jointed plates and conductor plate 3 combined bodies;
the circuit board 2 and the wire board 3 are conducted by soldering tin on the welding disc, the process of 'plugging the lamp panel, connecting in parallel' and the like which consume a large amount of manpower is not needed, and high-speed automatic processing is easy to realize.
Step 3): dividing the assembly formed in the step 2), i.e. dividing the assembly into a plurality of combined strips of the patch circuit board 2 and the flexible lead plate 3, as shown in fig. 9;
step 4): and 3) combining the surface mounted circuit board 2 and the flexible conductor board 3 to form the strip, and coating the outside of the strip with molten plastic by using an extruder to form the insulating shell 1, thereby finishing the production of the strip product.
As a further improvement of the above manufacturing method, in step 1): the unit insulating layer 31 comprises two insulating plastic films which are combined in a hot pressing mode and wrap the lead 32 positioned between the two insulating plastic films; the adjacent unit insulating layers 31 are spaced apart to form a gap.
This form mode of processing of breach need not additionally to add the process of processing breach, and the process of this lamp area is more retrencied, and manufacturing cost is lower.
While the preferred embodiments of the present invention have been described in detail, it will be understood by those skilled in the art that the foregoing and various other changes, omissions and deviations in the form and detail thereof may be made without departing from the scope of this invention.
Claims (8)
1. The utility model provides an integrated form LED lamp area, includes a plurality of circuit boards, and LED granule and resistance paster are in on the circuit board, every all be equipped with pad, its characterized in that on the circuit board: the wire guide plate comprises a wire and an insulating layer, wherein the insulating layer wraps the wire, and gaps are formed in the insulating layer at intervals; the circuit board is placed on the insulating layer, and the pad and the lead are welded together at the notch.
2. An integrated LED strip as claimed in claim 1, wherein: the solder pad is provided with a through hole, a solder block is arranged in the through hole, and the solder block conducts the solder pad and the lead.
3. An integrated LED strip as claimed in claim 1, wherein: the circuit board is attached to the insulating layer.
4. An integrated LED strip as claimed in claim 1, wherein: the insulating layer comprises a plurality of unit insulating layers, the unit insulating layers are arranged at intervals, and gaps are formed between every two adjacent unit insulating layers.
5. An integrated LED strip as claimed in claim 4, wherein: each unit insulating layer comprises two layers of insulating plastic films, and the conducting wires are wrapped between the two layers of insulating plastic films.
6. An integrated LED strip as claimed in claim 5, wherein: two layers of insulating plastic films: one layer of the insulating plastic film is flat, and the flat insulating plastic film is attached to the circuit board.
7. An integrated LED strip as claimed in claim 1, wherein: the insulating layer is an injection molding body.
8. An integrated LED strip as claimed in claim 1, wherein: the lead is copper foil, or a columnar wiring harness formed by winding a plurality of metal wires, or a band-shaped body formed by weaving a plurality of metal wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921368565.XU CN210319515U (en) | 2019-08-20 | 2019-08-20 | Integrated LED lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921368565.XU CN210319515U (en) | 2019-08-20 | 2019-08-20 | Integrated LED lamp strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210319515U true CN210319515U (en) | 2020-04-14 |
Family
ID=70130954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921368565.XU Active CN210319515U (en) | 2019-08-20 | 2019-08-20 | Integrated LED lamp strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210319515U (en) |
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2019
- 2019-08-20 CN CN201921368565.XU patent/CN210319515U/en active Active
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