CN210274684U - Heat dissipation type circuit board - Google Patents
Heat dissipation type circuit board Download PDFInfo
- Publication number
- CN210274684U CN210274684U CN201920968305.XU CN201920968305U CN210274684U CN 210274684 U CN210274684 U CN 210274684U CN 201920968305 U CN201920968305 U CN 201920968305U CN 210274684 U CN210274684 U CN 210274684U
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- CN
- China
- Prior art keywords
- heat dissipation
- circuit board
- heat
- conducting layer
- type circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 56
- 230000005540 biological transmission Effects 0.000 claims abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 238000009423 ventilation Methods 0.000 claims description 7
- 229920000728 polyester Polymers 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000003973 paint Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000001737 promoting effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 244000144992 flock Species 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation type circuit board, including the circuit board, a circuit board side surface is provided with the heat-conducting layer, and the mutual symmetry in heat-conducting layer four corners is provided with four groups of conducting strips, and heat-conducting layer middle part fixed mounting has the heat dissipation shell, is provided with the radiator in the heat dissipation shell, and the radiator includes impeller and motor, and the motor vertical fixation is on the heat-conducting layer, and the output shaft of motor is connected with the inside input transmission of impeller. The utility model discloses a motor of installation drives impeller, conducting strip, the triple cooling system of heat-conducting layer can be quick in time discharge the circuit board heat, improve the life of circuit board, simple structure, the heat dissipation of being convenient for, the cost of manufacture is low, is fit for promoting and popularizing.
Description
Technical Field
The utility model relates to a circuit board field, a concretely designs heat dissipation type circuit board.
Background
The circuit board is an important element in an electric appliance, is small enough to electronic components such as an electronic watch, a calculator and computer communication electronic equipment, and the circuit board is used for electrical interconnection among the electronic components. In recent years, electronic technology has been rapidly advanced, electronic devices have become more precise, and particularly, in the case of miniaturization and densification of electronic components, the use effect of components mounted on a circuit board is affected if the heat dissipation treatment of the circuit board is not good because the heat generated by the electronic components is more and more. The traditional heat dissipation mode is generally to set up the heating panel on the base plate of circuit board, takes away the heat of base plate through the heating panel heat conduction, but if the base plate generates heat for a long time, especially in hot summer, the radiating effect still is relatively poor, influences the normal use of components and parts very easily.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a following technical scheme:
the utility model provides a heat dissipation type circuit board, includes the circuit board, circuit board side surface is provided with the heat-conducting layer, the mutual symmetry in heat-conducting layer four corners is provided with four groups of conducting strips, heat-conducting layer middle part fixed mounting has the heat dissipation shell, be provided with the radiator in the heat dissipation shell, the radiator includes impeller and motor, the motor vertical fixation is on the heat-conducting layer, the output shaft of motor is connected with the inside input transmission of impeller.
Preferably, four groups of vent holes are symmetrically formed around the radiating shell.
Preferably, a breathable film is arranged in the ventilation hole.
Preferably, a convex ring for installing the breathable film is arranged in the ventilation hole, and the breathable film is fixedly bonded on the convex ring.
Preferably, two breathable films are arranged in each ventilation hole, the breathable films are respectively bonded on the left side face and the right side face of the convex ring, and the two breathable films are semicircular and are arranged on the convex ring in a staggered mode.
Preferably, the heat conduction layer is a heat conduction polyester coating layer.
Preferably, the heat dissipation casing is provided with at least one heat dissipation hole penetrating through the surface right above the impeller.
Preferably, the heat dissipation shell is made of metal.
Preferably, a filter screen is arranged at the joint of the external air outlet of the heat dissipation hole and the top surface of the heat dissipation shell.
Preferably, the cross sections of the heat dissipation holes and the vent holes are circular and/or rectangular, heat dissipation fins are fixedly installed at the tops of the four groups of heat conduction fins through heat conduction silica gel, and the type of the heat conduction fin 3 is a C2405-6P2062 semiconductor heat conduction fin.
The utility model has the advantages that
(1) The utility model discloses a set up the heat-conducting layer, the heat-conducting layer can improve the heat dispersion of circuit board, at circuit board during operation, can play supplementary radiating function, avoids the circuit board overheat phenomenon to appear, has reduced the fault rate of circuit board, has improved the security performance of circuit board when using simultaneously.
(2) The utility model discloses a four group's conducting strip of installation, the heat with the inside effluvium of circuit board that can be quick is replaced, leads the radiating fin who makes the aluminum alloy to further discharge the heat through heat conduction silica gel.
(3) The utility model discloses a motor drive impeller of installation, conducting strip, the triple cooling system of heat-conducting layer can be quick in time discharge the circuit board heat, improve the life of circuit board.
(4) The utility model discloses simple structure, the heat dissipation of being convenient for, the cost of manufacture is low, is fit for promoting and popularizing.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic view of the interior of the heat dissipation housing.
Fig. 3 is an enlarged view of the vent hole.
Description of reference numerals: 1-circuit board, 2-heat conducting layer, 3-heat conducting sheet, 4-heat radiating silica gel, 5-heat conducting fin, 6-heat radiating shell, 7-vent hole, 71-convex ring, 72-air permeable membrane, 8-motor, 9-impeller, 10-heat radiating hole and 11-filter screen.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
Referring to fig. 1 to 3, a heat dissipation type circuit board includes a circuit board 1, a heat conduction layer 2 is disposed on a surface of one side of the circuit board 1, the heat conduction layer 2 is a heat conduction polyester coating layer, the heat conduction layer 2 can improve heat dissipation performance of the circuit board 1, when the circuit board 1 works, the heat conduction layer can play a role of assisting heat dissipation, avoid overheating of the circuit board 1, reduce failure rate of the circuit board 1, and improve safety performance of the circuit board 1 in use, the heat conduction polyester coating layer is formed by uniformly coating a heat conduction polyester coating, the heat conduction polyurethane has very excellent adhesion, heat conductivity and curing performance, and a heat conduction coefficient reaches 2.2W/(m.k), so that the heat conduction coating is a currently known heat conduction coating with very excellent performance, and can achieve a very good heat conduction effect; four groups of heat conducting fins 3 are symmetrically arranged at four corners of the heat conducting layer 2, heat radiating fins 5 are fixedly arranged at the tops of the four groups of heat conducting fins 3 through heat conducting silica gel 4, the heat conducting fins 2 can quickly replace heat radiated from the inside of the circuit board 1, and the heat is guided to the heat radiating fins 5 made of aluminum alloy through the heat conducting silica gel 4 to be discharged; a heat dissipation shell 6 is fixedly arranged in the middle of the heat conduction layer 2, and the heat dissipation shell 6 is made of metal materials which are convenient for heat conduction; four groups of vent holes 7 are symmetrically arranged around the heat dissipation shell 6, the cross section of each vent hole 7 is circular, a breathable film 72 is arranged in each vent hole 7, the breathable films 72 can prevent impurities such as dust from entering the circuit board 1 through the vent holes 7 and protect the circuit board 1, a convex ring 71 used for installing the breathable films 72 is arranged in each vent hole 7, the breathable films 72 are fixedly bonded on the convex ring 71, two breathable films 72 are arranged in each vent hole 7, the breathable films 72 are respectively bonded on the left side surface and the right side surface of the convex ring 71, the two breathable films 72 are semicircular and are arranged on the convex ring 71 in a staggered manner, the breathable films 72 are conveniently installed, the fixation of the breathable films 72 and the vent holes 7 can be stably realized, the breathable films 72 are prevented from falling out of the vent holes 7 in use, and the reliability of the whole circuit board 1 in use is improved, the breathable films 72 are arranged in a semicircular shape and are arranged in the vent holes 7 in a staggered mode, so that the circulation speed of airflow in the vent holes 7 can be guaranteed; a radiator is arranged in the radiating shell 6 and comprises an impeller 9 and a motor 8, the motor 8 is vertically fixed on the heat conducting layer 2, an output shaft of the motor 8 is in transmission connection with an internal input end of the impeller 9, and the motor 8 drives the impeller 9 to rotate so as to quickly discharge heat on the circuit board 1 in time; the heat dissipation casing 6 is provided with at least one heat dissipation hole 10 through the surface right above the impeller 9, the heat dissipation hole 10 is circular, and the heat dissipation hole 10 is further convenient for improving the heat dissipation efficiency of the circuit board 1.
Example 2
Referring to fig. 1 to fig. 3, the present embodiment is further optimized based on embodiment 1, specifically, a filter screen 11 is welded at a joint between an external air outlet of the heat dissipation hole 10 and a top surface of the heat dissipation housing 6.
This embodiment is through setting up filter screen 11, and it is inside to prevent that outside flock and the dust of large granule from entering into heat dissipation shell 6, and then reduces the life to motor 8.
Principle of operation
The utility model relates to a heat dissipation type circuit board, each part subsection is shown in fig. 1-fig. 3, during the use, set up heat-conducting layer 2 in the 1 outside of circuit board, can directly contact with circuit board 1, play fine guide to the heat, earlier further play the thermal discharge to circuit board 1, four group's conducting strip 3 through the installation, can be quick replace the heat of the inside effluvium of circuit board 1, further discharge the heat through radiating fin 5 that heat-conducting silica gel 4 led to the aluminum alloy and made, drive the timely discharge of the heat of the inside effluvium of impeller 9 with circuit board 1 through starter motor 8, motor 8 through the installation drives impeller 9, conducting strip 3, the triple cooling system of heat-conducting layer 2 can be quick in time discharge the heat of circuit board 1, improve circuit board 1's life.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (10)
1. The utility model provides a heat dissipation type circuit board, its characterized in that, includes circuit board (1), circuit board (1) side surface is provided with heat-conducting layer (2), the mutual symmetry in heat-conducting layer (2) four corners is provided with four groups of conducting strip (3), heat-conducting layer (2) middle part fixed mounting has heat dissipation shell (6), be provided with the radiator in heat dissipation shell (6), the radiator includes impeller (9) and motor (8), motor (8) vertical fixation is on heat-conducting layer (2), the output shaft of motor (8) is connected with the inside input transmission of impeller (9).
2. The heat dissipation type circuit board of claim 1, wherein four sets of vent holes (7) are symmetrically formed around the heat dissipation housing (6).
3. A heat dissipation circuit board according to claim 2, wherein a gas permeable membrane (72) is disposed in the ventilation hole (7).
4. The heat dissipation type circuit board according to claim 3, wherein a protruding ring (71) for installing a gas permeable membrane (72) is disposed in the ventilation hole (7), and the gas permeable membrane (72) is bonded and fixed on the protruding ring (71).
5. The heat dissipation circuit board according to claim 4, wherein two air permeable films (72) are disposed in each of the ventilation holes (7), the air permeable films (72) are respectively bonded to the left and right sides of the protruding ring (71), and the two air permeable films (72) are semicircular and are alternately disposed on the protruding ring (71).
6. A heat dissipation circuit board according to claim 1, wherein the heat conductive layer (2) is a heat conductive polyester paint layer.
7. The heat dissipation type circuit board according to claim 1, wherein the heat dissipation housing (6) has at least one heat dissipation hole (10) formed through a surface thereof directly above the impeller (9).
8. The heat dissipation type circuit board according to claim 7, wherein the heat dissipation housing (6) is made of metal.
9. The heat dissipation type circuit board according to claim 8, wherein a filter (11) is disposed at the junction between the external air outlet of the heat dissipation hole (10) and the top surface of the heat dissipation housing (6).
10. The heat dissipation type circuit board of claim 9, wherein the cross sections of the heat dissipation holes (10) and the ventilation holes (7) are circular and/or rectangular, and the top of the four sets of heat conduction fins (3) are fixedly provided with heat dissipation fins (5) through heat conduction silica gel (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920968305.XU CN210274684U (en) | 2019-06-26 | 2019-06-26 | Heat dissipation type circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920968305.XU CN210274684U (en) | 2019-06-26 | 2019-06-26 | Heat dissipation type circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210274684U true CN210274684U (en) | 2020-04-07 |
Family
ID=70044934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920968305.XU Expired - Fee Related CN210274684U (en) | 2019-06-26 | 2019-06-26 | Heat dissipation type circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210274684U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112584607A (en) * | 2020-12-06 | 2021-03-30 | 无锡英诺赛思科技有限公司 | Gallium nitride semiconductor device |
-
2019
- 2019-06-26 CN CN201920968305.XU patent/CN210274684U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112584607A (en) * | 2020-12-06 | 2021-03-30 | 无锡英诺赛思科技有限公司 | Gallium nitride semiconductor device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200407 |