CN219938816U - Heat exchange fin evenly distributed radiator - Google Patents
Heat exchange fin evenly distributed radiator Download PDFInfo
- Publication number
- CN219938816U CN219938816U CN202320992641.4U CN202320992641U CN219938816U CN 219938816 U CN219938816 U CN 219938816U CN 202320992641 U CN202320992641 U CN 202320992641U CN 219938816 U CN219938816 U CN 219938816U
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- Prior art keywords
- shell
- heat exchange
- exchange fin
- fins
- connector
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- 238000000034 method Methods 0.000 claims abstract description 6
- 238000001816 cooling Methods 0.000 claims description 11
- 238000004891 communication Methods 0.000 claims description 9
- 238000009827 uniform distribution Methods 0.000 claims 8
- 239000000428 dust Substances 0.000 abstract description 15
- 230000000694 effects Effects 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 238000005192 partition Methods 0.000 description 7
- 230000005855 radiation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model belongs to the technical field of radiators, and particularly relates to a radiator with uniformly distributed heat exchange fins. The method is characterized in that: the heat exchange fan is arranged between the shell and the heat exchange fin assembly. The heat exchange fin assembly comprises a plurality of fins, each fin is vertically arranged along the direction of the shell, and the fins are distributed in an annular array. The circuit board is placed in the shell, heat generated by the circuit board is transferred to the shell, the heat of the shell is then transferred to the heat exchange fin assembly, the heat dissipation fan blows to the heat exchange fin assembly, air beside the fins on the heat exchange fin assembly flows, the heat of the fins is transferred to the air faster, the heat dissipation effect is enhanced, meanwhile, the circuit board is arranged in the shell, dust is prevented from entering the circuit board, a certain waterproof effect is achieved, and the circuit board is prevented from being contacted with water to generate a short circuit.
Description
Technical Field
The utility model belongs to the technical field of radiators, and particularly relates to a radiator with uniformly distributed heat exchange fins.
Background
The circuit board plays an important role in mass production of the circuit and optimizing the layout of the electrical appliances, and is combined together according to related processes through a pressing procedure to form the high-current circuit board with characteristics. The existing high-current circuit board is lack of a necessary dustproof device, and external dust can directly enter the circuit board, so that short circuit and damage of internal elements of the circuit board can be caused. Therefore, a dust cover is covered on the circuit board to prevent dust from adhering to the circuit board, but the traditional high-current circuit board structure is single, a large amount of heat can be generated by the circuit board in work, after the dust cover is covered, the heat dissipation effect inside the circuit board is poorer, and the circuit board cannot be effectively dissipated, so that the working state of the circuit board is affected.
Chinese patent literature publication No.: CN213214104U discloses a multi-functional heavy current circuit board, including dustproof shell and circuit board body, the top fixed mounting of dustproof shell has the heat dissipation fan, the below fixed mounting of dustproof shell has the circuit board body, the left side fixed mounting on circuit board body top has the interface, the right side fixed mounting of interface has the chip, the right side fixed mounting of chip has the heating panel, the right side fixed mounting of heating panel has the battery, the top fixed mounting of heat dissipation fan has the louvre, the below fixed mounting of heat dissipation fan has micro motor, the left side fixed mounting of micro motor has the bolt, the bottom fixed mounting of bolt has the sealing strip, the bottom fixed mounting of sealing strip has the connecting plate, the inside fixed mounting of heat dissipation fan has the backup pad, the right side fixed mounting of backup pad has the bracing piece, the below fixed mounting of bracing piece has the dust screen panel. In this scheme, add a radiator fan in the dirt proof boot, utilize the radiator fan to dispel the heat to the inside heat that produces of circuit board, but in this scheme, the dust can see through the radiator fan and enter into in the dirt proof boot, and the dust adheres to on the circuit board, influences the life of circuit board.
Disclosure of Invention
The utility model aims to provide a heat exchange fin uniformly-distributed radiator, and aims to solve the technical problems that a circuit board in the prior art is generally covered with a dust cover for dust prevention, and after the dust cover is covered with the dust cover, the heat dissipation effect inside the circuit board is poorer, and the circuit board cannot be effectively cooled, so that the working state of the circuit board is influenced.
In order to achieve the above object, the heat exchanger fin uniformly distributed radiator provided by the embodiment of the utility model comprises a shell and a radiator fan, wherein the shell is used for loading a circuit board, and the radiator fan is arranged on one side of the shell. The method is characterized in that: the heat exchange fan is arranged between the shell and the heat exchange fin assembly. The heat exchange fin assembly comprises a plurality of fins, each fin is vertically arranged along the direction of the shell, and the fins are distributed in an annular array. One end of the fin is connected with the cooling fan, and the other end of the fin is connected with the shell.
Further, the heat exchange fin assembly is provided with 64 fins, and the included angle between the fins is 5.625 degrees.
Further, each fin is provided with a die drawing angle, and the die drawing angle is unilateral 1 degree. One side of the fin connected with the cooling fan is coarser than one side of the fin connected with the shell.
Further, 4 mounting holes are formed in one side of the shell, and connectors are arranged on the mounting holes.
Further, each connector is respectively an MCU connector, a direct current connector, a communication connector and an output connector. And the MCU connector, the direct current connector, the communication connector and the output connector are all electrically connected with the circuit board.
Further, the lower surface of the shell is provided with a louver vent hole.
Further, the side end of the shell is also provided with a plurality of mounting feet which are used for fixing the shell.
Further, each mounting leg is provided with a positioning hole, and a screw penetrates through the positioning hole to fix the shell.
Further, a partition board is arranged in the shell, the partition board isolates a cavity in the shell, and the cavity is used for placing electronic components.
The above technical solutions in the heat exchange fin uniformly distributed radiator provided by the embodiments of the present utility model have at least one of the following technical effects: the circuit board is placed in the shell, the heat exchange fin component is connected to one side of the shell, the radiator fan is arranged between the shell and the heat exchange fin component, heat generated by the circuit board is transferred to the shell, the heat of the shell is then transferred to the heat exchange fin component, the radiator fan blows to the heat exchange fin component, air beside the fins on the heat exchange fin component flows, the heat of the fins is transferred to the air faster, the radiating effect is enhanced, meanwhile, the circuit board is arranged in the shell, dust is prevented from entering the circuit board, a certain waterproof effect is achieved, and the circuit board is prevented from being contacted with water to generate a short circuit.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a heat exchanger fin uniformly distributed radiator according to an embodiment of the present utility model.
Fig. 2 is a schematic bottom view of a heat exchanger fin uniformly distributed radiator according to an embodiment of the present utility model.
Fig. 3 is a schematic diagram of an internal structure of a heat exchanger fin uniformly distributed radiator according to an embodiment of the present utility model.
Reference numerals: 10. a housing; 11. a circuit board; 13. a connector; 14. an MCU connector; 15. a DC connector; 16. a communication connector; 17. an output connector; 18. a louver vent; 19. a mounting foot; 20. a heat radiation fan; 30. a heat exchange fin assembly; 31. a fin; 40. positioning holes; 41. a partition board.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and intended to illustrate embodiments of the utility model and should not be construed as limiting the utility model.
In the description of the embodiments of the present utility model, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the embodiments of the present utility model and simplify description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present utility model, the meaning of "plurality" is two or more, unless explicitly defined otherwise.
In the embodiments of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and include, for example, either permanently connected, removably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present utility model will be understood by those of ordinary skill in the art according to specific circumstances.
In one embodiment of the present utility model, referring to fig. 1 to 3, there is provided a heat sink having heat exchanging fins 31 uniformly distributed, including a housing 10 for loading a circuit board 11 and a heat dissipating fan disposed at one side of the housing 10. The method is characterized in that: the heat exchange fin assembly 30 is arranged on the top surface of the shell 10, and the cooling fan is arranged between the shell 10 and the heat exchange fin assembly 30. The heat exchange fin assembly 30 comprises a plurality of fins 31, each fin 31 is vertically arranged along the direction of the shell 10, and the fins 31 are arranged in an annular array. One end of the fin 31 is connected to the heat radiation fan, and the other end is connected to the housing 10. In this embodiment, the circuit board 11 is placed in the casing 10, the heat exchange fin assembly 30 is connected to one side of the casing 10, and meanwhile, the radiator fan is arranged between the casing 10 and the heat exchange fin assembly 30, heat generated by the circuit board 11 is transferred to the casing 10, and then transferred to the heat exchange fin assembly 30, and the radiator fan blows to the heat exchange fin assembly 30 to accelerate air flow beside the fins 31 on the heat exchange fin assembly 30, so that heat of the fins 31 is transferred to the air more quickly, the radiating effect is enhanced, meanwhile, dust is prevented from entering the circuit board 11 due to the fact that the circuit board 11 is arranged in the casing 10, and the circuit board 11 is prevented from being in contact with water to generate a short circuit due to a certain waterproof effect.
Specifically, referring to fig. 1 to 3, the heat exchange fin assembly 30 is provided with 64 fins 31, and the included angle between the fins 31 is 5.625 degrees. In this embodiment, the heat exchange fin assembly 30 is provided with 64 fins 31, the included angle between the fins 31 is 5.625 degrees, the 64 fins 31 can accelerate the heat transfer from the housing 10 to the fins 31, meanwhile, the fins 31 are uniformly distributed, the included angle between the fins 31 is 5.625 degrees, so that the too small included angle between the fins 31 is avoided, and the ventilation is not facilitated.
Specifically, referring to fig. 1 to 3, each fin 31 is provided with a draft angle of 1 degree on one side. The side of the fin 31 to which the heat radiation fan is attached is coarser than the side of the fin 31 to which the housing 10 is attached. In this embodiment, the fins 31 are provided with a drawing angle, and one side of the fins 31 connected with the cooling fan is coarser than one side of the fins 31 connected with the housing 10, so as to play a guiding role, and enable the air to flow along the drawing direction of the fins 31 under the driving of the cooling fan, so that the air after heat exchange on the fins 31 flows to the periphery of the housing 10 rapidly, and the cooling rate is accelerated.
Specifically, referring to fig. 1 to 3, 4 mounting holes are provided in one side of the housing 10, and a connector 13 is provided in each mounting hole. In the present embodiment, 4 mounting holes are provided on one side of the housing 10, and connectors 13 are provided on each mounting hole, and each connector 13 is used for connecting to the circuit board 11 in the housing 10.
Specifically, referring to fig. 1 to 3, each connector 13 is an MCU connector 14, a dc connector 15, a communication connector 16, and an output connector 17, respectively. And the MCU connector 14, the dc connector 15, the communication connector 16 and the output connector 17 are electrically connected to the circuit board 11. In the present embodiment, the connectors 13 are an MCU connector 14, a dc connector 15, a communication connector 16, and an output connector 17, respectively. And the MCU connector 14, the dc connector 15, the communication connector 16 and the output connector 17 are connected to the circuit board 11 in the housing 10 through the connectors 13.
Specifically, referring to fig. 1 to 3, the lower surface of the housing 10 is provided with louver vents 18. In this embodiment, the louver vents 18 are disposed on the lower surface of the housing 10, so that the heat dissipation rate of the circuit board 11 can be increased, and the louver vents 18 can also well isolate dust from entering the housing 10.
Specifically, referring to fig. 1 to 3, the side end of the housing 10 is further provided with a plurality of mounting pins 19, and the mounting pins 19 are used for fixing the housing 10. In this embodiment, the side end of the housing 10 is further provided with a plurality of mounting pins 19, and the housing 10 is fixed by the mounting pins 19, so as to facilitate the installation of the housing 10.
Specifically, referring to fig. 1 to 3, each mounting leg 19 is provided with a positioning hole 40, and a screw passes through the positioning hole 40 to fix the housing 10. In this embodiment, each mounting leg 19 is provided with a positioning hole 40, and a screw passes through the positioning hole 40 to fix the housing 10, so as to facilitate the mounting of the housing 10.
Specifically, referring to fig. 1 to 3, a partition 41 is provided in the housing 10, and the partition 41 partitions the housing 10 into a cavity for accommodating the electronic component. In this embodiment, the partition 41 isolates a cavity in the housing 10 for placing the electronic component, and the circuit board 11 is isolated from the electronic component in the cavity to avoid short circuit.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (9)
1. The heat exchange fin uniformly distributed radiator comprises a shell and a cooling fan, wherein the shell is used for loading a circuit board, and the cooling fan is arranged on one side of the shell; the method is characterized in that: the heat exchange fin assembly is arranged on the top surface of the shell, and the cooling fan is positioned between the shell and the heat exchange fin assembly; the heat exchange fin assembly comprises a plurality of fins, each fin is vertically arranged along the direction of the shell, and the fins are distributed in an annular array; one end of the fin is connected with the cooling fan, and the other end of the fin is connected with the shell.
2. The heat exchange fin uniform distribution radiator according to claim 1, wherein: the heat exchange fin assembly is provided with 64 fins, and the included angle between the fins is 5.625 degrees.
3. The heat exchange fin uniform distribution radiator according to claim 1, wherein: each fin is provided with a drawing angle, and the drawing angle is unilateral 1 degree; one side of the fin connected with the cooling fan is thicker than one side of the fin connected with the shell.
4. A heat exchange fin uniform distribution radiator according to any one of claims 1 to 3, wherein: one side of the shell is provided with 4 mounting holes, and each mounting hole is provided with a connector.
5. The heat exchange fin uniform distribution radiator according to claim 4, wherein: each connector is an MCU connector, a direct current connector, a communication connector and an output connector respectively; and the MCU connector, the direct current connector, the communication connector and the output connector are electrically connected with the circuit board.
6. The heat exchange fin uniform distribution radiator according to claim 1, wherein: the lower surface of the shell is provided with a louver vent hole.
7. The heat exchange fin uniform distribution radiator according to claim 1, wherein: the side end of the shell is also provided with a plurality of mounting feet which are used for fixing the shell.
8. The heat exchange fin uniform distribution radiator according to claim 7, wherein: and each mounting leg is provided with a positioning hole, and a screw penetrates through the positioning hole to fix the shell.
9. The heat exchange fin uniform distribution radiator according to claim 1, wherein: the shell is internally provided with a baffle plate, the baffle plate isolates a cavity in the shell, and the cavity is used for placing electronic elements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320992641.4U CN219938816U (en) | 2023-04-26 | 2023-04-26 | Heat exchange fin evenly distributed radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320992641.4U CN219938816U (en) | 2023-04-26 | 2023-04-26 | Heat exchange fin evenly distributed radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219938816U true CN219938816U (en) | 2023-10-31 |
Family
ID=88494523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320992641.4U Active CN219938816U (en) | 2023-04-26 | 2023-04-26 | Heat exchange fin evenly distributed radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219938816U (en) |
-
2023
- 2023-04-26 CN CN202320992641.4U patent/CN219938816U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |