CN219873444U - Material taking mechanism for silicon wafer film covering machine - Google Patents
Material taking mechanism for silicon wafer film covering machine Download PDFInfo
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- CN219873444U CN219873444U CN202320834356.XU CN202320834356U CN219873444U CN 219873444 U CN219873444 U CN 219873444U CN 202320834356 U CN202320834356 U CN 202320834356U CN 219873444 U CN219873444 U CN 219873444U
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- silicon wafer
- material taking
- assembly
- laminating machine
- fixedly connected
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 72
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 72
- 239000010703 silicon Substances 0.000 title claims abstract description 72
- 239000000463 material Substances 0.000 title claims abstract description 69
- 230000007246 mechanism Effects 0.000 title claims abstract description 32
- 238000010030 laminating Methods 0.000 claims abstract description 18
- 230000005540 biological transmission Effects 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 150000001450 anions Chemical class 0.000 claims 4
- 230000007423 decrease Effects 0.000 claims 1
- 241000252254 Catostomidae Species 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 59
- 150000002500 ions Chemical class 0.000 description 20
- 238000004140 cleaning Methods 0.000 description 12
- 239000012535 impurity Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 230000005611 electricity Effects 0.000 description 6
- 239000007888 film coating Substances 0.000 description 6
- 238000009501 film coating Methods 0.000 description 6
- 230000003068 static effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a material taking mechanism for a silicon wafer film laminating machine, which comprises a moving assembly, wherein one side of the moving assembly is provided with a material taking assembly, the material taking assembly comprises a mounting table, the bottom of the mounting table is fixedly provided with a fixing frame, and the bottom of the fixing frame is fixedly connected with a plurality of suckers. In order to solve the problems that the manual operation material taking efficiency is low and the pollution to the silicon wafer is easy to cause in the prior art, the utility model can adjust the position of the material taking assembly through the arranged moving assembly and the material taking assembly, ensure that the sucker can be aligned to the silicon wafer, ensure that the material taking work can be better carried out, the air pump is matched with the sucker, the silicon wafer is adsorbed and fixed by utilizing negative pressure, the whole material taking work is automatic, the work efficiency is improved, and the pollution caused by manual operation can be avoided.
Description
Technical Field
The utility model relates to the technical field of film coating machines, in particular to a material taking mechanism for a silicon wafer film coating machine.
Background
Silicon wafers, also known as wafers, are fabricated from silicon ingots, and millions of transistors can be etched on a silicon wafer by specialized processes, which are widely used in the fabrication of integrated circuits. After the production of the silicon wafer is completed, the silicon wafer is also required to be subjected to film coating protection by a film coating machine. The laminator is composed of a plurality of parts, wherein the laminator comprises a material taking assembly for taking out the silicon wafer. In the prior art, part of manufacturers adopt manual operation to take materials, so that the efficiency is low and the silicon wafer is easy to pollute.
For example: chinese utility model patent: 201220235936.9, "a silicon wafer loader", the specification of which discloses: in the prior art, manual inserting sheets are adopted to operate in a habit, and the problems of high fragment rate, large pollution to silicon wafers, low efficiency and the like easily occur in the mode. The above patent can be used to demonstrate the drawbacks of the prior art.
We have therefore made improvements to this and have proposed a take-off mechanism for a silicon wafer laminator.
Disclosure of Invention
The utility model aims at: the method aims at solving the problems that the existing manual operation material taking efficiency is low, the silicon wafer is easy to pollute, and the quality of the coating is finally affected.
In order to achieve the above object, the present utility model provides a take-out mechanism for a silicon wafer laminator to improve the above problems.
The utility model is specifically as follows:
the automatic feeding device comprises a moving assembly, wherein a feeding assembly is arranged on one side of the moving assembly, the feeding assembly comprises an installation table, a fixing frame is fixedly installed at the bottom of the installation table, and a plurality of suckers are fixedly connected to the bottom of the fixing frame.
As the preferable technical scheme of the utility model, the moving assembly comprises an X-axis sliding table fixedly arranged at the top end of the supporting frame, a Z-axis sliding table is fixedly connected to a moving platform of the X-axis sliding table, and a mounting frame is fixedly connected to the moving platform of the Z-axis sliding table.
As the preferable technical scheme of the utility model, one end of the support frame far away from the X-axis sliding table is fixedly connected with a base, and a reinforcing plate is fixedly arranged at the joint of the base and the support frame.
As the preferable technical scheme of the utility model, a motor is fixedly arranged in the mounting frame, and an output shaft of the motor penetrates through the mounting frame to be in transmission connection with the material taking assembly.
As the preferable technical scheme of the utility model, air pumps are fixedly arranged at the four end parts of the mounting table, and the air pumps are connected with the sucking disc through pipelines.
As the preferable technical scheme of the utility model, a cleaning component is arranged at the middle position of the bottom of the fixing frame, the cleaning component comprises a machine box, and a fan is fixedly arranged on one side of the machine box, which is close to the mounting table.
As a preferable technical scheme of the utility model, the negative ion generator is fixedly arranged in the machine box, a negative ion output port of the negative ion generator faces the fixing frame, and an air outlet of the fan faces the negative ion generator.
As the preferable technical scheme of the utility model, the inside of the machine box is fixedly connected with a sleeve, a through hole is formed in the sleeve, a sliding ring is sleeved in the sleeve in a sliding manner, a spiral spring is arranged at the top of the sliding ring, and a telescopic pipe is fixedly sleeved at the bottom of the sliding ring.
As the preferable technical scheme of the utility model, one end of the telescopic pipe far away from the slip ring penetrates through the sleeve and is fixedly connected with the guide plate through the conical connecting pipe, the conical connecting pipe is provided with a gas transmission hole, and the outer diameter of the conical connecting pipe gradually reduces from one end close to the guide plate to the outer diameter far away from the guide plate.
As a preferable technical scheme of the utility model, one side of the guide plate, which is close to the telescopic pipe, is provided with a guide groove.
Compared with the prior art, the utility model has the beneficial effects that:
in the scheme of the utility model:
in order to solve the problems of low efficiency of manual operation material taking and easy pollution to silicon wafers in the prior art, the utility model can adjust the position of the material taking component by the moving component and the material taking component, ensure that a sucker can be aligned to the silicon wafers, ensure that material taking work can be better carried out, and an air pump is matched with the sucker to adsorb and fix the silicon wafers by utilizing negative pressure, so that the whole material taking work is automatic, the work efficiency is improved, and pollution caused by manual operation can be avoided;
in order to solve the problems that in the prior art, impurities such as partial particles are adhered to a silicon wafer in the conveying process, and the quality of a coating is difficult to clean and finally affected, the cleaning assembly is arranged, so that the impurities such as the particles adhered to the silicon wafer can be cleaned before adsorbing and taking materials, and meanwhile, static electricity removal treatment can be carried out, and the problem that the quality of the coating is finally affected due to the impurities such as the adhered particles of the silicon wafer is solved.
Drawings
FIG. 1 is a schematic view of a take-out mechanism for a silicon wafer laminator according to the present utility model;
FIG. 2 is a schematic view of a take-out assembly of a take-out mechanism for a silicon wafer laminator in accordance with the present utility model;
FIG. 3 is a schematic view of a take-out assembly of a take-out mechanism for a silicon wafer laminator in accordance with the present utility model;
FIG. 4 is a schematic view of a cleaning assembly of the take-off mechanism for a silicon wafer laminator provided by the utility model;
FIG. 5 is a cross-sectional view of a cassette of the take-out mechanism for a silicon wafer laminator provided by the utility model;
fig. 6 is a schematic structural view of a baffle of the material taking mechanism for a silicon wafer film laminating machine.
The figures indicate:
1. a moving assembly; 101. a support frame; 102. an X-axis sliding table; 103. a Z-axis sliding table; 2. a mounting frame; 3. a material taking assembly; 301. a mounting table; 302. a fixing frame; 303. a suction cup; 304. an air pump; 4. cleaning the assembly; 401. a machine box; 402. a telescopic tube; 403. a deflector; 404. a sleeve; 405. a slip ring; 406. a coil spring; 407. a through hole; 408. a blower; 409. a negative ion generator; 4010. and (5) a conical connecting pipe.
Detailed Description
In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.
As described in the background art, the manual operation is low in material taking efficiency and is easy to pollute the silicon wafer, and impurities such as partial particles are attached in the conveying process, so that the impurities are difficult to clean, and finally the quality of the coating is affected.
In order to solve the technical problem, the utility model provides a material taking mechanism for a silicon wafer film coating machine, which is applied to the material taking mechanism of the silicon wafer film coating machine.
Specifically, referring to fig. 1-6, the material taking mechanism for a silicon wafer film laminating machine specifically includes:
including moving the subassembly 1, one side of moving the subassembly 1 is equipped with gets material subassembly 3, gets material subassembly 3 and includes mount table 301, and the bottom fixed mounting of mount table 301 has mount 302, and the bottom fixedly connected with of mount 302 has a plurality of sucking disc 303.
According to the material taking mechanism for the silicon wafer laminating machine, the movable assembly 1 and the material taking assembly 3 are arranged, the movable assembly 1 operates, so that the material taking assembly 3 can adjust the position of the material taking assembly, the sucker 303 can be aligned to a silicon wafer, the material taking work can be better carried out, the air pump 304 is matched with the sucker 303, the silicon wafer is adsorbed and fixed by utilizing negative pressure, the whole material taking work is automatic, the work efficiency is improved, and pollution caused by manual operation can be avoided;
the cleaning component 4 is arranged, so that impurities such as particles attached to the silicon wafer can be cleaned before the material is taken by adsorption, and meanwhile, static electricity removal treatment can be performed, and the problem that the quality of a film is finally affected due to the impurities such as the attached particles of the silicon wafer is solved.
In order to make the person skilled in the art better understand the solution of the present utility model, the technical solution of the embodiment of the present utility model will be clearly and completely described below with reference to the accompanying drawings.
It should be noted that, under the condition of no conflict, the embodiments of the present utility model and the features and technical solutions in the embodiments may be combined with each other.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
Example 1
Referring to fig. 1-3, a material taking mechanism for a silicon wafer film laminating machine, a moving assembly 1 of the material taking mechanism comprises an X-axis sliding table 102 fixedly installed at the top end of a supporting frame 101, a Z-axis sliding table 103 fixedly connected to a moving platform of the X-axis sliding table 102, the X-axis sliding table 102 operates to drive the Z-axis sliding table 103 to move, a mounting frame 2 is fixedly connected to a moving platform of the Z-axis sliding table 103, and the Z-axis sliding table 103 operates to drive the mounting frame 2 to take the material assembly 3 and lift.
The material taking assembly 3 can adjust the position of the material taking assembly, so that the sucker 303 can be aligned with the silicon wafer, and the material taking work can be better performed.
Referring to fig. 1-3, a base is fixedly connected to one end of a support frame 101, which is far away from an X-axis sliding table 102, of a material taking mechanism for a silicon wafer film laminating machine, and a reinforcing plate is fixedly installed at a joint of the base and the support frame 101.
The structural strength of the joint of the base and the supporting frame 101 is improved.
Referring to fig. 1-3, a material taking mechanism for a silicon wafer film laminating machine is provided, wherein a motor is fixedly installed in a mounting frame 2, an output shaft of the motor penetrates through the mounting frame 2 to be in transmission connection with a material taking assembly 3, and the motor operates to transmit torque to the material taking assembly 3 through the output shaft so as to drive the material taking assembly 3 to perform rotary motion.
The material taking assembly 3 can adjust the position of the material taking assembly, so that the sucker 303 can be aligned with the silicon wafer, and the material taking work can be better performed.
Referring to fig. 1-3, in the material taking mechanism for a silicon wafer film laminating machine, air pumps 304 are fixedly installed at the four end parts of a mounting table 301, the mounting table 301 is in a cross structure, the air pumps 304 are connected with a sucker 303 through pipelines to form an air path, and the air pumps 304 can pump out air in the sucker 303.
The suction cup 303 is attached to the silicon wafer, and the air pump 304 pumps air inside the suction cup 303 to form a negative pressure environment, so that the silicon wafer is adsorbed and fixed by utilizing negative pressure.
Example 2
The material taking mechanism for a silicon wafer film laminating machine provided in embodiment 1 is further optimized, specifically, as shown in fig. 2-3, a cleaning assembly 4 is arranged at the central position of the bottom of the fixing frame 302, the cleaning assembly 4 comprises a machine box 401, a fan 408 is fixedly arranged on one side of the machine box 401 close to the mounting table 301, and the fan 408 operates to enable external air flow to enter the interior of the machine box 401 and finally reach the silicon wafer to clean the silicon wafer.
The surface of the silicon wafer can be cleaned by the air flow.
Further, as shown in fig. 4-5, the negative ion generator 409 is fixedly installed in the machine box 401, the negative ion output port of the negative ion generator 409 faces the fixing frame 302, the air outlet of the fan 408 faces the negative ion generator 409, the negative ion generator 409 generates negative ions, so that the air flow carries the negative ions, the surface of the silicon wafer is cleaned by the air flow, and meanwhile static electricity on the surface of the silicon wafer is eliminated by the negative ions.
Impurities such as particles adsorbed on the surface of the silicon wafer due to static electricity are easier to clean, and the cleaning effect is improved.
Example 3
For further optimization of the material taking mechanism for a silicon wafer film laminating machine provided in embodiment 1 or 2, specifically, as shown in fig. 5, a sleeve 404 is fixedly connected inside a machine box 401, a through hole 407 is formed in the sleeve 404, a sliding ring 405 is sleeved inside the sleeve 404 in a sliding manner, a coil spring 406 is arranged at the top of the sliding ring 405, a telescopic tube 402 is sleeved at the bottom of the sliding ring 405, and an air flow carrying negative ions enters the inside of the sleeve 404 after passing through the through hole 407, and passes through the telescopic tube 402 to reach the outside.
The telescopic tube 402 can be passively telescopic so as to cooperate with the downward displacement action of the material taking assembly 3 during material taking operation.
Further, as shown in fig. 5-6, one end of the telescopic tube 402 far away from the slip ring 405 passes through the sleeve 404 and is fixedly connected with the guide plate 403 through the conical connecting tube 4010, the conical connecting tube 4010 is provided with a gas transmission hole, the outer diameter of the conical connecting tube 4010 from one end close to the guide plate 403 to the end far away from the guide plate 403 is gradually reduced, and the airflow carrying negative ions is diffused by the guide plate 403 after passing through the telescopic tube 402 and the gas transmission hole.
The cleaning range of the air flow can be improved.
Further, as shown in fig. 6, a diversion trench is formed on a side of the diversion plate 403 close to the telescopic tube 402 to direct the air flow.
The silicon wafer will be aligned with the suction cups 303, and the air flow moves along the guide grooves, so that the air flow can be uniformly diffused to the silicon wafer aligned with any group of suction cups 303, and the cleaning work is more suitable.
The use process of the material taking mechanism for the silicon wafer film laminating machine provided by the utility model is as follows:
the X-axis sliding table 102 drives the Z-axis sliding table 103 and the material taking assembly 3 to move when in operation, the Z-axis sliding table 103 drives the material taking assembly 3 to lift when in operation, torque is transmitted to the material taking assembly 3 through an output shaft when in operation, the material taking assembly 3 is driven to rotate so as to adjust the material taking position, the material taking assembly 3 moves downwards when in material taking, meanwhile, the fan 408 operates, external air flow enters the inside of the machine box 401, negative ions are generated by the negative ion generator 409, the air flow carries the negative ions, the negative ions penetrate through the through holes 407, the sleeve 404 and the telescopic pipe 402, reach the guide plate 403 and diffuse along the guide groove, the surface of a silicon wafer is cleaned by the air flow, static electricity on the surface of the silicon wafer is eliminated by the negative ions, impurities such as particles adsorbed on the surface of the silicon wafer due to static electricity are easy to clean, cleaning effect is improved, the sucker 303 is attached to the silicon wafer, the air pump 304 pumps away air in the sucker 303, the silicon wafer is adsorbed and fixed by negative pressure, and finally the material taking is completed through the cooperation of the Z-axis sliding table 103 and the X-axis sliding table 102.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
It is apparent that the above-described embodiments are only some embodiments of the present utility model, but not all embodiments, and the preferred embodiments of the present utility model are shown in the drawings, which do not limit the scope of the patent claims. This utility model may be embodied in many different forms, but rather, embodiments are provided in order to provide a thorough and complete understanding of the present disclosure. Although the utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing description, or equivalents may be substituted for elements thereof. All equivalent structures made by the content of the specification and the drawings of the utility model are directly or indirectly applied to other related technical fields, and are also within the scope of the utility model.
Claims (8)
1. A feeding mechanism for silicon wafer laminating machine, its characterized in that, including moving subassembly (1), one side of moving subassembly (1) is equipped with feeding subassembly (3), feeding subassembly (3) are including mount table (301), the bottom fixed mounting of mount table (301) has mount (302), the bottom fixedly connected with sucking discs (303) of mount (302), the bottom intermediate position department of mount (302) is equipped with clearance subassembly (4), clearance subassembly (4) contain box (401), one side fixed mounting that box (401) is close to mount table (301) has fan (408), the inside fixed mounting of box (401) has anion generator (409), the anion delivery outlet of anion generator (409) is towards mount table (302), the air outlet of fan (408) is towards anion generator (409).
2. The material taking mechanism for a silicon wafer film laminating machine according to claim 1, wherein the moving assembly (1) comprises an X-axis sliding table (102) fixedly installed at the top end of a supporting frame (101), a Z-axis sliding table (103) is fixedly connected to a moving platform of the X-axis sliding table (102), and a mounting frame (2) is fixedly connected to a moving platform of the Z-axis sliding table (103).
3. The material taking mechanism for a silicon wafer film laminating machine according to claim 2, wherein a base is fixedly connected to one end of the support frame (101) far away from the X-axis sliding table (102), and a reinforcing plate is fixedly installed at the joint of the base and the support frame (101).
4. A take-out mechanism for a silicon wafer laminator according to claim 3, wherein a motor is fixedly mounted in the mounting frame (2), and an output shaft of the motor passes through the mounting frame (2) to be in transmission connection with the take-out assembly (3).
5. The material taking mechanism for a silicon wafer film laminating machine according to claim 4, wherein air pumps (304) are fixedly installed at all the end parts of the installation table (301), and the air pumps (304) are connected with sucking discs (303) through pipelines.
6. The material taking mechanism for a silicon wafer film laminating machine according to claim 5, wherein a sleeve (404) is fixedly connected to the inside of the machine box (401), a through hole (407) is formed in the sleeve (404), a slip ring (405) is sleeved in the sleeve (404) in a sliding manner, a spiral spring (406) is arranged at the top of the slip ring (405), and a telescopic tube (402) is fixedly sleeved at the bottom of the slip ring (405).
7. The material taking mechanism for a silicon wafer film laminating machine according to claim 6, wherein one end of the telescopic tube (402) far away from the slip ring (405) penetrates through the sleeve (404) and is fixedly connected with the guide plate (403) through a conical connecting tube (4010), a gas transmission hole is formed in the conical connecting tube (4010), and the outer diameter of the conical connecting tube (4010) gradually decreases from one end close to the guide plate (403) to the outer diameter far away from the guide plate (403).
8. The extracting mechanism for a silicon wafer film laminating machine according to claim 7, wherein a diversion trench is formed on one side of the diversion plate (403) close to the telescopic pipe (402).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320834356.XU CN219873444U (en) | 2023-04-14 | 2023-04-14 | Material taking mechanism for silicon wafer film covering machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320834356.XU CN219873444U (en) | 2023-04-14 | 2023-04-14 | Material taking mechanism for silicon wafer film covering machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219873444U true CN219873444U (en) | 2023-10-20 |
Family
ID=88319889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320834356.XU Active CN219873444U (en) | 2023-04-14 | 2023-04-14 | Material taking mechanism for silicon wafer film covering machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219873444U (en) |
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2023
- 2023-04-14 CN CN202320834356.XU patent/CN219873444U/en active Active
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