CN219574291U - Wafer suspension test disc and device - Google Patents

Abstract

The utility model discloses a wafer suspension test disc and a device, and relates to the technical field of wafer testing. The method is used for solving the technical problem that the wafer is easy to damage when Kelvin four-wire detection is carried out on the wafer in the prior art, so that the quality of a corresponding product is affected. The test disc comprises a disc body, the disc body comprises a first surface and a second surface which are oppositely arranged, a placing groove and a hollowed hole are formed in the first surface, orthographic projection of the hollowed hole on the second surface is located in orthographic projection of the placing groove on the second surface, the placing groove is used for placing a wafer, and the hollowed hole is used for exposing a test part of the wafer. Through the technical scheme, the wafer can be protected by the tray body, the wafer is not easy to damage and is not easy to pollute when Kelvin four-wire detection is carried out on the wafer, and therefore the quality of corresponding products can be improved.

Description

Wafer suspension test disc and device

Technical Field

The utility model relates to the technical field of wafer testing, in particular to a wafer suspension testing disc and a device.

Background

Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The wafer needs to be subjected to kelvin four-wire inspection, which is also referred to as four-terminal inspection, four-wire inspection or four-point probe method, which is an electrical impedance measurement technique using separate counter current and voltage detection electrodes.

In the prior art, when Kelvin four-wire detection is performed on a wafer, the wafer is directly placed on an operation table, and the back surface of the wafer is scratched in the process of moving on the operation table; meanwhile, when a person moves the wafer by hand to perform the point finding test, the glove may touch the front surface of the wafer, so that the wafer is easily polluted and is invalid.

Therefore, in the prior art, when the kelvin four-wire inspection is performed on the wafer, the wafer is easily damaged, so that the quality of the corresponding product is affected.

Disclosure of Invention

The utility model mainly aims to provide a wafer suspension test disc and a device, and aims to solve the technical problem that a wafer is easy to damage when Kelvin four-wire detection is carried out on the wafer in the prior art, so that the quality of a corresponding product is affected.

To solve the above technical problem, in a first aspect, the present utility model provides a wafer suspension test disc, where the test disc includes:

the tray body, the tray body is including relative first face and the second face that sets up, open on the first face has standing groove and fretwork hole, the fretwork hole is in orthographic projection on the second face is located the standing groove is in orthographic projection on the second face, the standing groove is used for placing the wafer, the fretwork hole is used for exposing the test position of wafer.

Optionally, the tray body is provided with an opening communicated with the hollowed-out hole.

Optionally, when the wafer is placed in the placement groove, an orthographic projection shape of the placement groove on the second face is the same as an orthographic projection shape of the wafer on the second face.

Optionally, a distance between the placement groove and the second face is greater than a thickness of the wafer.

Optionally, a picking component is arranged on the first surface.

Optionally, the picking assembly includes an auxiliary plate disposed on the first face, the auxiliary plate being located at and extending along an edge of the first face.

Optionally, at least one swinging member is arranged on the second surface near each edge of the second surface, and one surface of the swinging member far away from the second surface is a cambered surface.

Optionally, each edge of the second face is provided with a chamfer.

Optionally, the tray body is made of polyetherimide.

In a second aspect, the present utility model further provides a wafer suspension testing device, which includes the wafer suspension testing disc described in the present utility model.

Compared with the prior art, the utility model has the following beneficial effects:

the embodiment of the utility model provides a wafer suspension test disc and a device, wherein the test disc comprises: the tray body, the tray body is including relative first face and the second face that sets up, open on the first face has standing groove and fretwork hole, the fretwork hole is in orthographic projection on the second face is located the standing groove is in orthographic projection on the second face, the standing groove is used for placing the wafer, the fretwork hole is used for exposing the test position of wafer.

When the Kelvin four-wire detection is performed on the wafer, the wafer is placed in the placing groove, then the die to be detected of the wafer is found by swinging or moving the tray body, and then the Kelvin four-wire detection is performed on the wafer. Therefore, the wafer is placed in the placing groove of the tray body, the testing part on the back of the wafer can be exposed through the hollowed-out hole, and when the die to be tested of the wafer is found, the tray body only needs to be moved or swung. Compared with the prior art, the wafer can be protected by the tray body in a mode of directly contacting the wafer by hands and moving the wafer, and the wafer is not easy to damage and stain when the Kelvin four-wire detection is carried out on the wafer, so that the quality of corresponding products can be improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic front perspective view of a wafer suspension test tray according to an embodiment of the present utility model;

FIG. 2 is a schematic cross-sectional view of a wafer suspension test tray according to an embodiment of the present utility model;

FIG. 3 is a schematic diagram of the back structure of a test disc when the swing member provided in the embodiment of the present utility model is a swing rib;

FIG. 4 is a schematic diagram of the back structure of a test disc when the swing member provided in the embodiment of the present utility model is a swing protrusion;

FIG. 5 is a schematic view of a rear perspective structure of a test disc with one number of swing protrusions for each edge according to an embodiment of the present utility model;

fig. 6 is a schematic view of a rear perspective structure of a test disc when the number of swing protrusions of each edge is two according to an embodiment of the present utility model.

Description of the drawings: 1. a tray body; 11. a first face; 111. a placement groove; 112. a hollowed hole; 113. an opening; 12. a second face; 121. chamfering; 2. an auxiliary plate; 3. a wafer; 4. swinging ridges; 5. and (5) swinging the bulge.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present utility model, it should be noted that the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and are not to be construed as indicating or implying relative importance.

Referring to fig. 1, the present utility model provides a wafer suspension test plate, which includes:

the tray body 1, the tray body 1 includes relative first face 11 and the second face 12 that set up, open on the first face 11 has standing groove 111 and fretwork hole 112, the orthographic projection of fretwork hole 112 on the second face 12 is located standing groove 111 is in orthographic projection on the second face 12, the standing groove 111 is used for placing wafer 3, fretwork hole 112 is used for exposing the test position of wafer 3.

In this embodiment, the hollow hole 112 is preferably circular, the diameter of the hollow hole may be 113mm, the thickness of the disc body 1 may be 1.5mm, the hollow hole 112 and the placement groove 111 may be coaxially disposed, the diameter of the hollow hole 112 is smaller than that of the placement groove 111, and the placement groove 111 and the hollow hole 112 may integrally form a step structure. Thus, the edge of the wafer 3 can be placed on the placement groove 111, and the back surface of the wafer 3 is located in the hollowed-out hole 112, so that the wafer 3 can be placed more conveniently.

When the wafer 3 is subjected to the kelvin four-wire inspection, the wafer 3 is placed in the placement groove 111, then the die to be inspected of the wafer 3 is found by swinging or moving the tray 1, and then the wafer 3 is subjected to the kelvin four-wire inspection. In this way, by placing the wafer 3 in the placement groove 111 of the tray body 1, the test part on the back surface of the wafer 3 can be exposed through the hollowed-out hole 112, and when the die to be tested of the wafer 3 is found, only the tray body 1 needs to be moved or swung. Compared with the prior art, the tray body 1 can protect the wafer 3 by directly contacting the wafer 3 with hands and moving the wafer 3, and can reduce the contact condition of the wafer 3 with an operation table and hands, so that the wafer 3 is not easy to damage and stain when the wafer 3 is subjected to Kelvin four-wire detection, and the quality of corresponding products can be improved.

In some embodiments, referring to fig. 1 again, an opening 113 is formed on the tray body 1 and is in communication with the hollow hole 112. The size of the opening 113 can be continuously distributed at the position of 1/5-1/4 of the tray body 1, and the wafer 3 can be conveniently clamped through the opening 113, namely, the wafer 3 can be conveniently clamped and placed on the placing groove 111, and the wafer 3 can be conveniently clamped and taken down from the placing groove 111, so that the time of the taking and placing stage of the wafer 3 can be saved, and the Kelvin four-wire detection efficiency of the wafer 3 can be improved.

In some embodiments, referring again to fig. 1, when the wafer 3 is placed in the placement groove 111, the orthographic projection shape of the placement groove 111 on the second surface 12 is the same as the orthographic projection shape of the wafer 3 on the second surface 12. The shape of the placing groove 111 is set to be the same as that of the wafer 3, and the tolerance between the placing groove 111 and the wafer 3 is small, so that when the wafer 3 is placed in the placing groove 111, the wafer 3 basically cannot displace relative to the placing groove 111, and therefore the wafer 3 can be better positioned, and the possibility that the wafer 3 is scratched during Kelvin four-wire detection can be reduced.

In some embodiments, referring to fig. 2, the distance between the placement groove 111 and the second surface 12 is greater than the thickness of the wafer 3. When placing the wafer 3 in the standing groove 111, the wafer 3 in the hollowed-out hole 112 is in a suspended state, so that when placing the tray body 1 with the wafer 3 on the operation table, the wafer 3 cannot be contacted with the operation table, and therefore, the operation table cannot scratch the wafer 3 in the process that the tray body 1 drives the wafer 3 to move or swing, the wafer 3 can be further protected through the tray body 1, the quality of the wafer 3 after testing can be further improved, and two-needle Kelvin four-wire detection on the front surface and the back surface of the wafer 3 can be realized.

In some embodiments, the first surface 11 is provided with a picking assembly. The picking assembly can be integrally formed with the first surface 11 to form the picking rod or the auxiliary plate 2, so that the tray body 1 can be more conveniently picked up through the picking assembly, and the tray body 1 can be more conveniently moved or swung, thereby being more convenient for Kelvin four-wire detection on the wafer 3. In addition, when the wafer 3 is moved or swung by the taking component pressing plate body 1, the front surface of the wafer 3 is prevented from being touched to introduce contamination, and the operation time is effectively saved.

Preferably, referring again to fig. 1, the picking assembly comprises an auxiliary plate 2 disposed on the first face 11, the auxiliary plate 2 being located at an edge of the first face 11 and extending along the edge of the first face 11. By pressing the auxiliary plate 2 on the tray body 1, it is easier to move or swing the tray body 1, thereby easier to find the die to be tested on the wafer 3. Further, the auxiliary plate 2 is provided on each edge of the first face 11, so that the tray 1 can be swung or moved from each edge of the tray 1.

In some embodiments, at least one swinging member is disposed on each edge of the second surface 12 near the second surface 12, and a surface of the swinging member away from the second surface 12 is a cambered surface.

In this embodiment, referring to fig. 3, the swinging member may be a swinging rib 4 disposed near each edge of the second surface 12, where the swinging rib 4 is in a strip shape and extends along the edge of the second surface 12, and a surface of the swinging rib 4 away from the second surface 12 is a cambered surface. Thus, when the disc body 1 is pressed, the cambered surface of the swinging ridge 4 can swing or move the disc body 1 more easily.

Referring to fig. 4, the swinging member may also be a swinging protrusion 5 provided near each edge of the second face 12, and a face of the swinging protrusion 5 away from the second face 12 may be arc-shaped, i.e., the entire swinging protrusion 5 may be provided in a hemispherical shape. Therefore, when the disc body 1 is pressed, the cambered surface of the swing bulge 5 can enable the disc body 1 to swing or move more easily, so that the die to be detected on the wafer 3 can be found more easily and more quickly.

Referring to fig. 5, the number of the swing protrusions 5 near each edge on the second face 12 may be set to one, so that the time and cost for manufacturing the swing protrusions 5 may be reduced. Referring to fig. 6, the number of the swing protrusions 5 near each edge on the second face 12 may be set to two, so that stability when the disk body 1 is moved or swung by the swing protrusions 5 can be increased while securing reasonable time and cost for manufacturing the swing protrusions 5.

In some embodiments, referring again to fig. 2, each edge of the second face 12 is provided with a chamfer 121. When the swing arc of the tray body 1 is relatively large, the edge of the second surface 12 may contact with the console. At this time, the chamfer 121 at the upper edge of the second surface 12 is beneficial to further swinging of the tray body 1, if no chamfer 121 is provided at the edge of the second surface 12, the edge of the second surface 12 can limit the tray body 1 to further swing, so that the chamfer 121 is provided at the edge of the second surface 12, which is more beneficial to moving and swinging of the tray body 1, thereby being more beneficial to finding the die to be tested of the wafer 3, and further being more convenient to make Kelvin four-wire detection for the wafer 3.

In some embodiments, the material of the tray 1 is polyetherimide. The polyetherimide can be used for the whole test disc, so that the deformation of the test disc can be reduced in the long-term use process, and the quality of the test disc can be improved.

Based on the same inventive concept, the utility model also provides a wafer suspension testing device, which comprises the wafer suspension testing disc. The wafer suspension testing device has all the beneficial effects of the wafer suspension testing disc, and is not repeated herein.

In summary, according to the utility model, the wafer 3 is placed in the placement groove 111 of the tray body 1, and the test part on the back surface of the wafer 3 can be exposed through the hollowed-out hole 112, so that only the tray body 1 needs to be moved or swung when searching the die to be tested of the wafer 3. Compared with the prior art, the tray body 1 can protect the wafer 3 by directly contacting the wafer 3 with hands and moving the wafer 3, and the wafer 3 is not easy to be damaged and stained when the wafer 3 is subjected to Kelvin four-wire detection, so that the quality of corresponding products can be improved. In addition, the hollowed-out holes 112 can enable the wafer 3 not to be in contact with the operation table at all, so that the problem that the operation table scratches the wafer 3 in the Kelvin four-wire detection process of the wafer 3 can be solved, and the quality of corresponding products can be further improved.

The auxiliary plate 2 is arranged on the first surface 11 of the tray body 1, and the swinging piece is arranged on the second surface 12, so that the tray body 1 can drive the wafer 3 to move or swing more conveniently, and the time for finding the die to be tested on the wafer 3 can be saved. And the opening 113 is arranged on the tray body 1, so that time for placing the wafer 3 on the placing groove 111 and taking the wafer 3 off the placing groove 111 can be saved, and the Kelvin four-wire detection efficiency of the wafer 3 is improved.

The above description is merely illustrative of various embodiments of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art can easily think about variations or substitutions within the scope of the present utility model, and the utility model is intended to be covered by the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims (10)

1. A wafer suspension test disc, the test disc comprising:

the tray body (1), tray body (1) is including relative first face (11) and the second face (12) that set up, open on first face (11) has standing groove (111) and fretwork hole (112), fretwork hole (112) are in orthographic projection on second face (12) is located standing groove (111) are in orthographic projection on second face (12), standing groove (111) are used for placing wafer (3), fretwork hole (112) are used for exposing the test position of wafer (3).

2. The wafer suspension test disc according to claim 1, wherein the disc body (1) is provided with an opening (113) communicated with the hollowed-out hole (112).

3. Wafer suspension test disc according to claim 1, characterized in that the orthographic projection shape of the placement groove (111) on the second face (12) is the same as the orthographic projection shape of the wafer (3) on the second face (12) when the wafer (3) is placed in the placement groove (111).

4. Wafer suspension test disc according to claim 1, characterized in that the distance between the placement groove (111) and the second face (12) is larger than the thickness of the wafer (3).

5. Wafer suspension test disc according to claim 1, characterized in that the first face (11) is provided with a picking assembly.

6. Wafer suspension test disc according to claim 5, characterized in that the picking assembly comprises an auxiliary plate (2) arranged on the first face (11), the auxiliary plate (2) being located at the edge of the first face (11) and extending along the edge of the first face (11).

7. The wafer suspension test disc according to claim 1, wherein at least one swinging member is arranged on the second surface (12) close to each edge of the second surface (12), and a surface of the swinging member away from the second surface (12) is an arc surface.

8. Wafer suspension test disc according to claim 1, characterized in that each edge of the second face (12) is provided with a chamfer (121).

9. Wafer suspension test disc according to claim 1, characterized in that the material of the disc body (1) is polyetherimide.

10. A wafer suspension testing apparatus comprising a wafer suspension testing tray according to any one of claims 1 to 9.