CN219552948U - Heat radiation structure and electronic equipment - Google Patents

Abstract

The utility model provides a heat dissipation structure and electronic equipment, and relates to the technical field of heat dissipation. Wherein, the heat radiation structure includes: a first heating assembly; the second heating component is arranged adjacent to the first heating component; the heat conducting plate is covered on the first heating component and the second heating component to receive heat of the first heating component and the second heating component; and the heat dissipation device is adjacently arranged and connected with the heat conduction plate so as to receive and dissipate heat transmitted by the heat conduction plate. Therefore, the heat radiation structure provided by the utility model can realize the heat radiation of the first heat radiation component and the heat radiation of the second heat radiation component on the basis of not adding other heat radiation devices, thereby avoiding the problems of equipment thickness increase and noise caused by adding the heat radiation devices and ensuring the slim characteristic of the integrated machine. And the working temperatures of the first heating component and the second heating component are low, so that the service lives of the first heating component and the second heating component are prolonged.

Description

Heat radiation structure and electronic equipment

Technical Field

The present utility model relates to the field of heat dissipation technologies, and in particular, to a heat dissipation structure and an electronic device.

Background

At present, the cloud terminal all-in-one machine always adopts a CPU and a heat dissipation device to be placed in parallel due to the limitation of volume, and has the advantages of being thin and heat dissipation. As the CPU has stronger computing power and greater power consumption, other devices of the CPU accessory have too high temperature under the condition of no system fan, and the service life is affected.

In the prior art, a system fan of the integrated machine is added, but the thickness of the equipment is increased, and the problems of overlarge noise and the like are derived.

Therefore, how to provide a heat sink for other devices of a CPU accessory without increasing the thickness of the device.

Disclosure of Invention

The embodiment of the utility model aims to provide a heat dissipation structure and electronic equipment.

In order to solve the technical problems, the embodiment of the utility model provides the following technical scheme:

the first aspect of the present utility model provides a heat dissipation structure, including:

a first heating assembly;

the second heating component is arranged adjacent to the first heating component;

the heat conducting plate is covered on the first heating component and the second heating component to receive heat of the first heating component and the second heating component;

and the heat dissipation device is arranged adjacent to and connected with the heat conduction plate so as to receive and dissipate heat transmitted by the heat conduction plate.

In some variations of the first aspect of the present utility model, the second heat generating component is spaced from the heat conducting plate on a side facing the heat conducting plate relative to the first heat generating component;

the heat dissipation structure further comprises an elastic heat conduction pad, wherein the elastic heat conduction pad is arranged on one side, facing the heat conduction plate, of the second heating component so as to fill the interval between the second heating component and the heat conduction plate, and the second heating component is abutted to the heat conduction plate.

In some variant embodiments of the first aspect of the present utility model, further comprising:

the heat conducting plates are fixedly arranged on the heat conducting plate at the first end of each heat conducting plate, and the heat radiating device is fixedly arranged at the second end of each heat conducting plate so as to transmit heat of the heat conducting plate to the heat radiating device.

In some modified embodiments of the first aspect of the present utility model, the area of the heat conducting plate corresponding to the first heat generating component is a first area, the area corresponding to the second heat generating component is a second area, and the first end of the heat conducting tube is fixedly disposed on the first area.

In some modified embodiments of the first aspect of the present utility model, the second region is close to the heat dissipating device with respect to the first region, and the heat conducting tube does not interfere with the second region.

In some modified embodiments of the first aspect of the present utility model, the first heat generating component is connected to the heat conducting plate through a silica gel layer.

In some variations of the first aspect of the present utility model, the heat dissipating device comprises heat dissipating fins.

In some modified embodiments of the first aspect of the present utility model, the heat dissipating device further includes a plate body, the heat dissipating fins are disposed on the plate body, the heat dissipating fins are disposed in an extending manner along a direction perpendicular to the plate body, and the second end of the heat conducting tube is fixedly disposed on a surface of the plate body facing away from the heat dissipating fins.

In some modified embodiments of the first aspect of the present utility model, the second heat generating component includes a plurality of sub heat generating elements, and heights of the plurality of sub heat generating elements are different;

and a second area, which is away from one surface connected with the heat conducting pipe, of the heat conducting plate is provided with a bulge matched with the highest height of the plurality of sub heating elements.

The second aspect of the present utility model provides an electronic device, which includes the foregoing heat dissipation structure, and therefore includes all the technical features and beneficial technical effects of the foregoing heat dissipation structure, which are not described herein again.

Compared with the prior art, the heat radiation structure and the electronic device provided by the first aspect of the utility model, wherein the heat radiation structure comprises the first heat generating component, the second heat generating component, the heat conducting plate and the heat radiation device, wherein the first heat generating component and the second heat generating component are adjacently arranged, the heat conducting plate is covered on the first heat generating component and the second heat generating component so as to be used for receiving the heat transmitted by the first heat generating component and the second heat generating component and transmitting the heat received by the first heat generating component and the second heat generating component, the heat radiation device is adjacently arranged with the heat conducting plate, and is connected with the heat conducting plate so as to be capable of receiving the heat received by the heat conducting plate and radiating the heat received by the first heat generating component and the second heat generating component, so that the heat radiation of the first heat generating component and the second heat radiation component can be realized on the basis of not increasing other heat radiation devices, the problem of increasing the thickness of equipment and noise caused by the heat radiation device is avoided, and the thin characteristic of the integrated machine is ensured. And the working temperatures of the first heating component and the second heating component are low, so that the service lives of the first heating component and the second heating component are prolonged.

Drawings

The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present utility model will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. In the drawings, wherein like or corresponding reference numerals indicate like or corresponding parts, there are shown by way of illustration, and not limitation, several embodiments of the utility model, in which:

fig. 1 schematically illustrates a schematic structural diagram of a heat dissipation structure provided by the present utility model;

reference numerals illustrate:

the heat dissipation structure 1, the heat conduction plate 11, the first area 111, the second area 112, the heat dissipation device 12, the heat dissipation fins 121, the plate body 122 and the heat conduction pipe 13.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

As shown in fig. 1, the present utility model provides a heat dissipation structure 1, including:

a first heating assembly (not shown);

a second heat generating component (not shown) disposed adjacent to the first heat generating component;

a heat conducting plate 11, wherein the heat conducting plate 11 covers the first heating component and the second heating component to receive heat of the first heating component and the second heating component;

and a heat dissipating device 12, wherein the heat dissipating device 12 is disposed adjacent to and connected to the heat conducting plate 11 to receive and dissipate heat transferred from the heat conducting plate 11.

The heat dissipation structure 1 provided by the embodiment of the utility model comprises a first heat generating component, a second heat generating component, a heat conducting plate 11 and a heat dissipation device 12, wherein the first heat generating component and the second heat generating component are adjacently arranged, the heat conducting plate 11 covers the first heat generating component and the second heat generating component so as to be used for receiving heat transmitted by the first heat generating component and the second heat generating component and transmitting the received heat of the first heat generating component and the second heat generating component, the heat dissipation device 12 is adjacently arranged with the heat conducting plate 11, and the heat dissipation device 12 is connected with the heat conducting plate 11 so as to be capable of receiving the heat of the first heat generating component and the second heat generating component received by the heat conducting plate 11 and dissipating the received heat, thereby realizing heat dissipation of the first heat generating component and the second heat generating component, and further realizing heat dissipation of the second heat dissipation component while avoiding the problems of increased equipment thickness and noise caused by the heat dissipation device 12 on the basis of not increasing other heat dissipation devices 12.

As shown in fig. 1, in the embodiment of the present utility model, the second heat generating component is spaced apart from the heat conductive plate 11 at a side facing the heat conductive plate 11 with respect to the first heat generating component;

the heat dissipation structure 1 further comprises an elastic heat conduction pad, and the elastic heat conduction pad is disposed on one side of the second heating component facing the heat conduction plate 11, so as to fill the interval between the second heating component and the heat conduction plate 11, so as to abut the second heating component with the heat conduction plate 11.

In this embodiment, the heat dissipation structure 1 includes the first heating component/the second heating component/the heat conducting plate 11/the heat dissipation device 12 and the elastic heat conducting pad, the first heating component and the second heating component are adjacently disposed, and the first heating component and the second heating component are covered with the heat conducting plate 11, the first heating component and the second heating component have a height difference, one sides of the first heating component and the second heating component are located on the same plane, while one side facing the heat conducting plate 11, the first heating component is attached to the heat conducting plate 11, a space is provided between the second heating component and the heat conducting plate 11, and the elastic heat conducting pad is disposed between the second heating component and the heat conducting plate 11, so that the space between the second heating component and the heat conducting plate 11 is filled, so that the second heating component and the first heating component are located on the same horizontal plane, and both can be attached to the heat conducting plate 11, and therefore, on the basis of not increasing other heat dissipation devices 12, the heat dissipation device can also be realized, and the heat dissipation device can also be realized by increasing the thickness of the second heating component and the heat dissipation device 12, thereby avoiding the problem of heat dissipation device.

As shown in fig. 1, in an embodiment of the present utility model, further includes:

a plurality of heat conduction pipes 13, wherein a first end of each heat conduction pipe 13 is fixedly arranged on the heat conduction plate 11, and a second end is fixedly arranged on the heat dissipation device 12 so as to transfer heat of the heat conduction plate 11 to the heat dissipation device 12.

In this embodiment, the heat dissipation structure 1 further includes a plurality of heat conductive pipes 13, and a first end of each heat conductive pipe 13 is fixedly disposed on the heat conductive plate 11 and a second end is fixedly disposed on the heat dissipation device 12, so that the heat dissipation device 12 dissipates the heat of the first and second heat generation components absorbed by the heat conductive plate 11 to the heat dissipation device 12 through the plurality of heat conductive pipes 13. The heat conduction speed can be accelerated by the arrangement of the plurality of radiating pipes, so that the radiating effect is improved.

In the embodiment of the present utility model, the area of the heat conducting plate 11 corresponding to the first heat generating component is a first area 111, the area corresponding to the second heat generating component is a second area 112, and the first end of the heat conducting tube 13 is fixedly disposed on the first area 111.

In this embodiment, the heat conducting plate 11 has a first area 111 and a second area 112, the first area 111 is disposed adjacent to the second area 112, the first area 111 corresponds to the position of the first heat generating component, the second area 112 corresponds to the position of the second heat generating component, the first heat generating component and the second heat generating component are disposed adjacent to each other, the heat of the second heat generating component can be transferred to the second area 112 of the heat conducting plate 11 and transferred to the first area 111 through the second area 112 of the heat conducting plate 11, and the first end of the heat conducting tube 13 is connected with the first area 111 of the heat conducting plate 11 corresponding to the first heat generating component, so that the heat generated by the first heat generating component and the second heat generating component is transferred to the heat dissipating device 12 through the heat conducting tube 13 and the first area 111 of the heat conducting plate 11 for dissipating heat.

As shown in fig. 1, in the embodiment of the present utility model, the second region 112 is close to the heat dissipating device 12 with respect to the first region 111, and the heat conducting tube 13 does not interfere with the second region 112.

In this embodiment, the first end of the heat conductive pipe 13 is connected to the first region 111 of the heat conductive plate 11, so that heat dissipated from the first and second heat generating components through the first region 111 of the heat conductive plate 11 is transferred to the heat dissipating device 12 through the heat conductive plate 11 and the heat conductive pipe 13 for dissipating heat. The heat conducting pipe 13 is of an arc structure, the heat conducting pipe 13 does not interfere with the second area 112 of the heat conducting plate 11, the second heating component is close to the heat radiating device 12 relative to the first heating component, correspondingly, the second area 112 of the heat conducting plate 11 is close to the heat radiating device 12 relative to the first area 111, and accordingly the heat conducting pipe 13 of the arc structure can avoid the heat conducting pipe 13 to be in contact with the second area 112 of the heat conducting plate 11, the heat conducting pipe 13 is prevented from returning heat to the second area 112 of the heat conducting plate 11, the risk of heat returning is avoided, and the heat of the first heating component and the heat of the second heating component can be transmitted to the heat radiating device 12 through the heat conducting pipe 13, so that heat radiation is completed.

In the embodiment of the present utility model, the first heating component is connected to the heat conducting plate 11 through a silica gel layer.

In this embodiment, the first heating component is connected with the heat conducting plate 11 through the silica gel layer, so that heat of the first heating component can be better transmitted to the heat conducting plate 11, loss of the heat of the first heating component in transmission is avoided, heat radiation of the first heating component to the surroundings is avoided, influence on surrounding devices is avoided, and further heat of the first heating component can be transmitted to the heat radiating device 12 through the heat conducting plate 11 and the heat conducting pipe 13, and heat radiation is achieved.

As shown in fig. 1, in the embodiment of the present utility model, the heat dissipating device 12 includes heat dissipating fins 121.

In this embodiment, the heat dissipating device 12 includes the heat dissipating fins 121, and the heat dissipating fins 121 can better dissipate the heat generated by the received first heat generating component and the second heat generating component, so that heat dissipation can be better and faster realized, and the heat dissipating effect can be improved.

As shown in fig. 1, in the embodiment of the present utility model, the heat dissipating device 12 further includes a plate 122, the plate 122 is provided with the heat dissipating fins 121, the heat dissipating fins 121 are disposed along a direction perpendicular to the plate 122, and the second end of the heat conducting tube 13 is fixedly disposed on a surface of the plate 122 facing away from the heat dissipating fins 121.

In this embodiment, the heat dissipating device 12 includes a plate 122 and heat dissipating fins 121, the heat dissipating fins 121 are disposed on one surface of the plate 122, the plurality of heat dissipating fins 121 are disposed on the plate 122 along a direction perpendicular to the plate 122, and one surface of the plate 122 facing away from the heat dissipating fins 121 is used for connecting the second end of the heat conducting tube 13, so that when the first end of the heat conducting tube 13 is connected with the first area 111 of the heat conducting plate 11, the heat conducting tube 13 can transmit the heat of the first heat generating component and the second heat generating component to the plate 122 of the heat dissipating device 12, and then the heat is dissipated through the heat dissipating fins 121, thereby dissipating the heat of the first heat generating component and the second heat generating component.

In the embodiment of the utility model, the second heating component comprises a plurality of sub heating elements, and the heights of the plurality of sub heating elements are different;

the second area 112 of the heat conducting plate 11 facing away from the surface connected with the heat conducting pipe 13 is provided with a protrusion adapted to the highest height of the plurality of sub-heating elements.

In this embodiment, the second heat generating component includes a plurality of sub heat generating components, the heights of each sub heat generating component are not exactly the same, that is, the heights of the plurality of sub heat generating components are higher, and the heights of the plurality of sub heat generating components are lower, a protrusion matched with the plurality of sub heat generating components is arranged at one side of the heat conducting plate 11 facing the second heat generating component, the protrusion of the heat conducting plate 11 corresponding to the sub heat generating component with the higher height is lower, the protrusion of the heat conducting plate 11 corresponding to the sub heat generating component with the lower height is higher, so that the second heat generating component including the plurality of sub heat generating components is attached to the heat conducting plate 11 through the protrusion arranged on the heat conducting plate 11, heat of the second heat generating component is transmitted to the second area 112 of the heat conducting plate 11, and heat received by the second area 112 of the rear heat conducting plate 11 is transmitted to the first area 111 of the heat conducting plate 11, and heat received by the first area 111 of the heat conducting plate 11 is transmitted to the heat radiating device 12 through the heat conducting pipe 13, so that heat is radiated by the heat radiating device 12 is realized.

In this embodiment, the protrusions are elastic protrusions, so that the plurality of sub-heat generating members can be better adapted, so that the plurality of sub-heat generating members can be better fitted with the heat conductive plate 11, and better heat transfer is achieved.

In this embodiment, the first heat generating component is a main heat generating structure such as a CPU, the second heat generating component is a heat generating component such as a capacitor or an inductor, and the heat conducting plate 11 is an aluminum plate. The first heating component comprising a CPU and the like is adjacently provided with a second heating component comprising a capacitor, an inductor and the like, the first heating component comprising the CPU and the like and the second heating component comprising the capacitor, the inductor and the like are provided with a heat conducting plate 11, the area of the heat conducting plate 11 corresponding to the first heating component is a first area 111, the area corresponding to the second heating component is a second area 112, a silica gel layer is arranged between the first heating component comprising the CPU and the like and the first area 111 of the heat conducting plate 11, and therefore heat transmission between the first heating component and the first area 111 of the heat conducting plate 11 is facilitated. The first heating component comprising a CPU and the like and the second heating component comprising a capacitor or an inductor and the like are inconsistent in height, and an elastic heat conducting pad is arranged between the second region 112 of the heat conducting plate 11 and the second heating component, so that the problem of inconsistent heights of the first heating component and the second heating component is avoided. And the second region 112 of the heat conducting plate 11 will be transferred to the first region 111 of the heat conducting plate 11 after receiving heat, the first region 111 of the heat conducting plate 11 facing away from the first heat generating component is connected with a first end of the heat conducting tube 13, and a second end of the heat conducting tube 13 is connected with the heat dissipating device 12, so that heat of the first heat generating component and the second heat generating component is transferred to the heat dissipating device 12 through the heat conducting tube 13. Under the condition that structures such as a system fan and the like are not added, the heat dissipation problem of the first heating component and the second heating component is realized, and the thin body of the electronic equipment is maintained. And the operating temperature of the first heat generating component including the structure of the CUP and the second heat generating component including the capacitor or the inductor is low, thereby prolonging the life.

On the other hand, the utility model also provides an electronic device, which comprises the heat dissipation structure, so that all technical features and beneficial technical effects of the heat dissipation structure are included, and are not repeated herein.

The heat dissipation structure comprises a first heat generating component, a second heat generating component, a heat conducting plate and a heat dissipation device, wherein the first heat generating component and the second heat generating component are adjacently arranged, the heat conducting plate covers the first heat generating component and the second heat generating component so as to be used for receiving heat transmitted by the first heat generating component and the second heat generating component and transmitting the received heat of the first heat generating component and the second heat generating component, the heat dissipation device is adjacently arranged with the heat conducting plate, and is connected with the heat conducting plate so as to be capable of receiving the heat of the first heat generating component and the second heat generating component received by the heat conducting plate and dissipating the received heat, and therefore heat dissipation of the first heat generating component and the second heat generating component is achieved, and heat dissipation of the second heat generating component is achieved while heat dissipation of the first heat generating component is achieved without adding other heat dissipation devices, and the problems of increased thickness and noise of equipment caused by the heat dissipation device are avoided. And the operating temperature of the first heat generating component including the structure of the CUP and the second heat generating component including the capacitor or the inductor is low, thereby prolonging the life.

The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims (10)

1. A heat dissipation structure, comprising:

a first heating assembly;

the second heating component is arranged adjacent to the first heating component;

the heat conducting plate is covered on the first heating component and the second heating component to receive heat of the first heating component and the second heating component;

and the heat dissipation device is arranged adjacent to and connected with the heat conduction plate so as to receive and dissipate heat transmitted by the heat conduction plate.

2. The heat dissipating structure of claim 1, wherein,

the second heating component is spaced from the heat conducting plate at a side facing the heat conducting plate relative to the first heating component;

the heat dissipation structure further comprises an elastic heat conduction pad, wherein the elastic heat conduction pad is arranged on one side, facing the heat conduction plate, of the second heating component, so that the interval between the second heating component and the heat conduction plate is filled, and the second heating component is abutted to the heat conduction plate.

3. The heat dissipating structure of claim 2, further comprising:

the heat conducting plates are fixedly arranged on the heat conducting plate at the first end of each heat conducting plate, and the heat radiating device is fixedly arranged at the second end of each heat conducting plate so as to transmit heat of the heat conducting plate to the heat radiating device.

4. The heat dissipating structure of claim 3 wherein,

the region of the heat conducting plate corresponding to the first heating component is a first region, the region of the heat conducting plate corresponding to the second heating component is a second region, and the first end of the heat conducting pipe is fixedly arranged on the first region.

5. The heat dissipating structure of claim 4, wherein,

the second area is close to the heat dissipation device relative to the first area, and the heat conduction pipe is not interfered with the second area.

6. The heat dissipating structure of claim 5, wherein,

the first heating component is connected with the heat conducting plate through a silica gel layer.

7. The heat dissipating structure of claim 3 wherein,

the heat dissipating device comprises heat dissipating fins.

8. The heat dissipating structure of claim 7,

the heat dissipation device further comprises a plate body, the heat dissipation fins are arranged on the plate body, the heat dissipation fins are arranged in an extending mode along the direction perpendicular to the plate body, and the second end of the heat conduction pipe is fixedly arranged on one face, deviating from the heat dissipation fins, of the plate body.

9. The heat dissipating structure of claim 8, wherein,

the second heating component comprises a plurality of sub heating pieces, and the heights of the plurality of sub heating pieces are different;

and a second area, which is away from one surface connected with the heat conducting pipe, of the heat conducting plate is provided with a bulge matched with the highest height of the plurality of sub heating elements.

10. An electronic device comprising the heat dissipation structure as recited in any one of claims 1-9.