CN219434671U - Circuit board transmission device, image capturing device and optical detection equipment - Google Patents
Circuit board transmission device, image capturing device and optical detection equipment Download PDFInfo
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- CN219434671U CN219434671U CN202321670222.5U CN202321670222U CN219434671U CN 219434671 U CN219434671 U CN 219434671U CN 202321670222 U CN202321670222 U CN 202321670222U CN 219434671 U CN219434671 U CN 219434671U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
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Abstract
The utility model discloses a circuit board transmission device, an image capturing device and optical detection equipment, wherein the transmission device comprises a material supporting mechanism configured to place a circuit board; the upper vacuum adsorption mechanism comprises a vacuumizing power device and an upper adsorption table for performing vacuum adsorption on the upper surface of the circuit board, and the lower surface of the upper adsorption table is higher than the upper surface of the material supporting mechanism; the lower vacuum adsorption mechanism comprises a vacuumizing power device and a lower adsorption table for performing vacuum adsorption on the lower surface of the circuit board, and the upper surface of the lower adsorption table is lower than the lower surface of the upper adsorption table; the driving assembly is configured to drive the upper adsorption platform to move between a first position and a second position and drive the lower adsorption platform to move between a third position and a fourth position, the first position is opposite to the material supporting mechanism, the second position is opposite to the third position, and the fourth position is far away from the upper adsorption platform than the third position. The utility model can efficiently, stably and reliably transmit the circuit board with double-sided detection.
Description
Technical Field
The present utility model relates to the field of circuit board detection, and in particular, to a circuit board transmission device, an image capturing device, and an optical detection apparatus.
Background
Optical detection of circuit boards is an important link in design and production of circuit boards, and along with the increasing competition of electronic board factories, the market puts forward higher demands on equipment working efficiency, manual investment, equipment investment and the like.
Most of optical detection equipment mainly uses single-sided scanning and is matched with automatic carrying/overturning equipment to realize the scanning of the front and back sides of the whole circuit board, but the transmission mode of the circuit board can not meet the requirements of the market on the equipment. In addition, the circuit board is used as an integrated board of a precise electronic device, and is easy to damage in the carrying/overturning operation process of automatic carrying/overturning equipment, so that the reject ratio of products is improved.
The foregoing background is only for the purpose of aiding in the understanding of the principles and concepts of the present utility model and is not necessarily related to the prior art or the technical teachings of the present application; the above background should not be used to assess the novelty and creativity of the present application without explicit evidence that the above-mentioned content was disclosed prior to the filing date of the present patent application.
Disclosure of Invention
The utility model aims to provide a circuit board transmission device, an image capturing device and optical detection equipment, which are high in transmission efficiency, stable and reliable.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a circuit board transfer device comprising:
the material supporting mechanism is configured to place a circuit board to be transmitted;
the upper vacuum adsorption mechanism comprises a vacuumizing power device and an upper adsorption table for performing vacuum adsorption on the upper surface of the circuit board, and the lower surface of the upper adsorption table is higher than the upper surface of the material supporting mechanism;
the lower vacuum adsorption mechanism comprises a vacuumizing power device and a lower adsorption table for performing vacuum adsorption on the lower surface of the circuit board, and the upper surface of the lower adsorption table is lower than the lower surface of the upper adsorption table;
a lifting mechanism configured to drive the material carrying mechanism and/or the upper adsorption stage so as to shorten a distance between an upper surface of the material carrying mechanism and a lower surface of the upper adsorption stage;
the driving assembly is configured to drive the upper adsorption platform to move between a first position and a second position and drive the lower adsorption platform to move between a third position and a fourth position, wherein the first position is opposite to the material supporting mechanism, the second position is opposite to the third position, and the fourth position is far away from the upper adsorption platform compared with the third position.
Further, in combination with any one or more of the foregoing claims, the material supporting mechanism includes a lifting carrier plate surface and a lifting cylinder disposed below the lifting carrier plate surface, where a lifting stroke of the lifting cylinder is configured to be less than or equal to a difference of a height difference between a lower surface of the upper adsorption table and an upper surface of the lifting carrier plate surface minus a thickness of the circuit board.
Further, according to any one or a combination of the above technical solutions, the material supporting mechanism further includes a vacuum pumping power device, and the lifting carrier plate surface is provided with adsorption holes;
the actuator of the vacuum power device is a buffer sucker, and the buffer sucker is configured to lift the surface of the carrier plate surface through the adsorption Kong Tanchu.
Further, in any one or a combination of the foregoing technical solutions, the upper adsorption table is further provided with at least two claw members, one end of each claw member is pivotally connected to the upper adsorption table, and the other end of each claw member extends to a position below the upper adsorption table;
the other end of the claw piece is provided with an extension part which is close to the center of the upper adsorption table, the claw piece is provided with a first state and a second state, and in the first state, the projection of the extension part and the circuit board on the horizontal plane is not overlapped; in the second state, the extension part is positioned below the circuit board adsorbed on the lower surface of the upper adsorption table and is overlapped with the projection of the circuit board on the horizontal plane.
Further, in combination with any one or more of the preceding claims, the material loading mechanism further includes a positioning mechanism configured to position a circuit board when the circuit board is received from a prefrontal conveyor.
According to another aspect of the present utility model, there is provided a circuit board image capturing device, including a first image capturing device, a second image capturing device, and a circuit board transmission device according to any one or more of the above-mentioned technical solutions, wherein the first image capturing device is disposed between a material supporting mechanism and a lower adsorption table of the circuit board transmission device, and the first image capturing device is located below an upper adsorption table of the circuit board transmission device;
the second image acquisition device is arranged on one side of the upper adsorption table, which is close to the lower adsorption table, and is positioned above the lower adsorption table.
Further, in any one or a combination of the foregoing technical solutions, the first image capturing device and the second image capturing device each include a linear camera, a lens, and an illumination box, where the lens and the illumination box are in one-to-one correspondence with the linear camera;
the linear camera, the lens and the illumination box of the first image acquisition device are arranged from bottom to top, and the linear camera, the lens and the illumination box of the second image acquisition device are arranged from top to bottom.
Further, in any one or a combination of the foregoing aspects, the first image capturing device and the second image capturing device each have a plurality of linear cameras arranged side by side, a cross area is configured on a view optical path of two adjacent linear cameras of the first image capturing device, and a cross area is configured on a view optical path of two adjacent linear cameras of the second image capturing device.
Further, any one or a combination of the foregoing, wherein the plurality of side-by-side linear cameras are configured to be individually focused.
According to another aspect of the present utility model, there is provided an optical detection apparatus, including a processor and the circuit board image capturing device according to any one or a combination of the above aspects, where the processor is configured to perform data processing on an image obtained by the circuit board image capturing device.
The technical scheme provided by the utility model has the following beneficial effects:
a. the upper surface of the circuit board is absorbed by the upper absorption table, the optical detection of the lower surface of the circuit board is finished in the process of transferring the circuit board from the first position to the second position, the lower surface of the circuit board is absorbed by the lower absorption table through the second position of the upper absorption table and the third position of the lower absorption table, and the optical detection of the upper surface of the circuit board is finished in the process of transferring the circuit board from the third position to the fourth position, so that the circuit board does not need to be turned over or detected twice, the visual detection of the upper surface and the lower surface of the circuit board can be finished in the process of transferring the circuit board in one translation, and the circuit board is stable and reliable in transmission and high in detection efficiency;
b. in the utility model, the first image acquisition device and the second image acquisition device are provided with a plurality of linear cameras which are arranged side by side, the visual field light paths of two adjacent linear cameras of the first image acquisition device are provided with the cross areas, and the visual field light paths of two adjacent linear cameras of the second image acquisition device are provided with the cross areas, so that the image distortion caused by the problem of the edge distortion of a lens can be effectively avoided, the visual detection precision is further improved, and the scanning length of single visual detection can be improved;
c. the circuit board image capturing device provided by the utility model can realize modularized customization, can customize upper adsorption tables and lower adsorption tables with different sizes, and customize optical modules with different numbers and types, including industrial linear cameras, lenses and lighting boxes, and can meet various detection requirements of circuit boards with various sizes, wherein the parallel spacing of a plurality of industrial linear cameras can also be adjusted;
d. according to the utility model, a plurality of linear cameras arranged side by side are configured to be focused independently, and the optimal image of each partition can be obtained through the up-down fine adjustment of each linear camera and the lens with fixed multiplying power, so that the detection error generated by the flatness of the machine table can be reduced;
e. according to the utility model, the lifting mechanism is arranged below the material supporting mechanism, and the lifting function is arranged on the material supporting mechanism, so that the structure of the upper adsorption table is simplified, misoperation of lifting the circuit board in an adsorption state is avoided, and the reliability of equipment is improved;
f. according to the utility model, the circuit board is positioned by the positioning mechanism, so that a manipulator is not required to grasp the circuit board onto the material supporting mechanism, the circuit board damage caused by grasping the circuit board can be avoided, and the product reject ratio caused by detection and transmission is further reduced.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an optical detection device according to an exemplary embodiment of the present utility model;
fig. 2 is a schematic diagram illustrating an operation principle of a circuit board image capturing device according to an exemplary embodiment of the present utility model;
fig. 3 is a schematic structural diagram of a circuit board image capturing device according to an exemplary embodiment of the present utility model;
FIG. 4 is a schematic view of a material loading mechanism according to an exemplary embodiment of the present utility model;
FIG. 5 is a schematic view of a structure of a lift-up carrier plate according to an exemplary embodiment of the present utility model;
FIG. 6 is a schematic diagram of a buffer chuck according to an exemplary embodiment of the present utility model;
FIG. 7 is an enlarged schematic view shown at A in FIG. 1;
FIG. 8 is a schematic diagram of a single linear camera and lens combination provided by an exemplary embodiment of the present utility model;
fig. 9 is a schematic diagram of a plurality of side-by-side linear camera and lens combinations provided by an exemplary embodiment of the present utility model.
Wherein, the reference numerals include: the device comprises a 12-circuit board, a 2-material supporting mechanism, a 21-jacking carrier plate surface, 211-adsorption holes, a 22-jacking cylinder, 23-buffer suction cups, 24-air pipe interfaces, a 3-linear camera, a 4-lens, a 5-lighting box, a 6-upper adsorption table, a 7-lower adsorption table, an 8-base, a 91-first image acquisition device, a 92-second image acquisition device, a 93-first bridge and a 94-second bridge.
Detailed Description
In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the utility model described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, apparatus, article, or device that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or device.
In one embodiment of the present utility model, a circuit board transporting apparatus is provided for transporting a circuit board to an image pickup device, and referring to fig. 1 and 3, the circuit board transporting apparatus includes a material carrying mechanism 2, a lifting mechanism, an upper vacuum suction mechanism, a lower vacuum suction mechanism, and a driving assembly.
Wherein the material loading mechanism 2 is configured to place a circuit board 12 to be transported.
The upper vacuum adsorption mechanism comprises a vacuumizing power device and an upper adsorption table 6 for performing vacuum adsorption on the upper surface of the circuit board 12, and the lower surface of the upper adsorption table 6 is higher than the upper surface of the material supporting mechanism 2.
The lower vacuum adsorption mechanism comprises a vacuum pumping power device and a lower adsorption table 7 for performing vacuum adsorption on the lower surface of the circuit board 12, wherein the upper surface of the lower adsorption table 7 is lower than the lower surface of the upper adsorption table 6. Since there are two sets of vacuum suction mechanisms, to avoid interference, two sets of linear guide rails are provided side by side but staggered up and down/inside and outside, indicated by two broken lines in fig. 2, one of which is for the upper suction table 6 to slide and the other for the lower suction table 7 to slide.
Under the drive of the driving assembly, the upper adsorption platform 6 moves between a first position and a second position along the corresponding linear track, the lower adsorption platform 7 moves between a third position and a fourth position along the corresponding linear track, wherein the first position is opposite to the material supporting mechanism 2, the second position is opposite to the third position, and the fourth position is far away from the upper adsorption platform 6 compared with the third position.
The route of transport of the circuit board 12 is as follows:
the circuit board 12 is conveyed onto the material supporting mechanism 2 from the previous process equipment, the upper adsorption table 6 moves to a first position, and then the lifting mechanism drives the material supporting mechanism 2 and/or the upper adsorption table 6 so as to shorten the distance between the upper surface of the material supporting mechanism 2 and the lower surface of the upper adsorption table 6 (on the premise that the lower surface of the upper adsorption table 6 does not abut against the circuit board 12);
the upper vacuum adsorption mechanism acts, namely the upper adsorption table 6 adsorbs the circuit board 12 and then moves to the second position, and the lower adsorption table 7 moves to the third position at the moment; further, the upper suction table 6 releases the suction force to move the circuit board 12 away from the upper suction table 6 to reach the upper surface of the lower suction table 7;
the lower vacuum suction mechanism is operated, that is, the lower suction table 7 sucks the circuit board 12 and then moves to the fourth position.
The circuit board transmission device in this embodiment may be used for a circuit board image capturing device, referring to fig. 1 to 3, and the circuit board image capturing device further includes a base 8, and a first image capturing device 91 and a second image capturing device 92 disposed on the base 8. The first image acquisition device 91 is arranged on the base 8 through a first bridge 93; the second image acquisition device 92 is arranged on the base 8 by means of a second bridge 94. The base 8, the first bridge frame 93 and the second bridge frame 94 all use section bar welding machine workpieces, the section bar can lighten equipment weight when meeting strength, and the matched connection parts are machined workpieces, so that the precision requirement is met. The first image acquisition device 91 is disposed between the material supporting mechanism 2 and the lower adsorption table 7, and the first image acquisition device 91 is located below the upper adsorption table 6, and the first image acquisition device 91 is configured to optically image the lower surface of the circuit board 12. The second image capturing device 92 is disposed on a side of the upper suction table 6 close to the lower suction table 7, and the second image capturing device 92 is disposed above the lower suction table 7, and the second image capturing device 92 is configured to optically image the upper surface of the circuit board 12.
In the process of moving the upper adsorption table 6 from the first position to the second position, the first image acquisition device 91 acquires image information of the lower surface of the circuit board 12, and because the circuit board 12 is vacuum-adsorbed on the lower surface of the upper adsorption table 6 in the process, the circuit board 12 can be prevented from falling off, good flatness can be ensured, and image scanning quality of the lower surface of the circuit board is improved, so that optical detection accuracy of the lower surface of the circuit board is further improved. In one embodiment of the present utility model, the upper adsorption stage 6 is further provided with at least two claw members, for example, two claw members are respectively disposed on the left and right sides or the front and rear sides of the upper adsorption stage 6, or four claw members are respectively disposed on the left and right sides or the front and rear sides of the upper adsorption stage 6, or one claw member is respectively disposed on the front, rear, left and right sides of the upper adsorption stage 6. One end of each claw piece is pivotally connected with the upper adsorption table 6, and the other end of each claw piece extends downwards the upper adsorption table 6; the other end of the claw member is provided with an extension part which is close to the center of the upper adsorption table 6, the claw member is provided with a first state and a second state, in the first state, the claw member is outwards turned and opened, the projection of the extension part and the circuit board 12 on the horizontal plane is not overlapped, and the upper adsorption table 6 can adsorb the circuit board 12; in the second state, the extension part is located below the circuit board 12 sucked on the lower surface of the upper suction table 6 and overlaps with the projection of the circuit board 12 on the horizontal plane, i.e. after the circuit board 12 is sucked on the upper suction table 6, the claw member is retracted again. The first state corresponds to a state in which the upper suction table 6 does not suck the circuit board 12, and the second state corresponds to a state in which the upper suction table 6 sucks the circuit board 12, and by providing the claw members, the circuit board 12 can be prevented from falling from the upper suction table 6 due to unexpected circumstances, thereby improving the reliability of the apparatus.
Similarly, in the process that the lower adsorption table 7 moves from the third position to the fourth position, the second image acquisition device 92 acquires the image information of the upper surface of the circuit board 12, and the circuit board 12 is vacuum adsorbed on the upper surface of the lower adsorption table 7 in the process, so that the lower adsorption table has good flatness, and is beneficial to improving the image scanning quality so as to further improve the optical detection precision of the upper surface of the circuit board.
In one embodiment, the lifting mechanism is integrated on the material supporting mechanism 2, and the material supporting mechanism 2 further has a function of adsorbing the circuit board, specifically as shown in fig. 4, the material supporting mechanism 2 includes a lifting carrier plate surface 21 and a lifting cylinder 22 disposed below the lifting carrier plate surface 21, and a lifting stroke of the lifting cylinder 22 is configured to be smaller than or equal to a difference of a height difference between a lower surface of the upper adsorption table 6 and an upper surface of the lifting carrier plate surface 21 minus a thickness of the circuit board 12, so that, as a lot of circuit boards change, the lifting stroke of the lifting cylinder 22 needs to be adjusted according to the thickness of the circuit board. The jacking cylinder 22 may be a thin cylinder with a magnetic sensor, and jacking of the circuit boards 12 with different plate thicknesses is realized by fine tuning the magnetic sensor, so that extrusion to the circuit boards is reduced. In this embodiment, the jacking cylinder 22 is further provided with four linear shafts and shaft sleeves, so that the lifting verticality can be effectively ensured, and the accuracy of positioning the circuit board is realized.
Referring to fig. 5 and 7, the material supporting mechanism 2 further includes a vacuum pumping power device, and the lifting carrier plate surface 21 is provided with an adsorption hole 211; the actuator of the vacuum power device is a buffer sucker 23, and the buffer sucker 23 is configured to protrude out of the surface of the lifting carrier plate surface 21 through the suction hole 211. Referring to fig. 6, a through hole communicating with the air pipe interface 24 is arranged in the middle of the buffer sucker 23. Wherein, the adsorption holes 211 are plural, and the buffer sucker 23 corresponds to the adsorption holes 211 one by one. Through the vacuum generator evacuation, realize the function of light absorption circuit board in the in-process of jacking to ensure that jacking in-process circuit board position is stable unchangeable, and buffer chuck 23 also can reduce the extrusion to the circuit board, especially when elevating system drive makes the jack-up carrier plate face 21 the upper surface with the distance between the lower surface of upper adsorption stage 6 shortens and unexpected the lead to upper adsorption stage 6 to oppress circuit board 12, buffer chuck 23 can protect the circuit board not to be crushed between jack-up carrier plate face 21 and upper adsorption stage 6.
Through putting the lifting function on the material support mechanism 2, the structure of the upper adsorption table 6 is simplified, and misoperation of lifting the circuit board in an adsorption state is avoided.
In one embodiment of the utility model, the material handling mechanism 2 further comprises a positioning mechanism configured to position a circuit board 12 upon receipt of the circuit board 12 from a preface conveyor. For example, the positioning mechanism may be an edge alignment mechanism, which is capable of pushing the circuit board to a position corresponding to the target X-axis and Y-axis. The manipulator is adopted to grab the circuit board to easily cause the circuit board to be damaged, the manipulator is not required to grab the circuit board to the material carrying mechanism 2 when the positioning mechanism is used for positioning the circuit board, and the circuit board damage caused by grabbing the circuit board can be avoided.
In one embodiment of the utility model, an optical inspection apparatus is provided that is capable of meeting a 6um resolution and a disposable scan of up to 500mm circuit board, the optical inspection apparatus comprising a processor, a control module, and a circuit board imaging device. The feeding mechanism is configured to transmit the circuit board 12 to be optically detected to the material carrying mechanism 2, the discharging mechanism is configured to transmit the circuit board with the front and back sides optically detected to the next process equipment from the circuit board image capturing device, the processor is configured to process the image obtained by the circuit board image capturing device, and the control module can adopt a PLC control module and is configured to control the operation and safety of the equipment, including controlling the feeding and discharging processes, the transmission process of the circuit board 12 in the optical detection process, the operation state of the circuit board image capturing device and the like.
In this embodiment, the first image capturing device 91 and the second image capturing device 92 each include a linear camera 3, a lens 4, and an illumination box 5, where the lens 4 and the illumination box 5 are in one-to-one correspondence with the linear camera 3. The industrial linear camera 3, the lens 4 and the lighting box 5 of the first image capturing device 91 are arranged from bottom to top, and the industrial linear camera 3, the lens 4 and the lighting box 5 of the second image capturing device 92 are arranged from top to bottom. Referring to fig. 8, the selection of the lens 4 is determined according to the optical required magnification, and the distance M of the lens 4 to the upper suction stage 6 or the lower suction stage 7 is fixed. The distance N between the linear camera 3 and the lens 4 is determined according to the focal length of the lens 4.
Preferably, the first image capturing device 91 and the second image capturing device 92 each have a plurality of linear cameras 3 arranged side by side, the view optical paths of two adjacent linear cameras 3 of the first image capturing device 91 are configured with intersecting areas, and the view optical paths of two adjacent linear cameras 3 of the second image capturing device 92 are configured with intersecting areas. In practical application, the positions of a plurality of linear cameras 3 arranged side by side and the lenses 4 corresponding to the respective linear cameras 3 are determined according to the size of the detection table. Preferably, referring to fig. 9, the plurality of linear cameras 3 arranged side by side are configured to be focused independently, and the lens 4 with a fixed magnification is matched by fine tuning up and down of each linear camera 3, so as to obtain the optimal image of each partition, thereby reducing errors caused by the flatness of the machine.
The utility model provides the circuit board image capturing device which can realize modularization customization, for example, the upper adsorption table 6 and the lower adsorption table 7 with different sizes can be customized, and different numbers and types of optical modules comprising the industrial linear cameras 3, the lenses 4 and the lighting boxes 5 can be customized, and the side-by-side spacing of a plurality of the industrial linear cameras 3 can be also adjusted so as to meet various detection requirements of circuit boards with various sizes.
In one specific embodiment of the utility model, the optical inspection apparatus is a high-efficiency large-platform inspection apparatus for circuit boards with a precision of 6um resolution and a one-time scan length of 500 mm. In this embodiment, the total length of the inspection lands, i.e., the lands of the upper suction land 6 and the lower suction land 7, is 510mm (the actual use land length is 500 mm). The linear camera 3 is a 16K linear scanning camera with pixels (pixelsize) of 5um; the lens 4 is a 0.87X magnification lens. The total length of the linear cameras 3 is 81920um, and the scanning field of view of a single linear camera 3 is 98304um, so that 6 linear cameras 3 are required to be combined with one lens 4 respectively to complete efficient and rapid machine vision collocation.
In view of the space occupied by the 16K linear scanning camera, in this embodiment, six horizontal matching scan diagrams of the linear cameras 3 are shown in fig. 9. The camera at the leftmost side and the camera at the rightmost side are relatively short in actual requirement, the visual field light paths below the four cameras in the middle are provided with actual crossing areas, in the later image algorithm, the edge position of each crossing area is given to the lens camera combination closer to the central area to process the image, and the design can effectively avoid image distortion caused by the problem of edge distortion of the lens, so that the image effect is better, and the visual detection precision is improved.
Above the image processing, the correction (rotation processing and the like) of the collected composite image of each circuit board can be realized through the processor, the correction of certain deviation of the circuit board capacity is realized, and the detection and the processing of the collected image of the whole circuit board are better facilitated.
Referring to fig. 2, the working principle of the circuit board image capturing device provided by the utility model is as follows: the dashed line in fig. 2 is a transfer stroke of the circuit board 12, wherein the upper dashed line is a stroke of the upper suction table 6 for transferring the circuit board 12, and the lower dashed line is a stroke of the lower suction table 7 for transferring the circuit board 12.
In the transmission process, the upper adsorption table 6 moves to the left to a first position, namely above the material supporting mechanism 2, the material supporting mechanism 2 is lifted, the upper adsorption table 6 adsorbs the circuit board 12 again, and then the claw member is switched from a first state to a second state, and at this time, the circuit board 12 does not enter the view of the linear camera 3 of the first image acquisition device 91 yet; the upper adsorption table 6 moves right with the circuit board 12, and the lower surface of the lower camera 3 scans the line of the lower surface of the circuit board 12 during the transmission process.
The upper suction stage 6 goes to the right of the upper broken line to the second position, the lower suction stage 7 goes to the left of the lower broken line to the third position, at which time the upper suction stage 6 and the lower suction stage 7 are opposed up and down, and at which time the circuit board 12 has left the view of the line camera 3 of the first image pickup device 91; the upper suction table 6 is released, and the lower suction table 7 is sucked, and the circuit board 12 is not yet brought into the field of view of the linear camera 3 of the second image pickup device 92; in the right moving process of the lower adsorption table 7 with the circuit board 12, the linear camera 3 of the second image acquisition device 92 scans the line on the upper surface of the circuit board 12 until the fourth position, and the circuit board 12 leaves the view of the linear camera 3 at this time, so that the circuit board 12 does not need to be turned over or detected twice, and the circuit board can be stably and reliably transported and has high detection efficiency in the visual detection of the upper and lower surfaces of the circuit board 12 in one translational transport process.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is merely exemplary of the application and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the application and are intended to be comprehended within the scope of the application.
Claims (10)
1. A circuit board transmission device, comprising:
a material-carrying mechanism (2) configured to place a circuit board (12) to be transported;
the upper vacuum adsorption mechanism comprises a vacuumizing power device and an upper adsorption table (6) for performing vacuum adsorption on the upper surface of the circuit board (12), and the lower surface of the upper adsorption table (6) is higher than the upper surface of the material supporting mechanism (2);
the lower vacuum adsorption mechanism comprises a vacuumizing power device and a lower adsorption table (7) for performing vacuum adsorption on the lower surface of the circuit board (12), and the upper surface of the lower adsorption table (7) is lower than the lower surface of the upper adsorption table (6);
a lifting mechanism configured to drive the material carrying mechanism (2) and/or the upper adsorption stage (6) so as to shorten a distance between an upper surface of the material carrying mechanism (2) and a lower surface of the upper adsorption stage (6);
a drive assembly configured to drive the upper adsorption stage (6) between a first position and a second position, and to drive the lower adsorption stage (7) between a third position and a fourth position, wherein the first position is disposed opposite the material carrying mechanism (2), the second position is disposed opposite the third position, and the fourth position is further away from the upper adsorption stage (6) than the third position.
2. The circuit board conveying device according to claim 1, wherein the material supporting mechanism (2) comprises a lifting carrier plate surface (21) and a lifting cylinder (22) arranged below the lifting carrier plate surface (21), and the lifting stroke of the lifting cylinder (22) is configured to be smaller than or equal to the difference of the height difference between the lower surface of the upper adsorption table (6) and the upper surface of the lifting carrier plate surface (21) minus the thickness of the circuit board (12).
3. The circuit board transmission device according to claim 2, wherein the material supporting mechanism (2) further comprises a vacuumizing power device, and the jacking carrier plate surface (21) is provided with adsorption holes (211);
the actuator of the vacuumizing power device comprises a buffer sucker (23), and the buffer sucker (23) is configured to protrude out of the surface of the jacking carrier plate surface (21) through the adsorption hole (211).
4. The circuit board transmission device according to claim 1, wherein the upper adsorption table (6) is further provided with at least two claw members, one end of each claw member is pivotally connected with the upper adsorption table (6), and the other end of each claw member extends to the lower side of the upper adsorption table (6);
the other end of the claw piece is provided with an extension part which is close to the center of the upper adsorption table (6), the claw piece has a first state and a second state, and in the first state, the projection of the extension part and the circuit board (12) on the horizontal plane is not overlapped; in the second state, the extension part is positioned below a circuit board (12) adsorbed on the lower surface of the upper adsorption table (6) and is overlapped with the projection of the circuit board (12) on the horizontal plane.
5. The circuit board transfer device according to any one of claims 1 to 4, wherein the material loading mechanism (2) further comprises a positioning mechanism configured to position a circuit board (12) upon receiving the circuit board (12) from a preface conveyor.
6. A circuit board image capturing device, characterized by comprising a first image capturing device (91), a second image capturing device (92) and a circuit board transmission device according to any one of claims 1 to 5, wherein the first image capturing device (91) is arranged between a material carrying mechanism (2) and a lower adsorption table (7) of the circuit board transmission device, and the first image capturing device (91) is positioned below an upper adsorption table (6) of the circuit board transmission device;
the second image acquisition device (92) is arranged on one side, close to the lower adsorption table (7), of the upper adsorption table (6), and the second image acquisition device (92) is located above the lower adsorption table (7).
7. The circuit board image capturing device according to claim 6, wherein the first image capturing device (91) and the second image capturing device (92) each comprise a linear camera (3), a lens (4) and an illumination box (5), and the lens (4) and the illumination box (5) are in one-to-one correspondence with the linear camera (3);
the linear camera (3), the lens (4) and the illumination box (5) of the first image acquisition device (91) are arranged from bottom to top, and the linear camera (3), the lens (4) and the illumination box (5) of the second image acquisition device (92) are arranged from top to bottom.
8. The circuit board image capturing device according to claim 7, wherein the first image capturing device (91) and the second image capturing device (92) each have a plurality of linear cameras (3) arranged side by side, the visual field optical paths of two adjacent linear cameras (3) of the first image capturing device (91) are configured with intersecting areas, and the visual field optical paths of two adjacent linear cameras (3) of the second image capturing device (92) are configured with intersecting areas.
9. The circuit board imaging device according to claim 8, characterized in that the plurality of side-by-side arranged linear cameras (3) are configured for independent focusing.
10. An optical inspection apparatus comprising a processor and a circuit board imaging device according to any one of claims 6 to 9, the processor being configured to perform data processing on an image acquired by the circuit board imaging device.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321670222.5U CN219434671U (en) | 2023-06-29 | 2023-06-29 | Circuit board transmission device, image capturing device and optical detection equipment |
| TW112211479U TWM650924U (en) | 2023-06-29 | 2023-10-24 | Circuit board transmission device, image capture device and optical detection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321670222.5U CN219434671U (en) | 2023-06-29 | 2023-06-29 | Circuit board transmission device, image capturing device and optical detection equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219434671U true CN219434671U (en) | 2023-07-28 |
Family
ID=87332284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321670222.5U Active CN219434671U (en) | 2023-06-29 | 2023-06-29 | Circuit board transmission device, image capturing device and optical detection equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN219434671U (en) |
| TW (1) | TWM650924U (en) |
-
2023
- 2023-06-29 CN CN202321670222.5U patent/CN219434671U/en active Active
- 2023-10-24 TW TW112211479U patent/TWM650924U/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWM650924U (en) | 2024-01-21 |
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