CN219085658U - Hard disk radiator and chassis internal structure - Google Patents

Abstract

The application relates to the technical field of radiators and provides a hard disk radiator and a chassis internal structure, and the hard disk radiator includes: the heat absorption seat, heat radiation structure and heat conduction pipe, the heat conduction pipe includes a plurality of pipeline sections of buckling through at least 2 times, a plurality of pipeline sections include first pipeline section and second pipeline section, the axis of first pipeline section with the axis of second pipeline section is in different planes each other, the heat absorption seat install in first pipeline section, heat radiation structure install in the second pipeline section, on the one hand, this hard disk radiator has reasonable, nimble spatial layout, on the other hand, and this hard disk radiator's heat dispersion has obtained very big promotion.

Description

Hard disk radiator and chassis internal structure

Technical Field

The present application relates to the field of heat sinks, and more particularly, to a hard disk heat sink and a chassis internal structure.

Background

Integrated circuits are used in large numbers in computer components. It is well known that high temperature is a major challenge for integrated circuits. The high temperature not only can cause unstable operation of the system and shorten the service life, but also can cause burning of certain parts. The heat that causes the high temperature is not from outside the computer, but inside the computer, or inside the integrated circuit. The radiator is used for absorbing the heat and then radiating the heat into or out of the case so as to ensure the normal temperature of computer components. Most heat sinks absorb heat by contacting the surface of the heat-generating component, and then transfer the heat to a remote location, such as the air in a chassis, by various means, and then the chassis transfers the hot air out of the chassis, thereby completing the heat dissipation of the computer.

The heat sinks are very many, and are required for CPUs, graphics cards, motherboard chipsets, hard disks, chassis, power supplies, and even optical drives and memories.

In particular to the field of hard disks, in particular to a solid state disk (Solid State Drives), which is called a fixed disk for short, wherein the solid state disk (Solid State Drive) is a hard disk made of a solid state electronic memory chip array and consists of a control unit and a memory unit (FLASH chip and DRAM chip). The solid state disk is identical to the common hard disk in the aspects of interface specification, interface definition, interface function and interface using method, and is identical to the common hard disk in the aspects of product appearance and product size. The method is widely applied to the fields of military, vehicle-mounted, industrial control, video monitoring, network terminals, electric power, medical treatment, aviation, navigation equipment and the like, and the M.2 architecture solid state disk in the prior art is large in capacity and high in reading speed, so that high heat is brought, heat is not dissipated in time, and the phenomena of reading delay, short service life and the like can occur.

In the prior art, the solid state disk of the M.2 architecture is positioned below the CPU and above the display card, and after the computer host is assembled, the size space on the solid state disk is very small, and the volume of the radiating fin of the existing solid state disk cannot be too large, so that the radiating performance of the solid state disk radiator in the prior art is not high.

Disclosure of Invention

The utility model mainly aims to provide a hard disk radiator and aims to solve the technical problem that the heat radiation performance of the hard disk radiator in the prior art is poor.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a hard disk heat sink, the hard disk heat sink comprising:

the heat-conducting pipe comprises a plurality of pipe sections which are bent for at least 2 times, wherein the pipe sections comprise a first pipe section and a second pipe section, the axes of the first pipe section and the axes of the second pipe section are positioned on different planes, the heat-absorbing seat is installed on the first pipe section, and the heat-radiating structure is installed on the second pipe section.

Further, the plurality of tube sections include an intermediate transition tube section, the first tube section, the intermediate transition tube section, and the second tube section are connected in order, the first tube section with the intermediate transition tube section forms a first bend, and the intermediate transition tube section and the second tube section form a second bend.

Further, the axis of the first tube section and the axis of the second tube section are perpendicular to each other.

Further, the heat dissipation structure is located above or below the end side of the heat absorption seat in the length direction.

Further, the number of the heat conductive pipes is at least 2.

Further, the heat dissipation structure comprises a plurality of heat dissipation fins which are arranged at intervals along the axial direction of the second pipe section.

Further, the heat absorbing seat is a copper seat or an aluminum seat.

Further, the hard disk radiator further comprises a back plate, the back plate is connected with the heat absorbing seat, and a hard disk is installed between the back plate and the heat absorbing seat.

Further, a heat-conducting adhesive is arranged between the hard disk and the heat-absorbing seat.

In addition, the utility model also provides an internal structure of the case, which comprises a CPU, a display card and a fan, wherein the internal structure of the case also comprises the hard disk radiator, the heat absorption seat is positioned between the CPU and the display card, and the heat dissipation structure is positioned on the air outlet side of the fan.

The beneficial effect of hard disk radiator that this application provided lies in:

in the hard disk radiator provided by the utility model, the axis of the first pipe section and the axis of the second pipe section are positioned in different planes, the heat absorption seat is arranged on the first pipe section, and the heat dissipation structure is arranged on the second pipe section, so that the heat dissipation structure can be arranged in different directions relative to the heat absorption seat, for example, when the heat absorption seat is arranged between the CPU and the display card (below the CPU and above the display card) in the chassis, the heat absorption seat is arranged on the first pipe section through at least 2 bending actions of the heat conduction pipe, and the heat dissipation structure is arranged on the second pipe section, so that the heat dissipation structure is not positioned between the CPU and the display card any more, but is positioned at other needed positions, for example, on the air outlet side of a CPU fan or other fans in the chassis, so that the heat dissipation structure is not limited to a specific installation space (for example, the space between the CPU and the display card), and the heat dissipation structure with larger size can be designed as much as possible, so that the radiator has a reasonable and flexible space layout of the hard disk, and the heat dissipation performance of the radiator is greatly improved.

In a further scheme, the heat dissipation structure is located above or below the end side of the heat absorption seat in the length direction, so that the heat dissipation structure is far away from the end side of the heat absorption seat as far as possible, and the heat dissipation structure can be flexibly distributed to a proper space farther.

In a further aspect, the heat dissipation structure includes a plurality of heat dissipation fins arranged at intervals along the axial direction of the second tube section, and the greater the number of the heat dissipation fins, the greater the heat dissipation capability of the heat dissipation structure can be increased.

In a further scheme, heat conducting glue is arranged between the hard disk and the heat absorbing seat, so that heat of the hard disk is better conducted to the heat absorbing seat.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following description will briefly introduce the drawings that are needed in the embodiments or the description of the prior art, it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a perspective view of a hard disk heat sink according to one embodiment of the present application;

FIG. 2 is a side view of a hard disk heat sink provided in one embodiment of the present application;

fig. 3 is a perspective view of a hard disk heat sink according to an embodiment of the present application when the number of heat pipes is 2;

FIG. 4 is a perspective view of a back plate in a hard disk heat sink according to one embodiment of the present application;

fig. 5 is a partial perspective view of an internal structure of a chassis according to an embodiment of the present application.

Reference numerals related to the above figures are as follows:

1-a hard disk;

2-a heat absorbing seat;

3-a heat dissipation structure;

4-a back plate;

5-screws;

6-a fan;

7-a case;

100-heat conducting pipes;

101-a first pipe section;

102-a second pipe section;

103-intermediate transition pipe section.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

For the purpose of illustrating the technical solutions described herein, the following detailed description is provided with reference to specific drawings and examples.

Referring to fig. 1 to 4, an embodiment of the present utility model provides a hard disk heat sink, which may be particularly used as a heat sink of a solid state disk, but does not exclude heat dissipation for other types of hard disks, and even heat dissipation for other non-hard disk devices, where the hard disk heat sink includes: the heat sink base 2, the heat dissipation structure 3 and the heat conduction pipe 100, of course, do not exclude that the hard disk heat sink further comprises other parts than the heat sink base 2, the heat dissipation structure 3 and the heat conduction pipe 100.

The heat conducting pipe 100 includes a plurality of pipe sections that are bent at least 2 times, the plurality of pipe sections includes a first pipe section 101 and a second pipe section 102, axes of the first pipe section 101 and the second pipe section 102 are located on different planes, the heat absorbing seat 2 is mounted on the first pipe section 101, and the heat dissipating structure 3 is mounted on the second pipe section 102.

As can be seen from the above, in the hard disk radiator provided by the present utility model, the axis of the first pipe section 101 and the axis of the second pipe section 102 are located in different planes, the heat absorbing seat 2 is mounted on the first pipe section 101, and the heat dissipating structure 3 is mounted on the second pipe section 102, so that the heat dissipating structure 3 can be arranged in different orientations with respect to the heat absorbing seat 2, for example, when the heat absorbing seat 2 is located between the CPU and the video card in the chassis (below the CPU and above the video card), the heat absorbing seat 2 is mounted on the first pipe section 101 through at least 2 bending actions of the heat conducting pipe 100, and the heat dissipating structure 3 is mounted on the second pipe section 102, so that the heat dissipating structure 3 is no longer located between the CPU and the video card, but is located at other required positions, for example, on the air outlet side of the CPU fan or other fan in the chassis, so that the heat dissipating structure 3 is not limited to a specific mounting space (for example, space between the CPU and the video card), and the heat dissipating structure 3 with a larger size can be designed as much as possible, so that the hard disk has a reasonable and flexible space layout, and the heat dissipating performance of the hard disk radiator is greatly improved.

Referring to fig. 1 and 3, according to one embodiment of the present utility model, the plurality of tube sections includes an intermediate transition tube section 103, a first tube section 101, the intermediate transition tube section 103, and a second tube section 102 are connected in sequence, the first tube section 101 forming a first bend with the intermediate transition tube section 103, the intermediate transition tube section 103 and the second tube section 102 forming a second bend.

In addition, the multiple tube sections in the embodiment of the present utility model are not limited to the three tube sections including the first tube section 101, the intermediate transition tube section 103 and the second tube section 102, and more tube sections may be designed as needed, and more bending may be performed to adapt and match more complex space layout requirements.

According to an embodiment of the present utility model, the axes of the first pipe section 101 and the second pipe section 102 are perpendicular to each other, however, according to other embodiments of the present utility model, the axes of the first pipe section 101 and the second pipe section 102 are not perpendicular to each other, and it is only necessary to satisfy that the axes of the first pipe section 101 and the second pipe section 102 are in different planes from each other.

Referring to fig. 2, according to an embodiment of the present utility model, the heat dissipation structure 3 is located above or below the end side of the heat absorption seat 2 in the length direction L, and the first pipe segment 101, the intermediate transition pipe segment 103 and the second pipe segment 102 form a bend and extend to meet the requirement of the present embodiment.

The present embodiment makes the heat dissipation structure 3 as far away from the end side of the heat absorption seat 2 as possible, so that it can be flexibly laid out to a further suitable space, and of course, the present embodiment is only a preferred embodiment, that is, even if the heat dissipation structure 3 is not located above or below the end side of the heat dissipation structure 3, it should fall within the protection scope of the present utility model.

Referring to fig. 1 to 3, according to an embodiment of the present utility model, the number of heat pipes 100 is at least 2, for example, preferably 2, but 3, 4 or more heat pipes 100 are possible, and of course, each heat pipe 100 is required to have the above-mentioned bending manner and the layout manner of the first pipe section 101 and the second pipe section 102 in terms of structural design, regardless of the number of heat pipes 100.

Referring to fig. 1 and 2, according to an embodiment of the present utility model, the heat dissipation structure 3 includes a plurality of heat dissipation fins 31 arranged at intervals along the axial direction of the second tube section 102, and the heat dissipation capability of the heat dissipation structure 3 is increased as the number of the heat dissipation fins 31 is increased, and holes through which the second tube section 102 of the heat conduction tube 100 passes are formed in the heat dissipation fins 31, so that each heat dissipation fin 31 is conveniently installed on the second tube section 102.

Based on the same principle, the heat absorption seat 2 may also be provided with a hole through which the first tube section 101 of the heat conduction tube 100 passes, so that the heat absorption seat 2 is conveniently inserted (installed) in the first tube section 101, and the insertion manner can further increase the contact area between the heat dissipation fins 31 and the heat absorption seat 2 and the heat conduction tube 100, and of course, the heat dissipation structure 3 is not limited to a plurality of heat dissipation fins 31, but may be other heat dissipation structures, such as a heat dissipation tube, etc.

Of course, this embodiment is only a preferred embodiment, that is, even if the heat sink fins 31 and the heat absorbing seat 2 are not provided with holes through which the heat pipe 100 passes, the heat sink fins 31 and the heat absorbing seat 2 may be connected in contact with the heat pipe 100 by other connection means.

According to an embodiment of the present utility model, the heat absorbing seat 2 is a copper seat or an aluminum seat, and of course, the heat absorbing seat 2 is not limited to be made of copper or aluminum, as long as it can meet the corresponding heat dissipation requirement.

Similarly, the heat conducting tube 100 may be a copper tube, an aluminum tube, or other materials meeting the corresponding heat dissipation requirements, and the heat dissipation fins 31 may be copper sheets, aluminum sheets, or other materials meeting the corresponding heat dissipation requirements.

Referring to fig. 1, 2 and 4, according to an embodiment of the present utility model, the hard disk heat sink further includes a back plate 4, the back plate 4 is connected to the heat absorbing seat 2, and the hard disk 1 is installed between the back plate 4 and the heat absorbing seat 2.

As a specific embodiment, the back plate 4 may be connected to the heat absorbing seat 2 by the skirts 41 on two sides through the screws 5, but other connection manners are not excluded, for example, a plugging connection manner, a clamping connection manner and the like may be adopted between the back plate 4 and the heat absorbing seat 2.

According to an embodiment of the utility model, a heat-conducting glue is arranged between the hard disk 1 and the heat-absorbing seat 2, and in addition, a heat-conducting glue can be arranged between the hard disk 1 and the back plate 4, so that heat of the hard disk 1 can be better conducted to the heat-absorbing seat 2, the heat-conducting glue can be specifically silica gel which is prepared by mixing organic silica gel as a main body, polymer materials such as filling materials, heat-conducting materials and the like, and has better heat conduction and electrical insulation properties, but the heat-conducting glue adopting other proper materials is not excluded.

Referring to fig. 5, the present utility model further provides a chassis internal structure, which is located in the chassis 7, and the chassis internal structure may specifically be an internal structure of a main chassis of a computer, but does not exclude the internal structure of the chassis as other suitable devices.

Specifically, the internal structure of the case includes the CPU and the fan 6, where the internal structure of the case further includes the hard disk radiator, the heat absorbing seat 2 is located below the CPU, and the heat dissipating structure 3 is located at the air outlet side of the fan 6, so that the air flow blown by the fan 6 can directly act on the heat dissipating structure 3 to achieve the purpose of cooling and dissipating the heat of the heat dissipating structure 3, and it is understood that if other devices capable of performing a cooling function are adopted to replace the fan 6 in the present utility model, it should be regarded as being equivalent to the fan 6, and such an alternative scheme should also fall into the scope of protection of the present utility model.

The fan 6 in the utility model can be a CPU fan or other fans in the chassis, and the heat dissipation principle of the hard disk radiator applied in the internal structure of the chassis is that the heat absorption seat 2 is utilized to absorb the heat on the hard disk 1, the heat is transmitted to the heat dissipation structure 3 through the heat conduction pipe 100, and the purpose of dissipating the heat of the hard disk 1 is achieved by utilizing the airflow effect of the CPU fan or other fans in the chassis.

The foregoing description of the preferred embodiments is merely exemplary in nature and is in no way intended to limit the utility model, since it is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the utility model.

Claims (10)

1. A hard disk heat sink, the hard disk heat sink comprising:

the heat-conducting pipe comprises a plurality of pipe sections which are bent for at least 2 times, wherein the pipe sections comprise a first pipe section and a second pipe section, the axes of the first pipe section and the axes of the second pipe section are positioned on different planes, the heat-absorbing seat is installed on the first pipe section, and the heat-radiating structure is installed on the second pipe section.

2. The hard disk heat sink of claim 1 wherein the plurality of tube segments comprises an intermediate transition tube segment, the first tube segment, intermediate transition tube segment, and second tube segment being connected in sequence, the first tube segment forming a first bend with the intermediate transition tube segment, the intermediate transition tube segment and second tube segment forming a second bend.

3. The hard disk heat sink of claim 1 wherein the axis of the first tube section and the axis of the second tube section are perpendicular to each other.

4. The hard disk heat sink according to claim 1, wherein the heat radiation structure is located above or below a longitudinal end side of the heat absorbing seat.

5. The hard disk heat sink of claim 1 wherein the number of heat pipes is at least 2.

6. The hard disk heat sink of claim 1 wherein the heat dissipating structure comprises a plurality of heat dissipating fins spaced apart along the axial direction of the second tube section.

7. The hard disk heat sink as claimed in any one of claims 1 to 6, wherein the heat absorbing seat is a copper seat or an aluminum seat.

8. The hard disk heat sink as claimed in any one of claims 1 to 6, further comprising a back plate connected to the heat absorbing seat, a hard disk being mounted between the back plate and the heat absorbing seat.

9. The hard disk heat sink of claim 8 wherein a thermally conductive adhesive is disposed between the hard disk and the heat sink base.

10. The internal structure of the chassis comprises a CPU, a display card and a fan, and is characterized in that the internal structure of the chassis further comprises a hard disk radiator according to any one of claims 1 to 9, the heat absorption seat is positioned between the CPU and the display card, and the heat dissipation structure is positioned on the air outlet side of the fan.

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