CN219042392U

CN219042392U - Fin group structure

Info

Publication number: CN219042392U
Application number: CN202223430442.9U
Authority: CN
Inventors: 吴创博; 曹佳勇; 向宇飞
Original assignee: Guangdong Hongqin Communication Technology Co Ltd
Current assignee: Guangdong Hongqin Communication Technology Co Ltd
Priority date: 2022-12-21
Filing date: 2022-12-21
Publication date: 2023-05-16
Anticipated expiration: 2032-12-21

Abstract

The present disclosure relates to heat dissipation structures for electronic products, and more particularly to a fin assembly structure. The fin group structure comprises a bottom plate, a plurality of fins which are vertical and are arranged on the bottom plate side by side, and a top plate which is arranged above the fins, wherein a first heat dissipation channel which extends along a first direction is formed between any two adjacent fins; the fins are provided with through grooves along the thickness direction of the fins, and the grooves of adjacent fins are arranged along a second direction to form a second heat dissipation channel; the second direction is perpendicular to the first direction, and the second direction is the thickness direction of the fin. The fin group structure in this application has first heat dissipation channel and second heat dissipation channel, increases the area of contact of air current and fin group, simultaneously, because the amount of wind and the wind speed in a plurality of first heat dissipation channels are all different, the air current that circulates along the second heat dissipation channel helps balancing the pressure of air current in each first heat dissipation channel to make the heat evenly scatter, and then promote the radiating cooling effect of fin group structure.

Description

Fin group structure

Technical Field

The present disclosure relates to heat dissipation structures for electronic products, and more particularly to a fin assembly structure.

Background

With the continuous increase of power of electronic components such as a central processing unit (central processing unit, CPU), a graphics processor (graphics processing unit, GPU), etc., heat dissipation is becoming more and more important, especially in various portable electronic devices such as notebook computers. In order to efficiently remove heat generated by the system in a limited space, a heat dissipation module consisting of a fin set, a heat pipe and a heat dissipation fan is mainly used in the industry to dissipate heat of an electronic component. The heat conduction path of this embodiment is: the heat generated by the electronic component is transferred to the fin group through the heat pipe, the heat radiating area is increased through the design of the fin group, and wind power is provided for blowing to the fin group through the heat radiating fan, so that the fin group and the outside air are subjected to heat exchange, and the purpose of heat radiation is achieved.

The existing fin group comprises a plurality of radiating fins which are arranged in parallel, a radiating channel is formed between any two adjacent radiating fins, one end of the fin group faces to the air outlet of the radiating fan along the extending direction of the radiating channel, and air flow generated by the fan enters the radiating channel.

Disclosure of Invention

The application discloses a fin group structure is in order to solve the not good problem of current fin group radiating effect.

In order to achieve the above purpose, the present application provides the following technical solutions:

in a first aspect, the present application provides a fin group structure, where the fin group structure includes a bottom plate, a plurality of fins vertically arranged on the bottom plate side by side, and a top plate arranged above the plurality of fins, and a first heat dissipation channel extending along a first direction is formed between any two adjacent fins; the fins are provided with through grooves along the thickness direction of the fins, and the grooves of adjacent fins are arranged along a second direction to form a second heat dissipation channel; the second direction is perpendicular to the first direction, and the second direction is the thickness direction of the fin.

Further, along the arrangement direction of the fins, at least a plurality of fins located in the middle are provided with grooves.

Further, along the first direction, any fin is provided with a plurality of grooves which are arranged side by side.

Further, the dimension of the slot is 1mm or more along the first direction.

Further, in the first direction, a distance L between two adjacent grooves is 2 mm.ltoreq.L.ltoreq.5 mm.

Further, along the height direction of the fin, the distance between the slot and the edge of the fin is greater than or equal to 1mm.

Further, along the first direction, the fin comprises a first sheet body and a second sheet body connected with the first sheet body, and the height of the first sheet body is lower than that of the second sheet body; the first sheet body is positioned at one end of the fin group structure, which faces the fan for heat dissipation.

Further, the first sheet body and the second sheet body are connected through the connecting sheet body, and the height of the connecting sheet body gradually increases from one end of the connecting sheet body connected with the first sheet body to one end of the connecting sheet body connected with the second sheet body.

Further, the device also comprises short fins at least partially arranged between any two adjacent second sheets, and the size of the short fins is smaller than that of the bottom plate along the first direction.

Further, the short fins are provided with slots.

The utility model provides a fin group structure, wherein, bottom plate, roof and arbitrary two adjacent fins enclose and establish the first heat dissipation channel that forms along first direction extension, the air current that radiator fan produced gets into first heat dissipation channel to along first direction motion, when moving to fluting department, partial air current gets into second heat dissipation channel, thereby increase the area of contact of air current and fin group, simultaneously, because the amount of wind and the wind speed in a plurality of first heat dissipation channels are all different, the air current that circulates along second heat dissipation channel helps balancing the pressure of air current in each first heat dissipation channel, thereby make the heat evenly scatter, and then promote the cooling effect of fin group structure.

Drawings

Fig. 1 is a schematic structural diagram of a fin group structure according to an embodiment of the present application;

fig. 2 is a cross-sectional view of a fin group structure according to one embodiment of the present application;

fig. 3 is a schematic structural diagram of a fin group structure according to another embodiment of the present disclosure;

fig. 4 is a schematic structural view of a fin according to an embodiment of the present disclosure;

fig. 5 is a schematic diagram of an internal structure of a notebook with a fin set structure according to an embodiment of the present application.

Reference numerals:

10-fin group structure; 20-a heat conduction pipe; 30-CPU;40-GPU; 100-a bottom plate; 200-fins; 300-top plate; 210-a first sheet; 220-a second sheet; 230-connecting the sheet body; 400-short fins;

01-a first heat dissipation channel; 02-slotting; 03-second heat dissipation channel.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

Fig. 1 is a schematic structural view of a fin group structure according to an embodiment of the present application, fig. 2 is a cross-sectional view of a fin group structure according to an embodiment of the present application, fig. 3 is a schematic structural view of a fin group structure according to another embodiment of the present application, and referring to fig. 1 to 3 together, the embodiment of the present application provides a fin group structure 10, where the fin group structure 10 includes a bottom plate 100, a plurality of fins 200 vertically arranged on the bottom plate 100 side by side, and a top plate 300 arranged above the plurality of fins 200, and a first heat dissipation channel 01 extending along a first direction is formed between any two adjacent fins 200; along the thickness direction of the fins 200, the fins 200 are provided with through grooves 02, and the grooves 02 of adjacent fins 200 are arranged along the second direction to form a second heat dissipation channel 03; the first direction is the x direction in fig. 1 or fig. 2, the second direction is the y direction in fig. 1 or fig. 2, the second direction is also the thickness direction of the fin 200, and the second direction is perpendicular to the first direction.

The fin group structure 10 may have grooves 02 in the fins 200, or may have grooves 02 in some of the fins 200. Preferably, along the arrangement direction y of the fins 200, at least the fins 200 located in the middle are provided with grooves 02, i.e. the fins 200 at the two ends along the second direction y are not provided with grooves 02, so that air flows between the fins 200, and the heat dissipation capability of the fin group structure 10 is improved.

It will be appreciated that the number of fins 200 provided with slots 02 is not limited in this application, and that, with reference to fig. 2, at least the first fin 200 and the last fin 200 are not designed with slots 02 in the second direction y in order to prevent wind from flowing out of the fin group structure 10.

Wherein, along the first direction x, any fin 200 may be provided with one, two or more slots 02. With continued reference to fig. 2, in a first direction x, any one fin 200 is provided with a plurality of slots 02 disposed side-by-side. Properly increasing the number of slots 02 promotes airflow between the fins 200, thereby improving the heat dissipation capacity of the fin group structure 10, and at the same time, reducing the weight of the fin group structure 10.

Fig. 4 is a schematic structural diagram of a fin according to an embodiment of the present application, and referring to fig. 4, a dimension d of a slot 02 is greater than or equal to 1mm along a first direction x, which is convenient for processing and manufacturing. Of course, the dimension d of the slot 02 is not too large.

With continued reference to fig. 4, in the first direction x, the spacing L between two adjacent slots 02 is greater than or equal to 2mm. Too small a spacing L between adjacent slots 02 reduces the strength of the fin 200.

In an alternative of this embodiment, the spacing L between two adjacent slots 02 in the first direction x is less than or equal to 5mm. While ensuring the strength of the fins 200, the proper increase in the number of slots 02 helps to promote airflow between the fins 200.

Preferably, the distance L between two adjacent grooves 02 is 4 mm.ltoreq.L.ltoreq.5 mm.

In an alternative of this embodiment, the distance between the slot 02 and the edge of the fin 200 is 1mm or more along the height direction of the fin 200. In the above-mentioned range, the height of the slot 02 is not limited in the embodiment of the present application, and specifically, the design can be performed by comprehensively considering the heat dissipation requirement and the processing difficulty.

With continued reference to fig. 4, along a first direction x, the fin 200 includes a first blade 210 and a second blade 220 connected to the first blade 210, the first blade 210 having a height lower than the second blade 220; the first sheet body 210 is located at one end of the fin group structure 10 facing the fan for heat dissipation, the second sheet body 220 is located at one end of the fin group structure 10 facing the air outlet of the electronic device, and increasing the height of the second sheet body 220 can increase the cross-sectional area of one end of the first heat dissipation channel 01 facing the air outlet of the electronic device, so that hot air in the first heat dissipation channel 01 smoothly flows out of the first heat dissipation channel 01 and is discharged through the air outlet of the electronic device.

In summary, the motion trace of the airflow in the fin group structure 10 is specifically described as follows:

the air flow generated by the heat dissipation fan enters the first heat dissipation channel 01 from one end of the first sheet 210 and moves along the first direction, when moving to the slot 02, part of the air flow enters the second heat dissipation channel, so that the air flow fully flows between the fins 200, and becomes hot air after heat exchange with the fins 200, the hot air flows out towards one end of the electronic device through the first heat dissipation channel 01, and finally flows out through an air outlet of the electronic device. The fin group structure 10 in the embodiment of the application can significantly improve the heat dissipation performance of the electronic device.

The electronic device may be a notebook, a desktop computer, or the like.

In an alternative of this embodiment, the first sheet 210 and the second sheet 220 are connected by the connecting sheet 230, and the height of the connecting sheet 230 gradually increases from the end of the connecting sheet 230 connected to the first sheet 210 to the end of the connecting sheet 230 connected to the second sheet 220. The function of the connecting piece 230 is to provide a smooth transition between the first piece 210 and the second piece 220.

The first sheet 210, the second sheet 220, and the connecting sheet 230 may be integrally formed, or may be connected by welding, fastening, bonding, or the like.

Fig. 5 is a schematic diagram of an internal structure of a notebook with a fin group structure according to an embodiment of the present application, referring to fig. 5, two fin group structures 10 are disposed in the notebook, one of which is connected with a CPU30 through a heat pipe 20, and the other of which is connected with a GPU40 through the heat pipe 20, so that heat of the CPU30 and the GPU40 is transferred to the fin group structure 10 through the heat pipe 20.

In general, in order to meet the safety specification and save space, the space between the adjacent fins 200 in the fin group structure 10 of the notebook computer, that is, the width of the first heat dissipation channel 01 is within 1.0mm, so that the wind resistance when the air flow generated by the fan enters the fin group structure 10 is very large, and the use rate of the air quantity of the fan is not high.

In view of this, the fin assembly structure 10 in the embodiment of the present application further includes the short fins 400 at least partially disposed between any two adjacent second sheets 220, and the dimension of the short fins 400 is smaller than the dimension of the bottom plate 100 along the first direction x, that is, the short fins 400 do not extend between the ends of the first sheets 210 away from the second sheets 220, so that the width of the heat dissipation channel of the fin assembly structure 10 towards one end of the fan is greater than the width of the heat dissipation channel at the other end, thereby reducing the resistance when the air flow generated by the fan enters the fin assembly structure 10 and improving the utilization rate of the air volume of the fan.

In order to meet the safety specification, the width of the heat dissipation channel far away from one end of the fan is ensured to be within 1.0 mm. The specific position of the short fin 400 is not set in the application, and the short fin 400 may be disposed in the middle of two adjacent second sheets 220, that is, the distance between the short fin 400 and two adjacent second sheets 220 is equal and the distance is within 1.0 mm; of course, the distance between the short fin 400 and the adjacent two second sheets 220 is different, as long as the two distances are within 1.0 mm. The design of the short fins 400 not only reduces the resistance to the wind of the fan, but also reduces the cost and weight of the fin group.

In an alternative to this embodiment, with continued reference to fig. 2, the short fin 400 is provided with a slot 02. The principle of setting the slot 02 on the short fin 400 may refer to the design principle of the slot 02 on the fin 200, which is not described herein.

The fin group structure of the present application will be described in further detail with reference to specific examples and comparative examples.

Example 1

This embodiment is a fin group structure, namely B, referring to fig. 2, which includes long fins and short fins arranged at intervals.

Comparative example 1

The embodiment is a fin group structure, namely a, the fin size of the fin group structure is consistent, and other structures are the same as those of the fin group structure in embodiment 1.

Performance tests were performed on notebooks assembled from the fin pack structures of example 1 and comparative example 1, and specific data are shown in table 1 below:

TABLE 1

As can be seen from the data in table 1 for the embodiment 1 and the comparative example 1, the temperatures of the C-shell, D-shell, keyboard and keyboard rack of the notebook containing the fin group structure B in the embodiment 1 are significantly lower than the temperatures of the corresponding parts of the notebook containing the fin group structure a in the comparative example 1, which means that the fin group structure in the embodiment of the present application can significantly reduce the resistance to the fan and improve the heat dissipation capacity of the fin group structure, thereby greatly improving the heat dissipation of the chip, the shell temperature and the keyboard of the entire notebook system, and helping to improve the performance of the notebook.

It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to cover such modifications and variations.

Claims

1. The fin group structure is characterized by comprising a bottom plate, a plurality of fins which are vertical and arranged on the bottom plate side by side, and a top plate arranged at the tops of the fins, wherein a first heat dissipation channel extending along a first direction is formed between any two adjacent fins; along the thickness direction of the fins, the fins are provided with through grooves, and the grooves of adjacent fins are arranged along a second direction to form a second heat dissipation channel;

the second direction is perpendicular to the first direction, and the second direction is the thickness direction of the fin.

2. The fin group structure according to claim 1, wherein at least a plurality of the fins located in the middle are provided with the grooves along the arrangement direction of the fins.

3. The fin stock structure of claim 1, wherein in said first direction, any one of said fins is provided with a plurality of said slots disposed side-by-side.

4. A fin stock structure according to claim 3, wherein the slot has a dimension of 1mm or greater in the first direction.

5. A fin stock structure according to claim 3, wherein the spacing L between two adjacent slots is 2mm L5 mm in the first direction.

6. The fin group structure of any one of claims 1 to 5, wherein a distance between the groove and an edge of the fin is 1mm or more in a height direction of the fin.

7. The fin stock structure of any one of claims 1-5, wherein in the first direction, the fin comprises a first blade and a second blade connected to the first blade, the first blade having a height that is lower than a height of the second blade;

the first sheet body is positioned at one end of the fin group structure, which faces to the fan for heat dissipation.

8. The fin set structure of claim 7, wherein the first blade and the second blade are connected by a connecting blade, and the height of the connecting blade gradually increases from an end of the connecting blade connected to the first blade to an end of the connecting blade connected to the second blade.

9. The fin stock structure of claim 7, further comprising a short fin at least partially disposed between any two adjacent second sheets, the short fin having a dimension in the first direction that is less than a dimension of the base plate.

10. The fin stock structure of claim 9, wherein the short fins are provided with the slots.