CN218976923U

CN218976923U - Circuit board structure embedded with capacitor layer

Info

Publication number: CN218976923U
Application number: CN202223145929.2U
Authority: CN
Inventors: 李记帆
Original assignee: Shenzhen Yintaiming Electronic Co ltd
Current assignee: Shenzhen Yintaiming Electronic Co ltd
Priority date: 2022-11-26
Filing date: 2022-11-26
Publication date: 2023-05-05
Anticipated expiration: 2032-11-26

Abstract

The utility model discloses a circuit board structure embedded with a capacitor layer, which comprises a circuit board body, wherein the circuit board body comprises a substrate layer, a glue filling layer and a capacitor layer, a first functional layer is arranged at the top of the circuit board body and comprises a polytetrafluoroethylene copper-clad foil layer and a polyurea coating layer, a second functional layer is arranged at the bottom of the circuit board body and comprises a glass cloth layer and a nickel plating layer, the inside of the substrate layer is provided with the glue filling layer, a capacitor layer is arranged in an inner cavity of the glue filling layer, and the polytetrafluoroethylene copper-clad foil layer is adhered to the top of the circuit board body. According to the utility model, the problems that the existing circuit board is low in strength and poor in corrosion resistance effect, and the circuit board is easy to damage are solved through the matching of the circuit board body, the substrate layer, the glue filling layer, the capacitor layer, the first functional layer, the polytetrafluoroethylene copper-clad foil layer, the polyurea coating layer, the second functional layer, the glass cloth layer, the nickel plating layer and the radiating holes.

Description

Circuit board structure embedded with capacitor layer

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a circuit board structure embedded with a capacitor layer.

Background

The names of the circuit boards are: ceramic circuit board, aluminium oxide ceramic circuit board, aluminium nitride ceramic circuit board, PCB board, aluminium base board, high frequency board, thick copper, impedance board, PCB, ultra-thin circuit board, printed circuit board etc. the circuit board makes the circuit miniaturized, the observability plays important roles to fixed circuit's batch production and optimization electrical apparatus overall arrangement.

The utility model provides a circuit board structure embedded with a capacitor layer, which has the following bulletin number: CN215453379U, through the cross-layer embedded design of capacitor layer, realize that the circuit board possesses the filtering effect of different regions, different intensity or different scope, based on the cross-layer design of capacitor layer, adopt epoxy-glass fiber material to the adjacent filler layer of capacitor layer, guarantee that the capacitor layer can not fracture at the pressfitting process to guaranteed the bonding effect of capacitor layer and dielectric layer, current circuit board is not only low in intensity, and corrosion-resistant effect is poor moreover, leads to the circuit board to damage easily, for this reason, we propose a circuit board structure of embedding capacitor layer.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides a circuit board structure embedded with a capacitor layer, which has the advantage of difficult damage, and solves the problems that the existing circuit board is low in strength and poor in corrosion resistance effect, so that the circuit board is easy to damage.

Technical proposal

In order to achieve the above purpose, the present utility model provides the following technical solutions: the circuit board structure comprises a circuit board body, wherein the circuit board body comprises a base material layer, a glue filling layer and a capacitor layer, a first functional layer is arranged at the top of the circuit board body and comprises a polytetrafluoroethylene copper-clad foil layer and a polyurea coating layer, a second functional layer is arranged at the bottom of the circuit board body and comprises a glass cloth layer and a nickel plating layer.

Preferably, a glue filling layer is arranged on the inner side of the substrate layer, and a capacitor layer is arranged in an inner cavity of the glue filling layer.

Preferably, the polytetrafluoroethylene copper-clad foil layer is adhered to the top of the circuit board body, and the polyurea coating layer is coated on the top of the polytetrafluoroethylene copper-clad foil layer.

Preferably, the glass cloth layer is adhered to the bottom of the circuit board body, and the nickel plating layer is coated on the bottom of the glass cloth layer.

Preferably, the top of the circuit board body, the top of the first functional layer and the top of the second functional layer are provided with heat dissipation holes, the thickness of the polytetrafluoroethylene copper-clad foil layer is the same as that of the glass cloth layer, and the thickness of the polyurea coating layer is the same as that of the nickel plating layer.

Advantageous effects

Compared with the prior art, the utility model provides a circuit board structure embedded with a capacitor layer, which has the following beneficial effects:

according to the utility model, the problems that the existing circuit board is low in strength and poor in corrosion resistance effect, and the circuit board is easy to damage are solved through the matching of the circuit board body, the substrate layer, the glue filling layer, the capacitor layer, the first functional layer, the polytetrafluoroethylene copper-clad foil layer, the polyurea coating layer, the second functional layer, the glass cloth layer, the nickel plating layer and the radiating holes.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic cross-sectional view of a first functional layer according to the present utility model;

FIG. 3 is a schematic cross-sectional view of a second functional layer according to the present utility model;

fig. 4 is a schematic cross-sectional view of a circuit board body according to the present utility model.

In the figure: 1. a circuit board body; 11. a substrate layer; 12. a glue filling layer; 13. a capacitance layer; 2. a first functional layer; 21. a polytetrafluoroethylene copper-clad layer; 22. a polyurea coating layer; 3. a second functional layer; 31. a glass cloth layer; 32. a nickel plating layer; 4. and the heat dissipation holes.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1-4, a circuit board structure with a capacitor layer embedded therein includes a circuit board body 1, the circuit board body 1 includes a substrate layer 11, a filler layer 12 and a capacitor layer 13, a first functional layer 2 is disposed on top of the circuit board body 1, the first functional layer 2 includes a polytetrafluoroethylene copper-clad layer 21 and a polyurea coating layer 22, a second functional layer 3 is disposed on bottom of the circuit board body 1, and the second functional layer 3 includes a glass cloth layer 31 and a nickel-plated layer 32.

The inner side of the substrate layer 11 is provided with a glue filling layer 12, and the inner cavity of the glue filling layer 12 is provided with a capacitor layer 13.

The polytetrafluoroethylene copper-clad layer 21 is adhered to the top of the circuit board body 1, and the polyurea coating layer 22 is coated on the top of the polytetrafluoroethylene copper-clad layer 21.

By the above technical scheme, the polytetrafluoroethylene copper-clad layer 21 is excellent in electrical performance, heat resistance and mechanical strength, and the polyurea coating layer 22 is excellent in wear resistance, ageing resistance and corrosion resistance.

The glass cloth layer 31 is adhered to the bottom of the circuit board body 1, and the nickel plating layer 32 is coated on the bottom of the glass cloth layer 31.

Through the above technical scheme, through setting up glass cloth layer 31, have performances such as insulating, adiabatic, corrosion-resistant, incombustible, high temperature resistant and high strength, through setting up nickel coating 32, have corrosion-resistant, intensity is high and wear-resisting excellent performance.

The top of the circuit board body 1, the top of the first functional layer 2 and the top of the second functional layer 3 are respectively provided with a heat dissipation hole 4, the thicknesses of the polytetrafluoroethylene copper-clad layer 21 and the glass cloth layer 31 are the same, and the thicknesses of the polyurea coating layer 22 and the nickel plating layer 32 are the same.

Through above-mentioned technical scheme, through setting up louvre 4, make things convenient for the circuit board to dispel the heat.

When in use, the polytetrafluoroethylene copper-clad layer 21 has excellent electrical property, heat resistance and mechanical strength, the polyurea coating layer 22 has excellent wear resistance, ageing resistance and corrosion resistance, the glass cloth layer 31 has the properties of insulation, heat insulation, corrosion resistance, no combustion, high temperature resistance, high strength and the like, the nickel plating layer 32 has excellent corrosion resistance, high strength and wear resistance, and the heat dissipation holes 4 facilitate heat dissipation of the circuit board.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a circuit board structure of embedding capacitance layer, includes circuit board body (1), its characterized in that: the circuit board body (1) comprises a substrate layer (11), a glue filling layer (12) and a capacitor layer (13), a first functional layer (2) is arranged at the top of the circuit board body (1), the first functional layer (2) comprises a polytetrafluoroethylene copper-clad foil layer (21) and a polyurea coating layer (22), a second functional layer (3) is arranged at the bottom of the circuit board body (1), and the second functional layer (3) comprises a glass cloth layer (31) and a nickel plating layer (32).

2. A circuit board structure with embedded capacitor layer as claimed in claim 1, wherein: the inner side of the substrate layer (11) is provided with a filling layer (12), and the inner cavity of the filling layer (12) is provided with a capacitance layer (13).

3. A circuit board structure with embedded capacitor layer as claimed in claim 1, wherein: the polytetrafluoroethylene copper-clad layer (21) is adhered to the top of the circuit board body (1), and the polyurea coating layer (22) is coated on the top of the polytetrafluoroethylene copper-clad layer (21).

4. A circuit board structure with embedded capacitor layer as claimed in claim 1, wherein: the glass cloth layer (31) is adhered to the bottom of the circuit board body (1), and the nickel plating layer (32) is coated on the bottom of the glass cloth layer (31).

5. A circuit board structure with embedded capacitor layer as claimed in claim 1, wherein: the circuit board comprises a circuit board body (1), a first functional layer (2) and a second functional layer (3), wherein heat dissipation holes (4) are formed in the tops of the circuit board body, the polytetrafluoroethylene copper-clad layer (21) and the glass cloth layer (31) are the same in thickness, and the polyurea coating layer (22) and the nickel plating layer (32) are the same in thickness.