CN218727655U - Temperature rise fault monitoring system - Google Patents
Temperature rise fault monitoring system Download PDFInfo
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- CN218727655U CN218727655U CN202022308703.4U CN202022308703U CN218727655U CN 218727655 U CN218727655 U CN 218727655U CN 202022308703 U CN202022308703 U CN 202022308703U CN 218727655 U CN218727655 U CN 218727655U
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Abstract
Temperature rise fault monitoring system belongs to fault monitoring technical field, especially relates to a temperature rise fault monitoring system. The utility model provides a temperature rise fault monitoring system that excellent in use effect. The utility model discloses a temperature sensor, temperature collection station and data transmission part, the temperature measurement signal that its characterized in that temperature collection station gathered temperature sensor and sent, and temperature collection station's signal output port links to each other with data transmission part's signal input port.
Description
Technical Field
The utility model belongs to the technical field of the fault monitoring, especially, relate to a temperature rise fault monitoring system.
Background
The power switch cabinet is an important electrical device of a power plant and a transformer substation. In the long-term operation process of the electric contact in the switch cabinet and the loop cabinet, the impedance of the electric contact is easily increased and the contact surface is oxidized due to long-term overload and joint looseness of the electric contact or the joint of the bus bar and other parts, and local overheating and fire disasters are easily caused under the action of strong current and high voltage. Through the monitoring to power switch cabinet temperature, can know the operational aspect of power switch cabinet in real time, when monitoring the temperature rise trouble, can report to the police immediately and inform the information of maintainer fault point, in time eliminate the trouble hidden danger.
SUMMERY OF THE UTILITY MODEL
The utility model discloses be exactly to above-mentioned problem, provide a temperature rise fault monitoring system that excellent in use effect.
For realizing the above purpose, the utility model discloses a following technical scheme, the utility model discloses a temperature sensor, temperature collector and data transmission part, the temperature measurement signal that its characterized in that temperature collector gathered temperature sensor and sent, and temperature collector's signal output part links to each other with data transmission part's signal input part mouth.
As an optimal solution, temperature sensor adopts passive wireless temperature sensor.
As another preferred scheme, the signal of the passive wireless temperature sensor of the utility model is JT-CT-012430.
As another preferred scheme, passive wireless temperature sensor passes through the heat conduction adhesive and is connected fixedly with the temperature equipment that awaits measuring.
As another preferred scheme, the utility model discloses temperature sensor is a plurality of, and the interval between the adjacent temperature sensor is not less than 10CM.
As another preferred scheme, temperature collector includes RFID core circuit and RFID control circuit, and RFID control circuit's signal transmission port links to each other with RFID core circuit's signal transmission port.
As another kind of preferred scheme, RFID core circuit includes radio frequency module, power amplification portion, antenna, singlechip and power module, and the signal input port of singlechip links to each other with the signal output port of radio frequency module, and the signal input port of radio frequency module passes through power amplification portion tapping antenna, and power module's electric energy output port links to each other with the electric energy input port of singlechip, the electric energy input port of radio frequency module, the electric energy input port of power amplification portion respectively.
AS another preferred scheme, the rf module of the present invention includes an AS3991 chip U4, a pin 49 of U4 is connected to CLKSYS, a pin 50 of U4 is connected to CLK, a pin 51 of U4 is connected to a pin 38 of U4, one end of a capacitor C5, and 3V3, respectively, and the other end of the capacitor C4 and the other end of the capacitor C5 are grounded;
a pin 52 of the U4 is respectively connected with one end of a capacitor C17 and one end of a capacitor C11, and the other end of the C17 is respectively connected with the other end of the C11, one end of a capacitor C16, one end of a capacitor C15, one end of a capacitor C14, one end of a capacitor C10 and the ground; the other end of the capacitor C14 and the other end of the capacitor C10 are connected with a pin 54 of the U4, and the other end of the capacitor C16 and the other end of the capacitor C15 are connected with a pin 53 of the U4;
a pin 59 of the U4 is respectively connected with one end of a capacitor C23 and one end of a capacitor C24, and the other end of the capacitor C23 and the other end of the capacitor C24 are grounded;
the pin 60 of the U4 is respectively connected with one end of a capacitor C25 and one end of a resistor R9 through a resistor R8, the other end of the C25 is grounded, the other end of the R9 is respectively connected with one end of a resistor R10, the pin 62 of the U4 and one end of a capacitor C32, the other end of the C32 is grounded, the other end of the R10 is respectively connected with one end of a capacitor C30 and one end of a capacitor C31, and the other end of the capacitor C30 and the other end of the capacitor C31 are grounded;
a pin 63 of the U4 is respectively connected with one end of a capacitor C33 and one end of a capacitor C34, and the other end of the capacitor C33 and the other end of the capacitor C34 are grounded;
5V is respectively connected with one end of a capacitor C52 and one end of a capacitor C53, and the other end of the capacitor C52 and the other end of the capacitor C53 are grounded;
the pin 64 of the U4 is respectively connected with one end of a capacitor C50, one end of a capacitor C43, one end of a capacitor C44, one end of a capacitor C45, the pin 5 of the U4, the pin 13 of the U4, one end of a capacitor C48, one end of a capacitor C47, one end of a capacitor C49 and the pin 15 of the U4 through a capacitor C42, the other ends of the C50, the C48 and the C49 are grounded, the other end of the C43 is connected with the pin 1 of the U4, the other end of the C44 is connected with the pin 2 of the U4, the other end of the C45 is connected with the pin 3 of the U4, the other end of the C47 is connected with the pin 14 of the U4, and the pin 12 of the U4 is grounded through a capacitor C46;
a pin 16 of the U4 is respectively connected with a pin 17 of the U4, one end of a capacitor C40 and one end of a capacitor C41, and the other end of the capacitor C40 and the other end of the capacitor C41 are grounded;
the pin 19 of the U4 is respectively connected with one end of a capacitor C36, one end of a capacitor C37, one end of a capacitor C20, one end of a capacitor C21, one end of an inductor L3 and one end of an inductor L5, the other end of the capacitor C36, the other end of the capacitor C37, the other end of the capacitor C20 and the other end of the capacitor C21 are grounded, the other end of the L5 is respectively connected with the pin 32 of the U4, one end of a capacitor C28 and one end of a capacitor C13, the other end of the C28 is connected with the pin 6 of a Balun _0900BL18B100 chip T3, and the pin 4 of the T3 is respectively connected with the other end of the L3, the pin 33 of the U4 and the other end of the C13 through a capacitor C12;
a pin 34 of the U4 is respectively connected with one end of a capacitor C8 and one end of a capacitor C9;
a pin 37 of U4 is respectively connected with one end of a capacitor C79 and one end of a resistor R14 through a capacitor C78, the other end of C79 is grounded, the other end of R14 is connected with a pin 3 of a TCXO chip X1, pins 1 and 2 of X1 are grounded, a pin 4 of X1 is respectively connected with 3V3 and one end of a capacitor C55, and the other end of C55 is grounded;
a pin 39 of U4 is connected with EN, a pin 40 of U4 is connected with IRQ, and pins 41-48 of U4 are correspondingly connected with IO 0-IO 7 respectively.
As another preferred scheme, the power amplification part of the present invention includes an SPA-2118 chip U11, wherein pin 1 of U11 is connected to pin 4V5, one end of an inductor L4, one end of a capacitor C70, one end of a capacitor C71, one end of a capacitor C73, one end of a capacitor C72, and one end of an inductor L9, the other end of L4 is connected to pin 2 of resistor R15 and U11, the other end of R15 is connected to pin 3 of capacitor C68 and U11, the other end of C68 is connected to pin 2 of capacitor C67 and Balun _0900BL18B100 chip T3, the other end of C67 is grounded, pin 4 of U11 is connected to pin R21 and one end of capacitor C69, the other end of R21 is connected to pin 4V5, and the other end of C69 is grounded;
the other end of the L9 is respectively connected with a pin 5 of the U11, a pin 6 of the U11, a pin 7 of the U11, a pin 8 of the U11, one end of a capacitor C75 and one end of a capacitor C74, the other end of the C75 is grounded, the other end of the C74 is connected with a pin 1 of the LFCN-1000D + chip U6, a pin 2 of the U6 is connected with a pin 4 of the Coupler _ RCP890A05 chip T2, a pin 1 of the T2 is connected with the antenna J1, a pin 2 of the T2 is respectively connected with one end of a resistor R11 and one end of a resistor R12, and the other end of the resistor R11 and the other end of the resistor R12 are grounded; the pin 3 of the T2 is connected with the pin 2 of the Balun _0900BL18B100 chip T4 through the C51, the pin 4 of the T4 is connected with the pin 9 of the AS3991 chip U4 through the capacitor C76, and the pin 6 of the T4 is connected with the pin 7 of the AS3991 chip U4 through the capacitor C77.
As another preferred scheme, the single chip microcomputer of the present invention adopts a C8051F340 chip U1, a pin 11 of the U1 is respectively connected to a pin 10 of the 3V3 and U1, and one end of a capacitor C1, and the other end of the C1 is grounded;
the 12 pins of the U1 are respectively connected with 5V and one end of an inductor L1, the other end of the L1 is respectively connected with 1 pin of a USB connector J46, one end of a resistor R3 and 1 pin of a USB _ Mini _ B connector J11, and the other end of the R3 is connected with J5;
the other end of the S1 is respectively connected with the other end of the J40 and the ground, the other end of the R1 is connected with the other end of the J3, the other end of the R2, the other end of the R1, the other end of the Reset connector J40 and the other end of the switch S1, the other end of the R1 is connected with the 3V3, the other end of the C3 and the other end of the C2 are grounded, and the other end of the R4 is connected with the 15 pins of the U1;
the pin 8 of the U1 is respectively connected with the pin 2 of the J46 and the pin 3 of the J11;
the pin 9 of the U1 is respectively connected with the pin 3 of the J46 and the pin 2 of the J11;
the pin 22 of the U1 is connected with the cathode of the light-emitting diode D4, and the anode of the D4 is connected with 3V3 through a resistor R23;
the pin 21 of U1 is connected with the cathode of a light-emitting diode D5, and the anode of D5 is connected with 3V3 through a resistor R24;
the pins 17 and 16 of the U1 are correspondingly connected with the pins 2 and 3 of an SBUS connector J45 respectively,
the 36 pin of the U1 is connected with the cathode of the light-emitting diode D1 through a resistor R5, and the anode of the D1 is connected with 3V3;
a pin 37 of U1 is connected with EN, and a pin 38 of U1 is connected with CLK;
pins 39-46 of U1 are correspondingly connected with IO 7-IO 0 respectively;
the pin 3 of U1 is connected with IRQ, and the pin 4 of U1 is connected with PA _ xON;
AS another preferred solution, the power module of the present invention includes an AS1340_ TDFN8 chip U7, an AS1340_ TDFN8 chip U8, an AS1326A _ TDFN10 chip U9, and an AS1364_ TDFN8 chip U10, where pin 2 of U7 is respectively connected to one end of an inductor L7, 1 pin of U7, one end of a capacitor C22, one end of a capacitor C19, one end of a capacitor C54, one end of a capacitor C60, one end of an inductor L8, one end of a resistor R22, a cathode of a schottky diode D3, and one end of a fuse F1, the anode of the other end of the F1, which is connected with 3.6V and D3, is respectively connected with the ground, the other end of the capacitor C22, the other end of the capacitor C19, the other end of the capacitor C54, the pin 9 of the U7, the pin 7 of the U7, the one end of the resistor R17, the one end of the capacitor C80, the one end of the capacitor C59, the one end of the capacitor C57, the pin 8 of the U8, the pin 9 of the U8, the one end of the resistor R27, the one end of the capacitor C58, the other end of the C60, the pin 6 of the U9, the one end of the capacitor C63, the pin 3 of the U9, the pin 11 of the U9, the pin 7 of the U9, the one end of the resistor R20, the one end of the capacitor C62, the one end of the capacitor C61, the one end of the capacitor C64, the pin 8 of the U10, the pin 9 of the U10, the one end of the resistor R29 and the one end of the capacitor C65;
the other end of the L7 is respectively connected with a pin 5 of the U7 and the anode of a Schottky diode D2, the cathode of the D2 is respectively connected with one end of a capacitor C56, one end of a resistor R16, 5.5V, the other end of a capacitor C80, the other end of a capacitor C59, the other end of a capacitor C57, a pin 3 of the U8, a pin 4 of the U8, a pin 2 of the U8 and one end of a resistor R25, the other end of the R25 is respectively connected with a pin 6 of the U8, a pin 5 of the U8, one end of a resistor R28, 5V and the other end of the capacitor C58, and the other end of the R28 is respectively connected with a pin 7 of the U8 and the other end of the R27;
the other end of the L8 is connected with an 8 pin of the U9, the other end of the R22 is respectively connected with pins PA _ xON and U9, the other end of the C63 is respectively connected with pins 1 and 2 of the U9, the 4 pin of the U9 is respectively connected with the other end of the R20 and one end of a resistor R19, the other end of the R19 is respectively connected with a pin 5 of the U9, the other end of the C62 and one end of a resistor R18, the other end of the R18 is respectively connected with a pin 9 of the U9, the other end of the C61, the other end of the U0V, the other end of the C64, one end of a resistor R36, one end of a resistor R26, the other end of a pin 3 of the U10 and the other end of the U10, the other end of the R36 is respectively connected with pins EN _ PA and 2 of the U10, the other end of the R26 is respectively connected with a pin 5 of the U10, a pin 6 of the U10, one end of the resistor R30, the other end of the 4V5 and the other end of the capacitor C65, and the other end of the pin 7 of the U10 and the other end of the R29.
As another preferred scheme, the RFID control circuit of the present invention includes an SP-10S5-CE type 5V SOURCE chip, an admm 1201 chip, an MAX485 type 485 chip, a TLV1117LV33DCYR chip, wherein a pin 1 of the 5V SOURCE chip is connected to an anode of a diode D1, a cathode of the diode D1 is respectively connected to 5V-RF and one end of a resistor R2, the other end of the R2 is connected to an anode of a light emitting diode LD2, and a cathode of the LD2 is connected to GND; 3 pins of the 5V SOURCE chip are connected with L, and 4 pins of the 5V SOURCE chip are connected with N;
pins 1-7 of the 485 chip are correspondingly connected with 5Vin, RXDOUT, TXDOUT, GND, 485A, 485B and 485G respectively;
the 3 feet of the TLV1117LV33DCYR chip are respectively connected with 5Vin, the anode of a capacitor CT1 and one end of a capacitor C3, the cathode of the CT1 is respectively connected with the other end of the C3, GND, the 1 foot of the TLV1117LV33DCYR chip, one end of a capacitor C4, the cathode of a capacitor CT2 and the cathode of a light-emitting diode LD1, the 2 feet of the TLV1117LV33DCYR chip are respectively connected with the other end of the C4, 3V3-1, the anode of the CT2 and one end of a resistor R1, and the other end of the R1 is connected with the anode of the LD 1.
As another kind of preferred scheme, the data transmission part includes power supply unit, transmission module, singlechip and transceiver, and power supply unit's electric energy output port links to each other with transmission module's electric energy input port respectively, the electric energy input port of singlechip, the electric energy input port of transceiver, and the signal input port of transceiver links to each other with temperature collector's signal output port, and the signal output port of transceiver links to each other with the signal input port of singlechip, and the signal output port of singlechip links to each other with transmission module's signal input port.
As another preferred scheme, the transmission module adopts WH-NB73 chip U6, U6's 1, 2 feet link to each other with electric capacity C2 one end, electric capacity C10 positive pole, electric capacity C9 positive pole, V BATT respectively, the electric capacity C2 other end, electric capacity C10 negative pole, electric capacity C9 negative pole connect GND, U6's 5 feet connect NB _ Reload, U6's 9 feet connect NB _ Reset, U6's 14 feet connect NB _ Work, U6's 35 feet link to each other with resistance R12 one end, emitting diode LD1 negative pole respectively, R12 another end connects RXD, LD1 positive pole passes through resistance R10 and links to each other with VBATT, resistance R7 one end LD, R7 another end connects emitting diode 3 positive pole, LD3 negative pole links to each other with U6's 36 feet, resistance R11 one end respectively, R11 another end connects TXD.
As another preferred scheme, the power supply part includes L5973D chip U3 and TLV1117LV chip U7, U3's 8 feet link to each other with VCC, electric capacity C4 positive pole, electric capacity C5 positive pole respectively, electric capacity C4 negative pole, electric capacity C5 negative pole link to each other with electric capacity C7 one end, resistance R9 one end, U3's 3 feet, U3's 7 feet, diode D2 positive pole, resistance R8 one end, electric capacity C6 negative pole, GND respectively, the R9 other end passes through electric capacity C8 and links to each other with the C7 other end, U3's 4 feet respectively; a pin 5 of the U3 is respectively connected with the other end of the resistor R8 and one end of the resistor R3, the other end of the R3 is respectively connected with one end of the inductor L1, the positive electrode of the C6, the VBATT and one end of the capacitor C3, and the other end of the C3 is connected with the GND; the other end of the L1 is respectively connected with a pin 1 of the U3 and a cathode D2;
an INPUT end of the U7 is connected with VCC, an Output end of the U7 is respectively connected with a positive electrode of a capacitor C100, 3.3V, one end of the capacitor C22 and an anode of a light-emitting diode LED2, and a cathode of the LED2 is respectively connected with the ground, a GND end of the U7, a negative electrode of the C100 and the other end of the C22 through a resistor R27;
VBATT is connected to the anode of the light emitting diode LD2, and the cathode of the LD2 is connected to GND through a resistor R21.
As another preferred scheme, the single chip microcomputer of the present invention adopts STM32L476RGT6 chip U5, pins 16 and 17 of U5 are correspondingly connected with TXD and RXD, pins 41, 42 and 43 of U5 are correspondingly connected with RS485_ EN, TXD1 and RXD1, pins 46 and 49 of U5 are correspondingly connected with SW _ DIO and SW _ CLK, pin 5 of U5 is connected with pin 1 of CSTCE8M00G52 chip and one end of resistor R13, pin 6 of U5 is connected with pin 3 of CSTCE8M00G52 chip and the other end of resistor R13, pin 60 of U5 is connected with GND and one end of capacitor C13 through resistor R14, the other end of C13 is connected with pin 7 of U5, and 3.3V is connected with GND through capacitor C16; the capacitors C23-C29 are connected between 3.3V and GND in parallel;
u5 has pin 29 connected to Arm _ Work.
As another preferred scheme, the transceiver of the utility model adopts SN75176B chip U2, pin 1 of U2 connects with the cathode of diode D1, the anode of D1 connects with RXD1 and one end of resistor R2 respectively, the other end of R2 connects with 3.3v, pin 2 of U2 connects with RS485_ EN, pin 3 of U2, one end of resistor R6 respectively, pin 4 of U2 connects with TXD1;
the other end of R6 links to each other with ground, U2's 5 feet, resistance R5 one end respectively, the R5 other end links to each other with U2's 7 feet, B, resistance R4 one end respectively, the R4 other end links to each other with A, resistance R1 one end, U2's 6 feet respectively, the R1 other end links to each other with electric capacity C1 one end, U2's 8 feet, VCC respectively, the C1 other end ground connection.
As another preferred scheme, the data transmission part of the present invention comprises an NPN triode Q1, the collector of Q1 is connected to NB _ Reload and one end of a capacitor C12, respectively, and the other end of C12 is connected to GND; the base electrode of Q1 is respectively connected with one end of a resistor R17 and one end of a resistor R18, the other end of R17 is connected with Reload, and the other end of R18 is respectively connected with the emitting electrode of Q1 and GND.
As another preferred scheme, the data transmission part of the present invention comprises an NPN triode Q2, the collector of Q2 is connected to NB _ Reset and one end of a capacitor C11, respectively, and the other end of C11 is connected to GND; the base electrode of Q2 is respectively connected with one end of a resistor R23 and one end of a resistor R24, the other end of R23 is connected with Reset, and the other end of R24 is respectively connected with the emitting electrode of Q2 and GND.
Secondly, the data transmission part of the utility model comprises an NPN triode Q3, the collector electrode of the Q3 is respectively connected with one end of a cathode of the LED1 and one end of a capacitor C14, the other end of the C14 is connected with GND, and the anode of the LED1 is connected with VBATT through a resistor R15; the base electrode of Q3 is respectively connected with one end of a resistor R19 and one end of a resistor R22, the other end of R19 is connected with NB _ Work, and the other end of R22 is respectively connected with the emitter electrode of Q3 and GND.
In addition, the data transmission part of the utility model comprises an NPN triode Q4, the collector of the Q4 is respectively connected with the cathode of the LED3 and one end of a capacitor C15, the other end of the C15 is connected with GND, and the anode of the LED3 is connected with VBATT through a resistor R16; the base electrode of Q4 is respectively connected with one end of a resistor R20 and one end of a resistor R25, the other end of R20 is connected with Arm _ Work, and the other end of R25 is respectively connected with the emitter electrode of Q4 and GND.
The utility model has the advantages of.
The utility model discloses temperature sensor measurable quantity measured point temperature, the temperature measurement signal that temperature collection station gathered temperature sensor and sent, temperature collection station send the temperature measurement signal who gathers for the data transmission part, and the data transmission part can send temperature measurement information to the server, and the equipment maintenance personnel of being convenient for in time eliminate equipment trouble hidden danger to the temperature monitoring of equipment.
Drawings
The present invention will be further described with reference to the accompanying drawings and the following detailed description. The scope of protection of the present invention is not limited to the following description.
Fig. 1 is a schematic circuit diagram of the power module of the present invention.
Fig. 2 is a schematic diagram of the rf module circuit of the present invention.
Fig. 3, 4 and 5 are partially enlarged views of fig. 2.
Fig. 6 is a schematic diagram of the RFID control circuit of the present invention.
Fig. 7 is a schematic diagram of a transmission module circuit according to the present invention.
Fig. 8 and 10 are schematic diagrams of the circuit of the single chip microcomputer of the present invention.
Fig. 9 is a schematic circuit diagram of the data transmission part of the present invention.
Detailed Description
As shown in the figure, the utility model discloses a temperature sensor, temperature collection station and data transmission part, the temperature measurement signal that temperature collection station gathered temperature sensor and sent, temperature collection station's signal output port links to each other with data transmission part's signal input port.
The temperature sensor adopts a passive wireless temperature sensor (a sensor with model number of JT-CT-012430 can be adopted); the installation and the maintenance are convenient.
The passive wireless temperature sensor is fixedly connected with the equipment to be measured through the heat-conducting adhesive. The real-time temperature of the collected temperature equipment is transferred to the temperature sensor through the heat-conducting adhesive.
The temperature sensors are multiple, and the interval between every two adjacent temperature sensors is not less than 10CM; the wireless signal interference between the sensors is effectively weakened.
The temperature collector comprises an RFID core circuit and an RFID control circuit, and a signal transmission port of the RFID control circuit is connected with a signal transmission port of the RFID core circuit.
The RFID core circuit comprises a radio frequency module, a power amplification part, an antenna, a single chip microcomputer and a power supply module, wherein a signal input port of the single chip microcomputer is connected with a signal output port of the radio frequency module, a signal input port of the radio frequency module is connected with the antenna in a branching mode through the power amplification part, and an electric energy output port of the power supply module is connected with an electric energy input port of the single chip microcomputer, an electric energy input port of the radio frequency module and an electric energy input port of the power amplification part respectively.
The radio frequency module comprises an AS3991 chip U4, a pin 49 of the U4 is connected with CLKSYS, a pin 50 of the U4 is connected with CLK, a pin 51 of the U4 is respectively connected with a pin 38 of the U4, one end of a capacitor C5 and 3V3, and the other end of the capacitor C4 and the other end of the capacitor C5 are grounded;
a pin 52 of the U4 is respectively connected with one end of a capacitor C17 and one end of a capacitor C11, and the other end of the C17 is respectively connected with the other end of the C11, one end of a capacitor C16, one end of a capacitor C15, one end of a capacitor C14, one end of a capacitor C10 and the ground; the other end of the capacitor C14 and the other end of the capacitor C10 are connected with a pin 54 of the U4, and the other end of the capacitor C16 and the other end of the capacitor C15 are connected with a pin 53 of the U4;
a pin 59 of the U4 is respectively connected with one end of the capacitor C23 and one end of the capacitor C24, and the other end of the capacitor C23 and the other end of the capacitor C24 are grounded;
a pin 60 of the U4 is respectively connected with one end of a capacitor C25 and one end of a resistor R9 through a resistor R8, the other end of the C25 is grounded, the other end of the R9 is respectively connected with one end of a resistor R10, a pin 62 of the U4 and one end of a capacitor C32, the other end of the C32 is grounded, the other end of the R10 is respectively connected with one end of a capacitor C30 and one end of a capacitor C31, and the other end of the capacitor C30 and the other end of the capacitor C31 are grounded;
a pin 63 of the U4 is respectively connected with one end of a capacitor C33 and one end of a capacitor C34, and the other end of the capacitor C33 and the other end of the capacitor C34 are grounded;
5V is respectively connected with one end of a capacitor C52 and one end of a capacitor C53, and the other end of the capacitor C52 and the other end of the capacitor C53 are grounded;
the pin 64 of the U4 is respectively connected with one end of a capacitor C50, one end of a capacitor C43, one end of a capacitor C44, one end of a capacitor C45, the pin 5 of the U4, the pin 13 of the U4, one end of a capacitor C48, one end of a capacitor C47, one end of a capacitor C49 and the pin 15 of the U4 through a capacitor C42, the other ends of the C50, the C48 and the C49 are grounded, the other end of the C43 is connected with the pin 1 of the U4, the other end of the C44 is connected with the pin 2 of the U4, the other end of the C45 is connected with the pin 3 of the U4, the other end of the C47 is connected with the pin 14 of the U4, and the pin 12 of the U4 is grounded through a capacitor C46;
a pin 16 of the U4 is respectively connected with a pin 17 of the U4, one end of a capacitor C40 and one end of a capacitor C41, and the other end of the capacitor C40 and the other end of the capacitor C41 are grounded;
the pin 19 of the U4 is respectively connected with one end of a capacitor C36, one end of a capacitor C37, one end of a capacitor C20, one end of a capacitor C21, one end of an inductor L3 and one end of an inductor L5, the other end of the capacitor C36, the other end of the capacitor C37, the other end of the capacitor C20 and the other end of the capacitor C21 are grounded, the other end of the L5 is respectively connected with the pin 32 of the U4, one end of a capacitor C28 and one end of a capacitor C13, the other end of the C28 is connected with the pin 6 of a Balun _0900BL18B100 chip T3, and the pin 4 of the T3 is respectively connected with the other end of the L3, the pin 33 of the U4 and the other end of the C13 through a capacitor C12;
a pin 34 of the U4 is respectively connected with one end of a capacitor C8 and one end of a capacitor C9;
a pin 37 of U4 is respectively connected with one end of a capacitor C79 and one end of a resistor R14 through a capacitor C78, the other end of the C79 is grounded, the other end of the R14 is connected with a pin 3 of a TCXO chip X1, pins 1 and 2 of the X1 are grounded, a pin 4 of the X1 is respectively connected with one end of a capacitor C55 and a pin 3V3, and the other end of the C55 is grounded;
a pin 39 of U4 is connected with EN, a pin 40 of U4 is connected with IRQ, and pins 41-48 of U4 are correspondingly connected with IO 0-IO 7 respectively.
The power amplification part comprises an SPA-2118 chip U11, wherein a pin 1 of the U11 is respectively connected with a pin 4V5, one end of an inductor L4, one end of a capacitor C70, one end of a capacitor C71, one end of a capacitor C73, one end of a capacitor C72 and one end of an inductor L9, the other end of the L4 is respectively connected with one end of a resistor R15 and a pin 2 of the U11, the other end of the R15 is respectively connected with one end of a capacitor C68 and a pin 3 of the U11, the other end of the C68 is respectively connected with one end of a capacitor C67 and a pin 2 of a Balun _0900BL18B100 chip T3, the other end of the C67 is grounded, a pin 4 of the U11 is respectively connected with one end of a resistor R21 and one end of a capacitor C69, the other end of the R21 is connected with the pin 4V5, and the other end of the C69 is grounded;
the other end of the L9 is respectively connected with a pin 5 of the U11, a pin 6 of the U11, a pin 7 of the U11, a pin 8 of the U11, one end of a capacitor C75 and one end of a capacitor C74, the other end of the C75 is grounded, the other end of the C74 is connected with a pin 1 of the LFCN-1000D + chip U6, a pin 2 of the U6 is connected with a pin 4 of the Coupler _ RCP890A05 chip T2, a pin 1 of the T2 is connected with the antenna J1, a pin 2 of the T2 is respectively connected with one end of a resistor R11 and one end of a resistor R12, and the other end of the resistor R11 and the other end of the resistor R12 are grounded; the pin 3 of the T2 is connected with the pin 2 of the Balun _0900BL18B100 chip T4 through the C51, the pin 4 of the T4 is connected with the pin 9 of the AS3991 chip U4 through the capacitor C76, and the pin 6 of the T4 is connected with the pin 7 of the AS3991 chip U4 through the capacitor C77. And T4, converting the single-ended radio frequency signal into a differential signal, and matching the impedance of the differential signal with the impedance of the single-ended signal.
The single chip microcomputer adopts a C8051F340 chip U1, a pin 11 of the U1 is respectively connected with a pin 10 of a 3V3 and the U1 and one end of a capacitor C1, and the other end of the C1 is grounded;
the 12 pins of the U1 are respectively connected with 5V and one end of an inductor L1, the other end of the L1 is respectively connected with 1 pin of a USB connector J46 (the J46 can be used as a test point of hardware setting to facilitate testing), one end of a resistor R3 and 1 pin of a USB _ Mini _ B connector (the USB can be used as a debugging interface) J11, and the other end of the R3 is connected with J5;
the other end of the S1 is respectively connected with the other end of the J40 and the ground, the other end of the R1 is connected with the other end of the J3, the other end of the R2, the other end of the R1, the other end of the Reset connector J40 and the other end of the switch S1, the other end of the R1 is connected with the 3V3, the other end of the C3 and the other end of the C2 are grounded, and the other end of the R4 is connected with the 15 pins of the U1;
the pin 8 of the U1 is respectively connected with the pin 2 of the J46 and the pin 3 of the J11;
the pin 9 of the U1 is respectively connected with the pin 3 of the J46 and the pin 2 of the J11;
the pin 22 of the U1 is connected with the cathode of a light-emitting diode D4 (which can be used for reading and writing indication of equipment), and the anode of the D4 is connected with 3V3 through a resistor R23;
the pin 21 of U1 is connected with the cathode of a light-emitting diode D5 (which can be used for reading and writing indication of equipment), and the anode of D5 is connected with 3V3 through a resistor R24;
the pins 17 and 16 of the U1 are correspondingly connected with the pins 2 and 3 of an SBUS connector J45 respectively,
the pin 36 of the U1 is connected with the cathode of a light emitting diode D1 (which can be used for indicating the working state of the equipment) through a resistor R5, and the anode of the D1 is connected with 3V3;
the pin 37 of U1 is connected with EN, and the pin 38 of U1 is connected with CLK;
pins 39-46 of U1 are correspondingly connected with IO 7-IO 0 respectively;
the pin 3 of U1 is connected with IRQ, and the pin 4 of U1 is connected with PA _ xON;
J2-J43 can be used as a test point of hardware, and a signal can be conveniently tested. J45 can be used for power supply connection and signal input and output.
The power supply module comprises an AS1340_ TDFN8 chip U7, an AS1340_ TDFN8 chip U8, an AS1326A _ TDFN10 chip U9 and an AS1364_ TDFN8 chip U10, wherein a pin 2 of the U7 is respectively connected with one end of an inductor L7, a pin 1 of the U7, one end of a capacitor C22, one end of a capacitor C19, one end of a capacitor C54, one end of a capacitor C60, one end of the inductor L8, one end of a resistor R22, a cathode of a Schottky diode D3 and one end of a fuse F1, the other end of the F1 is connected with the anode of 3.6V and D3 and is respectively connected with the ground, the other end of the capacitor C22, the other end of the capacitor C19, the other end of the capacitor C54, the pin 9 of the U7, the pin 7 of the U7, one end of the resistor R17, one end of the capacitor C80, one end of the capacitor C59, one end of the capacitor C57, the pin 8 of the U8, the pin 9 of the U8, one end of the resistor R27, one end of the capacitor C58, the other end of the C60, the pin 6 of the U9, one end of the capacitor C63, the pin 3 of the U9, the pin 11 of the U9, the pin 7 of the U9, one end of the resistor R20, one end of the capacitor C62, one end of the capacitor C61, one end of the capacitor C64, the pin 8 of the U10, the pin 9 of the U10, one end of the resistor R29 and one end of the capacitor C65;
the other end of the L7 is respectively connected with a pin 5 of the U7 and the anode of a Schottky diode D2, the cathode of the D2 is respectively connected with one end of a capacitor C56, one end of a resistor R16, 5.5V, the other end of a capacitor C80, the other end of a capacitor C59, the other end of a capacitor C57, a pin 3 of the U8, a pin 4 of the U8, a pin 2 of the U8 and one end of a resistor R25, the other end of the R25 is respectively connected with a pin 6 of the U8, a pin 5 of the U8, one end of a resistor R28, 5V and the other end of the capacitor C58, and the other end of the R28 is respectively connected with a pin 7 of the U8 and the other end of the R27;
the other end of the L8 is connected with an 8 pin of the U9, the other end of the R22 is respectively connected with pins PA _ xON and U9, the other end of the C63 is respectively connected with pins 1 and 2 of the U9, the 4 pin of the U9 is respectively connected with the other end of the R20 and one end of a resistor R19, the other end of the R19 is respectively connected with a pin 5 of the U9, the other end of the C62 and one end of a resistor R18, the other end of the R18 is respectively connected with a pin 9 of the U9, the other end of the C61, the other end of the U0V, the other end of the C64, one end of a resistor R36, one end of a resistor R26, the other end of a pin 3 of the U10 and the other end of the U10, the other end of the R36 is respectively connected with pins EN _ PA and 2 of the U10, the other end of the R26 is respectively connected with a pin 5 of the U10, a pin 6 of the U10, one end of the resistor R30, the other end of the 4V5 and the other end of the capacitor C65, and the other end of the pin 7 of the U10 and the other end of the R29.
The RFID control circuit comprises an SP-10S5-CE type 5V SOURCE chip, an ADUM1201 chip, an MAX485 type 485 chip and a TLV1117LV33DCYR chip, wherein a pin 1 of the 5V SOURCE chip is connected with the anode of a diode D1, the cathode of the D1 is respectively connected with 5V-RF and one end of a resistor R2, the other end of the R2 is connected with the anode of a light-emitting diode LD2, and the cathode of the LD2 is connected with GND; 3 pins of the 5V SOURCE chip are connected with L, and 4 pins of the 5V SOURCE chip are connected with N;
pins 1-7 of the 485 chip are correspondingly connected with 5Vin, RXDOUT, TXDOUT, GND, 485A, 485B and 485G respectively;
the 3 feet of the TLV1117LV33DCYR chip are respectively connected with 5Vin, the anode of a capacitor CT1 and one end of a capacitor C3, the cathode of the CT1 is respectively connected with the other end of the C3, GND, the 1 foot of the TLV1117LV33DCYR chip, one end of a capacitor C4, the cathode of a capacitor CT2 and the cathode of a light-emitting diode LD1, the 2 feet of the TLV1117LV33DCYR chip are respectively connected with the other end of the C4, 3V3-1, the anode of the CT2 and one end of a resistor R1, and the other end of the R1 is connected with the anode of the LD 1.
RFID U3 in fig. 6 represents an RFID core circuit. TXDIN and RXDIN of the RFID control circuit are respectively and correspondingly connected with pins 17 and 16 of a chip U1 of a singlechip C8051F340 of the RFID core circuit; the 5V-RF of the RFID control circuit is connected with the 3.6V of the power module of the RFID core circuit. In the RFID control circuit, the actual voltage of 5V-RF is about 3.6V-3.8V, and the 5V voltage of 5Vin is converted into 3.6V-3.8V corresponding to 5V-RF due to the voltage drop of the diode D1.
The RFID control circuit provides a power supply for the RFID core circuit, and simultaneously converts signals of serial TTL levels of the RFID into 485 levels, so that the anti-interference performance is improved.
The data transmission part comprises a power supply part, a transmission module, a single chip microcomputer and a transceiver, wherein an electric energy output port of the power supply part is respectively connected with an electric energy input port of the transmission module, an electric energy input port of the single chip microcomputer and an electric energy input port of the transceiver, a signal input port of the transceiver is connected with a signal output port of the temperature collector, a signal output port of the transceiver is connected with a signal input port of the single chip microcomputer (the single chip microcomputer can read data transmitted by the temperature sensor, unpack the data and upload the packed data), and the signal output port of the single chip microcomputer is connected with the signal input port of the transmission module.
The transmission module adopts a WH-NB73 chip U6 (U6 converts RXD and TXD corresponding signals into corresponding wireless signals, pin 41 of U6 is an interface of a radio frequency antenna), pins 1 and 2 of U6 are respectively connected with one end of a capacitor C2, the anode of a capacitor C10, the anode of a capacitor C9 and V BATT, the other end of the capacitor C2, the cathode of the capacitor C10 and the cathode of the capacitor C9 are connected with GND, pin 5 of U6 is connected with NB _ Reload, pin 9 of U6 is connected with NB _ Reset, pin 14 of U6 is connected with NB _ Work, pin 35 of U6 is respectively connected with one end of a resistor R12 and the cathode of a light emitting diode LD1, the other end of R12 is connected with D, the anode of RXDLD 1 is respectively connected with VBATT and one end of a resistor R7 through a resistor R10, the other end of R7 is connected with the anode of the light emitting diode LD3, the cathode of LD is respectively connected with pin 36 and one end of TXD U6, and the other end of R11 is connected with D. LD1 and LD3 may be used to indicate the status of the transmission.
The power supply part comprises an L5973D chip U3 and a TLV1117LV chip U7, wherein a pin 8 of the U3 is respectively connected with VCC, a positive electrode of a capacitor C4 and a positive electrode of a capacitor C5, a negative electrode of the capacitor C4 and a negative electrode of the capacitor C5 are respectively connected with one end of the capacitor C7, one end of a resistor R9, a pin 3 of the U3, a pin 7 of the U3, an anode of a diode D2, one end of a resistor R8, a negative electrode of a capacitor C6 and GND, and the other end of the R9 is respectively connected with the other end of the C7 and a pin 4 of the U3 through the capacitor C8; a pin 5 of the U3 is respectively connected with the other end of the resistor R8 and one end of the resistor R3, the other end of the R3 is respectively connected with one end of the inductor L1, the positive electrode of the C6, the VBATT and one end of the capacitor C3, and the other end of the C3 is connected with the GND; the other end of the L1 is respectively connected with a pin 1 of the U3 and a cathode D2;
an INPUT end of the U7 is connected with VCC, an Output end of the U7 is respectively connected with a positive electrode of a capacitor C100, 3.3V, one end of a capacitor C22 and an anode of a light emitting diode LED2, and a cathode of the LED2 is respectively connected with the ground, a GND end of the U7, a negative electrode of the C100 and the other end of the C22 through a resistor R27;
VBATT is connected to the anode of the light emitting diode LD2, and the cathode of the LD2 is connected to GND through a resistor R21.
The single chip microcomputer adopts an STM32L476RGT6 chip U5, pins 16 and 17 of U5 are correspondingly connected with TXD and RXD respectively, pins 41, 42 and 43 of U5 are correspondingly connected with RS485_ EN, TXD1 and RXD1 respectively, pins 46 and 49 of U5 are correspondingly connected with SW _ DIO and SW _ CLK respectively, pin 5 of U5 is connected with pin 1 of CSTCE8M00G52 chip and one end of a resistor R13 respectively, pin 6 of U5 is connected with pin 3 of CSTCE8M00G52 chip and the other end of the resistor R13 respectively, pin 60 of U5 is connected with GND and one end of a capacitor C13 respectively through a resistor R14, the other end of C13 is connected with pin 7 of U5, and 3.3V is connected with GND through a capacitor C16; the capacitors C23-C29 are connected between 3.3V and GND in parallel;
pins 52 and 53 of U5 are correspondingly connected with Reset and Reload respectively;
a pin 29 of U5 is connected with Arm _ Work.
The transceiver adopts an SN75176B chip U2, a pin 1 of the U2 is connected with a cathode of a diode D1, an anode of the D1 is respectively connected with RXD1 and one end of a resistor R2, the other end of the R2 is connected with 3.3V, a pin 2 of the U2 is respectively connected with an RS485_ EN, a pin 3 of the U2 and one end of a resistor R6, and a pin 4 of the U2 is connected with TXD1;
the other end of R6 links to each other with ground, U2's 5 feet, resistance R5 one end respectively, the R5 other end links to each other with U2's 7 feet, B, resistance R4 one end respectively, the R4 other end links to each other with A, resistance R1 one end, U2's 6 feet respectively, the R1 other end links to each other with electric capacity C1 one end, U2's 8 feet, VCC respectively, the C1 other end ground connection. A. B are respectively and correspondingly connected with 485A and 485B in the RFID control circuit.
The data transmission part comprises an NPN triode Q1, the collector of the Q1 is respectively connected with one end of an NB _ Reload and one end of a capacitor C12, and the other end of the C12 is connected with GND; the base electrode of Q1 is respectively connected with one end of a resistor R17 and one end of a resistor R18, the other end of R17 is connected with Reload, and the other end of R18 is respectively connected with the emitting electrode of Q1 and GND.
The data transmission part comprises an NPN triode Q2, the collector of the Q2 is respectively connected with NB _ Reset and one end of a capacitor C11, and the other end of the C11 is connected with GND; the base electrode of Q2 is respectively connected with one end of a resistor R23 and one end of a resistor R24, the other end of R23 is connected with Reset, and the other end of R24 is respectively connected with the emitting electrode of Q2 and GND.
The data transmission part comprises an NPN triode Q3, the collector of the Q3 is respectively connected with the cathode of the LED1 and one end of a capacitor C14, the other end of the C14 is connected with GND, and the anode of the LED1 is connected with VBATT through a resistor R15; the base electrode of Q3 is respectively connected with one end of a resistor R19 and one end of a resistor R22, the other end of R19 is connected with NB _ Work, and the other end of R22 is respectively connected with the emitter electrode of Q3 and GND.
The data transmission part comprises an NPN triode Q4, the collector of the Q4 is respectively connected with the cathode of the LED3 and one end of a capacitor C15, the other end of the C15 is connected with GND, and the anode of the LED3 is connected with VBATT through a resistor R16; the base electrode of Q4 is respectively connected with one end of a resistor R20 and one end of a resistor R25, the other end of R20 is connected with Arm _ Work, and the other end of R25 is respectively connected with the emitter electrode of Q4 and GND.
The temperature collector transmits a radio frequency pulse (the radio frequency pulse is transmitted through J1 of the RFID core circuit) through the antenna to charge and activate the temperature sensor, meanwhile, a temperature measurement command (transmitted through J1) is sent to the sensor, after the passive wireless temperature sensor receives the radio frequency pulse, the radio frequency pulse signal containing node temperature information is transmitted through the sensor antenna, and the temperature collector receives and demodulates (the function of a singlechip in the RFID core circuit) the radio frequency pulse signal to obtain temperature information. The data transmission part sends the temperature information to the server, alarms and informs maintenance personnel of the information of the fault point, and the fault hidden danger is eliminated in time.
The temperature collector communicates with the temperature sensor and acquires temperature information through an internal protocol (Gen 2 protocol can be adopted) and transmits ultrahigh frequency radio frequency signals.
The utility model discloses can be applied to cubical switchboard temperature rise fault monitoring. The temperature measuring device is used for measuring the temperature of switch contacts, bus contacts and cable contact contacts (temperature sensors can be arranged at the positions of the switch contacts, the bus contacts and the cable contact contacts) in the power switch cabinet.
The server can set and display the current temperature uploaded by each serial number temperature sensor; storing historical data and displaying the historical data in a temperature change curve form; and setting an alarm value, alarming and informing maintenance personnel of fault point information when a temperature rise fault occurs, and eliminating fault hidden danger in time.
It should be understood that the above detailed description of the present invention is only for illustrating the present invention and is not limited by the technical solutions described in the embodiments of the present invention, and those skilled in the art should understand that the present invention can still be modified or equivalently replaced to achieve the same technical effects; as long as the use requirement is satisfied, the utility model is within the protection scope.
Claims (8)
1. The temperature rise fault monitoring system comprises a temperature sensor, a temperature collector and a data transmission part, and is characterized in that the temperature collector collects temperature measurement signals sent by the temperature sensor, and a signal output port of the temperature collector is connected with a signal input port of the data transmission part;
the data transmission part comprises a power supply part, a transmission module, a single chip microcomputer and a transceiver, wherein an electric energy output port of the power supply part is respectively connected with an electric energy input port of the transmission module, an electric energy input port of the single chip microcomputer and an electric energy input port of the transceiver;
the transmission module adopts a WH-NB73 chip U6, pins 1 and 2 of U6 are respectively connected with one end of a capacitor C2, the anode of a capacitor C10, the anode of a capacitor C9 and V BATT, the other end of the capacitor C2, the cathode of the capacitor C10 and the cathode of the capacitor C9 are connected with GND, pin 5 of U6 is connected with NB _ Reload, pin 9 of U6 is connected with NB _ Reset, pin 14 of U6 is connected with NB _ Work, pin 35 of U6 is respectively connected with one end of a resistor R12 and the cathode of a light-emitting diode LD1, the other end of R12 is connected with RXD, the anode of LD1 is respectively connected with VBATT and one end of a resistor R7 through a resistor R10, the other end of R7 is connected with the anode of the light-emitting diode LD3, the cathode of LD3 is respectively connected with pin 36 of U6 and one end of a resistor R11, and the other end of R11 is connected with TXD;
the temperature sensor adopts a passive wireless temperature sensor;
the passive wireless temperature sensor is fixedly connected with the equipment to be measured through a heat-conducting adhesive;
the temperature sensor is in a plurality of, and the interval between adjacent temperature sensors is not less than 10CM.
2. The temperature rise fault monitoring system according to claim 1, wherein the power supply part comprises an L5973D chip U3 and a TLV1117LV chip U7, wherein 8 pins of the U3 are respectively connected with VCC, a C4 anode of a capacitor and a C5 anode of the capacitor, a C4 cathode of the capacitor and a C5 cathode of the capacitor are respectively connected with one end of the capacitor C7, one end of a resistor R9, a 3 pin of the U3, a 7 pin of the U3, an anode of a diode D2, one end of a resistor R8, a C6 cathode of the capacitor and GND, and the other end of the R9 is respectively connected with the other end of the C7 and a 4 pin of the U3 through the capacitor C8; a pin 5 of the U3 is respectively connected with the other end of the resistor R8 and one end of the resistor R3, the other end of the R3 is respectively connected with one end of the inductor L1, the positive electrode of the C6, the VBATT and one end of the capacitor C3, and the other end of the C3 is connected with the GND; the other end of the L1 is respectively connected with a pin 1 of the U3 and a cathode D2;
an INPUT end of the U7 is connected with VCC, an Output end of the U7 is respectively connected with a positive electrode of a capacitor C100, 3.3V, one end of a capacitor C22 and an anode of a light emitting diode LED2, and a cathode of the LED2 is respectively connected with the ground, a GND end of the U7, a negative electrode of the C100 and the other end of the C22 through a resistor R27;
VBATT is connected to the anode of the light emitting diode LD2, and the cathode of the LD2 is connected to GND through a resistor R21.
3. The temperature rise fault monitoring system according to claim 1, wherein the single chip microcomputer adopts an STM32L476RGT6 chip U5, pins 16 and 17 of U5 are correspondingly connected with TXD and RXD, respectively, pins 41, 42 and 43 of U5 are correspondingly connected with RS485_ EN, TXD1 and RXD1, pins 46 and 49 of U5 are correspondingly connected with SW _ DIO and SW _ CLK, respectively, pin 5 of U5 is connected with pin 1 of CSTCE8M00G52 chip and one end of a resistor R13, pin 6 of U5 is connected with pin 3 of CSTCE8M00G52 chip and the other end of the resistor R13, pin 60 of U5 is connected with GND and one end of a capacitor C13 through a resistor R14, the other end of the C13 is connected with pin 7 of U5, and 3.3V is connected with GND through a capacitor C16; the capacitors C23-C29 are connected between 3.3V and GND in parallel;
pins 52 and 53 of U5 are correspondingly connected with Reset and Reload respectively;
u5 has pin 29 connected to Arm _ Work.
4. The temperature-rise fault monitoring system according to claim 1, wherein the transceiver adopts an SN75176B chip U2, a pin 1 of the U2 is connected with a cathode of a diode D1, an anode of the D1 is respectively connected with RXD1 and one end of a resistor R2, the other end of the R2 is connected with 3.3V, a pin 2 of the U2 is respectively connected with RS485_ EN, a pin 3 of the U2 and one end of a resistor R6, and a pin 4 of the U2 is connected with TXD1;
the other end of R6 links to each other with ground, U2's 5 feet, resistance R5 one end respectively, the R5 other end links to each other with U2's 7 feet, B, resistance R4 one end respectively, the R4 other end links to each other with A, resistance R1 one end, U2's 6 feet respectively, the R1 other end links to each other with electric capacity C1 one end, U2's 8 feet, VCC respectively, the C1 other end ground connection.
5. The temperature rise fault monitoring system according to claim 1, wherein the data transmission part comprises an NPN triode Q1, a collector of the NPN triode Q1 is connected to NB _ Reload and one end of a capacitor C12, respectively, and the other end of the capacitor C12 is connected to GND; the base electrode of Q1 is respectively connected with one end of a resistor R17 and one end of a resistor R18, the other end of R17 is connected with Reload, and the other end of R18 is respectively connected with the emitting electrode of Q1 and GND.
6. The temperature rise fault monitoring system according to claim 1, wherein the data transmission part comprises an NPN triode Q2, a collector of the NPN triode Q2 is connected to the NB _ Reset and one end of a capacitor C11, respectively, and the other end of the capacitor C11 is connected to GND; the base electrode of Q2 is respectively connected with one end of a resistor R23 and one end of a resistor R24, the other end of R23 is connected with Reset, and the other end of R24 is respectively connected with the emitting electrode of Q2 and GND.
7. The temperature-rise fault monitoring system according to claim 1, wherein the data transmission part comprises an NPN triode Q3, a collector of the NPN triode Q3 is connected to a cathode of the LED1, one end of a capacitor C14 is connected to the diode, respectively, the other end of the capacitor C14 is connected to GND, and an anode of the LED1 is connected to VBATT through a resistor R15; the base electrode of Q3 is respectively connected with one end of a resistor R19 and one end of a resistor R22, the other end of R19 is connected with NB _ Work, and the other end of R22 is respectively connected with the emitter electrode of Q3 and GND.
8. The temperature-rise fault monitoring system according to claim 1, wherein the data transmission part comprises an NPN triode Q4, a collector of the NPN triode Q4 is connected to a cathode of the LED3, one end of a capacitor C15, respectively, the other end of the capacitor C15 is connected to GND, and an anode of the LED3 is connected to VBATT through a resistor R16; the base electrode of Q4 is respectively connected with one end of a resistor R20 and one end of a resistor R25, the other end of R20 is connected with Arm _ Work, and the other end of R25 is respectively connected with the emitter electrode of Q4 and GND.
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