CN218455812U

CN218455812U - Silicon light 800G DR8 laser emission component structure

Info

Publication number: CN218455812U
Application number: CN202123266761.6U
Authority: CN
Inventors: 黃劲威; 周书刚; 陈正刚; 赵永成; 黄敏华; 陈斌; 陈龙
Original assignee: Fujian ZK Litecore Ltd
Current assignee: Fujian ZK Litecore Ltd
Priority date: 2021-12-23
Filing date: 2021-12-23
Publication date: 2023-02-07
Anticipated expiration: 2031-12-23

Abstract

The utility model provides a silicon light 8 passageway short distance transmission is used and speed 800 Gbit/s's laser emission subassembly structure for the optical engine in optical communication, laser emission subassembly structure is including the light integrated chip waveguide, the fiber array and the high power distributed feedback laser light source of integration in circuit board department, and the laser of light source outgoing gets into the isolator after the convergence coupling lens plastic convergence, forms the first waveguide entry of the optical signal that gets into the light integrated chip waveguide; the optical integrated chip waveguide divides an optical signal first waveguide inlet signal into an output optical signal a and an output optical signal b, the output optical signal a and the output optical signal b are subjected to optical debugging through a Mach-Zehnder modulator arranged in the optical integrated chip waveguide, are output to the optical fiber array from a waveguide port of the optical integrated chip waveguide, are coupled with the waveguide and are output from the multichannel optical fiber connector; the utility model discloses can reduce optical communication device's cost effectively.

Description

Silicon light 800G DR8 laser emission component structure

Technical Field

The utility model belongs to the technical field of the optical communication technique and specifically relates to a silicon light 800G DR8 laser emission subassembly structure.

Background

Silicon light: silicon photonics is a low-cost, high-speed optical communication technology based on silicon photonics. Based on a silicon-based substrate material, a CMOS process is utilized, and an integrated circuit represented by microelectronics and a photonic technology are combined, so that laser beams are used for replacing electronic information to transmit data.

800G transmission rate 800Gbps

The laser emitting component is an abbreviation of Transmitter Optical Subassembly, and Chinese is an Optical emission submodule. The method is mainly applied to converting an electric signal into an optical signal (E/O conversion), and the performance indexes comprise optical power, threshold values and the like.

With the ever-increasing desire of our society for data-not only the more data, but also the faster the data transmission speed-older modulation schemes based on NRZ type coding are becoming less and less sufficient. We need to acquire data from point a to point B as efficiently as possible, whether it be chips on a PC board or long distance fiber end to end. A modulation scheme that is favored in many respects is PAM4.

PAM4 signal-it employs 4 different signal levels for signal transmission, and each symbol period may represent 2 bits of logical information (0, 1, 2, 3).

Because each symbol period of the PAM4 signal can transmit 2 bits of information, in order to realize the same signal transmission capability, the symbol rate of the PAM4 signal only needs to reach half of that of the NRZ signal, and thus the loss caused by a transmission channel is greatly reduced. With the development of future technologies, the possibility of using PAM8 and even PAM16 signals at more levels for information transmission is not excluded.

Disclosure of Invention

The utility model provides a silicon light 800G DR8 laser emission subassembly structure can reduce optical communication device's cost effectively.

The utility model adopts the following technical scheme.

A silicon light 800G DR8 laser emission component structure is used for an optical engine in optical communication, and comprises an optical integrated chip waveguide, an optical fiber array and a high-power distributed feedback laser light source which are integrated on a circuit board, wherein laser emitted by the light source enters an isolator after being shaped and converged by a convergent coupling lens to form a first waveguide inlet of an optical signal entering the optical integrated chip waveguide; the optical integrated chip waveguide divides an optical signal first waveguide inlet signal into an output optical signal a and an output optical signal b, the output optical signal a and the output optical signal b are subjected to optical debugging through a Mach-Zehnder modulator arranged in the optical integrated chip waveguide, are output to the optical fiber array from a waveguide outlet of the optical integrated chip waveguide, are coupled with the waveguide, and are output from the multichannel optical fiber connector.

A first waveguide outlet and a second waveguide outlet which are used for self-loop monitoring are arranged in the optical integrated chip waveguide; and the first waveguide outlet and the second waveguide outlet respectively separate a small amount of light energy from the output light signal a and the output light signal b for self-loop monitoring.

The silicon light 800G DR8 laser emission component structure is used for an optical transmitter optical subassembly of an optical engine, and the high-power distributed feedback laser light source consists of 4 high-power distributed feedback lasers.

The high-power distributed feedback laser light source is arranged on a laser gasket on the circuit board, and the laser gasket is plated with gold on two sides and is attached to the tungsten copper cushion block.

The optical fiber array is a 0.25mm optical fiber array.

The isolator is an isolator with an aperture of 4mm width.

And the circuit board is also provided with a micro-control unit control circuit.

The waveguide angle is 1 DEG & lt 1 & lt 12 DEG, and the waveguide intervals Pitch 250um,500um,750um and 1000um.

The dimensions and indices of the coupling lens are: 2.10.6 < W < 4.5mm,0.5 < H < 2mm, 0.5 < T < 2mm; optical surface parameters: the radius of the curved surface is more than-4 and less than 4mm, the refractive index is more than 1.48 and less than 3.6, and the cone coefficient is more than-4 and less than 4mm.

The utility model provides a TOSA structure and the whole scheme of light path, its advantage lies in:

1. on the premise of meeting the performance requirement, the High Power DFB with the low threshold can be selected through the scheme, the price of the High Power DFB with the unit price is lower, and the cost can be effectively reduced.

2. On the premise of meeting the performance requirement, the Fiber Array with the thickness of 0.25mm can be selected by the scheme, and the size of the light engine can be further reduced.

3. On the premise of meeting performance requirements, the isolator with the aperture of 4mm width can be selected for use according to the scheme, and cost reduction is facilitated.

Drawings

The invention will be described in further detail with reference to the following drawings and detailed description:

FIG. 1 is a schematic view of the optical path of the present invention;

FIG. 2 is a schematic diagram of the internal principle of the optical integrated chip waveguide according to the present invention;

FIG. 3 is a schematic diagram of the waveguide angle of the present invention;

fig. 4 is a schematic view of the waveguide spacing of the present invention;

FIG. 5 is a schematic dimensional view of a lens;

in the figure: 100. a circuit board; 101. an optical integrated chip waveguide; 102. an isolator; 103. a coupling lens; 104. a first waveguide inlet; 105. a laser spacer; 106. a high power distributed feedback laser light source; 107. a tungsten copper cushion block; 108. an optical fiber array; 109. a waveguide outlet; 110. a laser driving chip; 111. a multi-channel fiber optic splice; 112. a photodiode; 113. Mach-Zehnder modulators.

Detailed Description

As shown in the figure, a silicon optical 800G DR8 laser emission component structure is used for an optical engine in optical communication, and the silicon optical 800G DR8 laser emission component structure includes an optical integrated chip waveguide 101 integrated at a circuit board 100, an optical fiber array 108 and a high-power distributed feedback laser light source 106, and laser emitted by the light source enters an isolator 102 after being shaped and converged by a converging coupling lens 103, so as to form an optical signal first waveguide inlet 104 entering the optical integrated chip waveguide; the optical integrated chip waveguide divides the first waveguide inlet signal of the optical signal into an output optical signal a and an output optical signal b, the output optical signal a and the output optical signal b are subjected to optical debugging through a Mach-Zehnder modulator 113 arranged in the optical integrated chip waveguide, then are output to the optical fiber array 108 from a waveguide outlet 109 of the optical integrated chip waveguide, and are output from a multichannel optical fiber connector 111 after being coupled with the waveguide.

The high-power distributed feedback laser light source is arranged on a laser gasket 105 on the circuit board, and the laser gasket is plated with gold on two sides and is attached to a tungsten copper cushion block 107.

The optical fiber array is a 0.25mm optical fiber array.

The isolator is an isolator with an aperture of 4mm width.

The dimensions and indices of the coupling lens are: 2.10.6 is more than W and less than 4.5mm, H is more than 0.5 and less than 2mm, T is more than 0.5 and less than 2mm; optical surface parameters: the radius of the curved surface is more than-4 and less than 4mm, the refractive index is more than 1.48 and less than 3.6, and the cone coefficient is more than-4 and less than 4mm.

The utility model discloses can be used to the optical communication of PAM4 mode.

The embodiment is as follows:

in the optical path of this embodiment, 4 high-power distributed feedback lasers emit laser with a wavelength of 1310nm, the adjacent intervals of the channels are 1mm,4 paths of light respectively pass through a convergence coupling lens to shape and converge a light beam, and in the convergence process, the light beam passes through an isolator and then enters an optical integrated chip waveguide, the optical integrated chip waveguide divides an optical signal from a waveguide inlet 1 into two output optical signals a and b through the optical integrated chip waveguide, namely a TX add 1 (optical signal a) and a TX add 2 (optical signal b), and the TX add 1 and the TX add 2 respectively divide a small amount of light energy to MPD1 (first waveguide outlet) and MPD2 (second waveguide outlet) to form self-loop monitoring; the optical signals a and b are subjected to optical debugging through the Mach-Zehnder modulator and output from the waveguide port, the optical fiber array is coupled with the waveguide, and the laser emission component outputs the optical signals through the optical fiber connector and is connected with an external module or equipment.

In the circuit of this embodiment, the printed circuit board and the optical integrated chip that have assembled carry out electrical connection through the gold thread bonding, laser instrument driver chip 110 and optical integrated chip carry out electrical connection through flip-chip bonding, the printed circuit board and the laser instrument gasket that have assembled carry out electrical connection through the gold thread bonding, laser instrument gasket and high power distributed feedback laser instrument carry out electrical connection through the gold thread bonding, the printed circuit board that has assembled provides matching circuit and power supply for the optical integrated chip, the optical integrated chip is to the light source of entering, modulate and monitor.

The circuit of this example was prepared as follows:

1. patch with adhesive layer

The high-power distributed feedback laser is attached to a laser gasket by using gold tin, and is fixed by high-temperature welding, and the fixed structure is called COC. Attaching COC on the tungsten-copper alloy cushion block by using silver adhesive, and baking and fixing the COC in an oven. The optical integrated chip is attached to the assembled printed circuit board by silver adhesive, and then is baked and fixed in an oven. The laser driving chip is welded on the optical integrated chip through flip chip. And attaching the tungsten-copper alloy cushion block to the assembled printed circuit board by using silver adhesive, and baking and fixing the tungsten-copper alloy cushion block in an oven. The isolators are placed according to the designed light path conditions and fixed by glue.

2. Gold wire bonding

Welding a high-power distributed feedback laser pad to a laser pad by utilizing vertical routing and gold wire welding; soldering from the laser pad to the assembled printed circuit board pad using gold wire soldering; and bonding the optical integrated chip to the assembled printed circuit board pad by gold wire bonding.

3. Lens and fiber array coupling

Eight lenses are used for coupling four paths of divergent light respectively, eight paths of light need to be balanced and coupled to the maximum during coupling, and the eight lenses are fixed by glue respectively. The 250um interval fiber array respectively couples eight paths of divergent light, the eight paths of light need to be balanced during coupling and coupled to the maximum, and the fiber array is fixed by glue.

Claims

1. A silicon optical 800G DR8 laser emission component structure used for an optical engine in optical communication is characterized in that: the silicon light 800G DR8 laser emission component structure comprises a light integrated chip waveguide, an optical fiber array and a high-power distributed feedback laser light source which are integrated on a circuit board, wherein laser emitted by the light source enters an isolator after being shaped and converged by a converging coupling lens to form a first waveguide inlet of an optical signal entering the light integrated chip waveguide; the optical integrated chip waveguide divides a first waveguide inlet signal of an optical signal into an output optical signal a and an output optical signal b, the output optical signal a and the output optical signal b are subjected to optical debugging through a Mach-Zehnder modulator arranged in the optical integrated chip waveguide, then are output to the optical fiber array from a waveguide outlet of the optical integrated chip waveguide, and are output from the multichannel optical fiber connector after being coupled with the waveguide.

2. The structure of claim 1, wherein the silicon optical 800G DR8 laser emitting component is characterized in that: a first waveguide outlet and a second waveguide outlet which are used for self-loop monitoring are arranged in the optical integrated chip waveguide; and the first waveguide outlet and the second waveguide outlet respectively separate a small amount of light energy from the output light signal a and the output light signal b for self-loop monitoring.

3. The structure of claim 1, wherein the silicon optical 800G DR8 laser emitting component is characterized in that: the silicon light 800G DR8 laser emission component structure is used for an optical transmitter optical subassembly of an optical engine, and the high-power distributed feedback laser light source consists of 4 high-power distributed feedback lasers.

4. The structure of claim 3, wherein the structure of a silicon light 800G DR8 laser emitting component is characterized in that: the high-power distributed feedback laser light source is arranged on a laser gasket on the circuit board, and the laser gasket is plated with gold on two sides and is attached to the tungsten copper cushion block.

5. The structure of claim 1, wherein the silicon optical 800G DR8 laser emitting component is characterized in that: the optical fiber array is a 0.25mm optical fiber array.

6. The structure of claim 1, wherein the silicon optical 800G DR8 laser emitting component is characterized in that: the isolator is an isolator with an aperture of 4mm width.

7. The structure of claim 1, wherein the silicon optical 800G DR8 laser emitting component is characterized in that: and the circuit board is also provided with a micro-control unit control circuit.

8. The structure of claim 1, wherein the structure of a silicon light 800G DR8 laser emitting component is characterized in that: the waveguide angle is 1 DEG & lt 1 & lt 12 DEG, and the waveguide intervals Pitch 250um,500um,750um and 1000um.

9. The structure of claim 1, wherein the silicon optical 800G DR8 laser emitting component is characterized in that: the dimensions and indices of the coupling lens are: 2.10.6 is more than W and less than 4.5mm, H is more than 0.5 and less than 2mm, T is more than 0.5 and less than 2mm; optical surface parameters: the radius of the curved surface is more than-4 and less than 4mm, the refractive index is more than 1.48 and less than 3.6, and the cone coefficient is more than-4 and less than 4mm.