CN218388138U - Repair device - Google Patents
Repair device Download PDFInfo
- Publication number
- CN218388138U CN218388138U CN202222674034.1U CN202222674034U CN218388138U CN 218388138 U CN218388138 U CN 218388138U CN 202222674034 U CN202222674034 U CN 202222674034U CN 218388138 U CN218388138 U CN 218388138U
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- film
- bottom wall
- base
- pinhole
- repair
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- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
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Abstract
A repair device is suitable for being arranged above a workbench for bearing an object to be repaired and used for installing a malleable film, an adhesive layer is arranged on the surface of the film to remove bad crystal grains or tin balls on the object to be repaired or reset the crystal grains on the object to be repaired, and the repair device comprises a fixing module and a pushing module, wherein the fixing module is used for fixing the film and can be in a slightly tight state, and the pushing module can be used for vacuum-absorbing the film and is provided with a needle body for pushing the film. The repair device can be applied to the processes of removing the crystal grains, the solder balls and supplementing the crystal grains, has various purposes, can adjust the size of the pin body of the pushing module according to the sizes of the crystal grains and the solder balls, can remove a single crystal grain or the solder ball in a small range, cannot influence the crystal grains and the solder balls which do not need to be removed nearby, and cannot be polluted.
Description
Technical Field
The utility model relates to a reprocess the device, especially relate to a reprocess device for repairing circuit board.
Background
Generally, in a circuit board with a plurality of LED dies soldered, if some of the dies are defective, the dies of the defective and the solder balls for soldering the dies need to be removed, and then the spare dies are soldered again, thereby avoiding the whole circuit board from being scrapped and reducing the loss.
At present, the method of removing the die and the solder ball on the circuit board is mostly to use the suction nozzle to suck. However, this removal method not only easily causes pollution to the suction nozzle, but also requires frequent replacement of the suction nozzle, and the removal range is limited by the size of the suction nozzle. Since the size of the die is smaller and smaller, and the size of the suction nozzle is larger, the suction nozzle cannot be matched with the size of a single die, and good dies near bad dies are easy to be sucked together.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a can solve the repair device of aforementioned problem.
The utility model discloses a reprocess device in some implementation modes appearance, be applicable to the setting and be used for bearing the workstation top of waiting to repair the object and supply the installation to have the film of ductility, and the surface of this film is equipped with the viscose layer to remove this bad crystalline grain or the tin ball of waiting to repair on the object, or reset the crystalline grain in this object of waiting to repair, this reprocess device contains: a holding module and a pushing module. The fixing module comprises a bearing frame and a pressure frame, so as to fix the film and enable the film to be in a slightly-tightened state. The pushing module is arranged above the fixing module and comprises a base and an ejector pin mechanism. The base is provided with a bottom wall facing the film and defining a gas channel, the bottom wall is provided with a pinhole and a plurality of gas holes distributed around the pinhole, and the gas channel is communicated with the gas holes and connected with an air extractor for vacuum adsorption of the film on the bottom wall. The thimble mechanism is arranged on the base along the up-down direction, part of the thimble mechanism is positioned in the gas channel and is provided with a needle body, and the needle body can be operated to penetrate out of the bottom wall through the pinhole so as to push the film.
In some embodiments, the base has a base body, a cap connected to the base body and having the bottom wall, a first sealing ring disposed between the base body and the cap, and a second sealing ring disposed between the base body and the ejector pin mechanism, wherein the first sealing ring and the second sealing ring are used to block the gas channel from communicating with the external environment.
In some embodiments, the pressure frame is used for adhering and fixing the film through the adhesive layer and making the adhesive layer face downwards, the pressure frame is provided with a horizontally arranged ring plate part and a ring pushing part vertically extending from the inner edge of the ring plate part, the ring plate part abuts against the pressure frame and makes the film clamped between the ring plate part and the pressure frame, and the ring pushing part pushes the film downwards to stretch the film.
In some embodiments, the bearing frame and the pressure frame are mother-son rings which are matched with each other inside and outside.
The utility model discloses reprocess the device in some implementation patterns appearance, be applicable to the setting and be used for bearing the workstation top of waiting to repair the circuit board and supply the installation to have the film of ductility, and the surface of this film is equipped with the viscose layer to remove this bad crystalline grain or the tin ball of waiting to repair on the circuit board, this reprocess the device and contain: a holding module and a pushing module. The fixing module comprises a bearing frame and a pressure frame, so as to fix the film and enable the film to be in a slightly-tightened state. The pushing module is arranged above the fixing module and comprises a base and a thimble mechanism. The base is provided with a bottom wall facing the film and defining a gas channel, the bottom wall is provided with a pinhole and a plurality of gas holes distributed around the pinhole, and the gas channel is communicated with the gas holes and connected with an air extractor for vacuum adsorption of the film on the bottom wall. The thimble mechanism is arranged on the base along the up-down direction, part of the thimble mechanism is arranged in the gas channel and is provided with a needle body, and the needle body can be operated to penetrate out of the bottom wall through the pinhole so as to push the film at a position corresponding to the crystal grains or the solder balls to be removed, so that the film is adhered to the crystal grains or the solder balls to be removed.
The utility model discloses reprocess the device in some implementation patterns appearance, be applicable to the setting and be used for bearing the workstation top of waiting to repair the circuit board and supply the installation to have the film of ductility, and a plurality of crystalline grains that are used for the replacement of adhering on the surface of this film, should wait to repair the circuit board and be equipped with the tin ball of waiting to repair the crystalline grain, should reprocess the device and contain: a fixing module and a pushing module. The fixing module comprises a bearing frame and a pressurizing frame, so as to fix the film and enable the film to be in a slightly-tensioned state. The pushing module is arranged above the fixing module and comprises a base and a thimble mechanism. The base is provided with a bottom wall facing the film and defining a gas channel, the bottom wall is provided with a pinhole and a plurality of gas holes distributed around the pinhole, and the gas channel is communicated with the gas holes and connected with an air extractor for vacuum adsorption of the film on the bottom wall. The thimble mechanism is arranged on the base along the up-down direction, part of the thimble mechanism is positioned in the gas channel and is provided with a needle body, and the needle body can be operated to penetrate out of the bottom wall through the pinhole so as to push the film at a position corresponding to the crystal grain to be replaced, so that the crystal grain to be replaced is transferred to the tin ball to be replaced.
The utility model discloses have following efficiency: the utility model discloses the device of reprocessing can be applied to the process of removing crystalline grain, tin ball and repairing the brilliant, not only has multiple use, and can push away the needle body size of module in response to crystalline grain and tin ball size adjustment, and can remove single crystalline grain or tin ball by the small range, can not influence crystalline grain and tin ball that near need not remove, and the device of reprocessing itself can not polluted yet simultaneously.
Drawings
Other features and advantages of the present invention will become apparent from the following detailed description of the preferred embodiments with reference to the accompanying drawings, in which:
FIG. 1 is a schematic side view of a rework apparatus of an embodiment of the invention with a film loaded to remove dies and solder balls of an object to be reworked;
fig. 2 is an exploded perspective view of the holding module and the clamping mechanism of the embodiment;
FIG. 3 is a schematic cross-sectional view of the holding module of the embodiment in a state of holding a thin film;
fig. 4 is a perspective view of the jacking module of this embodiment;
FIG. 5 is a cross-sectional view of the jacking module;
FIG. 6 is a fragmentary perspective view of the jacking module;
FIGS. 7 and 8 are side views similar to FIG. 1 and illustrate, in conjunction with FIG. 1, a flow of die removal according to this embodiment; and
fig. 9 to 11 are schematic side views similar to fig. 1, illustrating the operation flow of the embodiment for crystal supplement.
Detailed Description
Referring to fig. 1 and 9, the embodiment of the rework apparatus 100 of the present invention is suitable for being disposed above a worktable (not shown) for carrying an object a to be repaired and for installing a malleable film B to remove a bad die A1 or a solder ball A2 on the object a to be repaired or to reset a die on the object a to be repaired. For example, the object a to be repaired is a circuit board a 'to be repaired, as shown in fig. 1, the mounted film B is used to remove a bad die A1 or a solder ball A2 on the circuit board a' to be repaired, as shown in fig. 9, a plurality of dies B1 for replacement are adhered to one surface of the mounted film B ', and the circuit board a' to be repaired is provided with the solder ball A2 for replacement of the die B1.
Referring to fig. 1 to 3, the rework apparatus 100 includes a holding module 1 and a pushing module 2. The holding module 1 includes a carrying frame 11 and a pressing frame 12 to fix the film B and to be in a slightly tightened state. In the embodiment, an adhesive layer B2 is disposed on one surface of the film B, and the frame 11 is a wafer frame (wafer frame) for adhering and fixing the film B through the adhesive layer B2 with the adhesive layer B2 facing downward. The pressure frame 12 is an expansion ring, and has a ring plate 121 horizontally disposed and a ring pushing portion 122 vertically extending from the inner edge of the ring plate 121. The carrying frame 11 and the pressure frame 12 are disposed on a clamping mechanism 13, the clamping mechanism 13 includes a substrate 131, a cover 132, and a pair of fingers 133 respectively disposed on two opposite sides of the cover 132, the substrate 131 and the pair of fingers 133 are connected by a plurality of connecting components 134 and can be opened and closed relatively. The ring plate 121 of the pressure frame 12 is fixed to the substrate 131, and the carriage 11 is detachably held by the pair of fingers 133. When the carrying frame 11 is to be installed, the clamping mechanism 13 needs to be opened to separate the substrate 131 from the pair of fingers 133, and after the carrying frame 11 is placed, the clamping mechanism 13 is closed to close the substrate 131 and the pair of fingers 133, as shown in the schematic cross-sectional view of fig. 3, at this time, the annular plate portion 121 of the pressing frame 12 abuts against the carrying frame 11 and clamps the film B between the annular plate portion 121 and the carrying frame 11, and the annular pushing portion 122 pushes the film B downward to stretch the film B, so that the film B is in a slightly tightened state. In alternative embodiments, the carrying frame 11 and the pressing frame 12 may also be provided with conventional male and female rings (not shown) that fit inside and outside, and also make the film slightly taut.
Referring to fig. 1, 4 to 6, the pushing module 2 is disposed above the holding module 1 and includes a base 21 and an ejector mechanism 22. In the present embodiment, the base 21 defines a gas channel 211 and has a base body 212, a cap 213 connected to the base body 212, a first sealing ring 214 disposed between the base body 212 and the cap 213, and a second sealing ring 215 disposed between the base body 212 and the ejector pin mechanism 22. The first sealing ring 214 and the second sealing ring 215 are used to block the gas channel 211 from communicating with the external environment. The cap 213 has a bottom wall 213a facing the film B. The bottom wall 213a has a needle hole 213b and a plurality of air holes 213c distributed around the needle hole 213b, and the air channel 211 is communicated with the air holes 213 c. A pressure joint 216 connected to the gas channel 211 is disposed on the base 212 to connect to an air-extracting device (not shown) for extracting air from the gas channel 211 to vacuum-adsorb the film B on the bottom wall 213a. The needle mechanism 22 is disposed on the base 21 along the vertical direction and partially disposed in the gas channel 211, and has a needle seat 221 and a needle 222, the needle 222 can be operated to pass through the needle hole 213B and penetrate out of the bottom wall 213a to push the film B.
Referring to fig. 1, 7 and 8, the operation flow of using the rework apparatus 100 to remove the defective die A1 is described as follows. The pushing module 2 is moved to a working position to make the position of the needle 222 vertically correspond to the position of the bad die A1 to be removed. Then, the pushing module 2 is lowered to the working height, and the gas channel 211 is pumped to make the film B vacuum-adsorb on the bottom wall 213a, and then the needle 222 penetrates out of the bottom wall 213a through the pinhole 213B to push the film B at the position corresponding to the bad die A1 to be removed, so that the film B adheres to the bad die A1 to be removed. By making the film B vacuum-adsorb on the bottom wall 213a, when the pin 222 extends out of the bottom wall 213a, the film B is attached on the pin 222 to reduce the protruding area of the film B, so as to reduce the range of the film B capable of adhering crystal grains, and accurately adhere a single crystal grain. When the film B sticks the defective die A1, the pin 222 is retracted into the bottom wall 213a, the air suction is closed, and the pushing module 2 is raised to the original height, thereby completing the operation of removing the defective die A1. The operation flow is repeated for a plurality of bad dies A1, and the operation flow for removing the bad solder balls A2 is the same as the operation flow for removing the bad dies A1. The size of the needle 222 and the viscosity of the adhesive layer B2 of the film B can be adjusted according to the size of the die A1 and the solder ball A2 to be removed. Therefore, the method of removing the die A1 and the solder ball A2 can not only remove a single die A1 or a single solder ball A2 at a small range at a single point, but also the pin 222 can not directly contact the die A1 and the solder ball A2, and the film B can be replaced, so that the rework apparatus 100 is not polluted.
Referring to fig. 9 to 11, after the bad die A1 and the solder ball A2 are removed from the circuit board to be repaired a', a solder ball A2 is disposed at the position where the solder ball A2 is removed by using a solder dispensing device, and then the repair device 100 is used for repairing the die. When the repair apparatus 100 is used to repair a wafer, a thin film B' having a plurality of replacement dies B1 attached to the surface thereof, such as a blue film or a UV film, is mounted, and the flow of the repair operation is described below. The pushing module 2 is moved to a working position to make the position of the needle body 222 vertically correspond to the position of the solder ball A2 of the die to be repaired. Then, the pushing module 2 is lowered to a working height, the needle body 222 penetrates out of the bottom wall 213a through the pinhole 213B to push the film B 'at a position corresponding to the to-be-replaced crystal grain B1 and make the to-be-replaced crystal grain B1 contact with the solder ball A2, and then the gas channel 211 is pumped to make the film B' vacuum-adsorb on the bottom wall 213a, so that the to-be-replaced crystal grain B1 is transferred to the solder ball A2 to be replaced. By making the film B 'vacuum-adsorb on the bottom wall 213a, the film B' can be attached to the needle 222, so as to reduce the area of the film B 'adhering to the crystal grain B1 to be replaced, and the crystal grain B1 to be replaced can be easily separated from the film B' and transferred onto the solder ball A2. Then, the needle 222 is retracted into the bottom wall 213a, the air-exhaust is closed, and the pushing module 2 is raised to the original height, thereby completing the operation of supplementing one die. The aforementioned process is repeated for a plurality of times when there are a plurality of positions where the die needs to be replenished.
At least two repair devices 100 can be disposed on a machine, wherein one repair device 100 is used for removing the die and the solder ball, and the other repair device 100 is used for repairing the die, thereby improving the production efficiency.
To sum up, the utility model discloses rework device 100 can be applied to the process of removing crystalline grain, tin ball and mending brilliant, not only has the multiple use, and can push away the needle body 222 size of module 2 in response to crystalline grain and tin ball size adjustment, and can remove single crystalline grain or tin ball by a small margin, can not influence crystalline grain and tin ball that need not remove near, and rework device 100 itself can not polluted simultaneously.
The above description is only an example of the present invention, and the scope of the present invention should not be limited thereto, and the present invention is also within the scope of the present invention by simple equivalent changes and modifications according to the claims and the contents of the specification.
Claims (6)
1. A kind of repair device, suitable for setting up and is used for bearing the weight of the work level top which treats the repair object and for installing the malleable film, and the surface of the film has adhesive layers, in order to remove the bad crystalline grain or tin ball on the repair object, or reset crystalline grain in the repair object, characterized by that: the repair device includes:
the fixing module comprises a bearing frame and a pressurizing frame, so as to fix the film and enable the film to be in a slightly-tensioned state; and
the pushing module is arranged above the fixing module and comprises a base and an ejector pin mechanism, the base is provided with a bottom wall facing the film and defines an air channel, the bottom wall is provided with a pinhole and a plurality of air holes distributed around the pinhole, the air channel is communicated with the air holes and is connected with an air extractor for vacuum adsorption of the film on the bottom wall, the ejector pin mechanism is arranged on the base along the vertical direction, part of the ejector pin mechanism is positioned in the air channel and is provided with a pin body, and the pin body can be operated to penetrate out of the bottom wall through the pinhole so as to push the film.
2. The rework device of claim 1, wherein: the base is provided with a base body, a cap connected with the base body and provided with the bottom wall, a first sealing ring arranged between the base body and the cap, and a second sealing ring arranged between the base body and the thimble mechanism, wherein the first sealing ring and the second sealing ring are used for blocking the communication of the gas channel and the external environment.
3. The rework device of claim 1, wherein: the bearing frame is used for adhering and fixing the film through the adhesive layer and enabling the adhesive layer to face downwards, the pressurizing frame is provided with a horizontally arranged annular plate part and an annular pushing part vertically extending from the inner edge of the annular plate part, the annular plate part abuts against the bearing frame and enables the film to be clamped between the annular plate part and the bearing frame, and the annular pushing part pushes the film downwards to stretch the film.
4. The rework device of claim 1, wherein: the bearing frame and the pressurizing frame are mother-son rings matched with each other inside and outside.
5. The utility model provides a repair device, is applicable to and sets up the workstation top that is used for bearing the circuit board of waiting to repair and supplies the installation to have the film of ductility, and the surface of this film is equipped with the viscose layer to remove bad crystalline grain or tin ball on this circuit board of waiting to repair, its characterized in that: the repair device includes:
the fixing module comprises a bearing frame and a pressurizing frame, so as to fix the film and enable the film to be in a slightly-tensioned state; and
the pushing module is arranged above the fixing module and comprises a base and an ejector pin mechanism, the base is provided with a bottom wall facing the film and defines an air channel, the bottom wall is provided with a pinhole and a plurality of air holes distributed around the pinhole, the air channel is communicated with the air holes and is connected with an air extractor for vacuum adsorption of the film on the bottom wall, the ejector pin mechanism is arranged on the base along the up-down direction and is partially positioned in the air channel and is provided with a pin body, and the pin body can penetrate out of the bottom wall through the pinhole to push the film at a position corresponding to the crystal grains or the solder balls to be removed, so that the film is adhered to the crystal grains or the solder balls to be removed.
6. A kind of repair device, suitable for setting up in the work station top used for bearing the circuit board to be repaired and supplying and installing the film with ductility, and the surface of the film adheres a plurality of crystal grains used for replacing, the circuit board to be repaired has tin balls to be repaired crystalline, characterized by that: the repair device includes:
the fixing module comprises a bearing frame and a pressure frame so as to fix the film and can be in a slightly tightened state; and
the pushing module is arranged above the holding module and comprises a base and an ejector pin mechanism, the base is provided with a bottom wall facing the film and defines an air channel, the bottom wall is provided with a pinhole and a plurality of air holes distributed around the pinhole, the air channel is communicated with the air holes and is connected with an air extractor for vacuum adsorption of the film on the bottom wall, the ejector pin mechanism is arranged on the base along the vertical direction, part of the ejector pin mechanism is positioned in the air channel and is provided with a needle body, and the needle body can penetrate out of the bottom wall through the pinhole to push the film at a position corresponding to a crystal grain to be replaced, so that the crystal grain to be replaced is transferred to a tin ball to be replaced.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111209432U TWM636093U (en) | 2022-08-31 | 2022-08-31 | Rework apparatus |
| TW111209432 | 2022-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218388138U true CN218388138U (en) | 2023-01-24 |
Family
ID=84929190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222674034.1U Active CN218388138U (en) | 2022-08-31 | 2022-10-11 | Repair device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN218388138U (en) |
| TW (1) | TWM636093U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116598236A (en) * | 2023-07-19 | 2023-08-15 | 昆山鸿义精微科技有限公司 | Grain sorting method and sorting system |
-
2022
- 2022-08-31 TW TW111209432U patent/TWM636093U/en unknown
- 2022-10-11 CN CN202222674034.1U patent/CN218388138U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116598236A (en) * | 2023-07-19 | 2023-08-15 | 昆山鸿义精微科技有限公司 | Grain sorting method and sorting system |
| CN116598236B (en) * | 2023-07-19 | 2023-10-13 | 昆山鸿义精微科技有限公司 | Grain sorting method and sorting system |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM636093U (en) | 2023-01-01 |
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