CN218385194U - Chip packaging heat dissipation mechanism - Google Patents
Chip packaging heat dissipation mechanism Download PDFInfo
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- CN218385194U CN218385194U CN202222293182.9U CN202222293182U CN218385194U CN 218385194 U CN218385194 U CN 218385194U CN 202222293182 U CN202222293182 U CN 202222293182U CN 218385194 U CN218385194 U CN 218385194U
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- chip body
- heat dissipation
- dissipation mechanism
- chip
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Abstract
The utility model discloses a chip packaging heat dissipation mechanism, which comprises a substrate, the draw-in groove has all been seted up to the both sides on base plate top, and the block is provided with the encapsulation cover between two draw-in grooves, and the fixed intercommunication in top of encapsulation cover has two heat radiation structure, and two heat radiation structure all include fixing base and semiconductor refrigeration piece, and the inboard middle part fixed mounting of fixing base has the semiconductor refrigeration piece, the utility model relates to a chip packaging heat dissipation mechanism comes to carry out the heat exchange with the chip body through the coolant liquid in a plurality of heat transfer pipe, comes to dispel the heat the cooling to the chip body, comes to blow the surface of chip body with the cold air that two semiconductor refrigeration piece refrigeration faces produced through two second fans, comes to carry out the heat exchange with the chip body, comes to cool down the processing to it to accelerate the discharge of the inside hot-air of encapsulation cover, and then improves the radiating efficiency, avoids the high temperature on chip body surface to further influence the life of chip body.
Description
Technical Field
The utility model relates to a chip package heat dissipation technical field specifically is a chip package heat dissipation mechanism.
Background
The shell for installing the semiconductor integrated circuit chip plays the roles of placing, fixing, sealing, protecting the chip and enhancing the electric heating performance, and is also a bridge for communicating the internal world of the chip with an external circuit, the connecting points on the chip are connected to the pins of the packaging shell through wires, and the pins are connected with other devices through the wires on the printed board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a chip package heat dissipation mechanism to the radiating effect of the current chip package heat dissipation mechanism who provides in solving above-mentioned background art is not good, leads to the high temperature on chip surface and then influences the life's of chip problem.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a chip package heat dissipation mechanism, includes the base plate, the draw-in groove has all been seted up to the both sides on base plate top, two the block is provided with the encapsulation cover between the draw-in groove, the fixed intercommunication in top of encapsulation cover has two heat radiation structure, two heat radiation structure all includes fixing base and semiconductor refrigeration piece, the inboard middle part fixed mounting of fixing base has the semiconductor refrigeration piece, the fixed a plurality of fin that is provided with of cooling surface of semiconductor refrigeration piece, a plurality of top fixed mounting between the fin has first fan, the inboard bottom of fixing base is fixed and is provided with two branches, two fixed mounting has the second fan between the branch, the middle part on base plate top is fixed and is provided with two mount pads, two the block is provided with the chip body between the mount pad, blows the cold air that two refrigeration face produced to the surface of chip body through two second fans, comes to carry out the heat exchange with the chip body, cools down the processing to it to accelerate the discharge of encapsulation cover inside hot-air, and then improve the radiating efficiency, avoid the high temperature on chip body surface to advance and influence the life of chip body.
Preferably, the bottom mounting of chip body is provided with a plurality of heat exchange tube, every adjacent two all fixed intercommunication has a branch pipe between the heat exchange tube, a plurality of the inside of heat exchange tube all is filled with the coolant liquid, comes to carry out the heat exchange with the chip body through the coolant liquid in a plurality of heat exchange tube, comes to dispel the heat the cooling to the chip body.
Preferably, a plurality of radiating holes are formed in the two sides of the packaging cover, a dust separation net is fixedly arranged inside the radiating holes, and the radiating efficiency inside the packaging cover can be improved through the arrangement of the plurality of radiating holes.
Preferably, the packaging cover and the joint of the two clamping grooves are provided with mounting grooves, two limiting elastic pieces are fixedly arranged inside the mounting grooves, the inner sides of the two clamping grooves are provided with limiting grooves, the two limiting elastic pieces are respectively connected with the two limiting groove blocks, and the packaging cover is locked and fixed by the two limiting elastic pieces and the two limiting groove blocks respectively to ensure the tight packaging of the whole structure.
Preferably, the top of the inner side of the packaging cover is fixedly provided with a temperature control switch, the semiconductor refrigeration pieces, the two first fans and the two second fans are electrically connected with an external power supply through the temperature control switch, and the temperature inside the packaging cover is monitored through the temperature control switch.
Preferably, the refrigeration face of semiconductor refrigeration piece corresponds the setting with the second fan, the fixed dust screen that is provided with in inboard top of fixing base, the setting of dust screen can play dirt-proof effect.
Compared with the prior art, the beneficial effects of the utility model are that: the cooling liquid in the plurality of heat exchange pipes exchanges heat with the chip body to cool the chip body, cold air generated by the refrigerating surfaces of the two semiconductor refrigerating pieces is blown to the surface of the chip body through the two second fans to exchange heat with the chip body, the cooling treatment is performed on the chip body, the discharge of hot air in the packaging cover is accelerated, the heat dissipation efficiency is further improved, and the problem that the service life of the chip body is influenced due to the fact that the temperature of the surface of the chip body is too high is avoided.
Drawings
Fig. 1 is a perspective view of the present invention;
fig. 2 is a front sectional view of the present invention;
FIG. 3 is a structural diagram of the heat dissipation structure of the present invention;
fig. 4 is an enlarged view of a portion a of the present invention.
In the figure: 1. a substrate; 2. a package cover; 3. heat dissipation holes; 4. a dust-proof net; 5. a heat dissipation structure; 51. a fixed seat; 52. a semiconductor refrigeration sheet; 53. a heat sink; 54. a first fan; 55. a dust screen; 56. a strut; 57. a second fan; 6. a temperature control switch; 7. a mounting seat; 8. a chip body; 9. a heat exchange pipe; 10. a branch pipe; 11. a card slot; 12. mounting grooves; 13. a limiting elastic sheet; 14. a limiting groove.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Please refer to fig. 1-4, the utility model provides a chip package heat dissipation mechanism, including base plate 1, draw-in groove 11 has all been seted up to the both sides on 1 top of base plate, the block is provided with encapsulation cover 2 between two draw-in grooves 11, the fixed intercommunication in top of encapsulation cover 2 has two heat radiation structure 5, two heat radiation structure 5 all include fixing base 51 and semiconductor refrigeration piece 52, the inboard middle part fixed mounting of fixing base 51 has semiconductor refrigeration piece 52, the fixed a plurality of fin 53 that is provided with of cooling surface of semiconductor refrigeration piece 52, top fixed mounting between a plurality of fin 53 has first fan 54, the inboard bottom of fixing base 51 is fixed and is provided with two branches 56, fixed mounting has second fan 57 between two branches 56, the fixed middle part on 1 top of base plate is provided with two mount pads 7, the block is provided with chip body 8 between two mount pads 7, come to blow the cold air that two semiconductor refrigeration piece 52 refrigeration faces produced to the surface of chip body 8 to the surface through two second fans 57, come to carry out the heat exchange with chip body 8, cool down the processing to it, and accelerate the discharge of encapsulation cover 2 inside hot-air, and then improve the radiating efficiency, avoid the high temperature of chip body 8 to influence the chip body and the life of chip 8.
The bottom mounting of chip body 8 is provided with a plurality of heat exchange tube 9, and all fixed intercommunication has branch pipe 10 between every two adjacent heat exchange tubes 9, and the inside of a plurality of heat exchange tube 9 all is filled with the coolant liquid, comes to carry out the heat exchange with chip body 8 through the coolant liquid in a plurality of heat exchange tube 9, comes to dispel the heat the cooling to chip body 8.
A plurality of louvre 3 has all been seted up to the both sides of packaging cover 2, and the inside of a plurality of louvre 3 is all fixed and is provided with dust separation net 4, can improve the inside radiating efficiency of packaging cover 2 through setting up of a plurality of louvre 3.
The inside top fixed mounting of packaging cover 2 has temperature detect switch 6, and two semiconductor refrigeration pieces 52, two first fans 54 and two second fans 57 all monitor the inside temperature of packaging cover 2 through temperature detect switch 6 and external power supply electric connection, through temperature detect switch 6.
The refrigeration face of semiconductor refrigeration piece 52 corresponds the setting with second fan 57, and the inboard top of fixing base 51 is fixed and is provided with dust screen 55, and dust screen 55's setting can play dirt-proof effect.
When the embodiment of the application is used: chip body 8 work can produce heat, can come to carry out the heat exchange with chip body 8 through the coolant liquid in a plurality of heat exchange tube 9, come to dispel the heat to chip body 8, come to detect the temperature of encapsulation cover 2 internal environment through temperature detect switch 6 simultaneously, when the temperature risees to a definite value, temperature detect switch 6 can be triggered, come to control two semiconductor refrigeration pieces 52, two first fans 54 and two second fans 57 all circular telegram and begin work, come to blow the cold air that two semiconductor refrigeration pieces 52 refrigeration faces produced to the surface of chip body 8 through two second fans 57, come to carry out the heat exchange with chip body 8, come to cool down the processing to it, and accelerate the discharge of encapsulation cover 2 internal hot-air, and then improve the radiating efficiency, avoid the temperature on chip body 8 surface too high to advance and influence the life of chip body 8, come to discharge the heat that two semiconductor refrigeration pieces 52 cooling faces produced fast through two first fans 54, and then improve the radiating efficiency.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (6)
1. A chip package heat dissipation mechanism, includes base plate (1), its characterized in that: draw-in groove (11), two have all been seted up to the both sides on base plate (1) top the block is provided with encapsulation cover (2) between draw-in groove (11), the fixed intercommunication in top of encapsulation cover (2) has two heat radiation structure (5), two heat radiation structure (5) all include fixing base (51) and semiconductor refrigeration piece (52), the middle part fixed mounting of fixing base (51) inboard has semiconductor refrigeration piece (52), the fixed a plurality of fin (53), a plurality of cooling fin (52) that is provided with of cooling surface top fixed mounting between fin (53) has first fan (54), the fixed two branch (56) that are provided with in bottom of fixing base (51) inboard, two fixed mounting has second fan (57) between branch (56), the middle part on base plate (1) top is fixed to be provided with two mount pads (7), two the block is provided with chip body (8) between mount pad (7).
2. The chip package heat dissipation mechanism of claim 1, wherein: the bottom of the chip body (8) is fixedly provided with a plurality of heat exchange tubes (9), and a branch tube (10) is fixedly communicated between every two adjacent heat exchange tubes (9).
3. The die package heat dissipation mechanism of claim 1, wherein: a plurality of radiating holes (3) are formed in two sides of the packaging cover (2), and dust separation nets (4) are fixedly arranged inside the radiating holes (3).
4. The chip package heat dissipation mechanism of claim 1, wherein: mounting grooves (12) are formed in the joints of the packaging cover (2) and the two clamping grooves (11), limiting elastic pieces (13) are fixedly arranged inside the mounting grooves (12), limiting grooves (14) are formed in the inner sides of the two clamping grooves (11), and the limiting elastic pieces (13) are connected with the two limiting grooves (14) in a clamping mode respectively.
5. The chip package heat dissipation mechanism of claim 1, wherein: the top of the inner side of the packaging cover (2) is fixedly provided with a temperature control switch (6), and the semiconductor refrigeration pieces (52), the two first fans (54) and the two second fans (57) are electrically connected with an external power supply through the temperature control switch (6).
6. The chip package heat dissipation mechanism of claim 1, wherein: the refrigerating surface of the semiconductor refrigerating sheet (52) is arranged corresponding to the second fan (57), and a dust screen (55) is fixedly arranged at the top of the inner side of the fixed seat (51).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222293182.9U CN218385194U (en) | 2022-08-31 | 2022-08-31 | Chip packaging heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222293182.9U CN218385194U (en) | 2022-08-31 | 2022-08-31 | Chip packaging heat dissipation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218385194U true CN218385194U (en) | 2023-01-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222293182.9U Active CN218385194U (en) | 2022-08-31 | 2022-08-31 | Chip packaging heat dissipation mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218385194U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118158999A (en) * | 2024-05-09 | 2024-06-07 | 深圳市莫尼迪科技有限责任公司 | Video matrix switching device |
-
2022
- 2022-08-31 CN CN202222293182.9U patent/CN218385194U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118158999A (en) * | 2024-05-09 | 2024-06-07 | 深圳市莫尼迪科技有限责任公司 | Video matrix switching device |
| CN118158999B (en) * | 2024-05-09 | 2024-07-23 | 深圳市莫尼迪科技有限责任公司 | Video matrix switching device |
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