CN218122175U - Wafer all-in-one test equipment - Google Patents
Wafer all-in-one test equipment Download PDFInfo
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- CN218122175U CN218122175U CN202222011163.2U CN202222011163U CN218122175U CN 218122175 U CN218122175 U CN 218122175U CN 202222011163 U CN202222011163 U CN 202222011163U CN 218122175 U CN218122175 U CN 218122175U
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Abstract
The utility model discloses a wafer all in one test equipment, include: the device comprises a carrying platform for bearing a wafer to be tested, a first moving unit for adjusting the position of the carrying platform, an optical image capturing module for optically capturing images of the wafer to be tested, an integrated circuit testing module for testing an integrated circuit of the wafer to be tested, and a crimping conduction assembly, wherein the crimping conduction assembly comprises a pressure head unit for crimping and conducting the wafer to be tested and the integrated circuit testing module, a point screen module for providing a point screen signal for the wafer to be tested, and a control module. The utility model discloses at a test equipment integrated optical test and integrated circuit test function, saved the time that the wafer shifted between test equipment, promoted detection efficiency.
Description
Technical Field
The utility model relates to a wafer detects technical field, more specifically relates to a test equipment is unified to wafer more.
Background
In the existing wafer Test, one Test apparatus usually supports only one Test function, and an integrated circuit Test module (ATE), an Automatic Optical Inspection (AOI) apparatus and a spectrum, chromaticity, and brightness Test apparatus are usually separated independently. Therefore, the wafers need to be transferred and switched to be tested on a plurality of test devices, and the wafers are in pressure connection with the probes for a plurality of times, so that the consumption of manufacturing materials is increased, and the labor cost and the detection time are also increased.
SUMMERY OF THE UTILITY MODEL
At least one defect or improvement demand to prior art, the utility model provides a wafer unifies test equipment more has integrateed optical test and integrated circuit test function at a test equipment, has saved the time that the wafer shifted between test equipment, has promoted detection efficiency.
To achieve the above object, according to the first aspect of the present invention, there is provided an all-in-one wafer testing apparatus, comprising:
a carrier for bearing a wafer to be measured and a first motion unit for adjusting the position of the carrier,
an optical image capturing module for optically capturing an image of a wafer to be tested,
an integrated circuit test module for performing an integrated circuit test on a wafer to be tested,
a press-connecting and conducting component, which comprises a press head unit for press-connecting and conducting the wafer to be tested and the integrated circuit testing module,
a point screen module for providing a point screen signal to the wafer to be tested,
and a first end of the control module is electrically connected with the first motion unit, a second end of the control module is electrically connected with the crimping conduction assembly, and a third end of the control module is electrically connected with the screen dotting module.
Furthermore, the fourth end of the control module is electrically connected to the optical image capturing module, and the fifth end of the control module is electrically connected to the integrated circuit testing module.
Furthermore, the wafer all-in-one testing device further comprises a data processor, a first end of the data processor is electrically connected with the optical image capturing module, and a second end of the data processor is electrically connected with the integrated circuit testing module.
Further, the wafer all-in-one test equipment further comprises a filter wheel, the filter wheel comprises a plurality of optical filters, and the filter wheel is set to enable light rays to pass through one of the optical filters and then enter the optical image capturing module when the optical image capturing module performs optical image capturing on a wafer to be tested.
Furthermore, the wafer all-in-one test equipment further comprises a second moving unit for controlling the position of the filter wheel, and the sixth end of the control module is electrically connected with the second moving unit.
Further, the optical image capturing module comprises a housing, and the housing comprises at least one light inlet;
the shell is internally provided with:
at least one beam splitter for splitting a beam path of an incident beam into at least two partial beam paths,
at least one spectroscopic probe located at least in one of the partial beam paths,
at least one optical sensor located at least in one of the partial beam paths.
Further, each light inlet is provided with a beam splitter.
Further, the beam splitter is located between the optical sensor and the light inlet.
Further, the spectrum probe is arranged on the side of the beam splitter.
Further, the center points of the spectroscopic probe and the optical sensor are arranged in a conjugate or non-conjugate arrangement with respect to the beam splitter.
Generally, through the utility model discloses above technical scheme who conceives compares with prior art, can gain following beneficial effect:
(1) The optical image capturing module and the integrated circuit testing module are integrated in one testing device, switching between two testing functions is achieved through the matching of the modules such as the crimping conduction assembly, the point screen module and the control module, time and labor cost for transferring wafers between the testing devices are saved, the detection efficiency is improved, the number of times for crimping the wafers and the probes is reduced, and wafer loss is reduced.
(2) The optical imaging module is integrated with the spectrum probe and the optical sensor, and different optical tests can be realized based on the spectrum probe and the optical sensor.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without any inventive work.
Fig. 1 is a schematic diagram of a part of components of a wafer all-in-one testing apparatus according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a data processor according to an embodiment of the present invention;
fig. 3 is a schematic view of an optical image capturing module according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. The terms "including" and "having," and any variations thereof, in the description and claims of this invention and the above-described drawings are intended to cover non-exclusive inclusions.
As shown in fig. 1, the utility model discloses a wafer all-in-one test equipment, include: the system comprises a carrying platform, a first motion unit (not shown), an optical image capturing module (101), an integrated circuit testing module (not shown), a press connection conducting assembly (102), a screen dotting module (not shown) and a control module (not shown).
The carrying platform is used for carrying a wafer to be tested, and the first moving unit is used for adjusting the position of the carrying platform so as to move the wafer to be tested to a preset position.
The optical image capturing module is used for optically capturing an image of the wafer to be tested, and the image data acquired by the optical image capturing module can be used for data analysis and processing, for example, the appearance defect detection result, the chromaticity, the brightness test data and the like are acquired according to the image data. The specific structure can be realized by any prior art.
The integrated circuit test module is used for carrying out integrated circuit test on the wafer to be tested, and the specific structure of the integrated circuit test module can be realized by adopting any prior art.
The crimping conduction assembly (102) comprises a pressure head unit for crimping and conducting the wafer to be tested and the integrated circuit testing module, and after the pressure head unit conducts the integrated circuit testing module and the wafer to be tested, the integrated circuit can be tested. The crimp conduction assembly may be a probe card.
The point screen module is used for providing a point screen signal for the wafer to be tested. The level signal is controlled by the control module, and the switching of different point screen signals can be realized. When the integrated circuit is tested, the point screen module is controlled to provide corresponding point screen signals for the wafer, and then the point screen signals required by optical image capture are switched to when the optical image capture is carried out.
The first end of the control module is electrically connected with the first moving unit, the first moving unit is controlled to drive the carrying platform to move, the position of the wafer is adjusted, the second end of the control module is electrically connected with the crimping conduction assembly to control the conduction and disconnection operations of the crimping conduction assembly, the third end of the control module is electrically connected with the point screen module, and the switching of point screen signals is controlled.
Furthermore, the fourth end of the control module is electrically connected to the optical image capturing module, and the fifth end of the control module is electrically connected to the integrated circuit testing module and is respectively used for controlling the optical image capturing module and the integrated circuit testing module.
Furthermore, the wafer all-in-one test equipment further comprises a filter wheel (103), the filter wheel comprises a plurality of optical filters, and the filter wheel is set to be in a state that light rays pass through one of the optical filters and then enter the optical image capturing module when the optical image capturing module performs optical image capturing on the wafer to be tested.
Furthermore, the wafer all-in-one test equipment further comprises a second movement unit for controlling the position of the filter wheel, and the sixth end of the control module is electrically connected with the second movement unit to control the movement of the second movement unit, so that the switching of the optical filter is realized.
Further, as shown in fig. 2, the wafer all-in-one testing apparatus further includes a data processor, a first end of the data processor is electrically connected to the optical image capturing module, and obtains data of the optical image capturing module, such as AOI measurement data and other optical detection data. And the second end of the processor is electrically connected with the integrated circuit test module to obtain the integrated circuit test.
The working principle of the wafer all-in-one test equipment is as follows: 1. the control module controls the first movement unit to drive the crystal grains on the wafer to be tested to reach the preset position, then controls the crimping conduction assembly to crimp and conduct the wafer to be tested and the integrated circuit test module, and controls the point screen signal of the point screen module according to different test requirements after crimping is completed. 2. The integrated circuit test module is used for carrying out integrated circuit test and obtaining the integrated circuit test data of the tested crystal grain. 3. After the integrated circuit is tested, the point screen module is switched to a point screen signal required by optical image capture to obtain optical image data, such as an AOI image and other optical measurement images, wherein the AOI image can be used for outputting an AOI result, and the other optical measurement images can be used for outputting results such as chromaticity, brightness and the like of a tested crystal grain. 4. The data processor acquires and analyzes various test data after completing various tests, and can also integrate several types of result data for local storage and result reporting. And switching to the next crystal grain after the current crystal grain is tested, finally completing the detection of the whole wafer, and then switching to the next wafer for the next detection.
The testing equipment of the embodiment integrates the optical image capturing module and the integrated circuit testing module, realizes switching among several testing functions through matching of the modules such as the crimping conduction assembly, the point screen module and the control module, saves time and labor cost for transferring wafers among the testing equipment, improves detection efficiency, reduces the number of times of crimping the wafers and the probes and reduces wafer loss.
Further, as shown in fig. 3, the optical image capturing module includes a housing 1, where the housing 1 includes a light inlet 2; a beam splitter 3 is arranged in the housing 1 and is used for splitting a beam path of an incident beam 6 into two partial beam paths 7, wherein one partial beam path 7 is coaxially arranged with the incident beam 6, and the other partial beam path 7 is vertically arranged with the incident beam 6; a spectroscopic probe 4 is arranged on a partial beam path 7 arranged coaxially to the incident beam 6, and an optical sensor 5 is arranged on a partial beam path 7 arranged perpendicularly to the incident beam 6.
In a preferred embodiment of the present invention, the beam splitter 3 is located between the optical sensor 5 and the light inlet 2.
In a preferred embodiment of the present invention, the spectroscopic probe 4 is arranged to the side of the beam splitter 3.
In a preferred embodiment of the present invention, as shown in fig. 1, the inside and outside of the casing 1 is provided with the spectrum processing module 10, the spectrum processing module 10 is directly connected to the spectrum probe 4, i.e. the spectrum processing module 10+ the spectrum probe 4= the spectrometer, this condition is suitable for a large-size camera, so as to directly integrate the spectrometer into the camera casing.
The utility model discloses an in the preferred embodiment, casing 1 is provided with spectrum processing module 10 outward, and spectrum processing module 10 passes through light with spectral probe 4 and is connected, and this kind of condition is applicable to small-size camera, and the spectrum appearance is not deposited to the space in the camera casing, so can draw forth the signal of spectral probe 4 to external spectrum appearance with light.
In a preferred embodiment of the present invention, the center points of the spectrum probe 4 and the optical sensor 5 are arranged in a conjugate manner with respect to the beam splitter 3, and the spectrum probe 4 is not necessarily conjugated with the center point of the chip, and can also be placed at a conjugate point of other fields of view, so that the spectrum measurement can be performed at any point in the field of view.
In a preferred embodiment of the present invention, the optical sensor 5 includes, but is not limited to, a black and white camera sensor chip, a color camera sensor chip.
In a preferred embodiment of the present invention, the optical sensor 5 is connected to an external computer.
In a preferred embodiment of the present invention, a lens 8 is disposed at the light inlet 2.
In a preferred embodiment of the present invention, the beam splitter 3 comprises a beam splitter or a plate beam splitter.
In a preferred embodiment of the present invention, the beam splitting ratio of the beam splitter 3 includes 1:9 or 2:8 or 3:7 or 4:6 or 5:5.
in a preferred embodiment of the present invention, the housing 1 may be provided with a plurality of light inlets 2, and each light inlet 2 is correspondingly provided with a beam splitter 3.
In a preferred embodiment of the present invention, the spectrum probe 4 can be one, or a plurality of spectrum probes can be arranged side by side, and is selected according to the requirement of displaying the point to be measured of the product.
In a preferred embodiment of the present invention, the spectroscopic probe 4 may be a spectroscopic probe.
In the above embodiment, the optical image capturing module works according to the following principle:
an incident light beam 6 emitted by a product 9 to be detected is imaged and collected through a lens 8, and then a part of light is incident on an optical sensor 5 to image the product, so that the product 9 to be detected can be subjected to defect detection or other analysis based on a computer; and the other part of light is reflected to the spectrum probe of the spectrum probe 4, wherein the front end point of the spectrum probe collects light emitted from the object surface of the product 9 to be measured, and outputs the light to the built-in or external spectrum processing module 10, so that the function of spectrum measurement is realized.
In the above embodiments, the optical imaging module is integrated with the optical spectrum probe and the optical sensor, and different optical tests can be implemented based on the optical spectrum probe and the optical sensor. Overall, can be used to realize trinity test: (1) wafer AOI test; (2) testing spectrum, chroma and brightness; and (3) testing the integrated circuit.
The above description is only an exemplary embodiment of the present disclosure, and the scope of the present disclosure should not be limited thereby. That is, all equivalent changes and modifications made in accordance with the teachings of the present disclosure are intended to be included within the scope of the present disclosure. Embodiments of the present disclosure will be readily apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. The invention is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
Claims (10)
1. An all-in-one wafer test device, comprising:
a carrier for bearing a wafer to be measured and a first motion unit for adjusting the position of the carrier,
an optical image capturing module for optically capturing an image of a wafer to be tested,
an integrated circuit test module for performing an integrated circuit test on a wafer to be tested,
a press-connecting component, which comprises a pressure head unit for press-connecting and connecting the wafer to be tested and the integrated circuit testing module,
a point screen module for providing a point screen signal to the wafer to be tested,
and a first end of the control module is electrically connected with the first motion unit, a second end of the control module is electrically connected with the crimping conduction assembly, and a third end of the control module is electrically connected with the screen dotting module.
2. The wafer all-in-one test apparatus as claimed in claim 1, wherein the fourth end of the control module is electrically connected to the optical image capturing module, and the fifth end of the control module is electrically connected to the integrated circuit test module.
3. The wafer all-in-one test apparatus as claimed in claim 1, further comprising a data processor, wherein a first end of the data processor is electrically connected to the optical image capturing module, and a second end of the data processor is electrically connected to the integrated circuit test module.
4. The wafer all-in-one testing apparatus as claimed in claim 1, further comprising a filter wheel, wherein the filter wheel comprises a plurality of optical filters, and the filter wheel is configured such that when the optical image capturing module performs optical image capturing on a wafer to be tested, light passes through one of the optical filters and then enters the optical image capturing module.
5. The wafer all-in-one test apparatus as claimed in claim 4, further comprising a second moving unit for controlling the position of the filter wheel, wherein the sixth end of the control module is electrically connected to the second moving unit.
6. The wafer all-in-one testing apparatus as claimed in claim 1, wherein the optical image capturing module includes a housing, the housing including at least one light inlet;
the casing is provided with:
at least one beam splitter for splitting a beam path of an incident beam into at least two partial beam paths,
at least one spectral probe located at least in one of said partial beam paths,
at least one optical sensor located at least in one of the partial beam paths.
7. The wafer all-in-one test apparatus as claimed in claim 6, wherein each light inlet is provided with a beam splitter.
8. The wafer all-in-one test apparatus as claimed in claim 6, wherein the beam splitter is located between the optical sensor and the light inlet.
9. The wafer all-in-one test apparatus as claimed in claim 6, wherein the spectrum probe is disposed at a side of the beam splitter.
10. The wafer all-in-one test apparatus as claimed in claim 6, wherein the center points of the spectrum probe and the optical sensor are arranged in a conjugate or non-conjugate manner with respect to the beam splitter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222011163.2U CN218122175U (en) | 2022-08-01 | 2022-08-01 | Wafer all-in-one test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222011163.2U CN218122175U (en) | 2022-08-01 | 2022-08-01 | Wafer all-in-one test equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218122175U true CN218122175U (en) | 2022-12-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222011163.2U Active CN218122175U (en) | 2022-08-01 | 2022-08-01 | Wafer all-in-one test equipment |
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| Country | Link |
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| CN (1) | CN218122175U (en) |
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- 2022-08-01 CN CN202222011163.2U patent/CN218122175U/en active Active
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