CN218019997U - Die parallelism monitoring and adjusting device - Google Patents
Die parallelism monitoring and adjusting device Download PDFInfo
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- CN218019997U CN218019997U CN202221343118.0U CN202221343118U CN218019997U CN 218019997 U CN218019997 U CN 218019997U CN 202221343118 U CN202221343118 U CN 202221343118U CN 218019997 U CN218019997 U CN 218019997U
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Abstract
The application discloses a mold parallelism monitoring and adjusting device, which is used for monitoring and adjusting the parallelism of molds fixed on a fixed mold plate and a movable mold plate respectively after the molds are closed, wherein four corners of the fixed mold plate are provided with leveling assemblies, each leveling assembly comprises a pressure pad and a pull rod, the pressure pad is internally hollow and is provided with an oil cavity, the rear end part of each pull rod is positioned in the pressure pad to divide the oil cavity into a front oil cavity and a rear oil cavity, the side walls of the front oil cavity and the rear oil cavity are respectively provided with an oil hole for filling or discharging oil inwards, the oil holes are connected to an oil pump, and the oil pump fills and discharges oil into the front oil cavity and the rear oil cavity so as to control the pull rod to move back and forth; through holes for the pull rods to pass through are formed in four corners of the movable template, and clamps for clamping the pull rods are arranged on the back of the movable template far away from the fixed template and beside the through holes. When the die is closed, the clamp clamps the pull rods, the four corners of the movable die plate are fixed with the four pull rods one by one, and the pull rods on a certain corner can be controlled to move to drive the movable die plate to adjust the die closing angle through checking the die closing parallelism of the die if deviation exists, so that the die closing parallelism is ensured.
Description
Technical Field
The application relates to a mold parallelism monitoring and adjusting device, and relates to the technical field of injection molding machines.
Background
The injection molding machine is used for producing integrated injection molding products, materials are injected into a mold and then are integrally formed, the mold is split into two parts, one part is fixed on a fixed mold plate, the other part is fixed on a movable mold plate, the movable mold plate moves towards the fixed mold plate to be closed, and the parallelism of the closed mold directly influences the operation of the injection molding machine and the quality of plastic products.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the application is how to monitor and adjust the parallelism of the closing die of the injection molding machine so as to evaluate the injection molding quality.
In order to solve the technical problems, the technical scheme of the application is to provide a mold parallelism monitoring and adjusting device which is used for monitoring and adjusting parallelism of molds which are fixed on a fixed mold plate and a movable mold plate respectively after the molds are closed, and the mold parallelism monitoring and adjusting device is characterized in that leveling assemblies are arranged at four corners of the fixed mold plate and comprise pressure pads and pull rods, an oil cavity is arranged in the pressure pads in a hollow mode, the rear end portions of the pull rods are located in the pressure pads to divide the oil cavity into a front oil cavity and a rear oil cavity, oil holes which are used for filling oil or discharging oil inwards are arranged on the side walls of the front oil cavity and the rear oil cavity and connected to an oil pump, and the oil pump is used for filling and discharging oil into the front oil cavity and the rear oil cavity so as to control the pull rods to move forwards and backwards; through holes for the pull rods to pass through are formed in four corners of the movable template, and clamps for clamping the pull rods are arranged on the back face, far away from the fixed template, of the movable template and beside the through holes.
Preferably, the leveling assembly further comprises a displacement sensor arranged between the rear end part of the pull rod and the oil cavity wall of the pressure pad, and the displacement sensor measures the displacement of the rear end part of the pull rod relative to the oil cavity wall of the pressure pad.
Specifically, the displacement sensor is a non-contact hysteresis telescopic linear displacement sensor and comprises a sensor body and a magnetic ring, the sensor body is fixedly arranged on the wall of the pressure pad oil cavity, the magnetic ring is fixedly arranged on the rear end part of the pull rod, and the pull rod moves to drive the magnetic ring to move on the sensor body.
This application advantage lies in, uses the mould depth of parallelism monitoring adjusting device that this application provided, thereby can monitor the displacement sensor on four pressure pads during the compound die and measure the offset value numerical value of tip behind the pull rod, through the numerical value when the compound die at every turn of comparison, can monitor the depth of parallelism of mould to the adaptability adjustment. The mould depth of parallelism, the operation of direct influence injection molding machine and the quality of plastic products, through adopting the mould depth of parallelism monitoring adjusting device that this application provided, can guarantee the mould depth of parallelism, improve injection molding machine production efficiency and production quality.
Drawings
FIG. 1 is a schematic diagram of a fixed die plate structure provided in the examples;
FIG. 2 is a schematic structural view of a leveling assembly provided in an embodiment;
FIG. 3 is a schematic view of the movable and fixed mold plates being closed;
reference numerals: the device comprises a fixed template 1, a leveling component 2, a pressure pad 21, a front oil cavity 21-1, a rear oil cavity 21-2, a pull rod 22, a displacement sensor 23, a movable template 3, a clamp 31 and a test block 4.
Detailed Description
In order to make the present application more comprehensible, preferred embodiments are described in detail below with reference to the accompanying drawings.
Examples
The embodiment provides a mold parallelism monitoring and adjusting device for adjusting the mold parallelism of mold closing of an injection molding machine, the structure of the mold closing of the injection molding machine comprises a fixed mold plate and a movable mold plate for fixing the mold, the mold is generally divided into two sub-molds which are respectively fixed on the side surfaces of the fixed mold plate and the movable mold plate facing to each other, the fixed mold plate keeps static, the movable mold plate moves towards the fixed mold plate and closes the two sub-molds, the movable mold plate always keeps parallel with the fixed mold plate in the moving process, but the movable mold plate or the sub-molds have possible installation errors to cause small deviation of the mold closing parallelism, therefore, as shown in figure 1, leveling assemblies 2 are arranged at four corners of the fixed mold plate 1, each leveling assembly 2 comprises a pressure pad 21 and a pull rod 22, as shown in figure 2, a hollow oil cavity in the pressure pad 21 is arranged, the rear end part of the pull rod 22 is positioned in the pressure pad 21 to divide the oil cavity into a front oil cavity 21-1 and a rear oil cavity 21-2, oil cavities 21-1 and the rear oil cavity 21-2 are respectively provided with oil holes for filling or discharging oil to the inside, and the front oil cavity 21-1 and the rear oil cavity 22 are controlled by controlling the oil cavity to move back and forth.
The through holes for the pull rods 22 to pass through are formed in four corners of the movable template 3, the movable template 3 is far away from the back face of the fixed template 1, and the clamp 31 for clamping the pull rods 22 is arranged beside the through holes.
Furthermore, in order to accurately measure the parallelism of the mold clamping, as shown in fig. 2, the leveling assembly 2 further includes a displacement sensor 23 disposed between the rear end of the tie rod 22 and the wall of the oil cavity in the pressure pad 21, wherein the displacement sensor 23 is used for measuring the displacement of the rear end of the tie rod 22 relative to the wall of the oil cavity in the pressure pad 21. When the four displacement sensors 23 distributed at four corners of the fixed die plate 1 provide four displacement parameters, in a specific use, as shown in fig. 3, a test block 4 is fixed on the fixed die plate 1 and the movable die plate 3 as a test die, readings of the four displacement sensors 23 when the test block 4 is closed are respectively marked as A1, A2, A3 and A4, at this time, A1, A2, A3 and A4 are used as standard reference values, then the die to be used is fixed on the fixed die plate 1 and the movable die plate 3, readings of the four displacement sensors 23 after the die is closed are marked as B1, B2, B3 and B4, at this time, B1, B2, B3 and B4 are actual measurement values, the actual measurement values and the standard reference values are subjected to zeroing comparison, if a measurement value at a certain corner has a small deviation, the movable die plate 3 is adjusted by adjusting the leveling component 2 at the corresponding corner, if a measurement value has a large deviation exceeding an allowable deviation range, the equipment may have other problems, and verification and check after alarm is performed.
Specifically, the displacement sensor 23 may be a non-contact hysteresis extension linear displacement sensor of gerfrran-IK 4S type, and includes a sensor body and a magnetic ring, the sensor body is fixed on the oil cavity wall of the pressure pad 21, the magnetic ring is fixed on the rear end portion of the pull rod 22, and the pull rod 22 moves to drive the magnetic ring to move on the sensor body, so as to measure the reading.
In conclusion, the mold parallelism monitoring and adjusting device provided by the embodiment can monitor the displacement sensors on the four pressure pads during mold closing so as to measure the value of the offset of the rear end part of the pull rod, and can monitor the parallelism of the mold by comparing the values during mold closing at each time, so that the adaptability can be adjusted. The quality of the mold parallelism directly influences the operation of the injection molding machine and the quality of plastic products, and the mold parallelism monitoring and adjusting device provided by the embodiment can ensure the mold parallelism and improve the production efficiency and the production quality of the injection molding machine.
Claims (3)
1. A mold parallelism monitoring and adjusting device is used for monitoring and adjusting parallelism of molds which are fixed on a fixed mold plate and a movable mold plate respectively after the molds are closed, and is characterized in that leveling assemblies (2) are arranged at four corners of the fixed mold plate (1), each leveling assembly (2) comprises a pressure pad (21) and a pull rod (22), an oil cavity is arranged in a hollow manner in each pressure pad (21), the rear end part of each pull rod (22) is positioned in each pressure pad (21) to divide the oil cavity into a front oil cavity (21-1) and a rear oil cavity (21-2), oil holes for filling or discharging oil inwards are formed in the side walls of the front oil cavity (21-1) and the rear oil cavity (21-2), the oil holes are connected to an oil pump, and the oil pump fills or discharges oil into the front oil cavity (21-1) and the rear oil cavity (21-2) so as to control the pull rod (22) to move back and forth; through holes for the pull rods (22) to penetrate through are formed in four corners of the movable template (3), and clamps (31) for clamping the pull rods (22) are arranged on the back, far away from the fixed template (1), of the movable template (3) and beside the through holes.
2. A mold parallelism monitoring-adjusting apparatus according to claim 1, wherein the leveling assembly (2) further comprises a displacement sensor (23) disposed between the rear end of the tie rod (22) and the oil chamber wall of the pressure pad (21), the displacement sensor (23) measuring the displacement of the rear end of the tie rod (22) relative to the oil chamber wall of the pressure pad (21).
3. The device for monitoring and adjusting the parallelism of a mold according to claim 2, wherein the displacement sensor (23) is a non-contact hysteresis-extension linear displacement sensor, and comprises a sensor body and a magnetic ring, the sensor body is fixed on the wall of the oil chamber of the pressure pad (21), the magnetic ring is fixed on the rear end of the pull rod (22), and the pull rod (22) moves to drive the magnetic ring to move on the sensor body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202221343118.0U CN218019997U (en) | 2022-05-19 | 2022-05-19 | Die parallelism monitoring and adjusting device |
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CN202221343118.0U CN218019997U (en) | 2022-05-19 | 2022-05-19 | Die parallelism monitoring and adjusting device |
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CN218019997U true CN218019997U (en) | 2022-12-13 |
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CN202221343118.0U Active CN218019997U (en) | 2022-05-19 | 2022-05-19 | Die parallelism monitoring and adjusting device |
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2022
- 2022-05-19 CN CN202221343118.0U patent/CN218019997U/en active Active
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