CN217820976U - Heat dissipation device and optical module - Google Patents

Abstract

The utility model discloses a heat dissipation device and an optical module, which belong to the technical field of optical module design and manufacture, and comprise an upper shell, a fixing clamp, a graphite radiating fin and a first heat conducting pad, wherein the upper shell is at least provided with a groove and comprises a hollow part for placing a heating device; the fixing clamp comprises a clamping groove and a supporting body, a limiting groove is arranged on the supporting body, and the clamping groove is clamped with the groove; the graphite radiating fin is arranged in the hollow part, the graphite radiating fin is clamped with the clamping groove, and the graphite radiating fin is tightly attached to the support body; the first heat conducting pad is embedded into the limiting groove and is connected with the graphite radiating fin and the heating device respectively. The utility model discloses reach the stability that improves graphite fin, realize long-term high-efficient radiating technological effect fast.

Description

Heat dissipation device and optical module

Technical Field

The utility model belongs to the technical field of optical module manufacturing and designing, in particular to heat abstractor and optical module.

Background

With the rapid development of the optical communication field, a large number of devices are applied to the optical module, and further the thermal power consumption of the optical module is increased rapidly. The design of the optical module needs to meet related protocols, so that the design is limited by the protocols, the heat dissipation technology becomes a challenge, and the graphite heat sink is gradually applied to the optical module due to the ultra-high heat conductivity coefficient.

At present, in the existing optical module design and manufacturing technology, a traditional graphite radiating fin is usually adhered to a shell by heat conducting glue, however, in an optical module, due to comprehensive factors such as a spatial structure and an application environment in the optical module, the graphite radiating fin cannot be ensured to be adhered to the optical module shell for a long time only by an adhesion mode. If the graphite radiating fins and the shell are degummed, the thermal resistance is increased, the radiating efficiency is reduced, and the temperature of the optical module is higher than the working temperature. More seriously, the communication equipment fails, the graphite radiating fins installed in the optical module have poor stability, and the graphite radiating fins are difficult to realize long-term fixation and long-term efficient and rapid heat dissipation.

As described above, in the conventional optical module designing and manufacturing technology, there is a technical problem that the stability of the graphite heat sink is poor and it is difficult to realize efficient and rapid heat dissipation for a long period of time.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that the poor stability of graphite fin is difficult to realize long-term high-efficient radiating technical problem fast.

In order to solve the technical problem, the utility model provides a heat dissipation device, the device includes: the heat-conducting device comprises an upper shell, a fixing clamp, a graphite radiating fin and a first heat-conducting pad, wherein the upper shell is at least provided with a groove and comprises a hollow part for placing a heating device; the fixing clamp comprises a clamping groove and a supporting body, a limiting groove is arranged on the supporting body, and the clamping groove is clamped with the groove; the graphite radiating fin is arranged in the hollow part, the graphite radiating fin is clamped with the clamping groove, and the graphite radiating fin is tightly attached to the support body; the first heat conducting pad is embedded into the limiting groove and is connected with the graphite radiating fin and the heating device respectively.

Further, the upper shell also comprises a mounting groove; the device further comprises: the cooling tooth piece sets are arranged in the mounting grooves and distributed along the length extending direction of the mounting grooves, and the distance between every two adjacent cooling tooth piece sets is equal.

Furthermore, each group of heat dissipation tooth piece group comprises a plurality of first tooth pieces and a second tooth piece arranged between two adjacent first tooth pieces, and the height of each first tooth piece is greater than that of each second tooth piece.

Further, a plurality of the first tooth plates are parallel to each other.

Further, the apparatus further comprises: and the PCB is connected with the heating device.

Further, the apparatus further comprises: and the second heat conduction pad is connected with the PCB.

Further, the apparatus further comprises: the base is matched with the upper shell and connected with the upper shell, and the hollow part is surrounded by the base and the upper shell.

According to the utility model discloses a still another aspect, the utility model discloses still provide an optical module, including the device that generates heat, still include heat abstractor, the device that generates heat place in well kenozooecium.

Has the beneficial effects that:

the utility model provides a heat abstractor, through recess looks joint in joint groove and the epitheca in the mounting fixture, graphite fin installs in the well kenozooecium of epitheca, the joint groove looks joint of graphite fin and mounting fixture, graphite fin with the support body pastes tightly mutually. The first heat conducting pad is embedded into a limiting groove in the support body of the fixing clamp, and the first heat conducting pad is connected with the graphite radiating fin and the heating device respectively. Therefore, the fixing clamp is arranged on the upper shell, the graphite radiating fins are arranged on the fixing clamp, the fixing clamp can enable the graphite radiating fins to be fastened in the upper shell for a long time, the stability of the graphite radiating fins can be improved, and long-term efficient and rapid heat dissipation is achieved. Therefore, the technical effects of improving the stability of the graphite radiating fin and realizing long-term efficient and rapid radiating are achieved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a first schematic view of a heat dissipation device according to an embodiment of the present invention;

fig. 2 is a second schematic view of a heat dissipation device according to an embodiment of the present invention;

fig. 3 is a third schematic view of a heat dissipation device according to an embodiment of the present invention;

fig. 4 is a schematic diagram of a heat dissipation apparatus according to a fourth embodiment of the present invention;

fig. 5 is a fifth schematic view of a heat dissipation device according to an embodiment of the present invention;

fig. 6 is a sixth schematic view of a heat dissipation device according to an embodiment of the present invention.

Detailed Description

The utility model discloses a heat abstractor, through 11 looks joints of recess in 2 well joint grooves 21 of mounting fixture and the epitheca 1, graphite fin 3 is installed in the well kenozooecium 12 of epitheca 1, the 21 looks joints in joint grooves of graphite fin 3 and mounting fixture 2, graphite fin 3 with supporter 22 pastes tightly mutually. The first heat conducting pad 4 is embedded into the limiting groove 221 on the support body 22 of the fixing clamp 2, and the first heat conducting pad 4 is connected with the graphite heat radiating fin 3 and the heating device 9 respectively. Like this mounting fixture 2 installs at epitheca 1, and graphite fin 3 installs at mounting fixture 2, and mounting fixture 2 can be so that graphite fin 3 fastens in epitheca 1 for a long time, can improve graphite fin 3's stability, realizes long-term high-efficient quick heat dissipation. Therefore, the technical effects of improving the stability of the graphite radiating fins 3 and realizing long-term efficient and rapid radiating are achieved.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art belong to the protection scope of the present invention; the "and/or" keyword involved in this implementation represents sum or two cases, in other words, the a and/or B mentioned in the embodiment of the present invention represents two cases of a and B, A or B, and describes three states where a and B exist, such as a and/or B, representing: only A does not include B; only B does not include A; including A and B.

It will be understood that, although the terms "first", "second", etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments. Spatially relative terms, such as "below," "above," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "lower" would then be oriented "upper" other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Also, in embodiments of the invention, when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions used in the embodiments of the present invention are for illustrative purposes only and are not intended to limit the present invention.

Example one

Please refer to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5 and fig. 6, fig. 1 is a first schematic diagram of a heat dissipation apparatus provided in an embodiment of the present invention, fig. 2 is a second schematic diagram of a heat dissipation apparatus provided in an embodiment of the present invention, fig. 3 is a third schematic diagram of a heat dissipation apparatus provided in an embodiment of the present invention, fig. 4 is a fourth schematic diagram of a heat dissipation apparatus provided in an embodiment of the present invention, fig. 5 is a fifth schematic diagram of a heat dissipation apparatus provided in an embodiment of the present invention, and fig. 6 is a sixth schematic diagram of a heat dissipation apparatus provided in an embodiment of the present invention. The embodiment of the utility model provides a pair of heat abstractor, including epitheca 1, mounting fixture 2, graphite fin 3 and first heat conduction pad 4, now carry out the detailed description to epitheca 1, mounting fixture 2, graphite fin 3 and first heat conduction pad 4 respectively:

for the upper case 1, the fixing jig 2, the graphite fins 3, and the first thermal pad 4:

the upper shell 1 is at least provided with a groove 11 and comprises a hollow part 12 for placing the heating device 9; the upper shell 1 further comprises a mounting groove 13; the fixing clamp 2 comprises a clamping groove 21 and a supporting body 22, a limiting groove 221 is formed in the supporting body 22, and the clamping groove 21 is clamped with the groove 11; the graphite radiating fins 3 are arranged in the hollow part 12, the graphite radiating fins 3 are clamped with the clamping grooves 21, and the graphite radiating fins 3 are tightly attached to the supporting body 22; the first thermal pad 4 is embedded in the limiting groove 221, and the first thermal pad 4 is connected to the graphite heat sink 3 and the heat generating device 9 respectively.

Specifically, the groove 11 in the upper case 1 is located at a side close to the fixing fixture 2, and the clamping groove 21 in the fixing fixture 2 means that one end of the fixing fixture 2 is bent upward to form a hem, and the hem can be clamped into the groove 11 in the upper case 1, so that the fixing fixture 2 and the groove 11 of the upper case 1 are clamped with each other through the clamping groove 21. Inside the hollow portion 12 of the upper case 1, there is a space in which the fixing jig 2, the graphite heat sink 3, the first heat conduction pad 4, the PCB board 6, and the second heat conduction pad 7 are accommodated. The limiting groove 221 disposed on the supporting body 22 in the fixing clamp 2 may have a space for accommodating the first thermal pad 4, and the first thermal pad 4 may be embedded in the limiting groove 221 to contact with the graphite heat sink 3, so as to transfer heat to the graphite heat sink 3 through the first thermal pad 4, and then the graphite heat sink 3 transfers heat to the upper case 1. The graphite heat sink 3 and the support 22 can be attached to each other, and the graphite heat sink 3 can absorb the heat transferred by the first thermal pad 4. The first heat conduction pad 4 is installed on the heating device 9, and the first heat conduction pad 4 penetrates through the limiting groove 221 and then is connected with the graphite heat radiating fin 3.

The embodiment of the utility model provides a pair of heat abstractor still includes multiunit heat dissipation tooth piece group 5, multiunit heat dissipation tooth piece group 5 install in mounting groove 13, multiunit heat dissipation tooth piece group 5 along the length extending direction of mounting groove 13 distributes, each group interval between the heat dissipation tooth piece group 5 equals. Each group of the heat dissipation tooth sheet group 5 comprises a plurality of first tooth sheets and second tooth sheets arranged between two adjacent first tooth sheets, and the height of each first tooth sheet is greater than that of each second tooth sheet. The first tooth plates are parallel to each other. The embodiment of the utility model provides a heat abstractor can also include PCB board 6, PCB board 6 with device 9 that generates heat is connected. The embodiment of the utility model provides a heat abstractor can also include second heat conduction pad 7, second heat conduction pad 7 with PCB board 6 is connected. An embodiment of the utility model provides a heat abstractor can also include with the base 8 that upper shell 1 matches each other, base 8 with upper shell 1 is connected, base 8 with upper shell 1 surrounds well kenozooecium 12.

Specifically, the multiple groups of cooling fin groups 5 may refer to 1 group of cooling fin groups 5, 2 groups of cooling fin groups 5, 3 groups of cooling fin groups 5, and the like. The heat dissipation tooth set 5 may include a plurality of first teeth, and a second tooth is disposed between two adjacent first teeth. The heights of the first tooth sheets in the vertical direction are equal, the heights of the second tooth sheets in the vertical direction are equal, and the heights of the first tooth sheets are larger than the heights of the second tooth sheets. Through the detachable connection of the base 8 and the upper shell 1, a hollow part 12 is enclosed between the base 8 and the upper shell 1.

Referring to fig. 1, 2 and 3, a graphite heat sink 3 with ultrahigh heat conductivity is applied to an upper casing 1, one side surface of the graphite heat sink 3 is adhered to the upper casing 1 through a heat conductive adhesive, the other side surface of the graphite heat sink 3 is tightly attached to a fixing clamp 2, and the whole fixing clamp 2 can be designed into a plate shape and made of stainless steel. Referring to fig. 1 and 2, one end of the fixing clip 2 may be designed as an upward folded hem, which may be engaged in a groove 11 formed in the upper housing 1, so as to fix one end of the fixing clip 2. Referring to fig. 2, 3 and 4, on the other side where the fixing clamp 2 and the heating device 9 contact each other, a portion of the fixing clamp 2 contacting the heating device 9 may be designed as a limiting groove 221 lower than the surface of the device, the limiting groove 221 may be fixed on the surface of the heating device 9, the limiting groove 221 may not completely cover the upper surface of the heating device 9, a first thermal pad 4 may be disposed on the upper surface of the heating device 9, and the first thermal pad 4 is used for transferring heat of the heating device 9 to the graphite heat sink 3. The vertical section of mounting fixture 2 and the device 9 in close contact with that generates heat that sets up can enlarge mounting fixture 2 and the device 9 that generates heat area all around, can adopt metal material's mounting fixture 2 to derive the device 9 heat all around that generates heat, improves the radiating efficiency. The number of the limiting grooves 221, which are formed by the metal fixing clamp 2 and the heating devices 9 in contact with each other, can be adjusted according to the number of the heating devices 9, and at least one limiting groove 221 needs to be arranged. Referring to fig. 4, the height of the horizontal section structure of the fixing clamp 2 made of metal may be adjusted up and down according to the actual spatial size of the optical module, and the flexibility is high. Referring to fig. 1 and 5, the multiple groups of heat dissipation tooth sets 5 of the heat sink in the optical module heat dissipation device may be configured to be in a high-low tooth structure, and the high-low tooth structure may destroy an adhesion layer of the flowing air on the surface of the heat dissipation belt, so as to increase the heat dissipation area and improve the heat dissipation capability. And the multiple groups of radiating tooth sheets can be designed to adopt 'broken teeth', so that not only can the system resistance be reduced, but also the radiating efficiency can be integrally improved. The plurality of groups of heat dissipation tooth sets 5 can be made into an integral part with the upper shell 1 through molding modes such as die casting, and the plurality of groups of heat dissipation tooth sets 5 can be adhered to the surface of the upper shell 1 through conductive silver adhesive and the like.

The utility model provides a heat abstractor, through 11 looks joints of recess in 2 well joint grooves 21 of mounting fixture and the epitheca 1, graphite fin 3 is installed in the well kenozooecium 12 of epitheca 1, the joint groove 21 looks joints of graphite fin 3 and mounting fixture 2, graphite fin 3 with supporter 22 pastes tightly mutually. The first heat conducting pad 4 is embedded into the limiting groove 221 on the support body 22 of the fixing clamp 2, and the first heat conducting pad 4 is connected with the graphite heat radiating fin 3 and the heating device 9 respectively. Like this mounting fixture 2 installs at epitheca 1, and graphite fin 3 installs at mounting fixture 2, and mounting fixture 2 can be so that graphite fin 3 fastens in epitheca 1 for a long time, can improve graphite fin 3's stability, realizes long-term high-efficient quick heat dissipation. Therefore, the technical effects of improving the stability of the graphite radiating fins 3 and realizing long-term efficient and rapid radiating are achieved.

In order to right the utility model provides a pair of optical module does the detailed description, and the detailed description has been done to a heat abstractor of above-mentioned embodiment, and based on same utility model design, this application still provides an optical module, sees embodiment two in detail.

Example two

An embodiment of the utility model provides an optical module, including heating device 9, still include heat abstractor, heating device 9 place in well kenozooecium 12.

The utility model provides an optical module, through 11 looks joints of recess in 2 middle joint groove 21 of mounting fixture and the epitheca 1, graphite fin 3 is installed in the well kenozooecium 12 of epitheca 1, the 21 looks joints in joint groove 21 of graphite fin 3 and mounting fixture 2, graphite fin 3 with supporter 22 pastes tightly mutually. The first heat conducting pad 4 is embedded into the limiting groove 221 on the support body 22 of the fixing clamp 2, and the first heat conducting pad 4 is connected with the graphite heat radiating fin 3 and the heating device 9 respectively. Like this mounting fixture 2 installs at epitheca 1, and graphite fin 3 installs at mounting fixture 2, and mounting fixture 2 can be so that graphite fin 3 fastens in epitheca 1 for a long time, can improve graphite fin 3's stability, realizes long-term high-efficient quick heat dissipation. Therefore, the technical effects of improving the stability of the graphite radiating fins 3 and realizing long-term efficient and rapid heat dissipation are achieved.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the examples, those skilled in the art should understand that the technical solutions of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.

Claims (8)

1. A heat dissipation device, the device comprising: the heat-conducting device comprises an upper shell, a fixing clamp, a graphite radiating fin and a first heat-conducting pad, wherein the upper shell is at least provided with a groove and comprises a hollow part for placing a heating device; the fixing clamp comprises a clamping groove and a supporting body, a limiting groove is arranged on the supporting body, and the clamping groove is clamped with the groove; the graphite radiating fin is arranged in the hollow part, the graphite radiating fin is clamped with the clamping groove, and the graphite radiating fin is tightly attached to the support body; the first heat conducting pad is embedded into the limiting groove and is connected with the graphite radiating fin and the heating device respectively.

2. The heat dissipating device of claim 1, wherein: the upper shell also comprises a mounting groove; the device further comprises: the radiating tooth sets are arranged in the mounting grooves and distributed along the length extending direction of the mounting grooves, and the distance between every two adjacent radiating tooth sets is equal.

3. The heat dissipating device of claim 2, wherein: each group of heat dissipation tooth piece group comprises a plurality of first tooth pieces and a second tooth piece arranged between two adjacent first tooth pieces, and the height of each first tooth piece is greater than that of each second tooth piece.

4. The heat dissipating device of claim 3, wherein: the first tooth plates are parallel to each other.

5. The heat dissipating device of claim 1, wherein said device further comprises: and the PCB is connected with the heating device.

6. The heat dissipating device of claim 5, wherein said device further comprises: and the second heat conduction pad is connected with the PCB.

7. The heat dissipating device of claim 6, wherein said device further comprises: the base is matched with the upper shell and connected with the upper shell, and the hollow part is surrounded by the base and the upper shell.

8. An optical module comprising a heat generating device, characterized by further comprising the heat dissipating apparatus according to any one of claims 1 to 7, wherein the heat generating device is placed in the hollow portion.

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