CN217721817U - Heat radiator - Google Patents

Abstract

The utility model discloses a heat dissipation device, including the heat dissipation main part, the working face has in the heat dissipation main part, set up flutedly on the working face, be equipped with the heat diffusion tube in the recess, the heat diffusion tube has heat absorption portion and radiating part, still be equipped with the heat absorption component on the working face, the heat absorption component is laminated with the circuit component who generates heat, and make the heat absorption component can be with the heat transfer of self absorption circuit component to heat absorption portion, the heat diffusion tube is sealed to have working fluid, working fluid can vaporize the heat absorption and conduct the heat of heat absorption portion to radiating part under the heat effect of heat absorption portion, therefore can be with the heat of heat absorption portion of transmission to the heat dissipation part fast through this working fluid vaporization heat absorption, reach the semiconductor integrated circuit component effect in the local high-efficient cooling circuit system, make the higher semiconductor integrated circuit component that generates heat can work with more efficient efficiency, prolong its life; effectively reduce heat abstractor's whole volume simultaneously, reach the utility model discloses a heat abstractor's miniaturized effect.

Description

Heat radiator

Technical Field

The present invention relates to a heat dissipation device for a semiconductor integrated circuit device of a heating element of an electronic apparatus, and more particularly to a heat dissipation device for a circuit device which can cool the circuit device locally and efficiently.

Background

In the past, a semiconductor integrated circuit element of a heat generating element in an electronic device such as a desktop or notebook computer or a server, particularly a heat generating element represented by a CPU (central processing unit), generally needs to be cooled in order to ensure its normal operation. However, in recent years, the miniaturization and high integration of the semiconductor integrated circuit device as the heat generating device have resulted in localization of the heat generating portion of the heat generating device, that is, a portion of the circuit has a high heat generation amount not for the entire circuit system but for only one or some of the components. However, the conventional heat dissipation structure for generating heat generating elements in a circuit system at high integration has a defect that it cannot locally and efficiently cool the semiconductor integrated circuit elements in the circuit system.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide a heat dissipating device, which can locally and efficiently cool the semiconductor integrated circuit device in the circuit system, so that the semiconductor integrated circuit device with higher heat productivity can work with more efficient efficiency, prolong the service life thereof, and effectively reduce the overall volume of the heat dissipating device, thereby achieving the miniaturization effect of the heat dissipating device.

The purpose of the utility model is realized by adopting the following technical scheme:

a heat dissipation device comprises a heat dissipation body, wherein a working face is arranged on the heat dissipation body, a groove is formed in the working face, heat dissipation pipes are arranged in the grooves, the plane of each heat dissipation pipe, which faces away from the groove, is lower than the working face, each heat dissipation pipe is provided with a heat absorption portion and a heat dissipation portion, the heat absorption portions are located in the grooves, heat absorption elements are arranged on the heat absorption portions, the planes, which face away from the heat absorption portions, of the heat absorption elements are flush with the working face, the heat absorption elements are used for being attached to circuit elements which generate heat and capable of transferring the heat absorbed by the circuit elements to the heat absorption portions, working fluid is sealed in the heat dissipation pipes, and the working fluid can be vaporized and absorb the heat under the heat effect of the heat absorption portions to transfer the heat of the heat absorption portions to the heat dissipation portions.

Furthermore, epoxy resin glue is filled between the heat diffusion pipe and the groove.

Further, heat-conducting silicone grease is filled between the heat diffusion tube and the groove.

Further, the working fluid is water.

Further, the heat diffusion tube is a straight tube structure, one end of the straight tube structure is the heat absorption portion, and the other end of the straight tube structure is the heat dissipation portion.

Further, the heat diffusion pipe is a bent pipe with a snake-shaped structure, one end of the bent pipe is the heat absorption part, and the other end of the bent pipe is the heat dissipation part.

Further, the heat diffusion pipes are U-shaped pipes, and there are two U-shaped pipes, each U-shaped pipe includes a first straight pipe, a U-shaped curved pipe and a second straight pipe, the U-shaped curved pipe connects the first straight pipe and the second straight pipe to form the U-shaped pipe, the first straight pipe of one of the two U-shaped pipes is located in the other U-shaped groove of the two U-shaped pipes, the second straight pipe of one of the two U-shaped pipes is located in the other U-shaped groove of the two U-shaped pipes, and the first straight pipe of one of the two U-shaped pipes, the first straight pipe of the other of the two U-shaped pipes, and the U-shaped curved pipe form the heat absorbing portion.

Further, the heat dissipation main part has base member and fin, the working face set up in the one side of base member, the fin set up in the base member is in a reverse direction on the one side of working face, be used for with heat on the base member scatters.

Further, a fan is arranged on the base body or the radiating fin.

Compared with the prior art, the beneficial effects of the utility model reside in that:

the utility model discloses a heat abstractor is when using, fixes the heat dissipation main part in circuit system to with heat absorbing element and the circuit element laminating of high generating heat, because the plane of heat diffusion pipe back to the recess is less than the working face, and heat absorbing part and radiating part all are located the recess, and the plane of the heat absorbing element back to the heat absorbing part that sets up on the heat absorbing part is parallel and level with the working face, consequently sets up the whole volume that heat diffusion pipe can reduce the heat dissipation main part through the recess, effectively reduces heat abstractor's whole volume, reaches the utility model discloses a heat abstractor's miniaturized effect; in addition, the heat of the highly-heated circuit element is transferred to the heat absorption part of the heat diffusion tube through the heat absorption element, the heat of the heat absorption part vaporizes the working fluid, and the vaporization needs to absorb heat, so that the heat transferred to the heat absorption part can be quickly transferred to the heat dissipation part through the vaporization heat absorption of the working fluid, the effect of locally and efficiently cooling the semiconductor integrated circuit element in the circuit system is achieved, the semiconductor integrated circuit element with high heat productivity can work with higher efficiency, and the service life of the semiconductor integrated circuit element is prolonged.

Drawings

Fig. 1 is a schematic structural view of a heat dissipation device according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a heat pipe according to an embodiment of the present invention;

fig. 3 is a schematic structural view of a heat dissipating body according to an embodiment of the present invention;

fig. 4 is a schematic view of another angle structure related to the heat dissipating body according to an embodiment of the present invention;

fig. 5 is a schematic structural view of a heat dissipation device according to a second embodiment of the present invention;

fig. 6 is a schematic structural view of a heat dissipation device according to a third embodiment of the present invention.

In the figure: 10. a heat dissipating body; 101. a substrate; 1011. a working surface; 10110. a groove; 1012. a fixing hole; 102. a heat sink; 20. a thermal diffusion tube; 201. a first straight pipe; 202. a second straight pipe; 203. a U-shaped curved tube; 204. a U-shaped groove; 30. a thermally conductive connector.

Detailed Description

In the following, the present invention is described with priority in conjunction with the accompanying drawings and the detailed description, and it should be noted that, in the premise of no conflict, the embodiments or technical features described below may be arbitrarily combined to form a new embodiment.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "horizontal", "vertical", "top", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

The implementation mode is as follows:

referring to fig. 1-6, the present invention shows a heat dissipation device.

The first embodiment is as follows:

as shown in fig. 1-4, the heat dissipation device of this embodiment includes a heat dissipation main body 10, a working surface 1011 is disposed on the heat dissipation main body 10, a groove 10110 is disposed on the working surface 1011, thermal diffusion pipes 20 are disposed in the grooves 10110, a plane of the thermal diffusion pipes 20 opposite to the groove 10110 is lower than the working surface 1011, the thermal diffusion pipes have heat absorption portions and heat dissipation portions both located in the grooves 10110, heat absorption elements are disposed on the heat absorption portions, a plane of the heat absorption elements opposite to the heat absorption portions is flush with the working surface 1011, the heat absorption elements are configured to be attached to a heat-generating circuit component and transfer heat absorbed by the heat absorption elements to the heat absorption portions, working fluid is sealed in the thermal diffusion pipes, and the working fluid can be vaporized under the heat effect of the heat absorption portions to absorb heat and conduct the heat of the heat absorption portions to the heat dissipation portions. It can also be understood that, when the heat dissipation device of the present invention is in use, the heat dissipation main body 10 is fixed in the circuit system, and the heat absorption element (not shown) is attached to the circuit element (not shown) that generates heat to make the heat of the circuit element that generates heat highly transmit to the heat absorption portion of the heat diffusion tube 20 through the heat absorption element, the heat transmitted to the heat absorption portion vaporizes the working fluid, because the vaporization requires heat absorption, the heat transmitted to the heat absorption portion can be quickly transmitted to the heat dissipation portion through the heat absorption of the working fluid vaporization, thereby achieving the effect of locally and efficiently cooling the semiconductor integrated circuit element in the circuit system, making the semiconductor integrated circuit element with higher heat productivity work with higher efficiency, and prolonging the service life thereof; in addition, because heat diffusion tube 20 is less than working face 1011 to the plane of recess 10110 dorsad, and heat absorption portion and heat dissipation part all are located the recess, and set up the plane and the working face 1011 parallel and level of heat absorption part dorsad of the heat absorption component in the heat absorption portion, consequently can reduce the whole volume of heat dissipation main part 10 to effectively reduce heat abstractor's whole volume, reach the utility model discloses a heat abstractor's miniaturized effect. And simultaneously, because the utility model discloses a heat abstractor cools off the heating element that the local high integration produced among the circuit system, therefore carries out refrigerated whole radiator volume than traditional to whole circuit system, changes in the heat dissipation of high integrated circuit.

Before the working fluid is vaporized, the working fluid is located in the heat absorption portion of the heat diffusion tube 20 by gravity, and the working fluid is sealed in the heat diffusion tube 20 after the heat diffusion tube 20 is evacuated. Therefore, when the heat dissipating body 10 is fixed to the circuit system, it is necessary to place the heat absorbing part at the lower end of the heat dissipating part, so that the working fluid sealed in the capillary of the heat diffusion tube 20 can be brought to the heat absorbing part of the heat diffusion tube 20 by gravity. The working fluid needs to absorb heat in the process of vaporization, so that the heat of the heat absorbing part is quickly transferred to the heat radiating part in the process of vaporization; after the heat dissipation part and the heat dissipation body 10 are cooled, the working fluid that has been vaporized in the thermal diffusion tube 20 is liquefied again, and flows back to the heat absorption part of the thermal diffusion tube 20 along the capillary structure of the inner wall of the thermal diffusion tube 20, and the next heat absorption cycle is performed.

In this embodiment, the working fluid is water, but in other embodiments, the working fluid may also be other refrigerant media, which is not limited herein.

In this embodiment, the heat dissipating body 10 has a base 101 and a heat sink 102, a working surface 1011 is disposed on one surface of the base 101, the heat sink 102 is disposed on one surface of the base 101 opposite to the working surface 1011, and the heat sink 102 is used for dissipating heat from the base 101. That is, it can be understood that the heat of the semiconductor integrated circuit element is transferred to the heat absorbing portion, then transferred from the heat absorbing portion to the heat dissipating portion, and finally dissipated to the air by being uniformly heated to the base 101 and the heat dissipating fins on the heat dissipating portion and the heat dissipating path.

In this embodiment, fixing holes 1012 are further provided at four corners of the base 101, and the base 101 is fixed to the circuit system by the fixing holes 1012 and screws.

In this embodiment, a fan (not shown) is provided on the base 101 or the heat sink 102, and the heat dissipation capability of the base 101 and the heat sink 102 is increased by the fan, thereby further improving the heat dissipation effect of the heat dissipation device of the present invention.

In this embodiment, the working surface 1011 further has a plurality of recessed portions communicating with the recess 10110, a heat conductive connecting member 30 is embedded in each recessed portion, the heat conductive connecting member 30 is attached to the heat absorbing portion, and the heat absorbing element is embedded in the heat conductive connecting member 30. That is, it can be understood that the heat of the highly exothermic semiconductor integrated circuit device is transferred to the heat absorbing member, and the heat of the heat absorbing member is transferred to the heat absorbing part through the heat conductive connecting member 30, so that the heat of the heat absorbing member can be weakened, and the heat of the straight body can be transferred to the heat radiating pipe through the heat conductive connecting member 30.

It should be noted that the heat absorbing element and the heat conductive connecting member 30 are made of red copper material with good heat absorbing performance, so as to further accelerate the heat conduction from the circuit element to the heat absorbing part of the heat diffusion tube 20.

In the present embodiment, a heat conductive silicone grease is filled between the heat diffusion tube 20 and the groove 10110 to adhere the heat diffusion tube 20 in the groove 10110. That is, it can be understood that the heat diffusion tube 20 can be fixed in the groove 10110 by adhering the heat conductive silicone grease, and the effect of the heat conduction of the base 101 in contact with the heat dissipation tube can be increased, so as to further improve the heat dissipation effect.

Of course, in other embodiments, an epoxy glue may be filled between the heat diffusion tube 20 and the groove 10110 to adhere the heat diffusion tube 20 in the groove 10110. That is, in other embodiments, the heat diffusion tube 20 may be also fixed in the groove 10110 by epoxy glue, and the effect of heat conduction between the base 101 and the heat dissipation tube may be increased, which is not limited herein. Therefore, it is considered that the skilled person can reasonably change the adhesive between the heat diffusion tube 20 and the groove 10110, and the adhesive is also within the scope of the present invention.

In this embodiment, the heat diffusion tube 20 is a U-shaped tube, and there are two U-shaped tubes, and correspondingly, there are two grooves, and each U-shaped tube is located in each groove, and each U-shaped tube includes a first straight tube 201, a U-shaped curved tube 203, and a second straight tube 202, where the U-shaped curved tube 203 connects the first straight tube 201 and the second straight tube 202 to form a U-shaped tube, the first straight tube 201 of one of the two U-shaped tubes is located in the other U-shaped groove 204 of the two U-shaped tubes, the second straight tube 202 of one of the two U-shaped tubes is located in the other U-shaped groove 204 of the two U-shaped tubes, the first straight tube 201 of one of the two U-shaped tubes and the first straight tube 201 and the U-shaped curved tube 203 of the other U-shaped tubes form the heat absorbing portion, and the second straight tube 202 and the U-shaped curved tube 203 of one U-shaped tube form the heat dissipating portion. From this, those skilled in the art can understand that, this kind of arrangement of heat diffusion tube 20 has formed a heat absorption portion, two radiating parts, owing to increased the heat absorption area of heat absorption portion, has consequently increased the heat absorption performance of heat absorption portion, and the working fluid in the U-shaped pipe separately carries out the vaporization heat absorption and has promoted the heat conduction of heat absorption portion to the radiating part of the U-shaped pipe separately greatly under the heat effect of this heat absorption portion, thereby has promoted by a wide margin the utility model discloses heat abstractor's radiating effect.

Of course, the U-shaped tubes of the present embodiment are not limited to two, and the inventors can appropriately change the number of the U-shaped tubes according to the actual situation. Therefore, it is within the scope of the present invention for those skilled in the art to reasonably change the number of the U-shaped tubes and the arrangement of the U-shaped tubes.

Example two:

the difference between this embodiment and the first embodiment is: the heat diffusion tube 20 is different in structure.

As shown in fig. 5, the heat diffusion tube 20 of the present embodiment has a straight tube structure, one end of which is a heat absorbing portion, and the other end of which is a heat dissipating portion. Of course, the heat absorption part of the straight-tube-shaped structure is arranged at the lower end of the heat dissipation part of the straight-tube-shaped structure, so that the working fluid is positioned in the heat absorption part of the straight-tube-shaped structure under the action of gravity before being vaporized, and the heat of the heat absorption part of the straight-tube-shaped structure is rapidly transferred to the heat dissipation part of the straight-tube-shaped structure in the process of vaporization of the working fluid; after the heat dissipating portion and the heat dissipating body 10 of the straight tubular structure are cooled, the working fluid vaporized in the straight tubular structure is liquefied again, and flows back to the heat absorbing portion of the straight tubular structure along the capillary structure of the inner wall of the straight tubular structure, and the next heat absorbing cycle is performed.

Example three:

the difference between the present embodiment and the first embodiment is: the heat diffusion tube 20 is different in structure.

As shown in fig. 6, the heat diffusion tube 20 of the present embodiment is a bent tube having a serpentine structure, one end of the bent tube is a heat absorbing portion, and the other end of the bent tube is a heat dissipating portion. Of course, the heat absorption part of the elbow is arranged at the lower end of the heat dissipation part of the elbow, so that the working fluid is positioned at the heat absorption part of the elbow under the action of gravity before being vaporized, and the heat of the heat absorption part of the elbow is rapidly conducted to the heat dissipation part of the elbow in the process of vaporization of the working fluid; after the heat dissipation part and the heat dissipation body 10 of the elbow are cooled, the vaporized working fluid in the elbow is liquefied again and flows back to the heat absorption part of the elbow along the capillary structure of the inner wall of the elbow to perform the next heat absorption cycle.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.

Claims (10)

1. A heat dissipating device includes a heat dissipating main body (10), characterized in that: the heat dissipation device is characterized in that the heat dissipation main body (10) is provided with a working surface (1011), the working surface (1011) is provided with a groove (10110), a heat diffusion tube (20) is arranged in the groove (10110), the plane of the heat diffusion tube (20) back to the groove (10110) is lower than the working surface (1011), the heat diffusion tube (20) is provided with a heat absorption part and a heat dissipation part which are both located in the groove (10110), a heat absorption element is arranged on the heat absorption part, the plane of the heat absorption element back to the heat absorption part is flush with the working surface (1011), the heat absorption element is used for being attached to a heating circuit element and transferring absorbed heat to the heat absorption part, working fluid is sealed in the heat diffusion tube (20), and the working fluid can be vaporized and absorb heat under the heat action of the heat absorption part and transfer the heat of the heat absorption part to the heat dissipation part.

2. The heat dissipating device of claim 1, wherein: the working face (1011) is further provided with a plurality of sunken parts communicated with the grooves (10110), heat-conducting connecting pieces (30) are embedded in the sunken parts, the heat-conducting connecting pieces (30) are attached to the heat absorbing parts, and the heat absorbing elements are embedded in the heat-conducting connecting pieces (30).

3. The heat dissipating device of claim 1, wherein: epoxy resin glue is filled between the thermal diffusion tube (20) and the groove (10110).

4. The heat dissipating device of claim 1, wherein: and heat-conducting silicone grease is filled between the heat diffusion tube (20) and the groove (10110).

5. The heat dissipating device of claim 1, wherein: the working fluid is water.

6. The heat dissipating device of claim 1, wherein: the heat diffusion pipe (20) is of a straight pipe-shaped structure, one end of the straight pipe-shaped structure is the heat absorption portion, and the other end of the straight pipe-shaped structure is the heat dissipation portion.

7. The heat dissipating device of claim 1, wherein: the heat diffusion pipe (20) is a bent pipe with a snake-shaped structure, one end of the bent pipe is the heat absorption part, and the other end of the bent pipe is the heat dissipation part.

8. The heat dissipating device of claim 1, wherein: the heat diffusion pipe (20) is a U-shaped pipe, the U-shaped pipe is provided with two U-shaped pipes, the U-shaped pipe comprises a first straight pipe (201), a U-shaped curved pipe (203) and a second straight pipe (202), the U-shaped curved pipe (203) is connected with the first straight pipe (201) and the second straight pipe (202) to form the U-shaped pipe, the first straight pipe (201) of one of the two U-shaped pipes is located in the other U-shaped groove (204) of the two U-shaped pipes, the second straight pipe (202) of one of the two U-shaped pipes is located in the other U-shaped groove (204) of the two U-shaped pipes, and the first straight pipe (201) of one of the two U-shaped pipes, the first straight pipe (201) of the other of the two U-shaped pipes and the U-shaped curved pipe (203) form the heat absorption part.

9. A heat sink as claimed in claim 1, wherein: the heat dissipation main body (10) is provided with a base body (101) and a heat dissipation sheet (102), the working surface (1011) is arranged on one surface of the base body (101), and the heat dissipation sheet (102) is arranged on one surface, back to the working surface (1011), of the base body (101) and used for dissipating heat on the base body (101).

10. A heat sink as claimed in claim 9, wherein: and a fan is arranged on the base body (101) or the radiating fin (102).

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