CN217363280U - Side sounding plane type semiconductor loudspeaker and earphone adopting same - Google Patents

Abstract

The utility model relates to a side pronunciation plane semiconductor loudspeaker and adopt earphone of semiconductor loudspeaker, include: the voice sensor assembly is arranged between the cover body and the mounting shell and is in contact connection with the PCB assembly; and a first sound outlet hole is formed in one end face of the mounting shell. The utility model discloses a semiconductor loudspeaker sets up to plane, and sets up the phonate hole on a terminal surface of semiconductor loudspeaker, forms the plane semiconductor loudspeaker that the side pronounced, and its is small, and the frequency response curve is straight, medium-high frequency is better. The planar semiconductor loudspeaker with lateral sounding is arranged in the earphone shell through the support, modular installation is achieved, and meanwhile the unique sounding hole is designed, so that the earphone has a flat frequency response curve and a better high-frequency effect, and can well present low-frequency shocking feeling of music and musical instruments and express the real effect of the music.

Description

Side sounding plane type semiconductor loudspeaker and earphone adopting same

Technical Field

The utility model relates to an earphone technical field, more specifically relates to a side pronunciation plane semiconductor loudspeaker and adopt semiconductor loudspeaker's earphone.

Background

With the increasing progress of science and technology and the continuous improvement of living standard, the requirement of consumers on hearing is correspondingly improved. Therefore, the earphone as an electroacoustic device is closely related to daily life and work of people, the existence of the earphone is not difficult to find in places such as home, outdoors, important meeting sites, hearing tests and the like, and the earphone becomes a symbol of personal sound of people.

Earphones are classified according to their transduction modes, and mainly include a moving coil mode, a moving iron mode, an electrostatic mode, and an isomagnetic mode. The classification is performed in a structurally separate manner, and can be classified into a semi-open type and a closed type. Ear plugs, ear hooks, ear insertion and head straps are classified according to wearing forms. The moving-coil type loudspeaker generally used by the existing in-ear earphone has certain limitation on low-frequency playback because the middle and low frequencies of the moving-coil type loudspeaker are good, but the high-frequency part is not good enough, and the listening feeling is rather beautiful, so that the earphone cannot well present the low-frequency shocking feeling of music and musical instruments and interpret the real effect of the music, and the heard music scene is single.

Therefore, in order to meet the individual requirements of people, the side-sounding planar semiconductor loudspeaker with good medium-high frequency effect is designed, and the semiconductor loudspeaker also has the effects of small volume and straight frequency response curve; simultaneously, because this semiconductor loudspeaker unique structure has special requirement to the phonate hole, conventional earlap structure when the semiconductor loudspeaker installation, easily causes glue position thickness inhomogeneous, the difficult realization of mould structure, beat to glue sealed difficult scheduling problem, so, on this semiconductor loudspeaker's structural basis, through a mode of tearing open, carry out the modularized design and adopt support 2 design, the product quality of being convenient for production, processing and control optimizes the mould structure.

SUMMERY OF THE UTILITY MODEL

The utility model discloses an overcome the moving coil loudspeaker that current earphone adopted, the high frequency part is not good enough, can not be fine present the music and the musical instrument low frequency shock feel and explain the true effect of music, the music scene that hears comparatively single scheduling problem provides a side pronunciation plane semiconductor loudspeaker and adopts semiconductor loudspeaker's earphone.

A side-emitting planar semiconductor horn, comprising: the voice sensor comprises a cover body, a voice sensor assembly and a mounting shell, wherein the cover body is internally provided with a PCB assembly, the cover body is fixedly mounted with the mounting shell, and the voice sensor assembly is mounted between the cover body and the mounting shell and is in contact connection with the PCB assembly; and a first sound outlet hole is formed in one end face of the mounting shell.

Further, as a preferred technical solution, the first sound outlet includes a long strip-shaped opening formed in the end surface of the mounting housing along the length direction of the end surface of the mounting housing, or a plurality of small holes uniformly distributed in the end surface of the mounting housing along the length direction of the end surface of the mounting housing.

Further, as a preferred technical scheme, a plurality of horn air holes are respectively arranged on two opposite surfaces of the cover body.

An earphone using a side-sounding planar type semiconductor speaker, comprising: earphone casing, above-mentioned semiconductor loudspeaker and support with cavity, semiconductor loudspeaker installs in the support, the support mounting is in earphone casing's cavity the support with the relative terminal surface in second sound outlet hole of earphone casing front end is equipped with loudspeaker form opening, installs semiconductor loudspeaker's in the support first sound outlet hole with loudspeaker form opening sets up relatively.

Furthermore, as a preferred technical scheme, the bracket is in a square shape with an opening at the top to enable the semiconductor horn to be embedded and installed, an opening is arranged at the position of the bracket opposite to a horn air hole of the semiconductor horn, and the semiconductor horn is inserted in the bracket and is connected with the bracket in a sealing way.

Further, as a preferred technical scheme, the earphone shell comprises a front shell and a rear shell which are matched, wherein mounting grooves matched with the supports are formed in the opposite end surfaces of the front shell and the rear shell, and the supports are fixedly mounted in the mounting grooves; the second sound outlet hole is positioned in the front shell and communicated with the mounting groove.

Further, as a preferred technical solution, the trumpet-shaped opening and the second sound outlet are in transitional connection through a third sound outlet.

Further, as a preferable technical solution, the diameter of the second sound outlet and the opposite end of the trumpet-shaped opening is set to be 1.8-2.4mm, and the diameter of the third sound outlet 313 is set to be 0.5-1.0 mm.

Furthermore, as preferred technical scheme, still include sound outlet tuning paper, backshell tuning paper and silica gel earmuff, the sound outlet tuning paper is installed the tip in the second sound outlet hole of preceding shell, the backshell tuning paper is installed trompil department in the backshell, the silica gel earmuff cover is established the front end of preceding shell.

Further, as preferred technical scheme, still include CABLE line and cover and establish SR line pendulum on the CABLE line, SR line pendulum with backshell fixed connection, the CABLE line embedding in the backshell with semiconductor loudspeaker is connected.

Compared with the prior art, the utility model discloses technical scheme's beneficial effect is:

the utility model discloses a semiconductor loudspeaker sets up to plane, and sets up the phonate hole on a terminal surface of semiconductor loudspeaker, forms the plane semiconductor loudspeaker of side pronunciation, and its is small, and the frequency response curve is straight, medium-high frequency is better.

The utility model discloses an earphone adopts the plane semiconductor loudspeaker of side pronunciation, with its glue fixed mounting on the support in advance, then in through the support mounting in earphone shell, realize the modularization installation, easily derive the different appearance earphone products of series, the quality of being convenient for produce, processing, control product, the structural style who adopts the support has solved because the casing of earphone is independent fashioned structure, and the casing glues position thickness inhomogeneous before easily causing the earphone, the difficult realization of mould structure, beat and glue sealed difficult scheduling problem. Simultaneously, set up loudspeaker form opening at the relative terminal surface in the first sound outlet hole of support with semiconductor loudspeaker, this loudspeaker form opening and the second sound outlet hole transitional coupling of earphone casing front end realize unique sound outlet design for this earphone frequency response curve is straight and straight, has better high frequency effect, can be fine present the low frequency shock sense of music and musical instrument and explain the true effect of music, makes the user have better sense of hearing.

Drawings

Fig. 1 is an exploded view of a side-sounding planar semiconductor speaker according to embodiment 1 of the present invention.

Fig. 2 is a schematic view of a side-view sounding planar semiconductor speaker according to embodiment 1 of the present invention.

Fig. 3 is an exploded view of a side-sounding planar semiconductor speaker and a stand according to embodiment 2 of the present invention.

Fig. 4 is a schematic view of a side-view sounding planar semiconductor speaker and a bracket according to embodiment 2 of the present invention.

Fig. 5 is a schematic view of a side-view sounding planar semiconductor speaker and a bracket according to embodiment 2 of the present invention.

Fig. 6 is an exploded view of an earphone according to embodiment 3 of the present invention, which employs a side-sounding planar semiconductor speaker.

Fig. 7 is a schematic view of an assembly structure of the earphone housing, the semiconductor speaker, and the support according to embodiment 3 of the present invention.

Fig. 8 is a schematic view of an assembly structure of the earphone housing, the semiconductor speaker, and the support according to embodiment 3 of the present invention.

Fig. 9 is a schematic view of connection between the semiconductor speaker and the CABLE according to embodiment 3 of the present invention.

Fig. 10 is a schematic view of an earphone assembly structure according to embodiment 3 of the present invention, which employs a side-sounding planar semiconductor speaker.

Fig. 11 is a sectional view of an earphone according to embodiment 3 of the present invention, which employs a side-emitting planar semiconductor speaker.

Fig. 12 is a graph illustrating an acoustic experimental data curve of an earphone according to embodiment 3 of the present invention, which employs a side-sounding planar semiconductor speaker.

Detailed Description

The present invention will be further described with reference to the following embodiments.

The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if there are the terms "upper", "lower", "left", "right", "top", "bottom", "inner", "outer", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of the description, but not for indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore the terms describing the positional relationship in the drawings are only used for illustrative purposes and should not be construed as limiting the patent.

Furthermore, if the terms "first," "second," and the like are used for descriptive purposes only, they are used primarily for distinguishing between different devices, elements, or components that may or may not be the same in particular nature and configuration, and not for indicating or implying relative importance between the indicated devices, elements, or components, but rather for indicating or implying relative importance.

Example 1

The embodiment discloses a side-sounding planar semiconductor horn, which solves the problems that a moving-coil horn has good middle-low frequency and poor high-frequency part, and cannot well present the low-frequency shocking sense of music and musical instruments and interpret the true effect of the music.

The side-emitting planar semiconductor horn of the present embodiment, as shown in fig. 1-2, includes: the voice sensor module comprises a cover body 11 internally provided with a PCB module, a voice sensor module 12 and an installation shell 13, wherein the cover body 11 is matched with the installation shell 13 and is fixedly installed, the voice sensor module 12 is installed between the cover body 11 and the installation shell 13, the voice sensor module 12 is provided with a first contact point 121, a second contact point 111 is arranged at the position, opposite to the first contact point 121, of the cover body 11, the second contact point 111 is connected with the PCB module, and the voice sensor module 12 installed between the cover body 11 and the installation shell 13 is in contact connection with the second contact point 111 through the first contact point 121 and the second contact point 111 which are correspondingly arranged.

Meanwhile, in the present embodiment, a first sound outlet hole 131 is provided on one end surface of the mounting case 13. The first sound outlet 131 includes a long strip-shaped opening formed in the end surface of the mounting housing 13 along the length direction of the end surface of the mounting housing 13, or a plurality of small holes uniformly distributed in the end surface of the mounting housing 13 along the length direction of the end surface of the mounting housing 13.

In the present embodiment, the mounting housing 13 is square and thin, so that the semiconductor horn is flat, and the first sound outlet 131 is located on one end surface of the mounting housing 13, thereby realizing lateral sound emission.

In addition, a plurality of horn air holes 112 are respectively provided on opposite surfaces of the cover 11, thereby realizing a unique external design. Meanwhile, the outer surface of the cover 11 is provided with a power connection point 113 connected with the PCB assembly, so that the semiconductor horn is electrically connected.

In this embodiment, the mounting case 13 is made of stainless steel, and the cover 11 is made of an insulating material.

The semiconductor horn of the present embodiment is configured in a planar shape, and the sound outlet 131 is disposed on one end surface of the semiconductor horn, so as to form a planar semiconductor horn with a lateral sounding surface.

Example 2

The present embodiment discloses a side-emitting planar semiconductor horn, and specifically discloses a mounting structure of a side-emitting planar semiconductor horn in addition to embodiment 1.

The mounting structure of the semiconductor horn of the present embodiment includes a bracket 2 for mounting the semiconductor horn 1, and the specific mounting structure of the bracket 2 of the semiconductor horn 1 is shown in fig. 3 to 5.

Support 2 is the square form that open-top can make semiconductor loudspeaker 1 embedding installation, simultaneously, because semiconductor loudspeaker 1's relative two sides is equipped with a plurality of loudspeaker gas pockets 112 respectively, when semiconductor loudspeaker 1 embedding is installed in support 2, can not plug up loudspeaker gas pocket 112, so, is equipped with the opening in support 2 and the loudspeaker gas pocket 112 relative position department of semiconductor loudspeaker 1. Meanwhile, the bottom end of the support 2 is provided with a horn-shaped opening 21, and when the semiconductor horn 1 is installed, the semiconductor horn is inserted into the support 2, and the first sound outlet 131 is arranged opposite to the horn-shaped opening 21.

In this embodiment, after the semiconductor horn 1 is embedded in the bracket 2, it needs to be sealed and fixed, that is, the semiconductor horn 1 and the bracket 2 are sealed and connected by the adhesive layer 4, the sealed area includes the front, back, left and right sides of the semiconductor horn 1, and when the side of the horn air hole 112 of the semiconductor horn 1 is sealed by the adhesive layer 4, the horn air hole 112 cannot be blocked.

The semiconductor loudspeaker 1 of this embodiment is installed in support 2 back in the embedding, beats to glue fixed as an organic whole to constitute the module, realize the modularization installation, easily derive the different appearance earphone products of series, be convenient for production, processing, control product's quality.

In addition, in the embodiment, since the support 2 is square, the horn-shaped opening 21 is also trapezoidal, and the outlet at the bottom end is circular, so that the first sound outlet 131 of the semiconductor horn 1 gradually changes from the horn-shaped shape to a circular hole, i.e., from a rectangle to a thin circular hole, so that the frequency response curve is flat and straight, and the semiconductor horn has a better high-frequency effect, and can well present the low-frequency shock of music and musical instruments and interpret the real effect of music.

Example 3

The embodiment discloses an earphone using a side-sounding planar semiconductor speaker, as shown in fig. 6: the method comprises the following steps: earphone shell 3, semiconductor loudspeaker 1, support 2, sound outlet tuning paper 5, backshell tuning paper 6, silica gel earmuff 7, CABLE line 8 and SR line pendulum 9 with the cavity.

The semiconductor loudspeaker 1 is installed in the support 2, the support 2 is installed in the cavity of the earphone housing 3, the horn-shaped opening 21 is arranged on the end surface of the support 2 opposite to the second sound outlet hole 312 at the front end of the earphone housing 3, and the first sound outlet hole 131 of the semiconductor loudspeaker 1 installed in the support 2 is arranged opposite to the horn-shaped opening 21.

In this embodiment, the semiconductor horn 1 is the side-emitting planar semiconductor horn of embodiment 1, and the specific structure thereof is described in embodiment 1, which is not described herein.

The specific mounting structure of the semiconductor horn 1 and the bracket 2 is described in embodiment 2, which is not described in detail.

In the present embodiment, the earphone housing 3 comprises a front shell 31 and a rear shell 32 which are matched, and the specific mounting structure of the support 2 and the earphone housing 3 is shown in fig. 7-8:

the opposite end surfaces of the front shell 31 and the rear shell 32 are provided with mounting grooves 311 matched with the brackets 2, and the brackets 2 are fixedly mounted in the mounting grooves 311 and then are fixed by gluing. By adopting the structural mode of the support 2, the problems that the thickness of the glue position of the front shell 31 of the earphone is uneven, the structure of a mould is difficult to realize, the glue is difficult to seal and the like due to the fact that the shell of the earphone is of an independently formed structure are solved.

In this embodiment, the earphone housing 3 may be tilted at different angles according to different external configurations of the earphone housing 2, and thus the mounting slot 311 may be a tilted slot having the same tilt angle as the earphone housing 2.

No matter which kind of state is that mounting groove 311 is, it is fixed to need to beat to glue support 2 and mounting groove 311, realizes simultaneously sealed between support 2 and the mounting groove 311.

In addition, in the present embodiment, referring to fig. 11, the second sound outlet hole 312 is located in the front shell 31 and communicates with the mounting groove 311, and the trumpet-shaped opening 21 and the second sound outlet hole 312 are transitionally connected through the third sound outlet hole 313. Wherein, the diameter of the second sound outlet hole 312 and the opposite end of the trumpet-shaped opening 21 is set to be 1.8-2.4mm, and the diameter of the third sound outlet hole 313 is set to be 0.5-1.0 mm. As a preferred embodiment, the diameters of the second sound outlet 312 and the opposite end of the trumpet-shaped opening 21 are set to be 2.0 to 2.2mm, that is, the diameter size of the sound outlet on the ear side of the earphone is 2.0 to 2.2mm, and the diameter of the third sound outlet 313 is set to be 0.6 to 0.8mm, that is, the diameter size of the sound outlet at the middle position of the earphone is 0.6 to 0.8mm, so that the good middle and high frequency characteristics can be maintained.

Due to the unique sounding hole design, the frequency response curve of the earphone is straight, a better high-frequency effect is achieved, the low-frequency impact of music and musical instruments can be presented well, the real effect of the music can be interpreted, and a user can have a better listening feeling; referring to fig. 12, it can be seen from the graph of the acoustic experimental data of the earphone that the audio effects of the left ear and the right ear are substantially the same.

In this embodiment, the sound outlet tuning paper 5 is installed at the end of the second sound outlet 312 of the front shell 31, the rear shell tuning paper 6 is installed at the opening 321 in the rear shell 32, the silicone earcap 7 is sleeved at the front end of the front shell 31, the SR line pendulum 9 is sleeved on the CABLE line 8, the SR line pendulum 9 is fixedly connected with the rear shell 32, the CABLE line 8 is embedded in the rear shell 32 and connected with the semiconductor loudspeaker 1, meanwhile, the power connection point 113 connected with the PCB assembly is arranged on the semiconductor loudspeaker 1, the positive and negative poles of the CABLE line 8 are respectively welded with the positive and negative power connection points 113 on the semiconductor loudspeaker 1, and the assembled earphone is as shown in fig. 10.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not limitations to the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (10)

1. A side-tone planar semiconductor horn, comprising: the voice sensor comprises a cover body (11) internally provided with a PCB assembly, a voice sensor assembly (12) and a mounting shell (13), wherein the cover body (11) and the mounting shell (13) are fixedly mounted, and the voice sensor assembly (12) is mounted between the cover body (11) and the mounting shell (13) and is in contact connection with the PCB assembly; a first sound outlet hole (131) is formed in one end face of the mounting housing (13).

2. The planar semiconductor horn of claim 1, wherein the first sound outlet (131) comprises an elongated opening formed in the end surface of the mounting housing (13) along the length of the end surface of the mounting housing (13), or a plurality of evenly distributed small holes formed in the end surface of the mounting housing (13) along the length of the end surface of the mounting housing (13).

3. The flat semiconductor horn of claim 1, wherein a plurality of horn air holes (112) are provided on opposite surfaces of the cover (11).

4. An earphone using a side-sounding planar semiconductor speaker, comprising: earphone house (3) with cavity, semiconductor loudspeaker (1) and support (2) of any one of claims 1-3, semiconductor loudspeaker (1) is installed in support (2), install in the cavity of earphone house (3) support (2) with the relative terminal surface in second sound outlet hole (312) of earphone house (3) front end of support (2) is equipped with loudspeaker form opening (21), install first sound outlet hole (131) of semiconductor loudspeaker (1) in support (2) with loudspeaker form opening (21) set up relatively.

5. The earphone with the side sounding planar type semiconductor speaker as claimed in claim 4, wherein the holder (2) is square with an opening at the top to allow the semiconductor speaker (1) to be inserted and mounted, an opening is provided at a position of the holder (2) opposite to the speaker air hole (112) of the semiconductor speaker (1), and the semiconductor speaker (1) is inserted into the holder (2) and hermetically connected to the holder (2).

6. The earphone with the side-sounding planar-type semiconductor speaker as claimed in claim 4, wherein the earphone housing (3) comprises a front shell (31) and a rear shell (32) which are matched, wherein a mounting groove (311) matched with the support (2) is formed in the opposite end surfaces of the front shell (31) and the rear shell (32), and the support (2) is fixedly mounted in the mounting groove (311); the second sound outlet hole (312) is positioned in the front shell (31) and is communicated with the mounting groove (311).

7. The earphone of claim 4, wherein the horn-shaped opening (21) is transitionally connected to the second sound outlet hole (312) through a third sound outlet hole (313).

8. The earphone according to claim 7, wherein the diameter of the second sound-emitting hole (312) opposite to the horn-shaped opening (21) is set to be 1.8-2.4mm, and the diameter of the third sound-emitting hole (313) is set to be 0.5-1.0 mm.

9. The earphone with the lateral sounding planar semiconductor speaker according to claim 6, further comprising a sound outlet tuning paper (5), a back shell tuning paper (6) and a silicone earmuff (7), wherein the sound outlet tuning paper (5) is installed at an end of the second sound outlet (312) of the front shell (31), the back shell tuning paper (6) is installed at an opening (321) in the back shell (32), and the silicone earmuff (7) is sleeved at a front end of the front shell (31).

10. The earphone with the lateral sounding planar semiconductor speaker as claimed in claim 6, further comprising a CABLE line (8) and an SR pendulum (9) sleeved on the CABLE line (8), wherein the SR pendulum (9) is fixedly connected to the rear housing (32), and the CABLE line (8) is embedded in the rear housing (32) and connected to the semiconductor speaker (1).

Images