CN217306468U - Positioning mechanism is used in production of power semiconductor chip - Google Patents

Abstract

The utility model discloses a positioning mechanism is used in production of power semiconductor chip, the power distribution box comprises a box body, fixedly connected with platen in the box, the mounting groove has been seted up to the upper surface of platen, and swing joint has the baffle in the mounting groove, and one side swing joint of baffle has fluted disc and scarce gear, and fluted disc and scarce gear are fixed mutually, one side fixedly connected with torsional spring that lacks the gear, and the torsional spring is fixed mutually with the baffle, the upper surface of platen has been seted up the second and has been kept away a groove, and the second keeps away an inslot fixedly connected with electric telescopic handle, the first rack of electric telescopic handle's one end fixedly connected with, and first rack meshes with the fluted disc mutually, swing joint has the thing board of putting in the mounting groove. The utility model discloses not only can improve the effect of holding fixedly to adding of semiconductor chip, can further improve the fixed effect of centre gripping of device moreover, improve the result of use of device, can also improve the convenience of device.

Description

Positioning mechanism is used in production of power semiconductor chip

Technical Field

The utility model relates to a semiconductor chip technical field especially relates to a positioning mechanism is used in production of power semiconductor chip.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and the semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, high-power conversion and the like, such as silicon wafers, wafers refer to silicon wafers used for manufacturing silicon semiconductor circuits, the original material of the wafers is silicon, the demand of the semiconductor is more and more increased along with the development of the society, and more attention is paid to the production of the semiconductor.

In the mechanical production, the production of semiconductors often occurs, in the production process of producing semiconductors, chips need to be fixed, and a conventional production device is clamped by a set of clamp, so that the clamping stability is not high, and the product is unqualified, and therefore, the need of providing a new positioning mechanism is very necessary.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a positioning mechanism for power semiconductor chip production.

In order to realize the purpose, the utility model adopts the following technical scheme:

a positioning mechanism for power semiconductor chip production comprises a box body, wherein a bedplate is fixedly connected in the box body, a mounting groove is formed in the upper surface of the bedplate, a baffle is movably connected in the mounting groove, a fluted disc and a gear lacking wheel are movably connected to one side of the baffle and are fixed with each other, a torsional spring is fixedly connected to one side of the gear lacking wheel and is fixed with the baffle, a second avoiding groove is formed in the upper surface of the bedplate, an electric telescopic rod is fixedly connected in the second avoiding groove, a first rack is fixedly connected to one end of the electric telescopic rod and is meshed with the fluted disc, a placing plate is movably connected in the mounting groove, a second rack is fixedly connected to one side of the placing plate and is meshed with the gear lacking wheel, sliding grooves are formed in the two sides of the placing plate, a clamping frame is movably connected in the sliding grooves and is contacted with the bedplate, fixedly connected with extension spring between the clamping frame, the first position groove of keeping away has all been seted up to the both sides of mounting groove, and the clamping frame can contact with the first position groove of keeping away.

As the utility model discloses scheme further again, the top inner wall fixedly connected with arm of box, and the arm contacts with putting the thing board.

As the utility model discloses the scheme of furthering again, the equal fixedly connected with light of both sides inner wall of box.

As a further proposal, one side of the box body is movably connected with a door plate and one side of the door plate is fixedly connected with a handle.

As the utility model discloses scheme further again, the installing port has been seted up to one side of door plant, fixedly connected with observation window in the installing port.

As the utility model discloses further scheme again, one side fixedly connected with controller of box, one side of controller are equipped with a plurality of buttons.

As the utility model discloses further scheme again, a plurality of lower margins of bottom outer wall fixedly connected with of box, and lower margin evenly distributed.

The utility model has the advantages that:

1. through the cooperation of torsional spring and scarce gear, electric telescopic handle extension drives first rack and removes, and first rack drives the fluted disc and rotates, and the fluted disc drives scarce gear revolve, can make the torsional spring take place deformation when lacking gear revolve to drive the baffle and rotate, thereby make the baffle carry out vertical centre gripping to the semiconductor, improved the fixed effect of device to the centre gripping of semiconductor chip.

2. Through the setting of clamping frame, the electric telescopic handle extension drives first rack and removes, first rack drives the fluted disc and rotates, the fluted disc drives lacks gear revolve, when lacking gear and second rack meshing, lack the gear and drive the second rack and remove, second rack moves puts the thing board and moves down, the platen can extrude clamping frame when putting the thing board and moving down, make the clamping frame take place to rotate, thereby it is fixed to make the clamping frame carry out the centre gripping to the chip, further improvement the fixed effect of centre gripping of device, the result of use of device has been improved.

3. Through the setting of light, when the arm carries out the during operation to the chip, the light can provide a luminance for in the box, makes things convenient for the workman can be more clearly from the processing condition in the observation window observation box, has improved the convenience of device.

Drawings

Fig. 1 is a schematic view of a three-dimensional structure of a positioning mechanism for power semiconductor chip production according to the present invention;

fig. 2 is a schematic view of an internal structure of a positioning mechanism for power semiconductor chip production according to the present invention;

fig. 3 is a schematic view of a partial cross-sectional structure of a positioning mechanism for power semiconductor chip production according to the present invention;

fig. 4 is a schematic diagram of a local enlarged structure of a positioning mechanism for power semiconductor chip production according to the present invention.

In the figure: 1. a box body; 2. a controller; 3. ground feet; 4. a door panel; 5. an observation window; 6. a handle; 7. an illuminating lamp; 8. a mechanical arm; 9. a platen; 10. a baffle plate; 11. a storage plate; 12. an electric telescopic rod; 13. a first rack; 14. a fluted disc; 15. a gear is missing; 16. a second rack; 17. a clamping frame; 18. a chute; 19. a first avoiding groove; 20. a tension spring; 21. a torsion spring; 22. a second avoiding groove.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Referring to fig. 1-4, a positioning mechanism for power semiconductor chip production comprises a box body 1, a bedplate 9 is fixed in the box body 1 through bolts, a mounting groove is formed in the upper surface of the bedplate 9, a baffle plate 10 is rotatably connected in the mounting groove, a fluted disc 14 and a missing gear 15 are rotatably connected to one side of the baffle plate 10, the fluted disc 14 and the missing gear 15 are fixed, a torsion spring 21 is welded to one side of the missing gear 15, the torsion spring 21 is fixed to the baffle plate 10, a second avoiding groove 22 is formed in the upper surface of the bedplate 9, an electric telescopic rod 12 is fixed in the second avoiding groove 22 through bolts, a first rack 13 is fixed to one end of the electric telescopic rod 12 through bolts, the first rack 13 is meshed with the fluted disc 14, a placement plate 11 is slidably connected in the mounting groove, a second rack 16 is fixed to one side of the placement plate 11 through bolts, and the second rack 16 is meshed with the missing gear 15, sliding grooves 18 are formed in two sides of the object placing plate 11, clamping frames 17 are rotatably connected in the sliding grooves 18, the clamping frames 17 are in contact with the bedplate 9, tension springs 20 are welded between the clamping frames 17, first avoiding grooves 19 are formed in two sides of the mounting groove, the clamping frames 17 can be in contact with the first avoiding grooves 19, the electric telescopic rod 12 extends to drive the first racks 13 to move, the first racks 13 drive the fluted disc 14 to rotate, the fluted disc 14 drives the missing gear 15 to rotate, the missing gear 15 can deform the torsion spring 21 when rotating, the baffle 10 is driven to rotate by the acting force of the torsion spring 21, the baffle 10 is in contact with the object placing plate 11, so that the baffle 10 can clamp and fix the chip, when the missing gear 15 rotates to be meshed with the second racks 16, the missing gear 15 drives the second racks 16 to move, the second racks 16 drives the object placing plate 11 to move downwards, and when the object placing plate 11 moves downwards, the bedplate 9 can extrude the clamping frames 17, thereby, the holder 17 is rotated, the upper half of the holder 17 is reduced, and the chip is held and fixed.

In the utility model, the inner wall of the top of the box body 1 is fixed with a mechanical arm 8 through bolts, the mechanical arm 8 is contacted with a storage plate 11, the inner walls of the two sides of the box body 1 are both fixed with illuminating lamps 7 through bolts, when the mechanical arm 8 works on chips, the illuminating lamps 7 can provide a brightness for the interior of the box body 1, so that workers can observe the processing condition in the box body 1 more clearly, one side of the box body 1 is rotatably connected with a door plate 4, one side of the door plate 4 is fixed with a handle 6 through bolts, one side of the door plate 4 is provided with a mounting port, an observation window 5 is fixed in the mounting port through bolts, one side of the box body 1 is fixed with a controller 2 through bolts, one side of the controller 2 is provided with a plurality of buttons, the controller 2 is a master switch for controlling the mechanical arm 8 and the electric telescopic rod 12 to work, the mechanical arm 8 and the electric telescopic rod 12 are controlled through the controller 2, the outer wall of the bottom of the box body 1 is fixed with a plurality of ground feet 3 through bolts, and the ground feet 3 are uniformly distributed.

The working principle is as follows: when a chip on a semiconductor needs to be clamped, the chip is placed on the object placing plate 11, the electric telescopic rod 12 is started, the electric telescopic rod 12 extends to drive the first rack 13 to move, the first rack 13 drives the fluted disc 14 to rotate, the fluted disc 14 drives the missing gear 15 to rotate, the missing gear 15 can deform the torsion spring 21 when rotating, the baffle plate 10 is driven to rotate by the acting force of the torsion spring 21, the baffle plate 10 is in contact with the object placing plate 11, so that the baffle plate 10 clamps and fixes the chip, when the missing gear 15 rotates to be meshed with the second rack 16, the missing gear 15 drives the second rack 16 to move, the second rack 16 drives the object placing plate 11 to move downwards, when the object placing plate 11 moves downwards, the bedplate 9 can extrude the clamping frame 17, so that the clamping frame 17 rotates, the upper half part of the clamping frame 17 is reduced, the chip is clamped and fixed, meanwhile, the clamping frame 17 can stretch the tension spring 20, and then the mechanical arm 8 is started, arm 8 fixes the chip on the chip, after work is accomplished, electric telescopic handle 12 contracts, it removes to drive first rack 13, first rack 13 drives fluted disc 14 reversal, fluted disc 14 drives lacks 15 reversals of gear, it drives baffle 10 through torsional spring 21's effort to lack gear 15 and resets, it drives second rack 16 and upwards removes to lack gear 15 simultaneously, second rack 16 drives and puts thing board 11 rebound, it drives clamping frame 17 rebound to put thing board 11, make platen 9 not extrude clamping frame 17, clamping frame 17 resets through extension spring 20's effort.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (7)

1. A positioning mechanism for power semiconductor chip production comprises a box body (1) and is characterized in that a bedplate (9) is fixedly connected in the box body (1), a mounting groove is formed in the upper surface of the bedplate (9), a baffle plate (10) is movably connected in the mounting groove, a fluted disc (14) and a gear lacking wheel (15) are movably connected to one side of the baffle plate (10), the fluted disc (14) and the gear lacking wheel (15) are fixed, a torsion spring (21) is fixedly connected to one side of the gear lacking wheel (15), the torsion spring (21) is fixed to the baffle plate (10), a second avoiding groove (22) is formed in the upper surface of the bedplate (9), an electric telescopic rod (12) is fixedly connected in the second avoiding groove (22), a first rack (13) is fixedly connected to one end of the electric telescopic rod (12), the first rack (13) is meshed with the fluted disc (14), a storage plate (11) is movably connected in the mounting groove, one side of the object placing plate (11) is fixedly connected with a second rack (16), the second rack (16) is meshed with the gear lacking wheel (15), sliding grooves (18) are formed in the two sides of the object placing plate (11), clamping frames (17) are movably connected in the sliding grooves (18), the clamping frames (17) are in contact with the bedplate (9), tension springs (20) are fixedly connected between the clamping frames (17), first avoiding grooves (19) are formed in the two sides of the mounting groove, and the clamping frames (17) can be in contact with the first avoiding grooves (19).

2. The positioning mechanism for power semiconductor chip production according to claim 1, wherein a mechanical arm (8) is fixedly connected to the inner wall of the top of the box body (1), and the mechanical arm (8) contacts with the object placing plate (11).

3. The positioning mechanism for power semiconductor chip production according to claim 1, wherein the inner walls of both sides of the box body (1) are fixedly connected with illuminating lamps (7).

4. The positioning mechanism for power semiconductor chip production according to claim 3, wherein a door plate (4) is movably connected to one side of the box body (1), and a handle (6) is fixedly connected to one side of the door plate (4).

5. The positioning mechanism for power semiconductor chip production according to claim 4, wherein a mounting opening is formed on one side of the door plate (4), and an observation window (5) is fixedly connected in the mounting opening.

6. The positioning mechanism for power semiconductor chip production according to claim 1, wherein a controller (2) is fixedly connected to one side of the box body (1), and a plurality of buttons are arranged on one side of the controller (2).

7. The positioning mechanism for power semiconductor chip production according to claim 6, wherein a plurality of feet (3) are fixedly connected to the outer wall of the bottom of the box body (1), and the feet (3) are uniformly distributed.

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