CN217035633U - Display screen paster LED device integrating RGB and IR chips - Google Patents
Display screen paster LED device integrating RGB and IR chips Download PDFInfo
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- CN217035633U CN217035633U CN202123423867.2U CN202123423867U CN217035633U CN 217035633 U CN217035633 U CN 217035633U CN 202123423867 U CN202123423867 U CN 202123423867U CN 217035633 U CN217035633 U CN 217035633U
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Abstract
The utility model discloses a display screen patch LED device integrating RGB and IR chips, which is characterized by comprising a PCB support, wherein the front surface of the PCB support is provided with a common bonding pad, a second bonding pad, a third bonding pad, a fourth bonding pad and a fifth bonding pad, and the back surface of the PCB support is provided with a common pin, a second pin, a third pin, a fourth pin and a fifth pin which are electrically connected with the corresponding bonding pads; the second bonding pad, the third bonding pad, the fourth bonding pad and the fifth bonding pad are electrically connected with the red chip, the green chip, the blue chip and the IR chip respectively, and the public bonding pad is electrically connected with the red chip, the green chip, the blue chip and the IR chip simultaneously. According to the utility model, the PCB is designed as the support, and the red, green and blue tricolor chips and the IR chips are integrated at four corners of the PCB, so that the improved LED device has a compact structure, and the pixel pitch of the display screen formed by sticking the uniform devices is smaller.
Description
Technical Field
The utility model relates to the field of light emitting diodes, in particular to a display screen patch LED device integrating RGB and IR chips.
Background
In recent years, small-pitch LED display screens are more widely applied, and recent visual technologies such as AR/VR are combined at present. In the last year, with a large capital AR/VR industry investment, the public interest in this area has been mobilized in the wake. With the advent of the 3.0 era of advertising, the single-way rebroadcasting of LED advertising in the past would gradually give consumers a way to participate in it. By enhancing the display technology, the advertiser's products and brands can form a good interaction with consumers through a large screen, and then become a gathering place for scene marketing. With this background, the demand for high-density LED display screens is increasing, and the demand for screens in various applications is also increasing.
The full-color SMDLED support structure and the packaging product device thereof disclosed in Chinese patent document with the publication number of CN102437151B and the publication date of 2013-10-16 comprise a plurality of conductive areas for arranging LED chips on a support body, wherein an anode area is provided with an L-shaped corner shape which is adjacent to a blue light cathode area and a red light cathode area; the red light cathode region is arranged to be adjacent to and adapted to an inverted L shape of a corner at one side end of the anode region; the blue negative electrode area is arranged to be adjacent to and adapted to the inverted L shape of the corner of the other side end of the positive electrode area. The full-color SMD LED support structure and the packaging product device thereof have the advantages that the red light cathode region and the side end corner of the corresponding adjacent anode region are provided with the wider adjacent region, so that the full-color SMD LED support structure adapts to different polarity red requirements during production, the same support can be used for production, and the complexity and the cost of inventory management are reduced. However, the technology is only an improvement on full-color LED devices, the full-color LED devices and IR devices are still independent from each other, and when two different devices are mixed and attached to form a display screen, a certain distance is required to avoid collision between the devices, so that the requirement of a high-density display screen cannot be met.
Disclosure of Invention
The utility model provides a display screen patch LED device integrating RGB and IR chips, aiming at overcoming the problem that the requirements of a high-density display screen are difficult to meet when a full-color LED device and an IR device are mutually independent and are pasted into the display screen in the prior art.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a display screen surface mounted LED device integrating RGB and IR chips comprises a PCB support, wherein a public bonding pad, a second bonding pad, a third bonding pad, a fourth bonding pad and a fifth bonding pad are arranged on the front surface of the PCB support, and a public pin, a second pin, a third pin, a fourth pin and a fifth pin which are electrically connected with the corresponding bonding pads are arranged on the back surface of the PCB; the second bonding pad, the third bonding pad, the fourth bonding pad and the fifth bonding pad are electrically connected with the red chip, the green chip, the blue chip and the IR chip respectively, and the public bonding pad is electrically connected with the red chip, the green chip, the blue chip and the IR chip simultaneously.
The PCB support is a PCB without a bowl-cup structure, and the production is convenient and the cost is lower than that of the PCB with the bowl-cup structure; the common bonding pad is electrically connected with the common pin and is electrically connected with all the chips together to form an electrical loop of a common end, the second bonding pad is electrically connected with the second pin, the third bonding pad is electrically connected with the third pin, the fourth bonding pad is electrically connected with the fourth pin, and the fifth bonding pad is electrically connected with the fifth pin respectively, and is electrically connected with the red chip, the green chip, the blue chip and the IR chip respectively to form a complete electrical loop together with the electrical loop of the common end. The red, green and blue three-primary-color chip and the IR chip are integrated on the same PCB, so that the models of new full-color LED devices are uniform, and the pixel distance is smaller when a display screen is formed by mounting.
Preferably, the common pin and the rest pins are connected with power supplies with opposite polarities in a positive four-negative or a negative four-positive mode. The connection mode of the chip is a common cathode or common anode connection mode, when the common pin is connected with a positive power supply, the connection mode is common anode connection, and when the common pin is connected with a negative power supply, the connection mode is common cathode connection.
Preferably, the common pad, the second pad, the third pad, the fourth pad and the fifth pad are arranged on the front face of the PCB bracket in a surrounding manner along the edge of the PCB. All the welding pads are arranged in sequence along the edge of the PCB in a surrounding mode, and compared with the welding pads arranged in parallel, the area utilization rate of the PCB is higher, so that the structure is more compact, the area required by the PCB is smaller, and the display screen with higher density can be pasted.
Preferably, the red chip, the green chip, the blue chip and the IR chip are electrically connected to the bonding pad through bonding wires. All chips are welded with bonding pads through bonding wires to be electrically connected, the chips have two modes of a forward-mounted process chip and a flip-chip process chip, the forward-mounted process chip adopts gold wires or alloy wires or copper wires as the bonding wires for welding, and the flip-chip process chip adopts tin paste for welding.
Preferably, the red chip and the IR chip are vertical type chips, and the green chip and the blue chip are horizontal type chips. Two electrodes of the vertical chip are positioned on two opposite side surfaces of the chip, and one electrode faces the bonding pad and the other electrode deviates from the bonding pad when the chip is fixed; the two electrodes of the horizontal chip are positioned on the same surface of the chip, and both the two electrodes are deviated from the bonding pad when the horizontal chip is fixed.
Preferably, the red chip and the IR chip are fixed on the corresponding bonding pads through silver paste; and the green chip and the blue chip are fixed on the corresponding bonding pads through insulating glue. According to the utility model, the red chip and the IR chip are vertical chips, so that the chips are fixed on the bonding pads by using silver adhesive, one electrode is electrically connected with the bonding pads, and the other electrode is electrically connected with the bonding pads through bonding wires; the green chip and the blue chip are horizontal chips, so that the chip is fixed on the bonding pad by using insulating glue to insulate the bottom of the chip from the bonding pad, and the two electrodes are electrically connected with the bonding pad through the bonding wire.
The utility model has the following beneficial effects: by designing the PCB as a support and integrating red, green and blue tricolor chips and IR chips at four corners of the PCB, the improved LED device has compact structure and smaller pixel pitch of a display screen formed by pasting uniform devices. Compared with the method for pasting two different devices into a display screen in a mixed mode, the method for pasting the same device into the display screen is lower in cost.
Drawings
FIG. 1 is a schematic front and back side view of an LED device of the present invention;
FIG. 2 is a schematic diagram of the circuit connections in an embodiment of the present invention;
in the figure: 1. a PCB board support; 21. a common pad; 22. a second bonding pad; 23. a third pad; 24. a fourth pad; 25. a fifth pad; 31. a first pin; 32. a second pin; 33. a third pin; 34. a fourth pin; 35. a fifth pin; 41. a blue chip; 42. a red chip; 43. a green chip; 44. an IR chip; 5. and (7) welding wires.
Detailed Description
The utility model is further described with reference to the following figures and embodiments.
As shown in fig. 1, a display screen patch LED device integrating RGB and IR chips includes a PCB board support 1, a common pad 21, a second pad 22, a third pad 23, a fourth pad 24 and a fifth pad 25 are sequentially disposed on a front surface of the PCB board support, and a common pin 31, a second pin 32, a third pin 33, a fourth pin 34 and a fifth pin 35 are disposed on a back surface of the PCB board support and electrically connected to corresponding pads respectively; the second, third, fourth and fifth pads are electrically connected to the red chip 42, the green chip 43, the blue chip 41 and the IR chip 44, respectively, and the common pad is electrically connected to the red chip, the green chip, the blue chip and the IR chip at the same time.
The common pin and the rest pins are connected with power supplies with opposite polarities in a positive four-negative or a negative four-positive mode. The common bonding pad, the second bonding pad, the third bonding pad, the fourth bonding pad and the fifth bonding pad are arranged on the front face of the PCB support in a surrounding mode along the edge of the PCB.
The red chip, the green chip, the blue chip and the IR chip are electrically connected with the bonding pad through bonding wires 5. The red chip and the IR chip are vertical type chips, and the green chip and the blue chip are horizontal type chips. The red chip and the IR chip are fixed on the corresponding bonding pads through silver adhesive; the green chip and the blue chip are fixed on the corresponding bonding pads through insulating glue.
The PCB support is a PCB without a bowl-cup structure, and the production cost is lower than that of the PCB with the bowl-cup structure; the common bonding pad is electrically connected with the common pin and is electrically connected with all the chips together to form an electric loop of a common end, the second bonding pad is electrically connected with the second pin, the third bonding pad is electrically connected with the third pin, the fourth bonding pad is electrically connected with the fourth pin, and the fifth bonding pad is electrically connected with the fifth pin respectively, and is electrically connected with the red chip, the green chip, the blue chip and the IR chip respectively to form a complete electric loop together with the electric loop of the common end. The IR chip is an infrared chip. The red, green and blue three-primary-color chip and the IR chip are integrated on the same PCB, so that the models of new full-color LED devices are uniform, and the pixel distance is smaller when a display screen is formed by mounting.
The connection mode of the chip is a common cathode or common anode connection mode, when the common pin is connected with an anode power supply, the common anode connection mode is adopted, and when the common pin is connected with a cathode power supply, the common cathode connection mode is adopted.
All the welding pads are arranged in sequence along the edge of the PCB in a surrounding mode, and compared with the welding pads arranged in parallel, the area utilization rate of the PCB is higher, so that the structure is more compact, the area required by the PCB is smaller, and the display screen with higher density can be pasted.
All chips are electrically connected with the bonding pads through welding wires, the chips have two modes of a forward-mounted process chip and an inverted-mounted process chip, the forward-mounted process chip adopts gold wires or alloy wires or copper wires as the welding wires for welding, and the inverted-mounted process chip adopts tin paste for welding.
Two electrodes of the vertical chip are positioned on two opposite side surfaces of the chip, and one electrode faces to a bonding pad and the other electrode deviates from the bonding pad when the chip is fixed; the two electrodes of the horizontal chip are positioned on the same surface of the chip, and both the two electrodes are deviated from the bonding pad when the horizontal chip is fixed. The positions of the green chip and the blue chip can be interchanged, and the positions of the red chip and the IR chip can be interchanged.
According to the utility model, the red chip and the IR chip are vertical chips, so that the chips are fixed on the bonding pads by using silver adhesive, one electrode is electrically connected with the bonding pads, and the other electrode is electrically connected with the bonding pads through bonding wires; the green chip and the blue chip are horizontal chips, so that the chip is fixed on the bonding pad by using insulating glue to insulate the bottom of the chip from the bonding pad, and the two electrodes are electrically connected with the bonding pad through the bonding wire.
The PCB support is black, gray or white, and is made of BT material or FR-4 material; the pins and the bonding pads are gold-plated or silver-plated or gold-plated or tin-plated; the thickness of the bracket can be designed to be 0.06mm-0.4mm, and the colloid thickness of the protective colloid can be designed to be 0.2mm-0.6 mm; the device can be rectangular or square, the length can be designed to be 0.6mm-3mm, and the width can be designed to be 0.6mm-3 mm. The LED device is characterized in that the protective adhesive covers the PCB support and all chips, and the protective adhesive material comprises solid or liquid epoxy resin, silicon resin, epoxy modified material and other traditional materials.
In a first embodiment of the present invention, as shown in fig. 1, a common pad, a second pad, a third pad and a fifth pad are respectively disposed near four corners of a PCB, the common pad extends toward a pad region of the PCB to enlarge a soldering area, and the third pad is L-shaped to increase the soldering area; the fourth pad is disposed between the common pad and the fifth pad. The common pin, the second pin, the third pin, the fourth pin and the fifth pin are sequentially arranged in a surrounding mode. The common bonding pad is electrically connected with the common pin, the second bonding pad is electrically connected with the second pin, the third bonding pad is electrically connected with the third pin, the fourth bonding pad is electrically connected with the fourth pin, and the fifth bonding pad is electrically connected with the fifth pin.
The common bonding pad is provided with a blue chip fixed through insulating glue, the second bonding pad is provided with a red chip fixedly connected through silver glue, the third bonding pad is provided with a green chip fixedly connected through insulating glue, and the fifth bonding pad is provided with an IR chip fixedly connected through silver glue. In this embodiment, all chips are normal-mounted process chips, and all chips are connected by a common anode as shown in fig. 2. The anode of the blue chip, the anode of the red chip, the anode of the green chip and the anode of the IR chip are electrically connected with the common bonding pad through gold wire welding; the cathode of the blue chip is electrically connected with the fourth bonding pad through gold wire welding; the cathode of the red chip is directly electrically connected with the second bonding pad through the silver adhesive; the cathode of the green chip is electrically connected with the third bonding pad through gold wire welding; and the cathode of the IR chip is directly electrically connected with the fifth bonding pad through the silver adhesive. The common bonding pad is connected with the anode of the power supply through a common pin, and the rest bonding pads are connected with the cathode of the power supply through corresponding pins.
In the second embodiment, all the chips adopt a common cathode connection mode, and on the basis of the first embodiment, the cathode of the blue chip, the cathode of the red chip, the cathode of the green chip and the cathode of the IR chip are electrically connected with the common pad through gold wire welding at the same time; the anode of the blue chip is electrically connected with the fourth bonding pad through gold wire welding; the anode of the red chip is directly electrically connected with the second bonding pad through the silver adhesive; the anode of the green chip is electrically connected with the third bonding pad through gold wire welding; and the anode of the IR chip is directly electrically connected with the fifth bonding pad through the silver adhesive. The common bonding pad is connected with the cathode of the power supply through a common pin, and the rest bonding pads are connected with the anode of the power supply through corresponding pins.
The above embodiments are further illustrated and described in order to facilitate understanding of the utility model, and no unnecessary limitations are to be understood therefrom, and any modifications, equivalents, and improvements made within the spirit and principle of the utility model should be included therein.
Claims (6)
1. A display screen patch LED device integrating RGB and IR chips is characterized by comprising a PCB support, wherein a common bonding pad, a second bonding pad, a third bonding pad, a fourth bonding pad and a fifth bonding pad are arranged on the front surface of the PCB support, and a common pin, a second pin, a third pin, a fourth pin and a fifth pin which are electrically connected with the corresponding bonding pads are arranged on the back surface of the PCB support; the second bonding pad, the third bonding pad, the fourth bonding pad and the fifth bonding pad are electrically connected with the red chip, the green chip, the blue chip and the IR chip respectively, and the public bonding pad is electrically connected with the red chip, the green chip, the blue chip and the IR chip simultaneously.
2. The integrated RGB and IR chip display panel chip LED device as claimed in claim 1, wherein the common pin is connected to the rest of the pins with power supply of opposite polarity in a positive four negative or a negative four positive manner.
3. The integrated RGB and IR chip display screen SMD LED device of claim 1 or 2, wherein said common bonding pad, second bonding pad, third bonding pad, fourth bonding pad and fifth bonding pad are disposed around the edge of PCB board on the front side of PCB board bracket.
4. The integrated RGB and IR chip display screen patch LED device as claimed in claim 3, wherein the red, green, blue and IR chips are electrically connected to the bonding pads by bonding wires.
5. The integrated RGB and IR chip display screen patch LED device of claim 1 or 2, wherein the red chip and the IR chip are vertical type chips, and the green chip and the blue chip are horizontal type chips.
6. The integrated RGB and IR chip display screen SMD LED device of claim 5, wherein said red chip and IR chip are fixed on the corresponding bonding pads by silver paste; and the green chip and the blue chip are fixed on the corresponding bonding pads through insulating glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123423867.2U CN217035633U (en) | 2021-12-28 | 2021-12-28 | Display screen paster LED device integrating RGB and IR chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123423867.2U CN217035633U (en) | 2021-12-28 | 2021-12-28 | Display screen paster LED device integrating RGB and IR chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217035633U true CN217035633U (en) | 2022-07-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123423867.2U Active CN217035633U (en) | 2021-12-28 | 2021-12-28 | Display screen paster LED device integrating RGB and IR chips |
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| Country | Link |
|---|---|
| CN (1) | CN217035633U (en) |
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- 2021-12-28 CN CN202123423867.2U patent/CN217035633U/en active Active
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